CN104022094A - 银铕合金键合丝及其制造方法 - Google Patents

银铕合金键合丝及其制造方法 Download PDF

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CN104022094A
CN104022094A CN201410234934.1A CN201410234934A CN104022094A CN 104022094 A CN104022094 A CN 104022094A CN 201410234934 A CN201410234934 A CN 201410234934A CN 104022094 A CN104022094 A CN 104022094A
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silver
europium
alloy
bonding wire
colored
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徐云管
李湘平
彭庶瑶
梁建华
涂海情
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JIANGXI LAN WEI ELECTRONIC TECHNOLOGY Co Ltd
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Abstract

一种银铕合金键合丝及其制造方法，该键合丝是以高纯银为主体材料，包括金和铕金属材料。其组成键合丝的材料各成分重量百分比为：银含量为：96%-97.5%、金含量为0.5%-1%、铕含量为2%-3%；其制造方法包括：提取纯度大于99.9999%的高纯银，制备成银合金铸锭，再制成铸态银铕合金母线，将母线拉制成1mm左右的银铕合金键合丝经热处理后，再经精密拉拔、热处理、清洗后制成不同规格的银铕合金键合丝。本发明克服现有合金类键合铜丝、铝丝表面易氧化、高温稳定性差和拉拔断线问题，以及黄金类键合丝生产成本高、电镀层硬度低不耐摩擦的缺陷和不足。

Description

银铕合金键合丝及其制造方法
技术领域
本发明涉及一种金属键合丝及其制造方法，尤其涉及一种银铕等合金材料制作的银铕合金键合丝及其制造方法。
背景技术
目前用于集成电路、半导体分立器件等领域的引线封装键合丝最为广泛采用的是黄金类键合丝。由于黄金属贵重金属，价格昂贵且日益上涨，给用量最大的中低端LED、IC封装用户带来沉重的成本压力。因而业界急需成本相对低廉、性能稳定可靠的新型键合丝材料用以取代黄金键合丝。以高纯银为主体材料的银铕合金键合丝既有银基类键合丝的优点又兼顾黄金类键合丝的优点，是一种价格相对低廉且性能又稳定可靠的一种新型键合丝。
发明内容
本发明的目的是提供一种以高纯银为主体材料的银铕合金键合丝及其制造方法，它克服现有合金类键合铜丝、铝丝表面易氧化、高温稳定性差和拉拔断线问题，以及黄金类键合丝生产成本高、电镀层硬度低不耐摩擦的缺陷和不足。
为达到上述目的，本发明所采用的技术方案是：一种银铕合金键合丝，组成键合丝的材料各成分重量百分比为：金（Au）占0.5%-1%、铕（Eu）占2%-3%，银（Ag）占96%-97.5%。其中要求金的纯度大于99.99%、银的纯度大于99.9999%、铕的纯度大于99.9%。
所述银铕合金键合丝的制造方法步骤如下：
① 提取高纯银：将1号银（IC-Ag99.99）作为阳极浸入电解液中，以高纯银箔作为阴极浸入电解液中；在阳极、阴极之间输入（7-9）V、（2.5-3.5）A的直流电，以补充新鲜电解液方式维持电解液温度不超过60℃，待阴极积聚一定重量的纯度大于99.9999%的高纯银时及时更换高纯银箔，再经清洗、烘干备用。
② 制备成银合金铸锭：按下述成分含量准备材料：金（Au）占0.5%-1%、铕（Eu）占2%-3%，银（Ag）占96%-97.5%。这些金属经机械混合后放入高纯石墨坩埚中，在惰性气体保护条件下使用感应电炉加热使其熔化，进而制备成银合金铸锭。
③ 连铸成铸态银铕合金母线：将制备好的银合金铸锭加入有氮气保护的水平连铸金属连铸室，应用中频感应加热至（1100-1150）℃，待完全熔化、精炼和除气后，将熔液注入连铸室中间的储液池保温，在维持（2-5）L/min净化氮气流量的连铸室中，完成对银铕合金熔液的水平连铸，得到Φ3mm左右的铸态银铕合金母线。
④ 粗拔：将Φ3mm左右的银铕合金母线拉拔成直径为1mm左右的银铕合金丝。
⑤ 热处理：将直径为1mm左右的银铕合金丝进行退火处理。
⑥ 精拔：将经退火处理的银铕合金丝精密拉拔成不同规格的（0.013mm-0.050mm）银铕合金键合丝。
⑦ 热处理：将精拔后的银铕合金键合丝进行退火处理。
⑧ 表面清洗：将退火处理后的银铕合金键合丝先经稀释后的酸液中进行清洗，然后经超声波清洗，再经高纯水清洗、烘干。
⑨ 分卷：将成品银铕合金键合丝进行复绕、分卷、包装。
本发明的技术效果是：以高纯银为主体材料的银铕合金键合丝既有银基类键合丝的优点又兼顾黄金类键合丝的优点，是一种价格相对低廉且性能又稳定可靠的一种新型键合丝。它克服现有合金类键合铜丝、铝丝表面易氧化、高温稳定性差和拉拔断线问题，以及黄金类键合丝生产成本高、电镀层硬度低不耐摩擦的缺陷和不足。
具体实施方式
为了便于理解，下面结合具体实施例对本发明予以进一步说明。
实施例1
本发明是这样实现的，一种以高纯银为主体材料的银铕合金键合丝，组成该键合丝的材料由下列重量百分比的原材料组成：金（Au)占0.5%、铕（Eu）占2%，银（Ag）占98.5%；要求金的纯度大于99.99%、银的纯度大于99.9999%、铕的纯度大于99.9%。
银铕合金键合丝的制作工艺步骤和方法如下：
① 提取高纯银：将1号银（IC-Ag99.99）作为阳极浸入电解液中，以高纯银箔作为阴极浸入电解液中；在阳极、阴极之间输入7V、2.5A的直流电，以补充新鲜电解液方式维持电解液温度不超过60℃，待阴极积聚一定重量的纯度大于99.9999%的高纯银时及时更换高纯银箔，再经清洗、烘干备用。
② 制备成银合金铸锭：按金（Au)占0.5%、铕（Eu）占2%，银占（Ag）98.5%的配比称取材料，这些金属经机械混合后放入高纯石墨坩埚中，在惰性气体保护条件下使用感应电炉加热使其熔化，进而制备成银合金铸锭。
③ 连铸成铸态银铕合金母线：将制备好的银合金铸锭加入有氮气保护的水平连铸金属连铸室，应用中频感应加热、熔化、精炼和除气后，将熔液注入储液池保温，完成对银铕合金熔液的水平连铸，得到Φ3mm左右、纵向和横向晶粒数均为1个的铸态银铕合金母线。
④ 粗拔：将Φ3mm左右的银铕合金母线拉拔成直径为1mm左右的银铕合金丝。
⑤ 热处理：将直径为1mm左右的银铕合金丝进行退火处理。
⑥ 精拔：将经退火处理的银铕合金丝精密拉拔成不同规格的（0.013mm-0.050mm）银铕合金键合丝。
⑦ 热处理：将精拔后的银铕合金键合丝进行退火处理。
⑧ 表面清洗：将退火处理后的银铕合金键合丝先经稀释后的酸液中进行清洗，然后经超声波清洗，再经高纯水清洗、烘干。
⑨ 分卷：将成品银铕合金键合丝进行复绕、分卷、包装。
 
