CN208262635U - Grinding wheel is thinned in ceramic bond diamond - Google Patents
Grinding wheel is thinned in ceramic bond diamond Download PDFInfo
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- CN208262635U CN208262635U CN201820651625.8U CN201820651625U CN208262635U CN 208262635 U CN208262635 U CN 208262635U CN 201820651625 U CN201820651625 U CN 201820651625U CN 208262635 U CN208262635 U CN 208262635U
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- diamond
- aluminium alloy
- thinned
- hard aluminium
- grinding
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Abstract
The utility model relates to ceramic bond diamonds, and grinding wheel is thinned, and can effectively solve resin wheel rigidity deficiency, wear no resistance, service life is short, and sharp property is poor, sharpness is poor, it is difficult to which meet working integrated circuit chip needs problem.The utility model includes hard aluminium alloy matrix and diamond grinding body, hard aluminium alloy matrix is cylindrical body, its center is provided with groove, the baseplane center of groove is provided with assembly through-hole, location hole is evenly equipped on the hard aluminium alloy matrix of recessed circumferential, multiple diamond grinding body fixed grooves are provided in hard aluminium alloy base plane on the outside of it, it is rectangle helical form to be evenly arranged in hard aluminium alloy base plane, combined dose of strong bond has diamond grinding body to constitute helical form grinding structure in each diamond grinding body fixed groove.The utility model cutting is sharp, and grinding efficiency is high, and machining accuracy easy to control, service life is longer, and is easy finishing, is very suitable to the thinned processing of silicon wafer, there is good economic and social benefit.
Description
Technical field
The utility model relates to grinding wheel, grinding wheel is thinned in especially a kind of ceramic bond diamond.
Background technique
Grinding wheel is the round FIxed abrasive article that there is through-hole in the center made of abrasive material and bonding agent etc..Grinding wheel is dosage in grinding tool
Maximum, the most wide one kind of using face.Thinned grinding wheel is mainly used for integrated circuit, backside of wafer or just in discrete device manufacturing process
The corase grinding in face, fine grinding thinned processing.The usual resins skive porosity is small, usually below 5%.It is carried on the back for silicon wafer
When grinding is thinned in face, chip removal ability is poor, and damaged layer on surface of silicon slice is big, and resin anchoring agent diamond grinding wheel, which wears no resistance, to be caused to process
Workpiece with form surface low precision, it is easily-deformable.Metal bonded wheel self-sharpening is bad, and grinding force is big, calorific value great Yi burn workpiece, sternly
It will lead to the broken of silicon wafer when weight.As the requirement of processing is higher and higher, the prior art is improved and is innovated, developed novel
Wafer thinning grinding wheel it is imperative.
Utility model content
For above situation, for the defect for overcoming the prior art, the purpose of the utility model is just to provide a kind of ceramic junction
Grinding wheel is thinned in mixture diamond, can effectively solve resin wheel rigidity deficiency, wear no resistance, service life is short, and sharp property is poor, sharp
It is poor to spend, it is difficult to which meet working integrated circuit chip needs problem.
The technical solution that the utility model solves is that a kind of thinned grinding wheel of ceramic bond diamond, including hard aluminium close
Auri body and diamond grinding body, hard aluminium alloy matrix are cylindrical body, and center is provided with groove, in the baseplane of groove
The heart is provided with assembly through-hole, and location hole, the hard aluminium alloy on the outside of location hole are evenly equipped on the hard aluminium alloy matrix of recessed circumferential
Multiple diamond grinding body fixed grooves are provided in base plane, it is uniformly distributed that diamond grinding body fixed groove is rectangle helical form
In hard aluminium alloy base plane, combined dose of strong bond has Buddha's warrior attendant stone mill in each diamond grinding body fixed groove
It cuts body and constitutes helical form grinding structure.
The utility model have, wearability good feature strong to diamond abrasive grain holding power, unique more air hole structures,
Being conducive to cooling and hold bits, therefore has cutting sharp, grinding efficiency is high, and it is not easy to generate heat in grinding process and block, thermal expansion
Measure small, machining accuracy easy to control, service life is longer, and is easy finishing, is very suitable to the thinned processing of silicon wafer, there is good warp
Ji and social benefit.
Detailed description of the invention
Fig. 1 is the structural front view of the utility model.
Fig. 2 is the cross sectional side view of the utility model structure.
Specific embodiment
It elaborates below in conjunction with attached drawing to specific embodiment of the present utility model.
As shown in Fig. 1, Fig. 2, grinding wheel, including hard aluminium alloy base is thinned in a kind of ceramic bond diamond of the utility model
Body 1 and diamond grinding body 2, hard aluminium alloy matrix 1 are cylindrical body, and center is provided with groove 5, in the baseplane of groove
The heart is provided with assembly through-hole 5-1, is evenly equipped with location hole 3, the hard aluminium on the outside of location hole on the hard aluminium alloy matrix of recessed circumferential
Multiple diamond grinding body fixed grooves 4 are provided in alloy substrate plane, diamond grinding body fixed groove 4 is rectangle spiral
Shape is evenly arranged in hard aluminium alloy base plane, and combined dose of strong bond has in each diamond grinding body fixed groove 4
Diamond grinding body 2 constitutes helical form grinding structure.
