CN104034918A - Multi-axis acceleration sensing device and related making method - Google Patents
Multi-axis acceleration sensing device and related making method Download PDFInfo
- Publication number
- CN104034918A CN104034918A CN201310071306.1A CN201310071306A CN104034918A CN 104034918 A CN104034918 A CN 104034918A CN 201310071306 A CN201310071306 A CN 201310071306A CN 104034918 A CN104034918 A CN 104034918A
- Authority
- CN
- China
- Prior art keywords
- acceleration sensing
- sensing chip
- pin plane
- detecting direction
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a multi-axis acceleration sensing device and a method for making the multi-axis acceleration sensing device. The method comprises the following steps: providing a substrate, wherein the substrate is provided with a pin plane; arranging a first acceleration sensing chip on the pin plane, wherein a wire bonding surface of the first acceleration sensing chip is perpendicular to the pin plane; and arranging a second acceleration sensing chip on the pin plane, wherein a wire bonding surface of the second acceleration sensing chip is in parallel with the pin plane.
Description
Technical field
The present invention relates to semiconductor packages, especially about a kind of in order to make method for making and the relevant multiaxis acceleration sensing device of multiaxis acceleration sensing device.
Background technology
As shown in Figure 1, wherein 3-axis acceleration sensing device 100 includes acceleration sensing chip 110 and base plate for packaging 140 to the structure of existing 3-axis acceleration sensing device.Acceleration sensing chip 110 is to bind on base plate for packaging 140 by solid 145, and in the mode of wire bonds (wire bonding), the pad 132 of itself is engaged with the pad 144 on base plate for packaging 140.
Need to be enough to measure acceleration detecting mechanism and the integrated circuit related with same of three different directions by the packaging body 120 in acceleration sensing chip 110, therefore comparatively complicated in the process of manufacturing, and have the problem of the bad measurement signal phase mutual interference with different directions of heat radiation.Therefore, need a kind of different manufacture to improve above problem.
Summary of the invention
Embodiments of the invention disclose a kind of method for making of multiaxis acceleration sensing device, comprise: a substrate is provided, and wherein said substrate has a pin plane; The first acceleration sensing chip is arranged in described pin plane, and the routing composition surface of wherein said the first acceleration sensing chip is vertical with described pin plane; And the second acceleration sensing chip is arranged in described pin plane to the routing composition surface of wherein said the second acceleration sensing chip and described pin plane parallel.Preferably, the step that described the first acceleration sensing chip is arranged on to described pin plane engagement comprises: by many bonding wires by soldered the multiple pads on the routing composition surface of described the first acceleration sensing chip multiple pads that are connected in described pin plane.
Embodiments of the invention disclose a kind of method for making of multiaxis acceleration sensing device, and described method for making comprises: a substrate is provided, and wherein said substrate has a pin plane; The first acceleration sensing chip is arranged in described pin plane to the routing composition surface of wherein said the first acceleration sensing chip and described pin plane parallel; And the second acceleration sensing chip is arranged in described pin plane to the routing composition surface of wherein said the second acceleration sensing chip and described pin plane parallel.Preferably, the step described the first acceleration sensing chip being arranged in described pin plane comprises: multiple on the routing composition surface of described the first acceleration sensing chip can be soldered to the multiple pads in described pin plane by welded contact.
Embodiments of the invention disclose a kind of multiaxis acceleration sensing device, and described multiaxis acceleration sensing device comprises: substrate, the first acceleration sensing chip and a second acceleration sensing chip.Described substrate has a pin plane.Described the first acceleration sensing chip is arranged in described pin plane, and the routing composition surface of wherein said the first acceleration sensing chip is vertical with described pin plane.Described the second acceleration sensing chip is arranged in described pin plane, the routing composition surface of wherein said the second acceleration sensing chip and described pin plane parallel.Preferably, the multiple pads on the described routing composition surface of described the first acceleration sensing chip and the multiple pads in described pin plane are electrically connected by many bonding wires.
