CN104037292A - Combined cutter and separable cutting method of ceramic substrate LED - Google Patents
Combined cutter and separable cutting method of ceramic substrate LED Download PDFInfo
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- CN104037292A CN104037292A CN201410273652.2A CN201410273652A CN104037292A CN 104037292 A CN104037292 A CN 104037292A CN 201410273652 A CN201410273652 A CN 201410273652A CN 104037292 A CN104037292 A CN 104037292A
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- grinding wheel
- milling cutter
- disc milling
- ceramic substrate
- sheet
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- 238000005520 cutting process Methods 0.000 title claims abstract description 89
- 239000000919 ceramic Substances 0.000 title claims abstract description 63
- 239000000758 substrate Substances 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000003801 milling Methods 0.000 claims abstract description 97
- 238000000227 grinding Methods 0.000 claims abstract description 94
- 239000000463 material Substances 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 229910003460 diamond Inorganic materials 0.000 claims description 11
- 239000010432 diamond Substances 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 7
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 238000003672 processing method Methods 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000000741 silica gel Substances 0.000 description 10
- 229910002027 silica gel Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 206010011376 Crepitations Diseases 0.000 description 3
- 208000037656 Respiratory Sounds Diseases 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 229910001651 emery Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 1
- 229910001573 adamantine Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- -1 wherein Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a combined cutter and separable cutting method of a ceramic substrate LED. The combined cutter comprises a main shaft, a main shaft flange, a grinding wheel sheet, a flange gasket, a disk shaped milling sheet, a gasket and a locking device, wherein the main shaft flange, the grinding wheel sheet, the flange gasket, the disk shaped milling sheet, the gasket and the locking device are sequentially arranged on the main shaft; the diameter of the grinding wheel sheet is more than that of the disk shaped milling sheet. The cutting method comprises the following steps: transversely cutting and lengthways cutting an LED sheet through the combined cutter; grinding and processing the ceramic substrate through the grinding wheel sheet during cutting; milling a rubber layer through the disk shaped milling sheet, wherein the grinding wheel sheet and the disk shaped milling sheet work at the same time. According to the method, the cutter of different forms and different processing methods are utilized to separately cut the rubber layer and the ceramic substrate, and thus the cutting efficiency and quality are improved.
Description
Technical field
The method that the present invention relates to the modular cutting tool assembly of a kind of different-diameter and different shape and based on this modular cutting tool assembly, ceramic substrate LED is carried out separate type cutting.
Background technology
The caloric value of single device of great power LED significantly rises with power at present, and in order to solve heat dissipation problem, one of them solution is to adopt metal or ceramic substrate, wherein, COB LED can adopt metal substrate, also can adopt ceramic substrate, and CHIP LED mainly adopts ceramic substrate.When CHIP LED is production, normally produce large stretch of sheet material of having put glue, then sheet material is cut, but pottery belongs to crisp hard material, can only adopt harder skive cutting, cutting mode is grinding.
Skive can be divided into metal-base diamond grinding wheel and resin-based skive according to the difference of binding agent, and the character of basic material has determined the hardness of skive, thereby is suitable for the cutting of different materials, meets different requirement on machining accuracy.Generally speaking, resin-based skive hardness is lower, and self-sharpening is good, is applicable to the harder more crisp material of polishing, and the surface accuracy of acquisition is higher, but wearing and tearing are very fast; Metal-base diamond grinding wheel is contrary.But, the in the situation that of having put glue on CHIP LED chip surface, adopt resin-based skive can have the situation of the sticky cutter of silica gel, make a part of adamantine blade can not participate in cutting, affected the effect of ceramic cutting, common cutting problem is that tangent plane is inclined to trapezoidal faces; Meanwhile, the cutting force of grinding is larger, easily pulls the gold thread on chip, and large cutting force brings large heat in metal cutting, easily burns out silica gel.Use metal-base diamond grinding wheel can cut smoothly silica gel, alleviate to a certain extent or avoid the situation of the sticky cutter of silica gel, but Wheel hardness is higher, has aggravated breaking of ceramic substrate, forms a large amount of crackles, collapse broken and projection etc.Single skive has been difficult to solve the mixing cutting of fragile material and plastic material.
