CN104060307A - Pure tin electroplating solution for inhibiting growth of tin whiskers and application thereof - Google Patents
Pure tin electroplating solution for inhibiting growth of tin whiskers and application thereof Download PDFInfo
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- CN104060307A CN104060307A CN201410307826.2A CN201410307826A CN104060307A CN 104060307 A CN104060307 A CN 104060307A CN 201410307826 A CN201410307826 A CN 201410307826A CN 104060307 A CN104060307 A CN 104060307A
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Abstract
The invention discloses a pure tin electroplating solution for inhibiting growth of tin whiskers and an application thereof. A mixed solution of methylsulphonic acid and sulfuric acid is adopted as an acidic plating solution, a mixed solution of alkyl sulfonic acid tin salt and hydrogen peroxide is adopted as tin salt, and antioxidants, adjuvants, brightening agents, wetting agents, surface-active agents and the like are added to the mixed solutions. In the application process, an unique electroplating solution preparing method and matters needing attention in use are adopted, and therefore the effect of inhibiting the growth of the tin whiskers is obvious compared with the application of a traditional electroplating solution; moreover, the growth speed of the tin whiskers is greatly reduced, and the growth of the tin whiskers on the surface of an electroplated part is reduced; moreover, plated layers electroplated through the method is good in flexibility and ductility, cracks of the plated layers can be well reduced, the ability to bear the temperature is flexible, and the practical value is high.
Description
Technical field
The present invention relates to metal plating galvanic deposit preparation field, relate in particular to a kind of reduce tin one of the main divisions of the male role in traditional opera long Pure Tin Plating Process liquid and application thereof.
Background technology
In electronic industry is produced, on component's feet surface, conventionally electroplate one deck tin-lead (Sn-Pb) alloy to improve the wettability of its welding, but lead element is the metallic element that a kind of bio-toxicity is very large, human body and environment are had to huge harm, since electron device gurry regulations case that European Commission passes through is defined in the waste after 2004, forbid to have after the objectionable impuritiess such as plumbous Pb, cadmium Cd, mercury Hg and sexavalent chrome Cr (VI), exploitation Lead-Free Soldering Technology and corresponding Pure Tin Plating Process technology have become the Main Means that substitutes plating Sn-Pb alloy.Existing unleaded plating alloy, it is higher that ubiquity welding temperature, and crystallization is thicker, easily the problem such as long Sn palpus.
Summary of the invention
Goal of the invention: the welding temperature that the existing Lead-free Pure Tin Plating Process alloy of prior art exists is higher in order to solve, slightly and easily long Sn must problem in crystallization, the invention provides a kind of snappiness of coating and ductility is good, to Sn must the inhibited reduction tin one of the main divisions of the male role in traditional opera of growth Pure Tin Plating Process liquid and the application thereof grown.
Technical scheme: for achieving the above object, the present invention adopts following technical scheme:
A kind of long Pure Tin Plating Process liquid of tin one of the main divisions of the male role in traditional opera that reduces, by following formula, formed: the alkylsulphonic acid pink salt that the volume ratio of the methylsulphonic acid that the volume ratio of 20%-50% is 3:1 and the mixing solutions of sulfuric acid, 10%-40% is 5:1-7:1 and the mixing solutions of hydrogen peroxide, the auxiliary of the antioxidant of 1%-10%, 1%-5%, the wetting agent of the brightening agent of 1%-5%, 1%-5%, the tensio-active agent of 1%-5%, the water of surplus, wherein above-mentioned per-cent is mass percent.
Further, described silane alcohol base sulfonic acid pink salt is one or more in methanesulfonic tin, ethane sulfonic acid tin, propane sulfonic acid tin, 2-propane sulfonic acid tin.
Further, described antioxidant is the mixture that reductinic acid compounds and complexation of metal ions mass ratio are 2:1-4:1, and wherein reductinic acid compounds is the acid of anti-sepsis, citric acid, a kind of in xitix and lactic acid.
Further, one or more in described auxiliary 5-chlorouracil, 4-acetylcytosine, 2-aminoadenine or xanthoglobulin.