Embodiments of the invention disclose a kind of multiaxis acceleration sensing device, and described multiaxis acceleration sensing device comprises: substrate, the first acceleration sensing chip and a second acceleration sensing chip.Described substrate has a pin plane.Described the first acceleration sensing chip is arranged in described pin plane, the routing composition surface of wherein said the first acceleration sensing chip and described pin plane parallel.Described the second acceleration sensing chip is arranged in described pin plane, the routing composition surface of wherein said the second acceleration sensing chip and described pin plane parallel.Preferably, multiple on the routing composition surface of described the first acceleration sensing chip can welded contact and described pin plane on multiple pads between be electrically connected by scolding tin.
Manufacture method of the present invention can effectively provide a multiaxis acceleration sensing device that processing procedure is simple, with low cost and performance is desirable.
Brief description of the drawings
Fig. 1 is the structural drawing of existing multiaxis acceleration sensing device.
Fig. 2 is the structural drawing of the first embodiment of multiaxis acceleration sensing device of the present invention.
Fig. 3 is the making process flow diagram of the first embodiment of multiaxis acceleration sensing device of the present invention.
Fig. 4 is the structural drawing of the second embodiment of multiaxis acceleration sensing device of the present invention.
Fig. 5 is the making process flow diagram of the second embodiment of multiaxis acceleration sensing device of the present invention.
Wherein, description of reference numerals is as follows:
100,200,400 multiaxis acceleration sensing devices
110,220,270,420,470 acceleration sensing chips
120,230,280,430,480 encapsulation part
130,140,210,240,290,410,440, substrate
490
132,144,242,254,256,292,456, pad
492
142,252,258,458 bonding wires
145,215,225,425 solids
445 sides
Embodiment
Please refer to Fig. 2 and Fig. 3, its be respectively multiaxis acceleration sensing device of the present invention the first embodiment structural drawing with and preparation method thereof process flow diagram, be described as follows.First, making in first step 310 of flow process, provide a base plate for packaging 210 with a pin plane, wherein the pin plane of base plate for packaging 210 is the planes at pad 254,256 places.Then, in step 320, the pin plane engagement by the first acceleration sensing chip 220 with base plate for packaging 210.The first acceleration sensing chip 220 can directly be seated in described pin plane, or by being seated in again in described pin plane after upset, or be to be seated in described pin plane in inverted mode.Between the side of the substrate 240 of the first acceleration sensing chip 220 and the pin plane of base plate for packaging 210, can be undertaken by any conduction or non-conductive solid 215 bondingly, the first acceleration sensing chip 220 is fixed in described pin plane.In addition, the first acceleration sensing chip 220 passes through many bonding wires 252 by the multiple pads 242 on the routing composition surface of the first acceleration sensing chip 220, with the technology of wire bonds (wire-bonding), be connected to the multiple pads 254 on base plate for packaging 210.Wherein, the routing composition surface of the first acceleration sensing chip 220 and the pin plane of base plate for packaging 210 are orthogonal.In other words, pad 254 is in respectively orthogonal two Different Plane with pad 242.
Afterwards, in step 330, pin plane engagement by the second acceleration sensing chip 270 with base plate for packaging 210, between the second acceleration sensing chip 270 and the pin plane of base plate for packaging 210, can be undertaken by any conduction or non-conductive property solid 225 bondingly, the second acceleration sensing chip 270 can be fixed in described pin plane.The second acceleration sensing chip 270 by the multiple pads 292 on its routing composition surface, with the skill of wire bonds (wire-bonding), is engaged to the multiple pads 256 on base plate for packaging 210 by many bonding wires 258.Wherein, the routing composition surface of the second acceleration sensing chip 270 and the pin plane of base plate for packaging 210 are parallel to each other.
The first acceleration sensing chip 220 and the second acceleration sensing chip 270 are respectively by packaging body 230 and 280, and 240 and 290 of substrates form.Package interior 230 and 280 includes respectively can measure at least sensing mechanism and the integrated circuit related with same of acceleration more than one dimension.In one embodiment, the first acceleration sensing chip 220 possesses two detecting directions, can measure in order to the acceleration that carries out Z-direction and X-direction; The second acceleration sensing chip 270 possesses a detecting direction, can measure in order to the acceleration that carries out Y direction.But, in other embodiments of the invention, the acceleration that the first acceleration sensing chip 220 may only can carry out single direction measures, and the second acceleration sensing chip 270 can measure in order to the acceleration that carries out multiple directions, and above combination all belongs to category of the present invention with variation.But anyway, the first acceleration sensing chip 220 is different separately from the detecting direction that the second acceleration sensing chip 270 possesses, and thus, the acceleration that just can make multiaxis acceleration sensing device 200 have multiple directions measures ability.