Summary of the invention
The first object of the present invention is to provide a kind of cutter that utilizes different shape and can be simultaneously glue-line and ceramic substrate is carried out separate type cutting and can improve the modular cutting tool assembly of cutting efficiency and quality.
The second object of the present invention is to provide a kind of cutter that utilizes different shape and can be simultaneously glue-line and ceramic substrate is carried out separate type cutting and can improve the cutting method of cutting efficiency and quality.
For reaching above-mentioned the first object, modular cutting tool assembly, comprise main shaft, spindle flange, grinding wheel, flange gasket, disc milling cutter sheet, pad and locking device, spindle flange, grinding wheel, flange gasket, disc milling cutter sheet, pad and locking device are located on main shaft successively from back to front, wherein, the diameter of grinding wheel is greater than the diameter of disc milling cutter sheet, the anterior angle of the each cutting edge of disc milling cutter sheet and relief angle be on the occasion of; The LED length of side that the thickness of flange gasket is corresponding with precut direction is identical; Described grinding wheel is resin-based skive sheet, and the material of disc milling cutter sheet is consistent with the material of metal-base diamond grinding wheel.
The modular cutting tool assembly of said structure, the spacing between grinding wheel and disc milling cutter sheet is just the size of a LED, can ensure accurately the LED size after cutting by the thickness of control flange pad.Described spindle flange is fixed on main shaft, for locating grinding wheel, and then with flange gasket, dish type cutter blade is installed, and then locks grinding wheel and disc milling cutter sheet by locking nut.For above-mentioned cutter, because grinding wheel is different from the diameter of disc milling cutter sheet, in feed process, utilize the cutting edge of disc milling cutter sheet to carry out Milling Process to glue-line, utilize grinding wheel to carry out grinding to ceramic substrate, utilize two cutters can carry out the object of separation cuts simultaneously to glue-line and ceramic substrate at diverse location thereby realized.Adopt combinations thereof formula cutter, get its advantage of cutter form separately, avoided the shortcoming of cutter material separately, therefore, this gang tool can not only improve cutting efficiency, and has improved the quality of cutting.
Further, be provided with the boss for locating dish type cutter blade near the flange gasket end face of disc milling cutter sheet; Flange gasket end face near grinding wheel is provided with the outward extending groove in the hole of passing from main shaft, and the flange gasket end face beyond groove compresses grinding wheel; Pad end face near disc milling cutter sheet is provided with the outward extending groove in the hole of passing from main shaft, the pad end face compression plate shape cutter blade beyond groove; Locking device is pressed on pad.By boss and groove are set, so that more firmly fixed emery wheel sheet and disc milling cutter sheet.
Further, grinding wheel equates with the semidiameter of disc milling cutter sheet and the thickness of ceramic substrate or is bigger, like this, ensures can just excise glue-line and ceramic substrate in one-pass process, is convenient to equipment to control.
Further, described locking device is locking nut.
