CN104015456A - Production method of anion insulation composite plate - Google Patents
Production method of anion insulation composite plate Download PDFInfo
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- CN104015456A CN104015456A CN201410254773.2A CN201410254773A CN104015456A CN 104015456 A CN104015456 A CN 104015456A CN 201410254773 A CN201410254773 A CN 201410254773A CN 104015456 A CN104015456 A CN 104015456A
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Abstract
The invention relates to a production method of an anion insulation composite plate, which relates to the technical field of an anion plate. According to a key technology for blending an anion mixed material and epoxy resin to form a polymer, 100 parts by weight of epoxy resin, 2 to 50 parts by weight of tourmaline, 2 to 50 parts by weight of special ices, 1 to 3 parts of dicyandiamide, 0.01 to 0.1 part by weight of imidazole and 30 to 50 parts by weight of acetone are blended at the temperature of 30 to 80 DEG C to produce an anion composite adhesive, the anion composite adhesive infiltrates glass fiber cloth, and 2 to 5 anion insulation pieces which are produced in a vacuum state and dried at the temperature of 170 DEG C for 20 minutes are orderly stacked to be pressed in a vacuum state, at the temperature of 180 DEG C and with the pressure of 4.5MPa for 90 minutes to obtain the anion insulation composite plate. The anion insulation composite plate is prepared for indoor use, simple in process, good in quality and low in cost and has a wide popularization range.
Description
Technical field
Anion insulated compound board manufacturing method of the present invention, relates to anion technology field; Be specifically related to anion insulated compound board manufacturing method technical field.
Background technology
At present, the heating mode of household relies on central heating/or warming by air conditioner/or mode such as burning coal, coke more, exist that Nitrogen Oxides in Indoor Air gathers, indoor building materials is heated and easily discharge the shortcomings such as harmful substance and pungent gas, air humidity is low, harmful bacteria easily grows, in indoor inhabitation, easily occur for a long time the illness of giddy, the air conditioner disease such as uncomfortable in chest, sleepy, weak.
Negative aeroion is described as " air vitamin ", can improve indoor air quality, contaminated gas in clean room, and there is the antibacterial function of deodorizing and good biological effect and environmental protection effect.
It is maximum in the anion generator that sell in market now, by high voltage electric field, making the corona discharge type anion generator of negative aeroion.The research of this known technology early, although it is high to produce negative ion concentration, easily produces the pernicious gases such as ozone, nitrogen oxide, easily causes secondary pollution, does not meet the requirement of environment protection health.
Current air negative ion material is mainly tourmaline material, tourmaline is a kind of natural crystal, and its crystal structure is special, has asymmetry, therefore its crystal is when ambient temperature or pressure have minor variations, cause the electrical potential difference between natural crystal crystal, near this electrostatic potential can make, air ionizes, and makes water and oxygen molecule ionization, become negative aeroion, in addition, tourmaline can also send far infrared, contributes to blood circulation of human body.Existing product both domestic and external is many to be brushed tourmaline arogel in heating element panel surface or by tourmaline slabstone and is covered on heater (as resistance wire, Electric radiant Heating Film and carbon fiber).The method of this existing known technology and present situation exist cost of manufacture high, use inconvenient, that service life is short, negative oxygen ion generation rate is low, anion material layer easily damagedly peels off, security is not good and restricted etc. is not enough, defect and drawback.
Professional knowledge based on inventor and abundant working experience and excelsior unremitting pursue, in conscientious and fully investigation, understand, analyze, sum up, on the existing known technology of research and present situation basis, creationary taking " anion composite material and epoxy blend form polymer " key technology, succeeded in developing the present invention, effectively solve deficiency, defect and drawback that existing known technology and present situation exist, effectively raised the technical merit of the industry.
Summary of the invention
The present invention takes " anion composite material and epoxy blend form polymer " key technology, " anion insulated compound board manufacturing method " and " anion insulated composite board " new product are provided, the present invention is by epoxy resin 100, tourmaline 2-50, strange ice stone 2-50, dicyandiamide 1-3, imidazoles 0.01-0.1, the anion compound adhesive that acetone 30-50 weight portion is mixed at 30-80 ℃ is soaked and is overlayed in glass fabric, at vacuum state, 170 ℃, through 20 minutes, dry the anion insulating trip 2-5 making and open stacking neatly, at vacuum state, 180 ℃, under 4.5Mpa pressure, suppress after 90 minutes and make anion insulated composite board.