In addition, for the convenience on manufacturing, the first acceleration sensing chip 220 and the second acceleration sensing chip 270 can be identical chips, and wherein, the first acceleration sensing chip 220 is same with the second acceleration sensing chip 270 is to carry out the chip that the acceleration of multiple directions measures.During with pin plane engagement, only need by one of them acceleration sensing chip (as: the first acceleration sensing chip 220) is upside down on base plate for packaging 210 and with base plate for packaging 210 and is electrically connected, and wherein the part pad of one can not be engaged to the pad in the pin plane of base plate for packaging 210.That is to say, measure result although the first acceleration sensing chip 220 and the second acceleration sensing chip 270 produce the acceleration of corresponding multiple directions separately, not to measure result be all necessary for acceleration to some extent.In general, three-dimensional acceleration sensing device only needs the measurement of three directions.
Please refer to Fig. 4 and Fig. 5, its be respectively multiaxis acceleration sensing device of the present invention the second embodiment structural drawing with and preparation method thereof process flow diagram, be described as follows.In the present embodiment, the initial step 510 of making flow process provides a base plate for packaging 410 with a pin plane, and wherein said pin plane is the plane at pad 456 places.Then, in step 520, the pin plane engagement by the first acceleration sensing chip 420 with base plate for packaging 410.The first acceleration sensing chip 420 can directly be seated in described pin plane, or by being seated in again in described pin plane after upset, or be to be seated in described pin plane in inverted mode.Moreover, the side 445 of the substrate 440 of the first acceleration sensing chip 420 have multiple can welded contact (not shown), these can pass through scolding tin by welded contact, engage with multiple pad (not shown) of base plate for packaging 410 in the mode of welding.The first acceleration sensing chip 420 is fixed on by scolding tin in the pin plane of base plate for packaging 410, and the pin plane of base plate for packaging 410 and the substrate 440 of the first acceleration sensing chip 420 are parallel to each other.Afterwards, in step 530, the pin plane engagement by the second acceleration sensing chip 470 with base plate for packaging 410, the second acceleration sensing chip 470 can engage by any conduction or non-conductive property solid 425 with the pin plane of base plate for packaging 410.The second acceleration sensing chip 470 by the multiple pads 492 on its substrate 490, with the skill of wire bonds (wire-bonding), is engaged to the multiple pads 456 on base plate for packaging 410 by many bonding wires 458.Wherein, the pin plane of base plate for packaging 410 and the substrate 490 of the second acceleration sensing chip 470 are parallel to each other.
The first acceleration sensing chip 420 and the second acceleration sensing chip 470 are respectively by packaging body 430 and 480, and 440 and 490 of substrates form.Packaging body 430 and 480 includes respectively can measure at least sensing mechanism and the integrated circuit related with same of acceleration more than one dimension.In one embodiment, the first acceleration sensing chip 420 possesses two detecting directions, can measure in order to the acceleration that carries out Z-direction and X-direction; And the second acceleration sensing chip 470 possesses a detecting direction, can be in order to carry out the acceleration detecting of Y direction.But, in other embodiments of the invention, the acceleration that the first acceleration sensing chip 420 may only can carry out single direction measures, and the second acceleration sensing chip 470 can measure in order to the acceleration that carries out multiple directions, and above combination all belongs to category of the present invention with variation.
In addition, for the convenience on manufacturing, the first acceleration sensing chip 420 and the second acceleration sensing chip 470 may be identical chip, and wherein, the first acceleration sensing chip 420 is same with the second acceleration sensing chip 470 is to carry out the chip that the acceleration of multiple directions measures.During with pin plane engagement, only need by one of them acceleration sensing chip (as: the first acceleration sensing chip 420) is put upside down and is electrically connected to base plate for packaging 410 and with base plate for packaging 410, and wherein the part pad of one can not be engaged to the pad in the pin plane of base plate for packaging 410.That is to say, measure result although the first acceleration sensing chip 420 and the second acceleration sensing chip 470 produce the acceleration of corresponding multiple directions separately, not to measure result be all necessary for acceleration to some extent.In general, three-dimensional acceleration sensing device only needs the acceleration of three directions to measure result.
