CN104037292B - Modular cutting tool assembly and the method that separate type cutting is carried out to ceramic substrate LED - Google Patents
Modular cutting tool assembly and the method that separate type cutting is carried out to ceramic substrate LED Download PDFInfo
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- CN104037292B CN104037292B CN201410273652.2A CN201410273652A CN104037292B CN 104037292 B CN104037292 B CN 104037292B CN 201410273652 A CN201410273652 A CN 201410273652A CN 104037292 B CN104037292 B CN 104037292B
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- Prior art keywords
- grinding wheel
- milling cutter
- disc milling
- cutter piece
- ceramic substrate
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
A kind of method that separate type cutting is carried out the invention discloses gang tool and to ceramic substrate LED.Gang tool includes main shaft and the spindle flange, grinding wheel, flange gasket, disc milling cutter piece, pad and the locking device that are sequentially arranged on main shaft, the diameter with diameter greater than disc milling cutter piece of grinding wheel.Cutting method is：Transverse cuts and longitudinally cutting are carried out to LED sheet materials using gang tool, in cutting process, grinding wheel carries out grinding to ceramic substrate, and disc milling cutter piece carries out Milling Process to glue-line, and grinding wheel and disc milling cutter piece are carried out simultaneously.The present invention, can be carried out separate type cutting and can be improved cutting efficiency and quality to glue-line and ceramic substrate simultaneously using the cutter and different processing modes of different shape.
Description
Technical field
The present invention relates to the modular cutting tool assembly of a kind of different-diameter and different shape and based on the modular cutting tool assembly to ceramics
The method that substrate LED carries out separate type cutting.
Background technology
The caloric value of single device of current great power LED is substantially increased with power, in order to solve heat dissipation problem, therein one
Individual solution is to use metal or ceramic substrate, wherein, COB LED can use metal substrate, it would however also be possible to employ ceramic base
Plate, and CHIP LED mainly use ceramic substrate.When CHIP LED are production, big sheet for dispensing glue is typically produced,
Then sheet material is cut, but ceramics belong to crisp hard material, can only be cut using harder skive, cutting mode
It is grinding.
Skive can be divided into metal-base diamond grinding wheel and resin base diamond grinding wheel according to the difference of binding agent,
The property of basic material determines the hardness of skive, so as to be suitable for the cutting of different materials, meets different processing
Required precision.Generally speaking, resin base diamond grinding wheel hardness is relatively low, and self-sharpening is good, it is adaptable to the harder more crisp material of polishing
Material, the surface accuracy of acquisition is higher, but abrasion is very fast；Metal-base diamond grinding wheel is then opposite.However, in CHIP LED chips
In the case of surface is for dispensing glue, can then there is the situation of the viscous knife of silica gel using resin base diamond grinding wheel, make a part of Buddha's warrior attendant
The blade of stone can not participate in cutting, have impact on the effect of the cutting of ceramics, and common cutting problem is that tangent plane is inclined to trapezoidal faces；
Meanwhile, the cutting force of grinding is larger, easily pulls the gold thread on chip, and big cutting force brings big cutting
Heat, easily burns out silica gel.Silica gel then can be smoothly cut using metal-base diamond grinding wheel, silicon is alleviated or avoided to a certain extent
The situation of gluing knife, but Wheel hardness is higher, exacerbates the rupture of ceramic substrate, forms substantial amounts of crackle, collapses broken and projection
Deng.Single skive has been difficult to solve the mixing cutting of fragile material and plastic material.
The content of the invention
The first object of the present invention is to provide a kind of cutter of utilization different shape can be while enter to glue-line and ceramic substrate
Row separate type is cut and can improve the modular cutting tool assembly of cutting efficiency and quality.
The second object of the present invention is to provide a kind of cutter of utilization different shape can be while enter to glue-line and ceramic substrate
Row separate type is cut and can improve the cutting method of cutting efficiency and quality.
