CN104015456B - Anion insulated compound board manufacturing method - Google Patents
Anion insulated compound board manufacturing method Download PDFInfo
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- CN104015456B CN104015456B CN201410254773.2A CN201410254773A CN104015456B CN 104015456 B CN104015456 B CN 104015456B CN 201410254773 A CN201410254773 A CN 201410254773A CN 104015456 B CN104015456 B CN 104015456B
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- anion
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- compound adhesive
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Abstract
Anion insulated compound board manufacturing method of the present invention relates to anion plate technique field.With " anion mixing material forms polymer with epoxy blend " key technology, anion compound adhesive leaching epoxy resin 100, tourmaline 4 100, dicyandiamide 13, imidazoles 0.01 0.1, acetone 30 50 weight portion being mixed at 30 80 DEG C overlays in glass fabric, vacuum state, 170 DEG C, dried the anion insulating trip 25 made through 20 minutes and stack neat, vacuum state, 180 DEG C, suppress 90 minutes under 4.5Mpa pressure after make anion insulated composite board.Indoor use.Technique is simple, quality is good, low cost, profit are promoted.
Description
Technical field
Anion insulated compound board manufacturing method of the present invention, relates to anion technology field；
It is specifically related to anion insulated compound board manufacturing method technical field.
Background technology
At present, heating mode many dependence central heating/of household or warming by air conditioner/or burning
The mode such as coal, coke, also exists Nitrogen Oxides in Indoor Air accumulation, indoor building materials
Easily release harmful substance and pungent gas, the air humidity of being heated is low, noxious bacteria easily grows
Etc. shortcoming, in indoor inhabitation, giddy, the sky such as uncomfortable in chest, sleepy, weak easily occur for a long time
Adjust sick disease.
Negative aeroion is described as " air vitamin ", can improve the air quality of indoor,
Contaminated gas in clean room, and there is the antibacterial function of deodorization and good life
Thing effect and environmental protection effect.
In present marketed anion generator by high voltage electric field make air bear from
The corona discharge type anion generator of sonization is most.The research of this known technology is relatively
Early, although produce negative ion concentration high, but be easily generated harmful gas such as ozone, nitrogen oxides
Body, easily causes secondary pollution, does not meets the requirement of environment protection health.
Current air negative ion material is mainly tourmaline material, and tourmaline is a kind of sky
So Ore, its crystal structure is special, has unsymmetry, and therefore its crystal is at extraneous ring
When border temperature or pressure have minor variations, cause the electric potential difference between natural crystal crystal, this
Planting electrostatic potential can make neighbouring air ionize, and makes water and oxygen molecule ionization, becomes
Negative aeroion, it addition, tourmaline can also send far infrared, contributes to blood of human body
Circulation.Existing product both domestic and external many by tourmaline arogel brush in heating element panel surface or
Tourmaline slabstone is covered on heater (such as resistance wire, Electric radiant Heating Film and carbon fiber).
The method of this existing known technology and present situation also exist cost of manufacture high in-convenience in use,
Service life is short, negative oxygen ion generation rate is low, the easily damaged peeling of anion material layer, peace
Full property is the best and restricted waits not enough, defect and drawback.
Professional knowledge based on inventor and abundant working experience and excelsior
Unremitting pursuit, in conscientious and abundant investigation, understands, analyzes, sums up, studies existing public affairs
On the basis of knowing technology and present situation, creative takes " anion mixing material and asphalt mixtures modified by epoxy resin
Fat is blended and forms polymer " key technology, succeed in developing the present invention, effectively solved
Deficiency, defect and the drawback that existing known technology and present situation exist, effectively raises
The technical merit of the industry.
Summary of the invention
The present invention takes " anion mixing material forms polymer with epoxy blend "
Key technology, offer " anion insulated compound board manufacturing method " and " anion insulation
Composite plate " new product, the present invention is by epoxy resin 100, tourmaline 2-50, strange ice
Stone 2-50, dicyandiamide 1-3, imidazoles 0.01-0.1, acetone 30-50 weight portion
The anion compound adhesive leaching being mixed at 30-80 DEG C overlays in glass fabric,
Vacuum state, 170 DEG C, dried, through 20 minutes, the anion insulating trip 2-5 that makes
Stack neat, vacuum state, 180 DEG C, suppress 90 minutes under 4.5Mpa pressure
After make anion insulated composite board.