In sum, the present invention is separately implemented in different chips from integrated circuit related with same by the sensing mechanism that traditional three axles are integrated, then these chip packages are become to a sensing device.Due to sensing mechanism of the present invention and integrated circuit no longer tight just like that as existing framework, therefore can solve the problem that existing framework faces, but reach again identical technology effect simultaneously.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (27)
1. a method for making for multiaxis acceleration sensing device, comprises:
A substrate is provided, and wherein said substrate has a pin plane;
The first acceleration sensing chip is arranged in described pin plane, and the routing composition surface of wherein said the first acceleration sensing chip is vertical with described pin plane; And
The second acceleration sensing chip is arranged in described pin plane to the routing composition surface of wherein said the second acceleration sensing chip and described pin plane parallel.
2. method for making as claimed in claim 1, is characterized in that, the step that in described method, described the first acceleration sensing chip is arranged on to described pin plane engagement comprises:
By many bonding wires by soldered the multiple pads on the routing composition surface of described the first acceleration sensing chip multiple pads that are connected in described pin plane.
3. method for making as claimed in claim 2, is characterized in that, the step in described method, described the first acceleration sensing chip being arranged in described pin plane comprises:
Solid between side and the described substrate of the substrate by described the first acceleration sensing chip, allows described the first acceleration sensing chip be fixed on described substrate.
4. method for making as claimed in claim 1, is characterized in that, the step in described method, described the first acceleration sensing chip being arranged in described pin plane comprises:
Described the first acceleration sensing chip overturns; And
Described the first acceleration sensing chip after upset is seated in described pin plane.
5. method for making as claimed in claim 1, is characterized in that, the step in described method, described the first acceleration sensing chip being arranged in described pin plane comprises:
Described the first acceleration sensing chip is upside down in described pin plane.
6. method for making as claimed in claim 1, it is characterized in that, described the first acceleration sensing chip has the first detecting direction and the second detecting direction, and described the second acceleration sensing chip have the 3rd detecting direction, described first detecting direction, described second detecting direction and described the 3rd detecting direction differs from one another.
7. method for making as claimed in claim 1, it is characterized in that, described the first acceleration sensing chip has the first detecting direction, and described the second acceleration sensing chip has and the second detecting direction and the 3rd detecting direction, described the first detecting direction, described the second detecting direction and the described the 3rd are detected direction and are differed from one another.
8. method for making as claimed in claim 1, is characterized in that, described the first acceleration sensing chip and described the second acceleration sensing chip are identical chip.
9. a method for making for multiaxis acceleration sensing device, comprises:
A substrate is provided, and wherein said substrate has a pin plane;
The first acceleration sensing chip is arranged in described pin plane to the routing composition surface of wherein said the first acceleration sensing chip and described pin plane parallel; And
The second acceleration sensing chip is arranged in described pin plane to the routing composition surface of wherein said the second acceleration sensing chip and described pin plane parallel.
10. method for making as claimed in claim 9, is characterized in that, the step in described method, described the first acceleration sensing chip being arranged in described pin plane comprises:
Multiple on the routing composition surface of described the first acceleration sensing chip can be soldered to the multiple pads in described pin plane by welded contact.
11. method for makings as claimed in claim 10, is characterized in that, the step that in described method, described the first acceleration sensing chip is arranged on to described pin plane engagement comprises:
By the scolding tin between routing composition surface and the described substrate of described the first acceleration sensing chip, allow described the first acceleration sensing chip be fixed on described substrate.
12. method for makings as claimed in claim 9, is characterized in that, the step in described method, described the first acceleration sensing chip being arranged in described pin plane comprises:
Described the first acceleration sensing chip overturns; And
Described the first acceleration sensing chip after upset is seated in described pin plane.