To reach above-mentioned first purpose, modular cutting tool assembly, including main shaft, spindle flange, grinding wheel, flange gasket, dish type
Cutter blade, pad and locking device, from back to front spindle flange, grinding wheel, flange gasket, disc milling cutter piece, pad and locking
Device is sequentially arranged on main shaft, wherein, the diameter with diameter greater than disc milling cutter piece of grinding wheel, disc milling cutter piece each cutting edge
Anterior angle and relief angle be on the occasion of；The thickness of the flange gasket LED length of sides corresponding with precut direction are identical；Described grinding wheel
It is resin base diamond grinding wheel piece, the material of disc milling cutter piece is consistent with the material of metal-base diamond grinding wheel.
The modular cutting tool assembly of said structure, the spacing between grinding wheel and disc milling cutter piece is just a size of LED,
LED sizes after the thickness of control flange pad then can accurately ensure cutting.Described spindle flange is fixed on main shaft
On, for positioning grinding wheel, and then dish type cutter blade is installed with flange gasket, grinding wheel and disk are then locked by locking nut
Shape cutter blade.For above-mentioned cutter, because grinding wheel is different from the diameter of disc milling cutter piece, during feed, using dish type
The cutting edge of cutter blade carries out Milling Process to glue-line, and grinding is carried out to ceramic substrate using grinding wheel, it is achieved thereby that
To glue-line and ceramic substrate can separate the purpose of cutting in diverse location simultaneously using two cutters.Using combinations thereof formula knife
Tool, takes the advantage of its respective cutter form, avoids the shortcoming of respective cutter material, therefore, the gang tool can not only be improved
Cutting efficiency, and improve the quality of cutting.
Further, the flange gasket end face near disc milling cutter piece is provided with the boss for positioning dish type cutter blade；
The first groove that the hole passed through from main shaft stretches out is provided near the flange gasket end face of grinding wheel, beyond the first groove
Flange gasket end face compresses grinding wheel；Pad end face near disc milling cutter piece is provided with what the hole passed through from main shaft stretched out
Second groove, the tight disc milling cutter piece of gasket-end face pressure beyond the second groove；Locking device is pressed on pad.It is convex by setting
Platform and first, second groove, in order to grinding wheel and disc milling cutter piece is more firmly fixed.
Further, grinding wheel is equal or bigger with the semidiameter of disc milling cutter piece and the thickness of ceramic substrate, so, protects
Card can just cut off glue-line and ceramic substrate during one-pass, be easy to be controlled equipment.
Further, described locking device is locking nut.
To reach above-mentioned second purpose, separate type cutting is carried out to ceramic substrate LED based on described modular cutting tool assembly
Method, comprises the following steps：
（1）Gang tool is arranged on the main shaft of lathe, the length of side according to LED selects the thickness of flange gasket, if LED
It is square, a flange gasket is only needed, if LED is rectangle, the method for another thickness need to be used on another a machine tool
Blue pad installs cutter；
（2）Ceramic substrate for dispensing glue is bonded on pad pasting, then is attached on pallet, then fixed tray is on workbench；
（3）The upright position of adjustment work platform so that grinding wheel one-pass can completely cut through ceramic substrate；
（4）First time transverse cuts are carried out, during first time transverse cuts, disc milling cutter piece cutting glue-line, grinding wheel does not enter
Row cutting；
（5）Mobile work platform, makes the size of movable workbench be grinding wheel and the centre-to-centre spacing of disc milling cutter piece, using combination
Cutter carries out second transverse cuts, and now, disc milling cutter piece cuts the glue-line of next path, and grinding wheel is corresponded exactly to
Together it is cut fall glue-line path and ceramic substrate is cut；
（6）According to above-mentioned steps（5）Transverse cuts are carried out successively until disc milling cutter piece cuts to last one glue-line；