Further, the mixture of the polyoxyethylene glycol of the oxysuccinic acid that described brightening agent is 15g/L, the lactic acid of 8mL/L, 8g/L, boric acid, benzyl two acetone, its mass ratio is 1:1:2:2:1.
Further, described wetting agent is anionic wetting agent.
Further, described tensio-active agent is aniorfic surfactant.
The application of the Pure Tin Plating Process liquid that a kind of above-mentioned reduction tin one of the main divisions of the male role in traditional opera is long, specific as follows: toward adding half water of aequum in plating tank, add alkylsulphonic acid pink salt and mixing solutions, methylsulphonic acid and the sulfuric acid of hydrogen peroxide mixing solutions, mix after standing 20-40min, first add in the desired amount antioxidant, auxiliary and tensio-active agent, the water that adds again wetting agent and brightening agent and surplus after mixing, mixes.
Further, the use temperature of described electroplate liquid is 30-55 ℃.
Further, in described electroplate liquid use procedure, per half hour, adds sorbent material to adsorb 10-15min in plating tank.
Beneficial effect: a kind of reduce tin one of the main divisions of the male role in traditional opera long Pure Tin Plating Process liquid and application thereof provided by the present invention, acidic bath adopts the mixing solutions of methylsulphonic acid and sulfuric acid, pink salt adopts the mixing solutions of alkylsulphonic acid pink salt and hydrogen peroxide, and added antioxidant, auxiliary, brightening agent, wetting agent, the compositions such as tensio-active agent, and unique electroplate liquid compound method and application notice have been adopted in the process of application, compare with the application of traditional electrical plating solution, growth inhibitory effect to tin palpus is obvious, greatly reduce the growth velocity of tin palpus, reduce the growth of plated item surface tin palpus, and use the present invention electroplates, and rear coating has snappiness and ductility is good, the appearance of coating crackle is had to good mitigation, more flexible to temperature ability to bear, there is very strong practical value.
Embodiment
Below in conjunction with embodiment, the present invention is described in further detail:
Embodiment 1:
Reduce the long Pure Tin Plating Process liquid of tin one of the main divisions of the male role in traditional opera, concrete formula is as follows, and wherein per-cent is mass percent:
20% volume ratio is the methylsulphonic acid of 3:1 and the mixing solutions of sulfuric acid;
40% volume ratio is the methanesulfonic tin of 5:1 and the mixing solutions of hydrogen peroxide;
The mixture that 10% anti-sepsis acid and complexation of metal ions mass ratio are 2:1;
1% 5-chlorouracil;
5% brightening agent, the mixture of the polyoxyethylene glycol of the oxysuccinic acid of the 15g/L that mass ratio is 1:1:2:2:1, the lactic acid of 8mL/L, 8g/L, boric acid, benzyl two acetone, wherein the mass ratio of polyoxyethylene glycol, boric acid, benzyl two acetone is 1:2:1;
5% anionic wetting agent;
5% sodium alkylarysulfonate;
Water surplus.
The application of the Pure Tin Plating Process liquid that a kind of above-mentioned reduction tin one of the main divisions of the male role in traditional opera is long, specific as follows: toward adding half water of aequum in plating tank, add alkylsulphonic acid pink salt and mixing solutions, methylsulphonic acid and the sulfuric acid of hydrogen peroxide mixing solutions, mix after standing 20min, first add in the desired amount antioxidant, auxiliary and tensio-active agent, the water that adds again wetting agent and brightening agent and surplus after mixing, mixes; In use, the use temperature of described electroplate liquid is 30 ℃, and per half hour adds sorbent material to adsorb 10min in plating tank.
Embodiment 2:
Reduce the long Pure Tin Plating Process liquid of tin one of the main divisions of the male role in traditional opera, concrete formula is as follows, and wherein per-cent is mass percent:
50% volume ratio is the methylsulphonic acid of 3:1 and the mixing solutions of sulfuric acid;
10% volume ratio is the ethane sulfonic acid tin of 7:1 and the mixing solutions of hydrogen peroxide;
The mixture that 10% citric acid and complexation of metal ions mass ratio are 4:1;
5% 4-acetylcytosine;
1% brightening agent, the mixture of the polyoxyethylene glycol of the oxysuccinic acid of the 15g/L that mass ratio is 1:1:2:2:1, the lactic acid of 8mL/L, 8g/L, boric acid, benzyl two acetone, wherein the mass ratio of polyoxyethylene glycol, boric acid, benzyl two acetone is 1:2:1;
1% anionic wetting agent;
1% Teepol;
Water surplus.
