CN104057656A - Aluminum-based copper-clad plate and production technology thereof - Google Patents
Aluminum-based copper-clad plate and production technology thereof Download PDFInfo
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- CN104057656A CN104057656A CN201410252112.6A CN201410252112A CN104057656A CN 104057656 A CN104057656 A CN 104057656A CN 201410252112 A CN201410252112 A CN 201410252112A CN 104057656 A CN104057656 A CN 104057656A
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- aluminum
- clad plate
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- based copper
- aluminium sheet
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- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses an aluminum-based copper-clad plate. The aluminum-based copper-clad plate comprises an adhesive coated aluminum plate and an electricity-conduction copper foil, wherein the adhesive coated aluminum plate is formed by means of adhering an insulating heat-conduction adhesive onto a metal aluminum plate, and the electricity-conduction copper foil covers the adhesive coated aluminum plate. According to the aluminum-based copper-clad plate, since a heat resisting material is removed from the insulating heat-conduction adhesive, in combination with other auxiliary filler for conducting heat of the aluminum-based copper-clad plate, the insulating performance is enhanced greatly. The invention also discloses a production technology of the aluminum-based copper-clad plate. According to the production technology, the aluminum plate is directly coated with the adhesive, the work process of manufacturing a prepreg can be omitted, the follow-up superimposition work is simplified, and the aluminum plate is directly covered by the copper foil, so that the working efficiency is enhanced.
Description
Technical field
The present invention relates to a kind of aluminum-based copper-clad plate and production technology thereof.
Background technology
Aluminum-based copper-clad plate industry production generally adopts traditional laminating method (annotation: sandwich layered manner), close with CCL technique, job step is numerous and diverse, manpower consumption is large, its mode of production is only applicable to the semisolid materials such as prepreg or heat-conducting silica gel sheet, and the glass fabric in the materials such as prepreg belongs to the lifting of the properties of product of restriction greatly of thermal resistance material, the deficiency of heat dispersion, poor with metal adhesion, had a strong impact on service life and the security of product! Can not meet the aluminium base plate hight heat conduction in future market, high performance product requirement.
Summary of the invention
The present invention is directed to the deficiencies in the prior art, a kind of aluminum-based copper-clad plate and production technology thereof are provided, this aluminum-based copper-clad plate is owing to having removed thermal resistance material in thermal plastic insulation, then coordinates the heat conduction of other auxiliary packings to aluminum-based copper-clad plate, and insulating properties have very large lifting; Secondly, the direct gluing aluminium sheet of production technology of aluminum-based copper-clad plate can save the work flow of making prepreg, and for follow-up superimposed operation easy, directly covering Copper Foil can complete, thereby has promoted operating efficiency.
In order to solve the problems of the technologies described above, the present invention is solved by following technical proposals:
An aluminum-based copper-clad plate, comprises gluing aluminium sheet and copper-foil conducting electricity, and described gluing aluminium sheet is by forming after bonding thermal plastic insulation on metal aluminum sheet, and described copper-foil conducting electricity covers gluing aluminium sheet top.
A kind of technique of producing aluminum-based copper-clad plate:
Step 1: epoxy resin and conductive powder allotment are also coated in the glue mixing up in epoxy resin and conductive powder and form thermal plastic insulation;
Step 2: will suppress and bond together and decompose test after metal aluminum sheet combination after the thermal plastic insulation obtaining in step 1 and surface treatment baking;
Step 3: by the gluing aluminium sheet obtaining in step 2 shear, check, pad pasting, leveling, check again, last packing.
Step 4: cover copper-foil conducting electricity on the gluing aluminium sheet in step 3.
Beneficial effect: compared with prior art, it has following beneficial effect in the present invention:
Aluminum-based copper-clad plate of the present invention is owing to having removed thermal resistance material in thermal plastic insulation, then coordinates the heat conduction of other auxiliary packings to aluminum-based copper-clad plate, and insulating properties have very large lifting; Secondly, the direct gluing aluminium sheet of production technology of aluminum-based copper-clad plate can save the work flow of making prepreg, and for follow-up superimposed operation easy, directly covering Copper Foil can complete, thereby has promoted operating efficiency.
Accompanying drawing explanation
Fig. 1 is the configuration diagram of aluminum-based copper-clad plate.
Fig. 2 is the production technological process of aluminum-based copper-clad plate.