实施例2
一种以高纯银为主体材料的银铕合金键合丝，组成该键合丝的材料由下列重量百分比的原材料组成：金（Au)占1%、铕（Eu）占3%，银（Ag）占96%；要求金的纯度大于99.99%、银的纯度大于99.9999%、铕的纯度大于99.9%。
银铕合金键合丝的制作工艺步骤和方法如下：
① 提取高纯银：将1号银（IC-Ag99.99）作为阳极浸入电解液中，以高纯银箔作为阴极浸入电解液中；在阳极、阴极之间输入9V、3.5A的直流电，以补充新鲜电解液方式维持电解液温度不超过60℃，待阴极积聚一定重量的纯度大于99.9999%的高纯银时及时更换高纯银箔，再经清洗、烘干备用。
② 制备成银合金铸锭：按金（Au)占1%、铕（Eu）占3%，银（Ag）占96%的配比称取材料，这些金属经机械混合后放入高纯石墨坩埚中，在惰性气体保护条件下使用感应电炉加热使其熔化，进而制备成银合金铸锭。
③ 连铸成铸态银铕合金母线：将制备好的银合金铸锭加入有氮气保护的水平连铸金属连铸室，应用中频感应加热、熔化、精炼和除气后，将熔液注入储液池保温，完成对银铕合金熔液的水平连铸，得到Φ3mm左右的铸态银铕合金母线。
④ 粗拔：将Φ3mm左右的银铕合金母线拉拔成直径为1mm左右的银铕合金丝。
⑤ 热处理：将直径为1mm左右的银铕合金丝进行退火处理。
⑥ 精拔：将经退火处理的银铕合金丝精密拉拔成不同规格的（0.013mm-0.050mm）银铕合金键合丝。
⑦ 热处理：将精拔后的银铕合金键合丝进行退火处理。
⑧ 表面清洗：将退火处理后的银铕合金键合丝先经稀释后的酸液中进行清洗，然后经超声波清洗，再经高纯水清洗、烘干。
⑨ 分卷：将成品银铕合金键合丝进行复绕、分卷、包装。
 
