CN204216068U - A kind of ceramic substrate LED cuts gang tool - Google Patents
A kind of ceramic substrate LED cuts gang tool Download PDFInfo
- Publication number
- CN204216068U CN204216068U CN201420326518.XU CN201420326518U CN204216068U CN 204216068 U CN204216068 U CN 204216068U CN 201420326518 U CN201420326518 U CN 201420326518U CN 204216068 U CN204216068 U CN 204216068U
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- China
- Prior art keywords
- grinding wheel
- milling cutter
- ceramic substrate
- disc milling
- pad
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- Expired - Fee Related
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The utility model discloses a kind of ceramic substrate LED and cut gang tool, comprise main shaft, spindle flange, grinding wheel, flange gasket, disc milling cutter sheet, pad and locking device, spindle flange, grinding wheel, flange gasket, disc milling cutter sheet, pad and locking device are located on main shaft successively from back to front, wherein, the diameter of grinding wheel is greater than the diameter of disc milling cutter sheet.Structure of the present utility model can improve cutting efficiency, improves cut quality.
Description
Technical field
The utility model relates to the gang tool cut ceramic substrate LED.
Background technology
The caloric value of current great power LED single device significantly rises with power, and in order to solve heat dissipation problem, one of them solution adopts metal or ceramic substrate, wherein, COB LED can adopt metal substrate, also can adopt ceramic substrate, and CHIP LED mainly adopts ceramic substrate.When CHIP LED is production, normally produce the large stretch of sheet material putting glue, then cut sheet material, but pottery belongs to crisp hard material, can only adopt harder skive cutting, cutting mode is grinding.
But, when glue has been put on CHIP LED chip surface, adopt the cutting of same cutter, if meet the requirement of cutting glue-line, then be difficult to ceramic cutting substrate, if meet the requirement of ceramic cutting substrate, then can have an impact to cutting glue-line, therefore, generally need two kinds of cutters to cut for this product, but use two kinds of cutters then to need change cutter and reorientate ceramic substrate, like this, not only efficiency is low, and the precision of secondary location is low, causes the quality of final cutting low.
Summary of the invention
In order to improve cutting efficiency, improve cut quality, the utility model provides a kind of ceramic substrate LED and cuts gang tool.
For achieving the above object, a kind of ceramic substrate LED cuts gang tool, comprise main shaft, spindle flange, grinding wheel, flange gasket, disc milling cutter sheet, pad and locking device, spindle flange, grinding wheel, flange gasket, disc milling cutter sheet, pad and locking device are located on main shaft successively from back to front, wherein, the diameter of grinding wheel is greater than the diameter of disc milling cutter sheet.
Said structure, the spacing between grinding wheel and disc milling cutter sheet is just the size of a LED, then can ensure the LED size after cutting by selecting the thickness of flange gasket accurately.Described spindle flange and integrated spindle axis, for locating grinding wheel, and then install dish type cutter blade with flange gasket, then by locking nut locking grinding wheel and disc milling cutter sheet.For above-mentioned cutter, because grinding wheel is different from the diameter of disc milling cutter sheet, in feed process, utilize the blade of disc milling cutter sheet to carry out Milling Process to glue-line, utilize grinding wheel to carry out grinding to ceramic substrate, thus achieve the object utilizing two cutters simultaneously can carry out separation cuts to the glue-line of diverse location and ceramic substrate, do not need to carry out secondary positional dissection to ceramic substrate, therefore, the efficiency of not only cutting is high, and the quality of cutting is good.
Further, grinding wheel is equal with the thickness of ceramic substrate with the semidiameter of disc milling cutter sheet or bigger, like this, ensures can just excise glue-line and ceramic substrate in one-pass process, is convenient to control equipment.
Further, the flange gasket end face of close disc milling cutter sheet is provided with the boss for locating dish type cutter blade; Flange gasket end face near grinding wheel is provided with the outward extending groove in the hole passed from main shaft, and the flange gasket end face beyond groove compresses grinding wheel; Pad end face near disc milling cutter sheet is provided with the outward extending groove in the hole passed from main shaft, the pad end face compression plate shape cutter blade beyond groove; Locking device is pressed on pad.By arranging boss and groove, so that more firmly fixed emery wheel sheet and disc milling cutter sheet.
Further, described locking device is locking nut.
Accompanying drawing explanation
Fig. 1 is the stereogram of modular cutting tool assembly.
Fig. 2 is the stereogram exploded view of modular cutting tool assembly.
Fig. 3 is the stereogram of flange gasket.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is further elaborated.