（7）Mobile work platform, makes the size of movable workbench be grinding wheel and the centre-to-centre spacing of disc milling cutter piece, using combination
Cutter carries out last time transverse cuts, and now, disc milling cutter piece does not cut, and grinding wheel corresponds exactly to cut together
Slice off the path of glue-line and ceramic substrate is cut；
（8）If LED is square, it is transferred to（9）；If LED is rectangle, pallet is taken out, be installed to another a machine tool
Workbench on, 90 ° of worktable rotary repeats the above steps（4）、（5）、（6）、（7）；
（9）By 90 ° of worktable rotary, lathe compensates the wear extent of cutter automatically；
（10）Carry out it is longitudinally cutting for the first time, when longitudinally cutting for the first time, disc milling cutter piece cutting glue-line, grinding wheel do not enter
Row cutting；
（11）Mobile work platform, makes the size of movable workbench be grinding wheel and the centre-to-centre spacing of disc milling cutter piece, using group
Closing cutter carries out second longitudinally cutting, and now, disc milling cutter piece cuts the glue-line of next path, and grinding wheel is corresponded exactly to
On together it is cut fall glue-line path and ceramic substrate is cut；
（12）According to above-mentioned steps（11）Carry out successively longitudinally cutting until disc milling cutter piece cuts to last one glue-line；
（13）Mobile work platform, makes the size of movable workbench be grinding wheel and the centre-to-centre spacing of disc milling cutter piece, using group
Close cutter carry out last time it is longitudinally cutting, now, disc milling cutter piece does not cut, grinding wheel correspond exactly to together by
Cut away the path of glue-line and ceramic substrate is cut, so as to complete the separate type cutting carried out to ceramic substrate LED.
Above-mentioned cutting method, because grinding wheel is different from the diameter of disc milling cutter piece, both forms are different, so-called shape
State difference refers to grinding wheel all different from the structure and material composition of disc milling cutter piece, during feed, using disc milling cutter
The Milling Process that piece can be well on to glue-line.What is carried out due to disc milling cutter piece is Milling Process, and participate in cutting is whole
The blade of cutting edge, and the size of cutting edge is larger, the silica gel being cut off flows along rake face, although still suffering from viscous knife,
But blade exposes all the time, the influence of viscous knife can almost be ignored.Positive rake angle promotes the flowing and discharge of silica gel chip again.No
As diamond wheel grinding processing, the cutting edge of each diamond particles is very trickle, and the silica gel for gluing knife can covering part cutting
Sword is cut, crudy is influenceed.Simultaneously as desk blade with cutter tooth is knife-tooth structure, it is to avoid grinding, therefore, cut
Cut power smaller, it is not easy to pull the gold thread on chip, and cutting heat is few, it is not easy to glue-line of burning.It is firm using resin fund
Stone grinding wheel cuts to ceramic substrate, and its self-sharpening is good, it is adaptable to the harder more crisp material of polishing, the surface essence of acquisition
Du Genggao, it is to avoid the rupture of ceramic substrate, forms substantial amounts of crackle, broken and projection etc. is collapsed, it is achieved thereby that using two cutter energy
To glue-line and ceramic substrate separate the purpose of cutting simultaneously, and cut quality and efficiency can be improved again.
Further, the ceramic substrate for dispensing glue being bonded on pad pasting is bonded on pallet, then is fixed to the suction of workbench
On disk, in order to fixed and dismounting ceramic substrate, and fixed good reliability.
Further, grinding wheel is equal or bigger with the semidiameter of disc milling cutter piece and the thickness of ceramic substrate, so, protects
Card can just cut off glue-line and ceramic substrate during one-pass, be easy to be controlled equipment.
Further, the length of side of the distance between two cutters equal to LED, the i.e. thickness of flange gasket, can be according to LED
The length of side from suitable thickness flange gasket, so as to determine cutting after LED sizes.
