CN104043911B - 一种可形成均匀组织焊点的无铅焊料及其焊接方法 - Google Patents
一种可形成均匀组织焊点的无铅焊料及其焊接方法 Download PDFInfo
- Publication number
- CN104043911B CN104043911B CN201410296364.9A CN201410296364A CN104043911B CN 104043911 B CN104043911 B CN 104043911B CN 201410296364 A CN201410296364 A CN 201410296364A CN 104043911 B CN104043911 B CN 104043911B
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- CN
- China
- Prior art keywords
- solder
- lead
- free solder
- powder
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
晶粒等效平均直径(μm) | |
实施例1 | 32 |
实施例2 | 24 |
实施例3 | 37 |
实施例4 | 28 |
实施例5 | 52 |
对比例1 | 126 |
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410296364.9A CN104043911B (zh) | 2014-06-27 | 2014-06-27 | 一种可形成均匀组织焊点的无铅焊料及其焊接方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410296364.9A CN104043911B (zh) | 2014-06-27 | 2014-06-27 | 一种可形成均匀组织焊点的无铅焊料及其焊接方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104043911A CN104043911A (zh) | 2014-09-17 |
CN104043911B true CN104043911B (zh) | 2017-08-08 |
Family
ID=51497571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410296364.9A Active CN104043911B (zh) | 2014-06-27 | 2014-06-27 | 一种可形成均匀组织焊点的无铅焊料及其焊接方法 |
Country Status (1)
Country | Link |
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CN (1) | CN104043911B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105127612A (zh) * | 2015-09-28 | 2015-12-09 | 苏州龙腾万里化工科技有限公司 | 一种无铅锡膏 |
CN105728977B (zh) * | 2016-04-29 | 2018-06-19 | 广东中实金属有限公司 | 一种高可靠性低温无铅锡膏及其制备方法 |
US11267080B2 (en) | 2019-05-09 | 2022-03-08 | Indium Corporation | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders |
CN112453752A (zh) * | 2020-11-30 | 2021-03-09 | 云南锡业集团(控股)有限责任公司研发中心 | 一种无铅低温锡基合金焊片 |
CN114211081A (zh) * | 2021-12-15 | 2022-03-22 | 航天科工防御技术研究试验中心 | Sn基无铅多晶焊点的制备方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8293370B2 (en) * | 2006-08-04 | 2012-10-23 | Panasonic Corporation | Bonding material, bonded portion and circuit board |
CN101269444A (zh) * | 2007-03-21 | 2008-09-24 | 长沙泰辉网络科技有限公司 | 一种锡-银-铜三元合金无铅焊锡膏 |
CN101362261A (zh) * | 2007-08-10 | 2009-02-11 | 北京康普锡威焊料有限公司 | 用于电子元器件的低温无铅焊接材料 |
CN101491866B (zh) * | 2008-01-25 | 2014-06-04 | 深圳市亿铖达工业有限公司 | 低温无铅焊锡膏 |
WO2010098357A1 (ja) * | 2009-02-25 | 2010-09-02 | 旭化成イーマテリアルズ株式会社 | 金属フィラー、低温接続鉛フリーはんだ、及び接続構造体 |
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2014
- 2014-06-27 CN CN201410296364.9A patent/CN104043911B/zh active Active
Also Published As
Publication number | Publication date |
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CN104043911A (zh) | 2014-09-17 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SUZHOU HOERSON ELECTRONICS TECHNOLOGY CO., LTD. Effective date: 20150430 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20150430 Address after: 518126 Guangdong city of Shenzhen province Baoan District Xixiang Shu Road third Industrial Zone No. 189 3 6 floor Applicant after: The Han Er of Shenzhen believes Electronic Science and Technology Co., Ltd. Applicant after: Suzhou city hanl Electronic Technology Co. Ltd. Address before: 518126 Guangdong city of Shenzhen province Baoan District Xixiang Shu Road third Industrial Zone No. 189 3 6 floor Applicant before: The Han Er of Shenzhen believes Electronic Science and Technology Co., Ltd. |
|
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 518126 Guangdong city of Shenzhen province Baoan District Xixiang Shu Road third Industrial Zone No. 189 3 6 floor Applicant after: The Han Er of Shenzhen believes Electronic Science and Technology Co., Ltd. Applicant after: Suzhou Han Er believes Electronic Science and Technology Co., Ltd. Address before: 518126 Guangdong city of Shenzhen province Baoan District Xixiang Shu Road third Industrial Zone No. 189 3 6 floor Applicant before: The Han Er of Shenzhen believes Electronic Science and Technology Co., Ltd. Applicant before: Suzhou city hanl Electronic Technology Co. Ltd. |
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