As shown in Figure 1 to Figure 2, modular cutting tool assembly comprises main shaft 1, spindle flange 2, grinding wheel 3, flange gasket 4, disc milling cutter sheet 5, pad 6 and locking device, described spindle flange 2 is fixed on main shaft 1, it is general that both are structure as a whole, grinding wheel 3 from back to front, flange gasket 4, disc milling cutter sheet 5, pad 6 is enclosed within main shaft 1, and utilize flange gasket 4 that grinding wheel 2 is installed, locking device is locking nut, locking nut 7 is threaded connection the one end at main shaft 1, for the grinding wheel 3 that is locked, flange gasket 4, disc milling cutter sheet 5, pad 6, wherein, the thickness of flange gasket 4 is selected flexibly according to the size of LED, the diameter of grinding wheel 2 is greater than the diameter of disc milling cutter sheet 5, semidiameter is equal with the thickness of ceramic substrate or bigger, described grinding wheel 2 is resin-based skive sheet, the material of disc milling cutter sheet 4 is consistent with the material of metal-base diamond grinding wheel, the length of side of the LED that the thickness of flange gasket 4 is corresponding with precut direction is identical, and as shown in Figure 3, flange gasket 4 end face near disc milling cutter sheet 5 is provided with the boss 41 for locating dish type cutter blade, flange gasket 4 end face near grinding wheel 3 is provided with the outward extending groove 42 in the hole passed from main shaft, and the overall diameter of groove 42 is greater than the overall diameter of boss 41, and the flange gasket end face beyond groove 42 compresses grinding wheel 3, pad end face near disc milling cutter sheet is provided with the outward extending groove 61 in the hole passed from main shaft, the pad end face compression plate shape cutter blade beyond groove 61, locking nut is pressed on pad 6.The process of mounting cutter is, first grinding wheel 3 is enclosed within main shaft 1, an end face of grinding wheel 3 is allowed to contact with spindle flange 2, then flange gasket 4 is enclosed within main shaft 1, flange gasket end face beyond groove 42 contacts with grinding wheel 3, then dish type cutter blade 5 is installed, boss is allowed to contact with disc milling cutter sheet, then, pad 6 is enclosed within main shaft 1, the pad end face beyond groove 61 is allowed to contact with disc milling cutter sheet, finally lock locking nut, the flange gasket end face beyond groove 42 is made to compress grinding wheel 3, boss compresses dish type cutter blade, pad end face compression plate shape cutter blade beyond groove 61, thus the firm installation realized cutter.
In the present embodiment, cut mainly for CHIP LED.
In cutting process, if change a little bit smaller disc milling cutter sheet of radius when resin base diamond grinding wheel pad wear acquires a certain degree, ensure that resin-based skive is equal with ceramic substrate thickness or bigger with the semidiameter of disc milling cutter sheet.
Present embodiment, because grinding wheel 2 is different from the diameter of disc milling cutter sheet 4, the processing mode that both use is different, in feed process, utilize the Milling Process that disc milling cutter sheet 4 can be well on to glue-line, the phenomenon reducing cutter viscose glue occurs, and avoids a part of adamantine blade not participate in cutting, thus the effect of impact cutting, simultaneously, because disc milling cutter sheet 4 is knife-tooth structure, avoid grinding, therefore, cutting force is less, be not easy the gold thread pullled on chip, and heat in metal cutting is few, is not easy glue-line of burning.Grinding wheel 2 pairs of ceramic substrates are utilized to cut, its self-sharpening is good, be applicable to polish harder more crisp material, the surface accuracy obtained is higher, avoid breaking of ceramic substrate, form a large amount of crackles, collapse broken and projection etc., thus achieve the object utilizing two cutters simultaneously can carry out separation cuts to glue-line and ceramic substrate, and cut quality and efficiency can be improved again.
Claims (4)
1. a ceramic substrate LED cuts gang tool, it is characterized in that: comprise main shaft, spindle flange, grinding wheel, flange gasket, disc milling cutter sheet, pad and locking device, spindle flange, grinding wheel, flange gasket, disc milling cutter sheet, pad and locking device are located on main shaft successively from back to front, wherein, the diameter of grinding wheel is greater than the diameter of disc milling cutter sheet.
2. ceramic substrate LED according to claim 1 cuts gang tool, it is characterized in that: grinding wheel is equal with the thickness of ceramic substrate with the semidiameter of disc milling cutter sheet or bigger.
3. ceramic substrate LED according to claim 1 cuts gang tool, it is characterized in that: the flange gasket end face near disc milling cutter sheet is provided with the boss for locating dish type cutter blade; Flange gasket end face near grinding wheel is provided with the outward extending groove in the hole passed from main shaft, and the flange gasket end face beyond groove compresses grinding wheel; Pad end face near disc milling cutter sheet is provided with the outward extending groove in the hole passed from main shaft, the pad end face compression plate shape cutter blade beyond groove; Locking device is pressed on pad.
4. ceramic substrate LED according to claim 1 cuts gang tool, it is characterized in that: described locking device is locking nut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420326518.XU CN204216068U (en) | 2014-06-19 | 2014-06-19 | A kind of ceramic substrate LED cuts gang tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420326518.XU CN204216068U (en) | 2014-06-19 | 2014-06-19 | A kind of ceramic substrate LED cuts gang tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204216068U true CN204216068U (en) | 2015-03-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420326518.XU Expired - Fee Related CN204216068U (en) | 2014-06-19 | 2014-06-19 | A kind of ceramic substrate LED cuts gang tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204216068U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107030538A (en) * | 2017-06-21 | 2017-08-11 | 苏州卡西德电机科技有限公司 | Ceramic insertion core processing unit (plant) and ceramic insertion core production equipment |
| CN109108848A (en) * | 2018-10-18 | 2019-01-01 | 河南格锐新材料科技有限公司 | A kind of grinding wheel firing activity bar of pressing device |
-
2014
- 2014-06-19 CN CN201420326518.XU patent/CN204216068U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107030538A (en) * | 2017-06-21 | 2017-08-11 | 苏州卡西德电机科技有限公司 | Ceramic insertion core processing unit (plant) and ceramic insertion core production equipment |
| CN109108848A (en) * | 2018-10-18 | 2019-01-01 | 河南格锐新材料科技有限公司 | A kind of grinding wheel firing activity bar of pressing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee after: Hongli Newell group Limited by Share Ltd Address before: Huadu District, Guangdong city of Guangzhou Province, 510890 East Town Airport high-tech industrial base and SAST Jingu South Road intersection Patentee before: Guangzhou Hongli Tronic Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150318 Termination date: 20190619 |