13. method for makings as claimed in claim 9, is characterized in that, the step in described method, described the first acceleration sensing chip being arranged in described pin plane comprises:
Described the first acceleration sensing chip is upside down in described pin plane.
14. method for makings as claimed in claim 9, it is characterized in that, described the first acceleration sensing chip has the first detecting direction and the second detecting direction, and described the second acceleration sensing chip have the 3rd detecting direction, described first detecting direction, described second detecting direction and described the 3rd detecting direction differs from one another.
15. method for makings as claimed in claim 9, it is characterized in that, described the first acceleration sensing chip has the first detecting direction, and described the second acceleration sensing chip has and the second detecting direction and the 3rd detecting direction, described the first detecting direction, described the second detecting direction and the described the 3rd are detected direction and are differed from one another.
16. method for makings as claimed in claim 9, is characterized in that, described the first acceleration sensing chip and described the second acceleration sensing chip are identical chip.
17. 1 kinds of multiaxis acceleration sensing devices, comprise:
Substrate, has a pin plane;
The first acceleration sensing chip, is arranged in described pin plane, and the routing composition surface of wherein said the first acceleration sensing chip is vertical with described pin plane; And
The second acceleration sensing chip, is arranged in described pin plane, the routing composition surface of wherein said the second acceleration sensing chip and described pin plane parallel.
18. multiaxis acceleration sensing devices as claimed in claim 17, the multiple pads in the multiple pads on the routing composition surface of wherein said the first acceleration sensing chip and described pin plane are electrically connected by many bonding wires.
19. multiaxis acceleration sensing devices as claimed in claim 18, have solid between the side of the substrate of wherein said the first acceleration sensing and substrate.
20. multiaxis acceleration sensing devices as claimed in claim 17, wherein said the first acceleration sensing chip has the first detecting direction and the second detecting direction, and described the second acceleration sensing chip have the 3rd detecting direction, described first detecting direction, described second detecting direction and described the 3rd detecting direction differs from one another.
21. multiaxis acceleration sensing devices as claimed in claim 17, wherein said the first acceleration sensing chip has the first detecting direction, and described the second acceleration sensing chip has and the second detecting direction and the 3rd detecting direction, described the first detecting direction, described the second detecting direction and the described the 3rd are detected direction and are differed from one another.
22. multiaxis acceleration sensing devices as claimed in claim 17, wherein said the first acceleration sensing chip and described the second acceleration sensing chip are identical chip.
23. 1 kinds of multiaxis acceleration sensing devices, comprise:
Substrate, has a pin plane;
The first acceleration sensing chip, is arranged in described pin plane, the routing composition surface of wherein said the first acceleration sensing chip and described pin plane parallel; And
The second acceleration sensing chip, is arranged in described pin plane, the routing composition surface of wherein said the second acceleration sensing chip and described pin plane parallel.
24. multiaxis acceleration sensing devices as claimed in claim 23, multiple on the routing composition surface of wherein said the first acceleration sensing chip can welded contact and described pin plane on multiple pads between be electrically connected by scolding tin.
25. multiaxis acceleration sensing devices as claimed in claim 23, wherein said the first acceleration sensing chip has the first detecting direction and the second detecting direction, and described the second acceleration sensing chip have the 3rd detecting direction, described first detecting direction, described second detecting direction and described the 3rd detecting direction differs from one another.
26. multiaxis acceleration sensing devices as claimed in claim 23, wherein said the first acceleration sensing chip has the first detecting direction, and described the second acceleration sensing chip has and the second detecting direction and the 3rd detecting direction, described the first detecting direction, described the second detecting direction and the described the 3rd are detected direction and are differed from one another.