The application of the Pure Tin Plating Process liquid that a kind of above-mentioned reduction tin one of the main divisions of the male role in traditional opera is long, specific as follows: toward adding half water of aequum in plating tank, add alkylsulphonic acid pink salt and mixing solutions, methylsulphonic acid and the sulfuric acid of hydrogen peroxide mixing solutions, mix after standing 40min, first add in the desired amount antioxidant, auxiliary and tensio-active agent, the water that adds again wetting agent and brightening agent and surplus after mixing, mixes; In use, the use temperature of described electroplate liquid is 55 ℃, and per half hour adds sorbent material to adsorb 15min in plating tank.
Embodiment 3:
Reduce the long Pure Tin Plating Process liquid of tin one of the main divisions of the male role in traditional opera, concrete formula is as follows, and wherein per-cent is mass percent:
35% volume ratio is the methylsulphonic acid of 3:1 and the mixing solutions of sulfuric acid;
25% 2-propane sulfonic acid tin and the mixing solutions of hydrogen peroxide;
The mixture that 5% lactic acid and complexation of metal ions mass ratio are 3:1;
3% 2-aminoadenine;
3% brightening agent, the mixture of the polyoxyethylene glycol of the oxysuccinic acid of the 15g/L that mass ratio is 1:1:2:2:1, the lactic acid of 8mL/L, 8g/L, boric acid, benzyl two acetone, wherein the mass ratio of polyoxyethylene glycol, boric acid, benzyl two acetone is 1:2:1;
3% anionic wetting agent;
3% sodium alkyl sulfate;
Water surplus.
The application of the Pure Tin Plating Process liquid that a kind of above-mentioned reduction tin one of the main divisions of the male role in traditional opera is long, specific as follows: toward adding half water of aequum in plating tank, add alkylsulphonic acid pink salt and mixing solutions, methylsulphonic acid and the sulfuric acid of hydrogen peroxide mixing solutions, mix after standing 30min, first add in the desired amount antioxidant, auxiliary and tensio-active agent, the water that adds again wetting agent and brightening agent and surplus after mixing, mixes; In use, the use temperature of described electroplate liquid is 45 ℃, and per half hour adds sorbent material to adsorb 13min in plating tank.
Embodiment 4:
The industrial Tin plating technique of employing standard is carried out the preparation of sample: the Cu lead frame that plating substrate is C19210, and temperature of electroplating solution is 30～55 ℃, electroplating efficiency is 600/h, electroplates without stirring, and then carries out 150 ℃, the high temperature anneal of 1h; Test is divided into four groups, adopt the formula of above-described embodiment 1-3 and the electroplate liquid of traditional Pure Tin Plating Process liquid formula to electroplate respectively, the coating mean thickness that after electroplating, x-ray fluorescence analyzer is measured is 10～12 microns, tin palpus growth experiment under temperature cycle condition has adopted the accelerated test method of JEDEC201, its parameter is :-55 ℃ of (+0/-10 ℃)～+ 85 ℃ (+10/-0 ℃), atmospheric environment, in 3 circulation/h. experimentations, after 500 circulations of every experience, just observe the growth of tin palpus; Carry out altogether 1500 circulations, observed the growth conditions of three tin palpuses.
Result is as shown in the table:
From upper table, can find out, use a kind of Pure Tin Plating Process liquid and application thereof that reduces tin one of the main divisions of the male role in traditional opera length of embodiment of the present invention 1-3, compare with the application of traditional electrical plating solution, growth inhibitory effect to tin palpus is obvious, greatly reduces the growth velocity of tin palpus, reduces the growth of plated item surface tin palpus, and use the present invention electroplates, and rear coating has snappiness and ductility is good, the appearance of coating crackle is had to good mitigation, more flexible to temperature ability to bear, there is very strong practical value.
