CN103184480A - Tinning solution additive - Google Patents
Tinning solution additive Download PDFInfo
- Publication number
- CN103184480A CN103184480A CN 201110454860 CN201110454860A CN103184480A CN 103184480 A CN103184480 A CN 103184480A CN 201110454860 CN201110454860 CN 201110454860 CN 201110454860 A CN201110454860 A CN 201110454860A CN 103184480 A CN103184480 A CN 103184480A
- Authority
- CN
- China
- Prior art keywords
- additive
- sulfuric acid
- tinning solution
- solution additive
- plated layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a tinning solution additive which is characterized in comprising, by weight, 20-200g/L of sulfuric acid, 5-50g/L of peroxy sulfuric acid, 1-5g/L of silver sulfate, 1-5g/L of tetrazole, 1-10g/L of propylene glycol, and balance of water. The additive provided by the invention has the advantages of reasonable formula and good stability when blended with a tinning solution. A tinned product has a uniform plated layer and bright surface. Whisker growth on the surface can be effectively inhibited. A welding performance is close to that of a lead-containing plated layer. With the additive, requirements by plated layers of various circuit boards, lead frames, and the like can be satisfied.
Description
Technical field
The invention belongs to the zinc-plated technical field in metallic surface, be specifically related to a kind of tin plating solution additive.
Background technology
Metal is zinc-plated to be widely used in the electronic devices and components, it has good welding property and Corrosion Protection, the plating pure tin whisker of growing easily causes the electronic devices and components short circuit to cause the accident, and alloy layers such as present zinc-plated nickel, tin cobalt are thin, is easy to generate craze of coating and extensibility is poor.
Summary of the invention
The object of the present invention is to provide a kind of prescription reasonable, good welding performance, coating is even, effectively prevents the tin plating solution additive of whisker.
Technical solution of the present invention is:
A kind of tin plating solution additive is characterized in that: sulfuric acid 20-200g/L, peroxosulphuric 5-50g/L, Sulfuric acid disilver salt 1-5g/L, tetrazolium 1-5g/L, propylene glycol 1-10g/L, excess water.
The present invention fills a prescription rationally, and is good with the tin plating solution fitment stability, and the product coating homogeneous surface light that plates effectively prevents the surface growth whisker, and welding property approaches with containing lead-coat, is fit to the demand of coating such as various circuit cards, lead frame.
Embodiment:
Embodiment 1
A kind of tin plating solution additive, by sulfuric acid 100g/L, peroxosulphuric 10g/L, Sulfuric acid disilver salt 2g/L, tetrazolium 1-5g/L, propylene glycol 2g/L and excess water fully stir and can join in the tin plating solution, and pH value is controlled 5,50 ° of C of bath temperature, current density 10A/dm
2
Claims (1)
1. a tin plating solution additive is characterized in that: sulfuric acid 20-200g/L, peroxosulphuric 5-50g/L, Sulfuric acid disilver salt 1-5g/L, tetrazolium 1-5g/L, propylene glycol 1-10g/L, excess water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110454860 CN103184480A (en) | 2011-12-30 | 2011-12-30 | Tinning solution additive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110454860 CN103184480A (en) | 2011-12-30 | 2011-12-30 | Tinning solution additive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103184480A true CN103184480A (en) | 2013-07-03 |
Family
ID=48675917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110454860 Pending CN103184480A (en) | 2011-12-30 | 2011-12-30 | Tinning solution additive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103184480A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022080191A1 (en) * | 2020-10-13 | 2022-04-21 | 三菱マテリアル株式会社 | Tin or tin alloy plating solution, and bump formation method which uses said plating solution |
-
2011
- 2011-12-30 CN CN 201110454860 patent/CN103184480A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022080191A1 (en) * | 2020-10-13 | 2022-04-21 | 三菱マテリアル株式会社 | Tin or tin alloy plating solution, and bump formation method which uses said plating solution |
| JP2022063889A (en) * | 2020-10-13 | 2022-04-25 | 三菱マテリアル株式会社 | Tin or tin alloy plating solution and formation method of bump using the solution |
| JP7064178B2 (en) | 2020-10-13 | 2022-05-10 | 三菱マテリアル株式会社 | Tin or tin alloy plating solution and method for forming bumps using the solution |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130703 |