The specific embodiment
Consult Fig. 1, a kind of aluminum-based copper-clad plate, comprises gluing aluminium sheet 10 and copper-foil conducting electricity 20, and the main feature of gluing aluminium sheet 10 is that thermal conductivity factor is good, dielectric strength is good, thermal resistance is low.It is prepreg material that traditional handicraft is produced aluminum-based copper-clad plate insulating barrier, cannot complete embodiment aluminium base characteristic, on the thermal conductivity factor of major embodiment, to this, I take charge of a kind of epoxy resin heat-conducting glue that replaces prepreg of development, adopt silk screen branding mode to be coated on aluminium sheet as insulating barrier, through drying tunnel preheating, make it be semi-cured state, then suppress with copper-foil conducting electricity 20 combinations
Traditional handicraft has reduced many operations relatively, and directly gluing aluminium sheet 10 can save the work flow of making prepreg, and for follow-up superimposed operation easy, directly covering copper-foil conducting electricity 20 can complete, and has promoted to a great extent operating efficiency!
Described gluing aluminium sheet 10 is by forming after bonding thermal plastic insulation 102 on metal aluminum sheet 101, described copper-foil conducting electricity 20 covers gluing aluminium sheet 10 tops, owing to having removed thermal resistance material in thermal plastic insulation 102, coordinate the heat conduction of other auxiliary packings to aluminum-based copper-clad plate, insulating properties have very large lifting again.
Consult Fig. 2, a kind of technique of producing aluminum-based copper-clad plate:
Step 1: epoxy resin and conductive powder allotment are also coated in the glue mixing up in epoxy resin and conductive powder and form thermal plastic insulation;
Step 2: will suppress and bond together and decompose test after metal aluminum sheet combination after the thermal plastic insulation obtaining in step 1 and surface treatment baking;
Step 3: by the gluing aluminium sheet obtaining in step 2 shear, check, pad pasting, leveling, check again, last packing.
Step 4: cover copper-foil conducting electricity on the gluing aluminium sheet in step 3.
In sum, aluminum-based copper-clad plate of the present invention is owing to having removed thermal resistance material in thermal plastic insulation, then coordinates the heat conduction of other auxiliary packings to aluminum-based copper-clad plate, and insulating properties have very large lifting; Secondly, the direct gluing aluminium sheet of production technology of aluminum-based copper-clad plate can save the work flow of making prepreg, and for follow-up superimposed operation easy, directly covering Copper Foil can complete, thereby has promoted operating efficiency.
Above described embodiment the preferred embodiment of the present invention is described, not the spirit and scope of the present invention are limited.Do not departing under the prerequisite of design concept of the present invention; various modification and improvement that this area ordinary person makes technical scheme of the present invention; all should drop into protection scope of the present invention, the technology contents that the present invention asks for protection, is all documented in claims.
Claims (2)
1. an aluminum-based copper-clad plate, it is characterized in that: comprise gluing aluminium sheet (10) and copper-foil conducting electricity (20), described gluing aluminium sheet (10) is above comprised of after bonding thermal plastic insulation (102) metal aluminum sheet (101), and described copper-foil conducting electricity (20) covers gluing aluminium sheet (10) top.
2. a technique of producing aluminum-based copper-clad plate as claimed in claim 1, is characterized in that:
Step 1: epoxy resin and conductive powder allotment are also coated in the glue mixing up in epoxy resin and conductive powder and form thermal plastic insulation;
Step 2: will suppress and bond together and decompose test after metal aluminum sheet combination after the thermal plastic insulation obtaining in step 1 and surface treatment baking;
Step 3: by the gluing aluminium sheet obtaining in step 2 shear, check, pad pasting, leveling, check again, last packing;
Step 4: cover copper-foil conducting electricity on the gluing aluminium sheet in step 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410252112.6A CN104057656A (en) | 2014-06-09 | 2014-06-09 | Aluminum-based copper-clad plate and production technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410252112.6A CN104057656A (en) | 2014-06-09 | 2014-06-09 | Aluminum-based copper-clad plate and production technology thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104057656A true CN104057656A (en) | 2014-09-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410252112.6A Pending CN104057656A (en) | 2014-06-09 | 2014-06-09 | Aluminum-based copper-clad plate and production technology thereof |
Country Status (1)
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| CN (1) | CN104057656A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107757061A (en) * | 2017-10-13 | 2018-03-06 | 乾乐欣展新材料技术（上海）有限公司 | A kind of aluminium base vacuum hot-pressing process |
-
2014
- 2014-06-09 CN CN201410252112.6A patent/CN104057656A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107757061A (en) * | 2017-10-13 | 2018-03-06 | 乾乐欣展新材料技术（上海）有限公司 | A kind of aluminium base vacuum hot-pressing process |
| CN107757061B (en) * | 2017-10-13 | 2018-11-27 | 乾乐欣展新材料技术（上海）有限公司 | A kind of aluminum substrate vacuum hot-pressing process |
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| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140924 |
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| WD01 | Invention patent application deemed withdrawn after publication |