27. multiaxis acceleration sensing devices as claimed in claim 23, wherein said the first acceleration sensing chip and described the second acceleration sensing chip are identical chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310071306.1A CN104034918A (en) | 2013-03-06 | 2013-03-06 | Multi-axis acceleration sensing device and related making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310071306.1A CN104034918A (en) | 2013-03-06 | 2013-03-06 | Multi-axis acceleration sensing device and related making method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104034918A true CN104034918A (en) | 2014-09-10 |
Family
ID=51465762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310071306.1A Pending CN104034918A (en) | 2013-03-06 | 2013-03-06 | Multi-axis acceleration sensing device and related making method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104034918A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070170228A1 (en) * | 2006-01-20 | 2007-07-26 | Memsic Corporation | Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same |
| TW200928406A (en) * | 2007-09-17 | 2009-07-01 | Honeywell Int Inc | 3-D integrated compass package |
| CN101525116A (en) * | 2008-12-19 | 2009-09-09 | 中国科学院上海微系统与信息技术研究所 | Structure of vertical three-dimensional combined packaging of micro electric mechanical system and manufacture method thereof |
| CN101958256A (en) * | 2009-07-14 | 2011-01-26 | 霍尼韦尔国际公司 | The vertical reference assemble method |
| US20110234218A1 (en) * | 2010-03-24 | 2011-09-29 | Matthieu Lagouge | Integrated multi-axis hybrid magnetic field sensor |
| US20120217286A1 (en) * | 2011-02-25 | 2012-08-30 | Noureddine Hawat | Method for mounting a three-axis mems device with precise orientation |
-
2013
- 2013-03-06 CN CN201310071306.1A patent/CN104034918A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070170228A1 (en) * | 2006-01-20 | 2007-07-26 | Memsic Corporation | Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same |
| TW200928406A (en) * | 2007-09-17 | 2009-07-01 | Honeywell Int Inc | 3-D integrated compass package |
| CN101525116A (en) * | 2008-12-19 | 2009-09-09 | 中国科学院上海微系统与信息技术研究所 | Structure of vertical three-dimensional combined packaging of micro electric mechanical system and manufacture method thereof |
| CN101958256A (en) * | 2009-07-14 | 2011-01-26 | 霍尼韦尔国际公司 | The vertical reference assemble method |
| US20110234218A1 (en) * | 2010-03-24 | 2011-09-29 | Matthieu Lagouge | Integrated multi-axis hybrid magnetic field sensor |
| US20120217286A1 (en) * | 2011-02-25 | 2012-08-30 | Noureddine Hawat | Method for mounting a three-axis mems device with precise orientation |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2014099591A (en) | Multi-chip module connection by way of bridging blocks | |
| KR20130117109A (en) | Semiconductor package and method of fabricating the same | |
| CN203721707U (en) | Chip packaging structure | |
| SG130068A1 (en) | Lead frame-based semiconductor device packages incorporating at least one land grid array package and methods of fabrication | |
| CN105280580B (en) | Lead packages body and electronic unit it is three-dimensional stacked | |
| CN103199075A (en) | Wafer level semiconductor encapsulation structure with stacking chips and manufacturing method thereof | |
| CN103500736B (en) | Chip packaging structure and chip packaging method | |
| CN105374788A (en) | Stacked flip chip packaging structure and manufacture method thereof | |
| CN103872004A (en) | Chip structure and multi-chip stack package | |
| CN100466246C (en) | Flexible substrate for packaging | |
| CN208433405U (en) | Circuit unit | |
| CN104034918A (en) | Multi-axis acceleration sensing device and related making method | |
| CN102064162B (en) | Stacked package structure, package structure thereof and manufacture method of the package structure | |
| TWI475231B (en) | Multi-axial acceleration sensor and method of manufacturing the same | |
| CN102332410A (en) | Packaging method and structure of chip | |
| CN208433406U (en) | Encapsulate chip | |
| CN207690781U (en) | QFN encapsulating structures, the QFN encapsulating structures of fingerprint recognition and the smart mobile phone with it | |
| TWI442488B (en) | Method for manufacturing a substrate, package method, package structure and system-in-package structure for a semiconductor package | |
| CN101685809A (en) | Semiconductor packaging component and conducting wire rack thereof | |
| CN106601639B (en) | Non-sticking detection test method and substrate and pressing plate used by same | |
| CN204516737U (en) | A kind of novel semi-conductor slip-off preventing encapsulating structure | |
| CN202957237U (en) | Chip encapsulation structure | |
| CN101145548A (en) | Universal packaging substrate and its application device | |
| CN205845940U (en) | Microminiature BGA construction packages structure | |
| KR20110124094A (en) | Method for fabricating the semiconductors package having a vertical chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140910 |