The purpose reached by the present invention is: 1., take " anion mixing material and ring
Epoxy resins be blended formed polymer " key technology, offer " anion insulated composite board system
Make method " and " anion insulated composite board " new product.2., the present invention use bear from
Son mixing material forms polymer with epoxy blend, is coated in glass fabric,
The anion insulated composite board produced under vacuum high-temperature high pressure, produced anion
Durability is good；And for compared to one side coating anion compound adhesive material, this
Bright specific surface area is big, and usable front panel and reverse panel can produce anion, and firm and durable,
Do not fall glue.3., the carrier of the present invention be glass fabric, heatproof may be up to 150 DEG C with
On, not only length in service life and also safe and reliable.4., the product of the present invention has not produced
Evil gas such as ozone and other indoor pollutants.5., present invention uses anion mixing
Material, is greatly promoted than the anion generation amount of single tourmaline powder.The present invention uses
MULTILAYER COMPOSITE pressure technology, anion production is bigger.6., the present invention have low cost,
Quality is good, technical process is simple and convenient to operate fast, the advantage easily promoted.7., originally
Invention solves existing known technology and deficiency, defect and the drawback of present situation existence.⑧、
By the present invention, effectively raise the technical merit of the industry.
For achieving the above object, the technical scheme that the present invention provides is:
A kind of anion insulated compound board manufacturing method:
1., the preparation of anion compound adhesive: with heat-resistant fireproof epoxy resin 100 weight
Part, tourmaline nano material 2-50 weight portion, rare ice stone nano material 2-50 weight
Part, the dicyandiamide 1-3 weight portion as firming agent, curing accelerator imidazoles 0.01-
0.1 weight portion, as the acetone 30-50 weight portion of solvent under the conditions of 30-80 DEG C
Anion compound adhesive is made stand-by after mixing；
2., impregnation: with cement dipping machine described anion compound adhesive uniformly soaked and overlay on glass fibers
Tie up in cloth stand-by；
3., the preparation of anion insulating trip: the glass fibre of anion compound adhesive will be soaked with
Anion insulation made in vacuum state, with 170 DEG C, after 20 minutes dry by cloth
Sheet is stand-by；
4., the preparation of anion insulated composite board: number 2-5 is opened according to thickness requirements
Stack neat for the anion insulating trip after drying, in vacuum state, with 180 DEG C,
Anion insulated composite board is made after suppressing 90 minutes under 4.5Mpa pressure.
Owing to have employed technical scheme provided by the present invention；Owing to the present invention takes " negative
Ar ion mixing material forms polymer with epoxy blend " key technology；Due to this
Bright by epoxy resin 100, tourmaline 2-50, rare ice stone 2-50, dicyandiamide 1-3,
Imidazoles 0.01-0.1, acetone 30-50 weight portion are mixed at 30-80 DEG C
Anion compound adhesive leaching overlay in glass fabric, vacuum state, 170 DEG C, through 20
Minute drying the anion insulating trip 2-5 that makes, to open stacking neat, vacuum state,
180 DEG C, suppress 90 minutes under 4.5Mpa pressure after make anion insulated composite board.
Make the present invention compared with existing known technology and present situation, it is thus achieved that to provide the benefit that:
1, this invention takes that " anion mixing material is formed poly-with epoxy blend
Compound " key technology, provide " anion insulated compound board manufacturing method " and " negative
Ion insulated composite board " new product.
2, the present invention uses anion mixing material to form polymer with epoxy blend,
Being coated in glass fabric, the anion insulation produced under vacuum high-temperature high pressure is multiple
Plywood, the durability of produced anion is good.
3, for the present invention is compared to one side coating anion compound adhesive material, the present invention
Specific surface area big, and usable front panel and reverse panel can produce anion, and firm and durable, no
Fall glue.
4, the carrier of the present invention is glass fabric, and heatproof may be up to more than 150 DEG C,
Not only length in service life and also safe and reliable.
5, the product of the present invention does not produce harmful gas such as ozone and other indoor pollutants.
