CN103184483A - Tin electroplating solution - Google Patents
Tin electroplating solution Download PDFInfo
- Publication number
- CN103184483A CN103184483A CN 201110458863 CN201110458863A CN103184483A CN 103184483 A CN103184483 A CN 103184483A CN 201110458863 CN201110458863 CN 201110458863 CN 201110458863 A CN201110458863 A CN 201110458863A CN 103184483 A CN103184483 A CN 103184483A
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- CN
- China
- Prior art keywords
- tin
- electroplating solution
- formula
- methylguanidine
- balance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a tin electroplating solution which is characterized in that a formula of the invention comprises 200 g/L-400 g/L of ethanesulfonic acid, 30 g/L-60 g/L of tin methanesulfonate, 1 g/L-5 g/L of silver hydroxyl propyl sulfonate, 50 g/L-150 g/L of methylguanidine, 20 g/L-50 g/L of sodium phosphate, 30 g/L-80 g/L of aminophenol, 5 g/L-15 g/L of chlorinated hexadecyl trimethylamine, 3 g/L-10 g/L of imidazole, and the balance being deionized water. The tin electroplating solution is reasonable in formula, can effectively overcome crystal whiskers produced by the tin-plating layer, with a plated layer having high bonding strength and good welding properties, and is suitable for electroplating tin of various electronic elements.
Description
Technical field
The present invention relates to a kind of plating tin liquor.
Background technology
Has good welding property after metal is zinc-plated, but having grown, the zinc-plated time can influence the product use by the growth whisker, can cause the equipment short trouble when serious, though adopt leaded tin coating effective but have and pollute harmfully, we need a kind ofly do not have whisker growth but the tin plating solution prescription of environmental protection.
Summary of the invention
The object of the invention is to provide a kind of prescription reasonable, does not produce tin palpus and the good plating tin liquor of weldability.
Technical solution of the present invention:
A kind of plating tin liquor is characterized in that: just its prescription is: ethyl sulfonic acid 200g/L-400g/L; Tin methane sulfonate 30g/L-60g/L; Hydroxy-propanesulfonic acid silver 1g/L-5g/L; Methylguanidine 50g/L-150g/L; Sodium phosphite 20g/L-50g/L; Amino-phenol 30g/L-80g/L; Chlorination hexadecyl trimethylamine 5g/L-15g/L imidazoles 3g/L-10g/L; Balance of deionized water.
The present invention fills a prescription rationally, and it is good effectively to overcome tin coating generation whisker and coat binding strength high welding performance, is applicable to the zinc-plated of various electronic components.
Embodiment:
Embodiment 1
A kind of plating tin liquor, just its prescription is: ethyl sulfonic acid 300g/L; Tin methane sulfonate 50g/L; Hydroxy-propanesulfonic acid silver 2g/L; Methylguanidine 100g/L; Sodium phosphite 30g/L; Amino-phenol 50g/L; Chlorination hexadecyl trimethylamine 10g/L imidazoles 5g/L fully mixes with balance of deionized water and gets final product.
Claims (1)
1. electroplate tin liquor for one kind, it is characterized in that: just its prescription is: ethyl sulfonic acid 200g/L-400g/L; Tin methane sulfonate 30g/L-60g/L; Hydroxy-propanesulfonic acid silver 1g/L-5g/L; Methylguanidine 50g/L-150g/L; Sodium phosphite 20g/L-50g/L; Amino-phenol 30g/L-80g/L; Chlorination hexadecyl trimethylamine 5g/L-15g/L imidazoles 3g/L-10g/L; Balance of deionized water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110458863 CN103184483A (en) | 2011-12-31 | 2011-12-31 | Tin electroplating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110458863 CN103184483A (en) | 2011-12-31 | 2011-12-31 | Tin electroplating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103184483A true CN103184483A (en) | 2013-07-03 |
Family
ID=48675920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110458863 Pending CN103184483A (en) | 2011-12-31 | 2011-12-31 | Tin electroplating solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103184483A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104060307A (en) * | 2014-06-30 | 2014-09-24 | 句容市博远电子有限公司 | Pure tin electroplating solution for inhibiting growth of tin whiskers and application thereof |
| CN106757212A (en) * | 2016-11-30 | 2017-05-31 | 深圳市创智成功科技有限公司 | For the ELECTROPLATING Sn-Ag ALLOY solution of wafer-level packaging |
-
2011
- 2011-12-31 CN CN 201110458863 patent/CN103184483A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104060307A (en) * | 2014-06-30 | 2014-09-24 | 句容市博远电子有限公司 | Pure tin electroplating solution for inhibiting growth of tin whiskers and application thereof |
| CN106757212A (en) * | 2016-11-30 | 2017-05-31 | 深圳市创智成功科技有限公司 | For the ELECTROPLATING Sn-Ag ALLOY solution of wafer-level packaging |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130703 |