实施例3
一种以高纯银为主体材料的银铕合金键合丝，组成该键合丝的材料由下列重量百分比的原材料组成：金（Au)占0.8%、铕（Eu）占2.7%，银（Ag）占96.5%。要求金的纯度大于99.99%、银的纯度大于99.9999%、铕的纯度大于99.9%。
银铕合金键合丝的制作工艺步骤和方法如下：
① 提取高纯银：将1号银（IC-Ag99.99）作为阳极浸入电解液中，以高纯银箔作为阴极浸入电解液中；在阳极、阴极之间输入8V、3.0A的直流电，以补充新鲜电解液方式维持电解液温度不超过60℃，待阴极积聚一定重量的纯度大于99.9999%的高纯银时及时更换高纯银箔，再经清洗、烘干备用。
② 制备成银合金铸锭：按金（Au)占0.8%、铕（Eu）占2.7%，银（Ag）占96.5%的配比称取材料，在高纯银内加入高纯金和铕，这些金属经机械混合后放入高纯石墨坩埚中，在惰性气体保护条件下使用感应电炉加热使其熔化，进而制备成银合金铸锭。
③ 连铸成铸态银铕合金母线：将制备好的银合金铸锭加入有氮气保护的水平连铸金属连铸室，应用中频感应加热、熔化、精炼和除气后，将熔液注入储液池保温，完成对银铕合金熔液的水平连铸，得到Φ3mm左右的铸态银铕合金母线。
④ 粗拔：将Φ3mm左右的银铕合金母线拉拔成直径为1mm左右的银铕合金丝。
⑤ 热处理：将直径为1mm左右的银铕合金丝进行退火处理。
⑥ 精拔：将经退火处理的银铕合金丝精密拉拔成不同规格的（0.013mm-0.050mm）银铕合金键合丝。
⑦ 热处理：将精拔后的银铕合金键合丝进行退火处理。
⑧ 表面清洗：将退火处理后的银铕合金键合丝先经稀释后的酸液中进行清洗，然后经超声波清洗，再经高纯水清洗、烘干。
⑨ 分卷：将成品银铕合金键合丝进行复绕、分卷、包装。

Claims (3)

1.一种银铕合金键合丝，其特征在于它由下列重量百分比的材料制备而成：金（Au）占0.5%-1%、铕（Eu）占2%-3%，银（Ag）占96%-97.5%。
2.根据权利要求1所述的银铕合金键合丝，其特征是所使用的材料中，金的纯度大于99.99%、银的纯度大于99.9999%、铕的纯度大于99.9%。
3.一种权利要求1所述的银铕合金键合丝的制造方法，其特征是制作的工艺步骤和方法如下：
① 提取高纯银：以国家标准GB/T4135中1号银为基材，经电镀后提取纯度大于99.9999%的高纯银，再经清洗、烘干备用；
② 制备成银合金铸锭：提取纯度大于99.9999%的高纯银，然后加入金和铕；其成分含量按照重量百分比分别为：金占0.5%-1%、铕占2%-3%，其余为银，之和等于100%，这些金属经机械混合后放入高纯石墨坩埚中，在惰性气体保护条件下使用感应电炉加热使其熔化，进而制备成银合金铸锭；
③ 连铸成铸态银铕合金母线：将制备好的银合金铸锭加入有氮气保护的水平连铸金属连铸室，应用中频感应加热熔化、精炼和除气后，将熔液注入储液池保温，完成对银铕合金熔液的水平连铸，得到Φ3mm左右的铸态银铕合金母线；
④ 粗拔：将Φ3mm左右的银铕合金母线拉拔成直径为1mm左右的银铕合金丝；
⑤ 热处理：将直径为1mm左右的银铕合金丝进行退火；
⑥ 精拔：对经热处理后的银铕合金丝精密拉拔成直径分别为13μm-50μm的成品银铕合金键合丝；
⑦ 热处理：将精拔后的银铕合金键合丝进行退火；
⑧ 表面清洗：先用稀释后的酸液对键合丝进行清洗，然后经超声波清洗，再经高纯水清洗、烘干；
⑨ 分卷：将成品银铕合金键合丝进行复绕、分卷、包装。
CN201410234934.1A 2014-05-30 2014-05-30 银铕合金键合丝及其制造方法 Pending CN104022094A (zh)

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CN1692485A (zh) * 2002-11-27 2005-11-02 新日本制铁株式会社 半导体器件的金连接线及其生产方法
CN101630670A (zh) * 2008-07-14 2010-01-20 Mk电子株式会社 用于半导体封装的Ag基合金引线
CN102130069A (zh) * 2008-07-14 2011-07-20 Mk电子株式会社 用于半导体封装的Ag基合金引线
CN102154574A (zh) * 2010-10-18 2011-08-17 东莞市正奇电子有限公司 半导体组件连接用合金线
CN103779309A (zh) * 2014-01-20 2014-05-07 江西蓝微电子科技有限公司 镀金金银钯合金单晶键合丝及其制造方法

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CN1692485A (zh) * 2002-11-27 2005-11-02 新日本制铁株式会社 半导体器件的金连接线及其生产方法
CN101630670A (zh) * 2008-07-14 2010-01-20 Mk电子株式会社 用于半导体封装的Ag基合金引线
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