6, present invention uses anion mixing material, bearing than single tourmaline powder
Ion generation amount is greatly promoted.The present invention uses MULTILAYER COMPOSITE pressure technology, and anion produces
Measure bigger.
7, the present invention has that low cost, quality be good, technical process is simple and convenient to operate
Fast, the advantage easily promoted.
8, the present invention solve deficiency that existing known technology and present situation exist, defect with
Drawback.
9, by the present invention, the technical merit of the industry is effectively raised.
Accompanying drawing explanation
Fig. 1 is the technique flow operation process window frame schematic diagram of the specific embodiment of the invention.
Detailed description of the invention
Detailed description of the invention one
Below in conjunction with Figure of description, the present invention is described in detail.As description is attached
Shown in figure:
A kind of anion insulated compound board manufacturing method:
1., the preparation of anion compound adhesive: with heat-resistant fireproof epoxy resin 100 weight
Part, tourmaline nano material 2-50 weight portion, rare ice stone nano material 2-50 weight
Part, the dicyandiamide 1-3 weight portion as firming agent, curing accelerator imidazoles 0.01-
0.1 weight portion, as the acetone 30-50 weight portion of solvent under the conditions of 30-80 DEG C
Anion compound adhesive is made stand-by after mixing；
2., impregnation: with cement dipping machine described anion compound adhesive uniformly soaked and overlay on glass fibers
Tie up in cloth stand-by；
3., the preparation of anion insulating trip: the glass fibre of anion compound adhesive will be soaked with
Anion insulation made in vacuum state, with 170 DEG C, after 20 minutes dry by cloth
Sheet is stand-by；
4., the preparation of anion insulated composite board: number 2-5 is opened according to thickness requirements
Stack neat for the anion insulating trip after drying, in vacuum state, with 180 DEG C,
Anion insulated composite board is made after suppressing 90 minutes under 4.5Mpa pressure.
In above-mentioned specific implementation process: to described tourmaline nano material respectively with 2,
5、8、10、13、18、20、22、24、26、28、30、33、36、39、41、
44,46,48,50 weight portions are carried out, and divide described rare ice stone nano material
Not with 2,5,8,10,13,18,20,22,24,26,28,30,33,36,
39,41,44,46,48,50 weight portions are carried out, to described as solidification
The dicyandiamide of agent is carried out with 1,2,3 weight portions respectively, promotes described solidification
Agent imidazoles respectively with 0.01,0.02,0.03,0.04,0.05,0.06,0.07,
0.08,0.09,0.1 weight portion is carried out, and divides the described acetone as solvent
It is not carried out with 30,33,36,39,41,44,46,48,50 weight portions；
To the temperature in the preparation of described anion compound adhesive respectively with 30,35,40,45,
50,55,60,65,70,75,80 DEG C are carried out；All obtain intended good
Good effect.
Detailed description of the invention two
Implement by detailed description of the invention one, simply: to described anion compound adhesive
In preparation, with heat-resistant fireproof epoxy resin 100 kilograms, tourmaline nano material 2-
50 kilograms, rare ice stone nano material 2-50 kilogram, dicyandiamide 1 as firming agent
-3 kilograms, curing accelerator imidazoles 0.01-0.1 kilogram, acetone 30 as solvent
-50 kilograms are carried out, and all have received intended good result.
In above-mentioned specific implementation process: to described tourmaline nano material respectively with 2,
5、8、10、13、18、20、22、24、26、28、30、33、36、39、41、
44,46,48,50 kilograms are carried out, to described rare ice stone nano material respectively
With 2,5,8,10,13,18,20,22,24,26,28,30,33,36,
39,41,44,46,48,50 kilograms are carried out, to described as firming agent
Dicyandiamide be carried out with 1,2,3 kilograms respectively, to described curing accelerator miaow
Azoles respectively with 0.01,0.02,0.03,0.04,0.05,0.06,0.07,0.08,
0.09,0.1 kilogram is carried out, to the described acetone as solvent respectively with 30,
33,36,39,41,44,46,48,50 kilograms are carried out；All obtain
Intended good result.