Should be understood that, above embodiment is only not used in and limits the scope of the invention for the present invention is described, after having read the present invention, those skilled in the art all fall within the application's claims limited range to the modification of the various equivalent form of values of the present invention.
Claims (10)
1. one kind is reduced the long Pure Tin Plating Process liquid of tin one of the main divisions of the male role in traditional opera, it is characterized in that being formed by following formula: the alkylsulphonic acid pink salt that the volume ratio of the methylsulphonic acid that the volume ratio of 20%-50% is 3:1 and the mixing solutions of sulfuric acid, 10%-40% is 5:1-7:1 and the mixing solutions of hydrogen peroxide, the auxiliary of the antioxidant of 1%-10%, 1%-5%, the wetting agent of the brightening agent of 1%-5%, 1%-5%, the tensio-active agent of 1%-5%, the water of surplus, wherein above-mentioned per-cent is mass percent.
2. the long Pure Tin Plating Process liquid of reduction tin one of the main divisions of the male role in traditional opera according to claim 1, is characterized in that: described silane alcohol base sulfonic acid pink salt is one or more in methanesulfonic tin, ethane sulfonic acid tin, propane sulfonic acid tin, 2-propane sulfonic acid tin.
3. the Pure Tin Plating Process liquid that reduction tin one of the main divisions of the male role in traditional opera according to claim 1 grows, it is characterized in that: described antioxidant is the mixture that reductinic acid compounds and complexation of metal ions mass ratio are 2:1-4:1, wherein reductinic acid compounds is anti-sepsis acid, citric acid, a kind of in xitix and lactic acid.
4. the long Pure Tin Plating Process liquid of reduction tin one of the main divisions of the male role in traditional opera according to claim 1, is characterized in that: one or more in described auxiliary 5-chlorouracil, 4-acetylcytosine, 2-aminoadenine or xanthoglobulin.
5. the long Pure Tin Plating Process liquid of reduction tin one of the main divisions of the male role in traditional opera according to claim 1, is characterized in that: the mixture of the polyoxyethylene glycol of the oxysuccinic acid that described brightening agent is 15g/L, the lactic acid of 8mL/L, 8g/L, boric acid, benzyl two acetone, its mass ratio is 1:1:2:2:1.
6. the long Pure Tin Plating Process liquid of reduction tin one of the main divisions of the male role in traditional opera according to claim 1, is characterized in that: described wetting agent is anionic wetting agent.
7. the long Pure Tin Plating Process liquid of reduction tin one of the main divisions of the male role in traditional opera according to claim 1, is characterized in that: described tensio-active agent is aniorfic surfactant.
8. the application of the Pure Tin Plating Process liquid of a reduction tin one of the main divisions of the male role in traditional opera length claimed in claim 1, it is characterized in that: toward adding half water of aequum in plating tank, add alkylsulphonic acid pink salt and mixing solutions, methylsulphonic acid and the sulfuric acid of hydrogen peroxide mixing solutions, mix after standing 20-40min, first add in the desired amount antioxidant, auxiliary and tensio-active agent, the water that adds again wetting agent and brightening agent and surplus after mixing, mixes.
9. the application of the Pure Tin Plating Process liquid of reduction tin one of the main divisions of the male role in traditional opera length according to claim 8, is characterized in that: the use temperature of described electroplate liquid is 30-55 ℃.