For reaching above-mentioned the second object, the method that the modular cutting tool assembly based on described carries out separate type cutting to ceramic substrate LED, comprises the steps:
(1) gang tool is arranged on the main shaft of lathe, select the thickness of flange gasket according to the length of side of LED, if LED is square, only need a flange gasket, if LED is rectangle, need on another a machine tool, use the flange gasket mounting cutter of another thickness;
(2) ceramic substrate of putting glue is bonded on pad pasting, then is attached on pallet, then fixed tray is to workbench;
(3) upright position of adjusting operating platform, makes grinding wheel one-pass can cut off ceramic substrate completely;
(4) carry out transverse cuts for the first time, for the first time when transverse cuts, disc milling cutter sheet cutting glue-line, grinding wheel cuts;
(5) travelling table, make movable workbench be of a size of the centre-to-centre spacing of grinding wheel and disc milling cutter sheet, utilize gang tool to carry out transverse cuts for the second time, now, disc milling cutter sheet cuts the glue-line of next path, and grinding wheel has just been cut together the path of glue-line and ceramic substrate is cut corresponding to upper;
(6) carry out transverse cuts successively until disc milling cutter sheet cuts to last one glue-line according to above-mentioned steps (5);
(7) travelling table, make movable workbench be of a size of the centre-to-centre spacing of grinding wheel and disc milling cutter sheet, utilize gang tool to carry out last transverse cuts, now, disc milling cutter sheet does not cut, and grinding wheel has just been cut together the path of glue-line and ceramic substrate is cut corresponding to upper;
(8) if LED is square, proceed to (9); If LED is rectangle, take out pallet, be installed on the workbench of another a machine tool, by 90 ° of worktable rotaries, repeat above-mentioned steps (4), (5), (6), (7);
(9) by 90 ° of worktable rotaries, the wear extent of lathe auto-compensation cutter;
(10) longitudinally cut for the first time, while longitudinally cutting for the first time, disc milling cutter sheet cutting glue-line, grinding wheel cuts;
(11) travelling table, make movable workbench be of a size of the centre-to-centre spacing of grinding wheel and disc milling cutter sheet, utilize gang tool longitudinally to cut for the second time, now, disc milling cutter sheet cuts the glue-line of next path, and grinding wheel has just been cut together the path of glue-line and ceramic substrate is cut corresponding to upper;
(12) longitudinally cut successively according to above-mentioned steps (11) until disc milling cutter sheet cuts to last one glue-line;
(13) travelling table, make movable workbench be of a size of the centre-to-centre spacing of grinding wheel and disc milling cutter sheet, utilize gang tool to carry out last longitudinally cutting, now, disc milling cutter sheet does not cut, grinding wheel has just been cut together the path of glue-line and ceramic substrate has been cut corresponding to upper, thereby completes the separate type cutting that ceramic substrate LED is carried out.
Above-mentioned cutting method, because grinding wheel is different from the diameter of disc milling cutter sheet, both form differences, so-called form difference refers to that grinding wheel is all different from the structure and material composition of disc milling cutter sheet, in feed process, the Milling Process of utilizing disc milling cutter sheet to be well on to glue-line.What carry out due to disc milling cutter sheet is Milling Process, and what participate in cutting is the blade of whole cutting edge, and the size of cutting edge is larger, the silica gel being cut off flows along rake face, although still have sticky cutter, blade exposes all the time, and the impact of sticky cutter almost can be ignored.Positive rake angle has promoted again flowing of silica gel smear metal and has discharged.Unlike diamond wheel grinding processing, the cutting edge of each diamond particles is very trickle, and the silica gel meeting cover part cutting edge of sticky cutter, affects crudy.Meanwhile, because the desk blade with cutter tooth is knife-tooth structure, avoided grinding, therefore, cutting force is less, is not easy to pull the gold thread on chip, and heat in metal cutting is few, is not easy the glue-line of burning.Utilize resin-based skive sheet to cut ceramic substrate, its self-sharpening is good, be applicable to the harder more crisp material of polishing, the surface accuracy obtaining is higher, avoid breaking of ceramic substrate, form a large amount of crackles, collapse broken and projection etc., utilize two cutters to carry out the object of separation cuts to glue-line and ceramic substrate thereby realized simultaneously, and can improve again cut quality and efficiency.
Further, the ceramic substrate that is bonded at the some glue on pad pasting is bonded on pallet, then is fixed on the sucker of workbench, so that fixing and dismounting ceramic substrate, and fixing good reliability.
Further, grinding wheel equates with the semidiameter of disc milling cutter sheet and the thickness of ceramic substrate or is bigger, like this, ensures can just excise glue-line and ceramic substrate in one-pass process, is convenient to equipment to control.
Further, the distance between two cutters equals the length of side of LED, i.e. the thickness of flange gasket can be selected according to the length of side of LED the flange gasket of suitable thickness, thereby has determined the LED size after cutting.