Further, the flange gasket end face near disc milling cutter piece is provided with the boss for positioning dish type cutter blade；
The first groove that the hole passed through from main shaft stretches out is provided near the flange gasket end face of grinding wheel, beyond the first groove
Flange gasket end face compresses grinding wheel；Pad end face near disc milling cutter piece is provided with what the hole passed through from main shaft stretched out
Second groove, the tight disc milling cutter piece of gasket-end face pressure beyond the second groove；Locking device is pressed on pad.It is convex by setting
Platform and groove, in order to grinding wheel and disc milling cutter piece is more firmly fixed.
Further, resin base diamond grinding wheel pad wear reaches and changed when to a certain degree a little bit smaller disc milling cutter of radius
Piece, it is ensured that resin base diamond grinding wheel piece is suitable with ceramic substrate thickness with disc milling cutter piece semidiameter, to improve the matter of cutting
Amount.
Brief description of the drawings
Fig. 1 is the stereogram of modular cutting tool assembly.
Fig. 2 is the stereogram exploded view of modular cutting tool assembly.
Fig. 3 is the schematic diagram of flange gasket.
Specific embodiment
The present invention will be described in further detail with reference to the accompanying drawings and detailed description.
As shown in Figure 1 to Figure 2, modular cutting tool assembly includes main shaft 1, spindle flange 2, grinding wheel 3, flange gasket 4, dish type milling
Blade 5, pad 6 and locking device, described spindle flange 2 are fixed on main shaft 1, and general both are structure as a whole, from backward
Preceding grinding wheel 3, flange gasket 4, disc milling cutter piece 5, pad 6 are enclosed within main shaft 1, and install grinding wheel 2 using flange gasket 4,
Locking device is locking nut, and locking nut 7 is threadedly attached in one end of main shaft 1, for the grinding wheel 3, method that is locked
Blue pad 4, disc milling cutter piece 5, pad 6, wherein, the thickness of flange gasket 4 is flexibly selected according to the size of LED, grinding wheel 2
With diameter greater than the diameter of disc milling cutter piece 5, semidiameter is equal with the thickness of ceramic substrate or bigger；The thickness of flange gasket 4 with
The length of side of the precut corresponding LED in direction is identical, as shown in figure 3, the end face of flange gasket 4 near disc milling cutter piece 5 is provided with
Boss 41 for positioning dish type cutter blade；The hole passed through from main shaft is provided near the end face of flange gasket 4 of grinding wheel 3 outside
The first groove 42 for extending, the overall diameter of the overall diameter more than boss 41 of the first groove 42, the flange gasket beyond the first groove 42
The tight grinding wheel 3 of bit end face pressure；Pad end face near disc milling cutter piece is provided with the hole passed through from main shaft stretches out second
Groove 61, the tight disc milling cutter piece of gasket-end face pressure beyond the second groove 61；Locking nut is pressed on pad 6.Cutter is installed
Process be that first grinding wheel 3 is enclosed within main shaft 1, allow the end face of grinding wheel 3 to be contacted with spindle flange 2, then by flange gasket
Piece 4 is enclosed within main shaft 1, and the flange gasket end face beyond the first groove 42 is contacted with grinding wheel 3, then installs dish type cutter blade 5,
Allow boss to be contacted with disc milling cutter piece, then, pad 6 is enclosed within main shaft 1, the pad end face and disk allowed beyond the second groove 61
Shape cutter blade is contacted, and finally locks locking nut so that the flange gasket end face beyond the first groove 42 compresses grinding wheel 3, convex
Platform compresses dish type cutter blade, the tight disc milling cutter piece of gasket-end face pressure beyond the second groove 61, so as to realize to the firm of cutter
Install.
Described grinding wheel 2 is resin base diamond grinding wheel piece, and the material of disc milling cutter piece 5 is and metal-base diamond sand
The material of wheel is consistent.