In order to guarantee using effect and easy to use, described diamond grinding body 2 is by ceramet bonding agent and gold
The two sides that hard rock abrasive mixed combined pressure system sinters into is in the cuboid of semicircle shape.
The one side aperture that described groove 5 is equipped with diamond grinding body 2 is greater than the aperture that one end is connect with assembly through-hole
The round recessed shape on the inclined-plane 6 of composition.
There is screw thread 3-1 in described 3 inner hole surface of location hole, location hole there are uniformly distributed 6, plays fixed make to the positioning of grinding wheel
With.
Described assembly through-hole 5-1 is circle, and groove 5 and assembly through-hole 5-1 play assembly and positioning action to grinding wheel.
When the utility model is used, being mounted on grinding machine by assembly through-hole 5-1 can be used；Ceramet bonding agent makes
With Low-temperature vitrified bond, the rigidity and sharpness of grinding wheel are improved, guarantees the biggish depth of cut, improves processing efficiency, have
Effect overcomes the low service life of common resin diamond grinding wheel, especially suitable for the processing of IC wafer, with the prior art
It is had the advantage that compared to the utility model
1) grinding efficiency is high;
2) there is very high-wearing feature, abrasive grain consumption is few；
3) workpiece accuracy being ground is high, and surface quality is good, and the shape retention of workpiece is good.
In short, the utility model has structure simple, and novel and unique, manufacture easy to produce, at low cost, good product quality, tool
There is cutting sharp, grinding efficiency is high, is not easy to generate heat in grinding process and block, and thermal expansion amount is small, machining accuracy easy to control, uses
It lasts a long time, and is easy finishing, be very suitable to the thinned processing of silicon wafer, there is good economic and social benefit.
Claims (5)
1. grinding wheel is thinned in a kind of ceramic bond diamond, including hard aluminium alloy matrix and diamond grinding body, feature exist
In described hard aluminium alloy matrix (1) is cylindrical body, and center is provided with groove (5), and the baseplane center of groove is provided with
It assembles through-hole (5-1), is evenly equipped with location hole (3) on the hard aluminium alloy matrix of recessed circumferential, the hard aluminium on the outside of location hole closes
Multiple diamond grinding body fixed grooves (4) are provided in golden base plane, diamond grinding body fixed groove (4) is rectangle spiral shell
Rotation shape is evenly arranged in hard aluminium alloy base plane, is securely glued for combined dose in each diamond grinding body fixed groove (4)
It is connected to diamond grinding body (2) and constitutes helical form grinding structure.
2. grinding wheel is thinned in ceramic bond diamond according to claim 1, which is characterized in that described diamond grinding
Body (2) be by ceramet bonding agent and diamond abrasive mixing compacting sintering at two sides be in semicircle shape cuboid.
3. grinding wheel is thinned in ceramic bond diamond according to claim 1, which is characterized in that described groove (5) is
The circle on the inclined-plane (6) that the one side aperture equipped with diamond grinding body (2) is greater than to be constituted with the aperture that assembly through-hole connect one end is recessed
Channel-shaped.
4. grinding wheel is thinned in ceramic bond diamond according to claim 1, which is characterized in that described location hole (3)
Have in inner hole surface screw thread (3-1), location hole there are uniformly distributed 6.
5. grinding wheel is thinned in ceramic bond diamond according to claim 1, which is characterized in that described assembly through-hole
(5-1) is circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820651625.8U CN208262635U (en) | 2018-05-03 | 2018-05-03 | Grinding wheel is thinned in ceramic bond diamond |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820651625.8U CN208262635U (en) | 2018-05-03 | 2018-05-03 | Grinding wheel is thinned in ceramic bond diamond |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208262635U true CN208262635U (en) | 2018-12-21 |
Family
ID=64681928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820651625.8U Active CN208262635U (en) | 2018-05-03 | 2018-05-03 | Grinding wheel is thinned in ceramic bond diamond |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208262635U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110561272A (en) * | 2019-10-23 | 2019-12-13 | 无锡市兰天金刚石有限责任公司 | Superhard tool for dressing grinding wheel and preparation method thereof |
| CN112296889A (en) * | 2020-11-06 | 2021-02-02 | 河南科恩超硬材料技术有限公司 | Thinned porous ceramic composite bonding agent for SIC wafer, diamond tool bit, grinding wheel and manufacturing method of grinding wheel |
-
2018
- 2018-05-03 CN CN201820651625.8U patent/CN208262635U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110561272A (en) * | 2019-10-23 | 2019-12-13 | 无锡市兰天金刚石有限责任公司 | Superhard tool for dressing grinding wheel and preparation method thereof |
| CN112296889A (en) * | 2020-11-06 | 2021-02-02 | 河南科恩超硬材料技术有限公司 | Thinned porous ceramic composite bonding agent for SIC wafer, diamond tool bit, grinding wheel and manufacturing method of grinding wheel |
| CN112296889B (en) * | 2020-11-06 | 2021-11-09 | 河南科恩超硬材料技术有限公司 | Thinned porous ceramic composite bonding agent for SIC wafer, diamond tool bit, grinding wheel and manufacturing method of grinding wheel |
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