Further, be provided with the boss for locating dish type cutter blade near the flange gasket end face of disc milling cutter sheet; Flange gasket end face near grinding wheel is provided with the outward extending groove in the hole of passing from main shaft, and the flange gasket end face beyond groove compresses grinding wheel; Pad end face near disc milling cutter sheet is provided with the outward extending groove in the hole of passing from main shaft, the pad end face compression plate shape cutter blade beyond groove; Locking device is pressed on pad.By boss and groove are set, so that more firmly fixed emery wheel sheet and disc milling cutter sheet.
Further, when resin-based skive pad wear acquires a certain degree, change a little bit smaller disc milling cutter sheet of radius, ensure that resin-based skive sheet is suitable with ceramic substrate thickness with disc milling cutter sheet semidiameter, to improve the quality of cutting.
Brief description of the drawings
Fig. 1 is the stereogram of modular cutting tool assembly.
Fig. 2 is the stereogram exploded view of modular cutting tool assembly.
Fig. 3 is the schematic diagram of flange gasket.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is further elaborated.
As shown in Figure 1 to Figure 2, modular cutting tool assembly comprises main shaft 1, spindle flange 2, grinding wheel 3, flange gasket 4, disc milling cutter sheet 5, pad 6 and locking device, described spindle flange 2 is fixed on main shaft 1, generally both are structure as a whole, grinding wheel 3 from back to front, flange gasket 4, disc milling cutter sheet 5, pad 6 is enclosed within on main shaft 1, and utilize flange gasket 4 that grinding wheel 2 is installed, locking device is locking nut, locking nut 7 is threaded connection the one end at main shaft 1, grinding wheel 3 is used for being locked, flange gasket 4, disc milling cutter sheet 5, pad 6, wherein, the thickness of flange gasket 4 is selected flexibly according to the size of LED, the diameter of grinding wheel 2 is greater than the diameter of disc milling cutter sheet 5, semidiameter equates with the thickness of ceramic substrate or is bigger, the length of side of the LED that the thickness of flange gasket 4 is corresponding with precut direction is identical, as shown in Figure 3, is provided with the boss 41 for locating dish type cutter blade near flange gasket 4 end faces of disc milling cutter sheet 5, flange gasket 4 end faces near grinding wheel 3 are provided with the outward extending groove 42 in the hole of passing from main shaft, and the overall diameter of groove 42 is greater than the overall diameter of boss 41, and the flange gasket end face beyond groove 42 compresses grinding wheel 3, pad end face near disc milling cutter sheet is provided with the outward extending groove 61 in the hole of passing from main shaft, the pad end face compression plate shape cutter blade beyond groove 61, locking nut is pressed on pad 6.The process of mounting cutter is, first grinding wheel 3 is enclosed within on main shaft 1, allow an end face of grinding wheel 3 contact with spindle flange 2, then flange gasket 4 is enclosed within on main shaft 1, flange gasket end face beyond groove 42 contacts with grinding wheel 3, then dish type cutter blade 5 is installed, allow boss contact with disc milling cutter sheet, then, pad 6 is enclosed within on main shaft 1, allow groove 62 pad end face in addition contact with disc milling cutter sheet, finally lock locking nut, make groove 42 flange gasket end face in addition compress grinding wheel 3, boss compresses dish type cutter blade, pad end face compression plate shape cutter blade beyond groove 62, thereby realize the firm installation to cutter.
Described grinding wheel 2 is resin-based skive sheet, and the material of disc milling cutter sheet 5 is consistent with the material of metal-base diamond grinding wheel.
The method of utilizing combinations thereof cutter to carry out separate type cutting to ceramic substrate LED is:
(1) gang tool is arranged on the main shaft 1 of lathe, select the thickness of flange gasket 4 according to the length of side of LED, if LED is square, only need a flange gasket 4, if LED is rectangle, need on another a machine tool, use flange gasket 4 mounting cutters of another thickness.