It is to the method that ceramic substrate LED carries out separate type cutting using combinations thereof cutter：
（1）Gang tool is arranged on the main shaft 1 of lathe, the length of side according to LED selects the thickness of flange gasket 4, if
LED is square, only needs a flange gasket 4, if LED is rectangle, another thickness need to be used on another a machine tool
Flange gasket 4 install cutter.
（2）Ceramic substrate for dispensing glue is bonded on pad pasting, then is attached on pallet, be then attached to the sucker of workbench
On, to improve the fix tightly solidity to ceramic substrate.
（3）The upright position of adjustment work platform so that the one-pass of grinding wheel 2 can completely cut through ceramic substrate.
（4）First time transverse cuts are carried out, during first time transverse cuts, the cutting glue-line of disc milling cutter piece 5, grinding wheel 2 is not
Cut.
（5）Mobile work platform, makes the size of movable workbench be grinding wheel and the centre-to-centre spacing of disc milling cutter piece, using combination
Cutter carries out second transverse cuts, and now, disc milling cutter piece 5 cuts the glue-line of next path, and grinding wheel 2 is corresponded exactly to
On together it is cut fall glue-line path and ceramic substrate is cut.
（6）According to above-mentioned steps（5）Transverse cuts are carried out successively until disc milling cutter piece 5 cuts to last one glue-line.
（7）Mobile work platform, makes the LEDs of movable workbench one make the size of movable workbench be grinding wheel and disc milling cutter
The centre-to-centre spacing of piece, last time transverse cuts are carried out using gang tool, and now, disc milling cutter piece 5 does not cut, and grinding wheel 2 is firm
Well correspond to it is upper together it is cut fall glue-line path and ceramic substrate is cut.
（8）If LED is square, it is transferred to（9）；If LED is rectangle, pallet is taken out, be installed to another a machine tool
Workbench on, 90 ° of worktable rotary repeats the above steps（4）、（5）、（6）、（7）；
（9）By 90 ° of worktable rotary, lathe compensates the wear extent of cutter automatically.
（10）Carry out for the first time it is longitudinally cutting, for the first time it is longitudinally cutting when, disc milling cutter piece 5 cutting glue-line, grinding wheel 2 is not
Cut.
（11）Mobile work platform, makes the size of movable workbench be grinding wheel and the centre-to-centre spacing of disc milling cutter piece, using group
Closing cutter carries out second longitudinally cutting, and now, disc milling cutter piece 5 cuts the glue-line of next path, and grinding wheel 2 is just corresponded to
In it is upper together it is cut fall glue-line path and ceramic substrate cut.
（12）According to above-mentioned steps（11）Carry out successively longitudinally cutting until disc milling cutter piece 5 cuts to last one glue
Layer.
（13）Mobile work platform, makes the size of movable workbench be grinding wheel and the centre-to-centre spacing of disc milling cutter piece, using group
Close cutter carry out last time it is longitudinally cutting, now, disc milling cutter piece 5 is not cut, and grinding wheel 2 is corresponded exactly to together
It is cut the path of glue-line and ceramic substrate is cut, so as to completes the separate type cutting carried out to ceramic substrate LED.
In the present embodiment, cut mainly for CHIP LED.
Radius is changed in cutting process, when if tree aliphatic radical skive pad wear reaches to a certain degree a little bit smaller
Desk blade with cutter tooth, it is ensured that resin base diamond grinding wheel is suitable with ceramic substrate thickness with the semidiameter of disc milling cutter piece 5.
Present embodiment, because grinding wheel 2 is different from the diameter of disc milling cutter piece 4, both forms are different, in feed
Cheng Zhong, the Milling Process that glue-line can be well on using disc milling cutter piece 5.What is carried out due to disc milling cutter piece is that milling adds
Work, participate in cutting is the blade of whole cutting edge, and the size of cutting edge is larger, and the silica gel being cut off is along rake face stream
Dynamic, although still suffering from viscous knife, blade exposes all the time, and the influence of viscous knife can almost be ignored.Positive rake angle promotes silicon again
The flowing and discharge of glue chip.Unlike diamond wheel grinding processing, the cutting edge of each diamond particles is very trickle, glues
The silica gel of knife can covering part cutting edge, influence crudy.Simultaneously as disc milling cutter piece 5 is knife-tooth structure, it is to avoid mill
Processing is cut, therefore, cutting force is smaller, it is not easy to pull the gold thread on chip, and cutting heat is few, it is not easy to glue-line of burning.