Detailed description of the invention three
Implement by detailed description of the invention one, simply: to described heat-resistant fireproof epoxy
Resin, tourmaline nano material, rare ice stone nano material, as firming agent dicyandiamide,
Curing accelerator imidazoles, the consumption of acetone as solvent, respectively to reduce 1,2,3,
4,5,6,7,8,9,10,15,20,25,30 times are carried out, and also divide
Not to expand 1,2,3,4,5,6,7,8,9,10,15,20,25,30 times
It is carried out, all have received intended good result.Make the present invention have small test,
Laboratory test, expanding test, the solid foundation of industrial experimentation, have theoretical direction
Operability with production application.
These are only presently preferred embodiments of the present invention, not the present invention is made any in form
Restriction；All industry technical staff all can smooth and easy implement；But without departing from skill of the present invention
Art scheme makes the equivalent variations modified with develop, and is technical scheme.
Claims (1)
1. an anion insulated compound board manufacturing method, it is characterised in that:
1., the preparation of anion compound adhesive: with heat-resistant fireproof epoxy resin 100 weight
Part, tourmaline nano material 4-100 weight portion, dicyandiamide 1-3 as firming agent
Weight portion, curing accelerator imidazoles 0.01-0.1 weight portion, acetone as solvent
30-50 weight portion is made anion compound adhesive and is treated after mixing under the conditions of 30-80 DEG C
With；
2., impregnation: with cement dipping machine described anion compound adhesive uniformly soaked and overlay on glass fibers
Tie up in cloth stand-by；
3., the preparation of anion insulating trip: the glass fibre of anion compound adhesive will be soaked with
Anion insulation made in vacuum state, with 170 DEG C, after 20 minutes dry by cloth
Sheet is stand-by；
4., the preparation of anion insulated composite board: 2-5 opened institute according to thickness requirements
State the anion insulating trip after drying and stack neat, in vacuum state, with 180 DEG C,
Anion insulated composite board is made after suppressing 90 minutes under 4.5Mpa pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410254773.2A CN104015456B (en) | 2014-06-11 | 2014-06-11 | Anion insulated compound board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410254773.2A CN104015456B (en) | 2014-06-11 | 2014-06-11 | Anion insulated compound board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104015456A CN104015456A (en) | 2014-09-03 |
| CN104015456B true CN104015456B (en) | 2016-08-17 |
Family
ID=51432593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410254773.2A Expired - Fee Related CN104015456B (en) | 2014-06-11 | 2014-06-11 | Anion insulated compound board manufacturing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN104015456B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106088525A (en) * | 2016-07-27 | 2016-11-09 | 湖北鸿连实业有限公司 | A kind of anion solid wooden compound floor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202225492U (en) * | 2011-06-27 | 2012-05-23 | 广东有金宋地板制造有限公司 | Novel insulating composite board |
| CN202242159U (en) * | 2011-06-27 | 2012-05-30 | 广东有金宋地板制造有限公司 | Novel composite decoration board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3975984B2 (en) * | 2003-08-11 | 2007-09-12 | 日立化成工業株式会社 | Insulating substrate in adhesive state with copper |
| JP2013052666A (en) * | 2011-08-10 | 2013-03-21 | Sekisui Chem Co Ltd | Polyethylene naphthalate film to which softening agent adheres, polyethylene naphthalate film to which softening is processed, insulating film with metal foil, method of manufacturing the same, method of manufacturing laminated structure, and laminated structure |
-
2014
- 2014-06-11 CN CN201410254773.2A patent/CN104015456B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202225492U (en) * | 2011-06-27 | 2012-05-23 | 广东有金宋地板制造有限公司 | Novel insulating composite board |
| CN202242159U (en) * | 2011-06-27 | 2012-05-30 | 广东有金宋地板制造有限公司 | Novel composite decoration board |
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| Publication number | Publication date |
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| CN104015456A (en) | 2014-09-03 |
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| C14 | Grant of patent or utility model | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20170714 Address after: 518000, Guangdong, Shenzhen, Baoan District manhole street, West Ring Road, 99 industrial city, A District, C building, west of the first floor Patentee after: SHENZHEN JUMBO COPPER LAMINATE TECHNOLOGY CO., LTD. Address before: 518000 Guangdong Province, Shenzhen Baoan District manhole Galaxy gardens B1 2102 Co-patentee before: Guo Kaihua Patentee before: Guo Changqi |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20210611 |
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| CF01 | Termination of patent right due to non-payment of annual fee |