(2) ceramic substrate of putting glue is bonded on pad pasting, then is attached on pallet, be then fixed on the sucker of workbench, to improve the fix tightly solidity to ceramic substrate.
(3) upright position of adjusting operating platform, makes grinding wheel 2 one-passes can cut off ceramic substrate completely.
(4) carry out transverse cuts for the first time, when transverse cuts, disc milling cutter sheet 5 cuts glue-line for the first time, and grinding wheel 2 cuts.
(5) travelling table, make movable workbench be of a size of the centre-to-centre spacing of grinding wheel and disc milling cutter sheet, utilize gang tool to carry out transverse cuts for the second time, now, the glue-line of disc milling cutter sheet 5 next path of cutting, grinding wheel 2 has just been cut together the path of glue-line and ceramic substrate has been cut corresponding to upper.
(6) carry out transverse cuts successively until disc milling cutter sheet 5 cuts to last one glue-line according to above-mentioned steps (5).
(7) travelling table, make movable workbench one LEDs make movable workbench be of a size of the centre-to-centre spacing of grinding wheel and disc milling cutter sheet, utilize gang tool to carry out last transverse cuts, now, disc milling cutter sheet 5 does not cut, and grinding wheel 2 has just been cut together the path of glue-line and ceramic substrate is cut corresponding to upper.
(8) if LED is square, proceed to (9); If LED is rectangle, take out pallet, be installed on the workbench of another a machine tool, by 90 ° of worktable rotaries, repeat above-mentioned steps (4), (5), (6), (7);
(9) by 90 ° of worktable rotaries, the wear extent of lathe auto-compensation cutter.
(10) longitudinally cut for the first time, while longitudinally cutting for the first time, disc milling cutter sheet 5 cuts glue-line, and grinding wheel 2 cuts.
(11) travelling table, make movable workbench be of a size of the centre-to-centre spacing of grinding wheel and disc milling cutter sheet, utilize gang tool longitudinally to cut for the second time, now, the glue-line of disc milling cutter sheet 5 next path of cutting, grinding wheel 2 has just been cut together the path of glue-line and ceramic substrate has been cut corresponding to upper.
(12) longitudinally cut successively until disc milling cutter sheet 5 cuts to last one glue-line according to above-mentioned steps (11).
(13) travelling table, make movable workbench be of a size of the centre-to-centre spacing of grinding wheel and disc milling cutter sheet, utilize gang tool to carry out last longitudinally cutting, now, disc milling cutter sheet 5 does not cut, grinding wheel 2 has just been cut together the path of glue-line and ceramic substrate has been cut corresponding to upper, thereby completes the separate type cutting that ceramic substrate LED is carried out.
In the present embodiment, cut mainly for CHIP LED.
In cutting process, if change a little bit smaller desk blade with cutter tooth of radius when resin base diamond grinding wheel pad wear acquires a certain degree, ensure that the semidiameter of resin-based skive and disc milling cutter sheet 5 is suitable with ceramic substrate thickness.
Present embodiment, because grinding wheel 2 is different from the diameter of disc milling cutter sheet 4, both form differences, in feed process, the Milling Process of utilizing disc milling cutter sheet 5 to be well on to glue-line.What carry out due to disc milling cutter sheet is Milling Process, and what participate in cutting is the blade of whole cutting edge, and the size of cutting edge is larger, the silica gel being cut off flows along rake face, although still have sticky cutter, blade exposes all the time, and the impact of sticky cutter almost can be ignored.Positive rake angle has promoted again flowing of silica gel smear metal and has discharged.Unlike diamond wheel grinding processing, the cutting edge of each diamond particles is very trickle, and the silica gel meeting cover part cutting edge of sticky cutter, affects crudy.Meanwhile, because disc milling cutter sheet 5 is knife-tooth structure, avoided grinding, therefore, cutting force is less, is not easy to pull the gold thread on chip, and heat in metal cutting is few, is not easy the glue-line of burning.Utilize grinding wheel 2 to cut ceramic substrate, its self-sharpening is good, be applicable to the harder more crisp material of polishing, the surface accuracy obtaining is higher, avoid breaking of ceramic substrate, form a large amount of crackles, collapse broken and projection etc., utilize two cutters to carry out the object of separation cuts to glue-line and ceramic substrate thereby realized simultaneously, and can improve again cut quality and efficiency.