Ceramic substrate is cut using grinding wheel 2, its self-sharpening is good, it is adaptable to the harder more crisp material of polishing, the table of acquisition
Face precision is higher, it is to avoid the rupture of ceramic substrate, forms substantial amounts of crackle, broken and projection etc. is collapsed, it is achieved thereby that using two knives
Tool to glue-line and ceramic substrate can separate the purpose of cutting simultaneously, and can improve cut quality and efficiency again.
Claims (9)
1. modular cutting tool assembly, it is characterised in that：Including main shaft, spindle flange, grinding wheel, flange gasket, disc milling cutter piece, pad
And locking device, spindle flange, grinding wheel, flange gasket, disc milling cutter piece, pad and locking device are sequentially arranged at from back to front
On main shaft, wherein, the diameter with diameter greater than disc milling cutter piece of grinding wheel, the anterior angle and relief angle of disc milling cutter piece each cutting edge
Be on the occasion of；The thickness of the flange gasket LED length of sides corresponding with precut direction are identical；Described grinding wheel is that resin fund is firm
Stone grinding wheel, the material of disc milling cutter piece is consistent with the material of metal-base diamond grinding wheel.
2. modular cutting tool assembly according to claim 1, it is characterised in that：On the flange gasket end face of disc milling cutter piece
It is provided with the boss for positioning dish type cutter blade；The hole passed through from main shaft is provided near the flange gasket end face of grinding wheel outside
The first groove for extending, the flange gasket end face beyond the first groove compresses grinding wheel；Near the pad end face of disc milling cutter piece
The second groove that the hole passed through from main shaft stretches out is provided with, the tight disc milling cutter piece of gasket-end face pressure beyond the second groove；
Locking device is pressed on pad.
3. modular cutting tool assembly according to claim 1, it is characterised in that：The semidiameter of grinding wheel and disc milling cutter piece and pottery
The thickness of porcelain substrate is equal.
4. modular cutting tool assembly according to claim 1, it is characterised in that：Described locking device is locking nut.
5. the method for separate type cutting being carried out to ceramic substrate LED based on the modular cutting tool assembly described in claim 1, its feature exists
In comprising the following steps：
（1）Gang tool is arranged on the main shaft of lathe, the length of side according to LED selects the thickness of flange gasket, if LED is in just
It is square, a flange gasket is only needed, if LED is rectangle, the flange gasket of another thickness need to be used on another a machine tool
Piece installs cutter；
（2）Ceramic substrate for dispensing glue is bonded on pad pasting, then is attached on pallet, then fixed tray is on workbench；
（3）The upright position of adjustment work platform so that grinding wheel one-pass can completely cut through ceramic substrate；
（4）First time transverse cuts are carried out, during first time transverse cuts, disc milling cutter piece cutting glue-line, grinding wheel is cut
Cut；
（5）Mobile work platform, makes the size of movable workbench be grinding wheel and the centre-to-centre spacing of disc milling cutter piece, using gang tool
Second transverse cuts is carried out, now, disc milling cutter piece cuts the glue-line of next path, and grinding wheel is corresponded exactly to together
It is cut fall glue-line path and ceramic substrate is cut；
（6）According to above-mentioned steps（5）Transverse cuts are carried out successively until disc milling cutter piece cuts to last one glue-line；
（7）Mobile work platform, makes the size of movable workbench be grinding wheel and the centre-to-centre spacing of disc milling cutter piece, using gang tool
Carry out last time transverse cuts, now, disc milling cutter piece does not cut, grinding wheel correspond exactly to together it is cut fall