1., take " anion composite material and epoxy blend form polymer " key technology, " anion insulated compound board manufacturing method " and " anion insulated composite board " new product are provided the object reaching by the present invention is:.2., the present invention adopts anion composite material and epoxy blend to form polymer, be coated in glass fabric, the anion insulated composite board of producing under vacuum high-temperature high pressure, the durability of the anion that produces is good; And applying anion compound adhesive material than one side, specific area of the present invention is large, and usable front panel and reverse panel can produce anion, and firm and durable, does not fall glue.3., carrier of the present invention is glass fabric, heatproof can be up to more than 150 ℃, not only long service life but also safe and reliable.4., product of the present invention does not produce pernicious gas as ozone and other indoor pollutants.5., the present invention used anion composite material, than the anion generation of single tourmaline powder, greatly promote.The present invention adopts the MULTILAYER COMPOSITE technology of exerting pressure, and anion production is larger.6., the present invention has that cost is low, quality good, technical process is simple, convenient to operation, the advantage of easily promoting.7., the invention solves deficiency, defect and the drawback that existing known technology and present situation exist.8., by the present invention, effectively raise the technical merit of the industry.
For achieving the above object, technical scheme provided by the invention is:
A kind of anion insulated compound board manufacturing method:
1., the preparation of anion compound adhesive: using heat-resistant fireproof epoxy resin 100 weight portions, tourmaline nano material 2-50 weight portion, strange ice stone nano material 2-50 weight portion, the dicyandiamide 1-3 weight portion as curing agent, curing accelerator imidazoles 0.01-0.1 weight portion, to make anion compound adhesive after mixing under 30-80 ℃ of condition as the acetone 30-50 weight portion of solvent stand-by;
2., impregnation: with cement dipping machine by described anion compound adhesive evenly soak overlay in glass fabric stand-by;
3., the preparation of anion insulating trip: by the glass fabric that is soaked with anion compound adhesive in vacuum state, with 170 ℃, after 20 minutes dry, to make anion insulating trip stand-by;
4., the preparation of anion insulated composite board: according to thickness demand by several 2-5 open for the anion insulating trip after drying stack neat, in vacuum state, make anion insulated composite board to suppress under 180 ℃, 4.5Mpa pressure after 90 minutes.
Owing to having adopted technical scheme provided by the present invention; Because the present invention takes " anion composite material and epoxy blend form polymer " key technology; Anion compound adhesive epoxy resin 100, tourmaline 2-50, strange ice stone 2-50, dicyandiamide 1-3, imidazoles 0.01-0.1, acetone 30-50 weight portion being mixed at 30-80 ℃ due to the present invention is soaked and is overlayed in glass fabric, vacuum state, 170 ℃, through 20 minutes, dry the anion insulating trip 2-5 making and open and stack neatly, make anion insulated composite board suppress 90 minutes under vacuum state, 180 ℃, 4.5Mpa pressure after.The present invention is compared with existing known technology and present situation, and the beneficial effect of acquisition is:
1, the present invention has taked " anion composite material and epoxy blend form polymer " key technology, " anion insulated compound board manufacturing method " and " anion insulated composite board " new product is provided.
2, the present invention adopts anion composite material and epoxy blend to form polymer, be coated in glass fabric, and the anion insulated composite board of producing under vacuum high-temperature high pressure, the durability of the anion that produces is good.
3, the present invention applies anion compound adhesive material than one side, and specific area of the present invention is large, and usable front panel and reverse panel can produce anion, and firm and durable, does not fall glue.
4, carrier of the present invention is glass fabric, and heatproof can be up to more than 150 ℃, not only long service life but also safe and reliable.
5, product of the present invention does not produce pernicious gas as ozone and other indoor pollutants.
6, the present invention has used anion composite material, than the anion generation of single tourmaline powder, greatly promotes.The present invention adopts the MULTILAYER COMPOSITE technology of exerting pressure, and anion production is larger.
7, the present invention have that cost is low, quality good, technical process is simple, convenient to operation, the advantage of easily promoting.
8, the invention solves deficiency, defect and the drawback that existing known technology and present situation exist.