Claims (9)
1. modular cutting tool assembly, it is characterized in that: comprise main shaft, spindle flange, grinding wheel, flange gasket, disc milling cutter sheet, pad and locking device, spindle flange, grinding wheel, flange gasket, disc milling cutter sheet, pad and locking device are located on main shaft successively from back to front, wherein, the diameter of grinding wheel is greater than the diameter of disc milling cutter sheet, the anterior angle of the each cutting edge of disc milling cutter sheet and relief angle be on the occasion of; The LED length of side that the thickness of flange gasket is corresponding with precut direction is identical; Described grinding wheel is resin-based skive sheet, and the material of disc milling cutter sheet is consistent with the material of metal-base diamond grinding wheel.
2. modular cutting tool assembly according to claim 1, is characterized in that: the flange gasket end face near disc milling cutter sheet is provided with the boss for locating dish type cutter blade; Flange gasket end face near grinding wheel is provided with the outward extending groove in the hole of passing from main shaft, and the flange gasket end face beyond groove compresses grinding wheel; Pad end face near disc milling cutter sheet is provided with the outward extending groove in the hole of passing from main shaft, the pad end face compression plate shape cutter blade beyond groove; Locking device is pressed on pad.
3. modular cutting tool assembly according to claim 1, is characterized in that: grinding wheel equates with the semidiameter of disc milling cutter sheet and the thickness of ceramic substrate or be bigger.
4. modular cutting tool assembly according to claim 1, is characterized in that: described locking device is locking nut.
5. the method for based on modular cutting tool assembly claimed in claim 1, ceramic substrate LED being carried out separate type cutting, is characterized in that, comprises the steps:
(1) gang tool is arranged on the main shaft of lathe, select the thickness of flange gasket according to the length of side of LED, if LED is square, only need a flange gasket, if LED is rectangle, need on another a machine tool, use the flange gasket mounting cutter of another thickness;
(2) ceramic substrate of putting glue is bonded on pad pasting, then is attached on pallet, then fixed tray is to workbench;
(3) upright position of adjusting operating platform, makes grinding wheel one-pass can cut off ceramic substrate completely;
(4) carry out transverse cuts for the first time, for the first time when transverse cuts, disc milling cutter sheet cutting glue-line, grinding wheel cuts;
(5) travelling table, make movable workbench be of a size of the centre-to-centre spacing of grinding wheel and disc milling cutter sheet, utilize gang tool to carry out transverse cuts for the second time, now, disc milling cutter sheet cuts the glue-line of next path, and grinding wheel has just been cut together the path of glue-line and ceramic substrate is cut corresponding to upper;
(6) carry out transverse cuts successively until disc milling cutter sheet cuts to last one glue-line according to above-mentioned steps (5);
(7) travelling table, make movable workbench be of a size of the centre-to-centre spacing of grinding wheel and disc milling cutter sheet, utilize gang tool to carry out last transverse cuts, now, disc milling cutter sheet does not cut, and grinding wheel has just been cut together the path of glue-line and ceramic substrate is cut corresponding to upper;
(8) if LED is square, proceed to (9); If LED is rectangle, take out pallet, be installed on the workbench of another a machine tool, by 90 ° of worktable rotaries, repeat above-mentioned steps (4), (5), (6), (7);
(9) by 90 ° of worktable rotaries, the wear extent of lathe auto-compensation cutter;
(10) longitudinally cut for the first time, while longitudinally cutting for the first time, disc milling cutter sheet cutting glue-line, grinding wheel cuts;
(11) travelling table, make movable workbench be of a size of the centre-to-centre spacing of grinding wheel and disc milling cutter sheet, utilize gang tool longitudinally to cut for the second time, now, disc milling cutter sheet cuts the glue-line of next path, and grinding wheel has just been cut together the path of glue-line and ceramic substrate is cut corresponding to upper;
(12) longitudinally cut successively according to above-mentioned steps (11) until disc milling cutter sheet cuts to last one glue-line;
(13) travelling table, make movable workbench be of a size of the centre-to-centre spacing of grinding wheel and disc milling cutter sheet, utilize gang tool to carry out last longitudinally cutting, now, disc milling cutter sheet does not cut, grinding wheel has just been cut together the path of glue-line and ceramic substrate has been cut corresponding to upper, thereby completes the separate type cutting that ceramic substrate LED is carried out.