Simultaneously ceramic substrate is cut in the path of glue-line；
（8）If LED is square, it is transferred to（9）；If LED is rectangle, pallet is taken out, be installed to the work of another a machine tool
Make on platform, 90 ° of worktable rotary repeats the above steps（4）、（5）、（6）、（7）；
（9）By 90 ° of worktable rotary, lathe compensates the wear extent of cutter automatically；
（10）Carry out it is longitudinally cutting for the first time, when longitudinally cutting for the first time, disc milling cutter piece cutting glue-line, grinding wheel cut
Cut；
（11）Mobile work platform, makes the size of movable workbench be grinding wheel and the centre-to-centre spacing of disc milling cutter piece, using combining knife
Tool carries out second longitudinally cutting, and now, disc milling cutter piece cuts the glue-line of next path, and grinding wheel corresponds exactly to one
Road it is cut fall glue-line path and ceramic substrate is cut；
（12）According to above-mentioned steps（11）Carry out successively longitudinally cutting until disc milling cutter piece cuts to last one glue-line；
（13）Mobile work platform, makes the size of movable workbench be grinding wheel and the centre-to-centre spacing of disc milling cutter piece, using combining knife
Tool carry out last time it is longitudinally cutting, now, disc milling cutter piece does not cut, and grinding wheel corresponds exactly to cut together
Fall the path of glue-line and ceramic substrate is cut, so as to complete the separate type cutting carried out to ceramic substrate LED.
6. the method for carrying out separate type cutting to ceramic substrate LED based on modular cutting tool assembly according to claim 5, it is special
Levy and be：The ceramic substrate for dispensing glue being bonded on pad pasting is bonded on pallet, then is fixed on the sucker of workbench.
7. the method for carrying out separate type cutting to ceramic substrate LED based on modular cutting tool assembly according to claim 5 or 6,
It is characterized in that：Grinding wheel is equal with the semidiameter of disc milling cutter piece and the thickness of ceramic substrate.
8. the method for carrying out separate type cutting to ceramic substrate LED based on modular cutting tool assembly according to claim 5, it is special
Levy and be：The boss for positioning dish type cutter blade is provided near the flange gasket end face of disc milling cutter piece；Near grinding wheel
Flange gasket end face be provided with the first groove that the hole passed through from main shaft stretches out, the flange gasket bit end beyond the first groove
The tight grinding wheel of face pressure；Pad end face near disc milling cutter piece is provided with the second groove that the hole passed through from main shaft stretches out,
The tight disc milling cutter piece of gasket-end face pressure beyond second groove；Locking device is pressed on pad.
9. the method for carrying out separate type cutting to ceramic substrate LED based on modular cutting tool assembly according to claim 5, it is special
Levy and be：Resin base diamond grinding wheel pad wear reaches and changed when to a certain degree a little bit smaller disc milling cutter piece of radius, it is ensured that tree
Aliphatic radical skive piece is suitable with ceramic substrate thickness with the semidiameter of disc milling cutter piece.
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| CN108129067B (en) * | 2017-12-30 | 2020-09-29 | 苏州赛尔科技有限公司 | Diamond scribing knife for ceramic substrate segmentation and preparation method thereof |
| CN110170849A (en) * | 2019-06-25 | 2019-08-27 | 绍兴创举汽车同步器齿环有限公司 | A kind of multi-functional processing assembly of lathe |
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| CN201320721Y (en) * | 2008-12-19 | 2009-10-07 | 无锡杰尔压缩机有限公司 | Combined wheelhead for grinding wheel sander |
| CN102649181A (en) * | 2011-02-25 | 2012-08-29 | 兼房株式会社 | Combined cutter |
| CN203018816U (en) * | 2012-12-26 | 2013-06-26 | 无锡市贝斯特精密机械有限公司 | Composite metal slitting saw |
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