10. the application of the Pure Tin Plating Process liquid of reduction tin one of the main divisions of the male role in traditional opera length according to claim 8, is characterized in that: in described electroplate liquid use procedure, per half hour adds sorbent material to adsorb 10-15min in plating tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410307826.2A CN104060307B (en) | 2014-06-30 | A kind of Pure Tin Plating Process liquid reducing stannum one of the main divisions of the male role in traditional opera's length and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410307826.2A CN104060307B (en) | 2014-06-30 | A kind of Pure Tin Plating Process liquid reducing stannum one of the main divisions of the male role in traditional opera's length and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104060307A true CN104060307A (en) | 2014-09-24 |
| CN104060307B CN104060307B (en) | 2016-11-30 |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104498946A (en) * | 2014-11-28 | 2015-04-08 | 安徽华灿彩钢薄板科技有限公司 | Steel plate surface phosphatization method |
| CN104499011A (en) * | 2014-11-28 | 2015-04-08 | 安徽华灿彩钢薄板科技有限公司 | Plating solution |
| CN105369302A (en) * | 2015-12-23 | 2016-03-02 | 苏州市金星工艺镀饰有限公司 | Preparation method for electroplating solution for inhibiting copper exposure of tinned copper wire |
| CN105463523A (en) * | 2015-12-23 | 2016-04-06 | 苏州市金星工艺镀饰有限公司 | Electroplate liquid capable of suppressing growth of tin whiskers of coating and application thereof |
| CN105483763A (en) * | 2015-12-23 | 2016-04-13 | 苏州市金星工艺镀饰有限公司 | Electroplating bath for inhibiting copper exposure of tinned wires and application of electroplating bath |
| CN105506680A (en) * | 2015-12-23 | 2016-04-20 | 苏州市金星工艺镀饰有限公司 | Preparation method of electroplating liquid for reducing growth of plating layer tin whisker |
| US20220267952A1 (en) * | 2021-02-25 | 2022-08-25 | Sixring Inc. | Modified sulfuric acid and uses thereof |
| US20220267951A1 (en) * | 2021-02-25 | 2022-08-25 | Sixring Inc. | Modified sulfuric acid and uses thereof |
| US20220267954A1 (en) * | 2021-02-25 | 2022-08-25 | Sixring Inc. | Modified sulfuric acid and uses thereof |
| CN116837429A (en) * | 2023-08-29 | 2023-10-03 | 宁波德洲精密电子有限公司 | Electroplating solution suitable for lead frame tinning |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104498946A (en) * | 2014-11-28 | 2015-04-08 | 安徽华灿彩钢薄板科技有限公司 | Steel plate surface phosphatization method |
| CN104499011A (en) * | 2014-11-28 | 2015-04-08 | 安徽华灿彩钢薄板科技有限公司 | Plating solution |
| CN105369302A (en) * | 2015-12-23 | 2016-03-02 | 苏州市金星工艺镀饰有限公司 | Preparation method for electroplating solution for inhibiting copper exposure of tinned copper wire |
| CN105463523A (en) * | 2015-12-23 | 2016-04-06 | 苏州市金星工艺镀饰有限公司 | Electroplate liquid capable of suppressing growth of tin whiskers of coating and application thereof |
| CN105483763A (en) * | 2015-12-23 | 2016-04-13 | 苏州市金星工艺镀饰有限公司 | Electroplating bath for inhibiting copper exposure of tinned wires and application of electroplating bath |
| CN105506680A (en) * | 2015-12-23 | 2016-04-20 | 苏州市金星工艺镀饰有限公司 | Preparation method of electroplating liquid for reducing growth of plating layer tin whisker |
| US20220267952A1 (en) * | 2021-02-25 | 2022-08-25 | Sixring Inc. | Modified sulfuric acid and uses thereof |
| US20220267951A1 (en) * | 2021-02-25 | 2022-08-25 | Sixring Inc. | Modified sulfuric acid and uses thereof |
| US20220267954A1 (en) * | 2021-02-25 | 2022-08-25 | Sixring Inc. | Modified sulfuric acid and uses thereof |
| CN116837429A (en) * | 2023-08-29 | 2023-10-03 | 宁波德洲精密电子有限公司 | Electroplating solution suitable for lead frame tinning |
| CN116837429B (en) * | 2023-08-29 | 2023-11-10 | 宁波德洲精密电子有限公司 | Electroplating solution suitable for lead frame tinning |
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Inventor after: Wang Jiarui Inventor after: Zhang Zhiyong Inventor after: Zhou Bin Inventor after: Du Weijun Inventor after: Zhang Jing Inventor after: Wang Meifeng Inventor before: Wang Meifeng |