6. method of ceramic substrate LED being carried out to separate type cutting based on modular cutting tool assembly according to claim 5, is characterized in that: the ceramic substrate of putting glue being bonded on pad pasting is bonded on pallet, then is fixed on the sucker of workbench.
7. according to the method for ceramic substrate LED being carried out to separate type cutting based on modular cutting tool assembly described in claim 5 or 6, it is characterized in that: grinding wheel equates with the semidiameter of disc milling cutter sheet and the thickness of ceramic substrate or be bigger.
8. method of ceramic substrate LED being carried out to separate type cutting based on modular cutting tool assembly according to claim 5, is characterized in that: the flange gasket end face near disc milling cutter sheet is provided with the boss for locating dish type cutter blade; Flange gasket end face near grinding wheel is provided with the outward extending groove in the hole of passing from main shaft, and the flange gasket end face beyond groove compresses grinding wheel; Pad end face near disc milling cutter sheet is provided with the outward extending groove in the hole of passing from main shaft, the pad end face compression plate shape cutter blade beyond groove; Locking device is pressed on pad.
9. method of based on modular cutting tool assembly, ceramic substrate LED being carried out separate type cutting according to claim 5, it is characterized in that: when resin-based skive pad wear acquires a certain degree, change a little bit smaller disc milling cutter sheet of radius, ensure that the semidiameter of resin-based skive sheet and disc milling cutter sheet is suitable with ceramic substrate thickness.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410273652.2A CN104037292B (en) | 2014-06-19 | 2014-06-19 | Modular cutting tool assembly and the method that separate type cutting is carried out to ceramic substrate LED |
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| CN201410273652.2A CN104037292B (en) | 2014-06-19 | 2014-06-19 | Modular cutting tool assembly and the method that separate type cutting is carried out to ceramic substrate LED |
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| CN104037292A true CN104037292A (en) | 2014-09-10 |
| CN104037292B CN104037292B (en) | 2017-06-06 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108129067A (en) * | 2017-12-30 | 2018-06-08 | 苏州赛尔科技有限公司 | A kind of ceramic substrate segmentation diamond scribing knife and preparation method thereof |
| CN110170849A (en) * | 2019-06-25 | 2019-08-27 | 绍兴创举汽车同步器齿环有限公司 | A kind of multi-functional processing assembly of lathe |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201320721Y (en) * | 2008-12-19 | 2009-10-07 | 无锡杰尔压缩机有限公司 | Combined wheelhead for grinding wheel sander |
| JP2012176448A (en) * | 2011-02-25 | 2012-09-13 | Kanefusa Corp | Combination cutter |
| CN203018816U (en) * | 2012-12-26 | 2013-06-26 | 无锡市贝斯特精密机械有限公司 | Composite metal slitting saw |
-
2014
- 2014-06-19 CN CN201410273652.2A patent/CN104037292B/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108129067A (en) * | 2017-12-30 | 2018-06-08 | 苏州赛尔科技有限公司 | A kind of ceramic substrate segmentation diamond scribing knife and preparation method thereof |
| CN110170849A (en) * | 2019-06-25 | 2019-08-27 | 绍兴创举汽车同步器齿环有限公司 | A kind of multi-functional processing assembly of lathe |
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| Publication number | Publication date |
|---|---|
| CN104037292B (en) | 2017-06-06 |
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