9,, by the present invention, effectively raise the technical merit of the industry.
Accompanying drawing explanation
Figure of description is the process flow operating process window frame schematic diagram of the specific embodiment of the invention.
The specific embodiment
The specific embodiment one
Below in conjunction with Figure of description, the present invention is described in detail.Shown in Figure of description:
A kind of anion insulated compound board manufacturing method:
1., the preparation of anion compound adhesive: using heat-resistant fireproof epoxy resin 100 weight portions, tourmaline nano material 2-50 weight portion, strange ice stone nano material 2-50 weight portion, the dicyandiamide 1-3 weight portion as curing agent, curing accelerator imidazoles 0.01-0.1 weight portion, to make anion compound adhesive after mixing under 30-80 ℃ of condition as the acetone 30-50 weight portion of solvent stand-by;
2., impregnation: with cement dipping machine by described anion compound adhesive evenly soak overlay in glass fabric stand-by;
3., the preparation of anion insulating trip: by the glass fabric that is soaked with anion compound adhesive in vacuum state, with 170 ℃, after 20 minutes dry, to make anion insulating trip stand-by;
4., the preparation of anion insulated composite board: according to thickness demand by several 2-5 open for the anion insulating trip after drying stack neat, in vacuum state, make anion insulated composite board to suppress under 180 ℃, 4.5Mpa pressure after 90 minutes.
In above-mentioned specific implementation process: to described tourmaline nano material respectively with 2, 5, 8, 10, 13, 18, 20, 22, 24, 26, 28, 30, 33, 36, 39, 41, 44, 46, 48, 50 weight portions are implemented, to described strange ice stone nano material respectively with 2, 5, 8, 10, 13, 18, 20, 22, 24, 26, 28, 30, 33, 36, 39, 41, 44, 46, 48, 50 weight portions are implemented, to the described dicyandiamide as curing agent respectively with 1, 2, 3 weight portions are implemented, to described curing accelerator imidazoles respectively with 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, 0.1 weight portion is implemented, to the described acetone as solvent respectively with 30, 33, 36, 39, 41, 44, 46, 48, 50 weight portions are implemented, temperature in the preparation of described anion compound adhesive is implemented with 30,35,40,45,50,55,60,65,70,75,80 ℃ respectively, all obtained the good result of expection.
The specific embodiment two
By the specific embodiment one, implement, just: in the preparation of described anion compound adhesive, using 100 kilograms of heat-resistant fireproof epoxy resin, 2-50 kilogram of tourmaline nano material, 2-50 kilogram of strange ice stone nano material, as curing agent dicyandiamide 1-3 kilogram, 0.01-0.1 kilogram of curing accelerator imidazoles, as the acetone 30-50 kilogram of solvent, implement, all received the good result of expection.
In above-mentioned specific implementation process: to described tourmaline nano material respectively with 2, 5, 8, 10, 13, 18, 20, 22, 24, 26, 28, 30, 33, 36, 39, 41, 44, 46, 48, implement for 50 kilograms, to described strange ice stone nano material respectively with 2, 5, 8, 10, 13, 18, 20, 22, 24, 26, 28, 30, 33, 36, 39, 41, 44, 46, 48, implement for 50 kilograms, to the described dicyandiamide as curing agent respectively with 1, 2, implement for 3 kilograms, to described curing accelerator imidazoles respectively with 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, implement for 0.1 kilogram, to the described acetone as solvent respectively with 30, 33, 36, 39, 41, 44, 46, 48, implement for 50 kilograms, all obtained the good result of expection.
The specific embodiment three
By the specific embodiment one, implement, just: to described heat-resistant fireproof epoxy resin, tourmaline nano material, strange ice stone nano material, dicyandiamide as curing agent, curing accelerator imidazoles, as the consumption of the acetone of solvent, to dwindle 1,2,3,4,5,6,7,8,9,10,15,20,25,30 times, implement respectively, also to expand 1,2,3,4,5,6,7,8,9,10,15,20,25,30 times, implement respectively, all received the good result of expection.Make the present invention there is the solid foundation of small test, laboratory test, expanding test, industrial experimentation, there is the operability of theoretical direction and production application.
These are only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction; All industry technical staff all can smooth and easyly implement; But make and modifying and the equivalent variations developing not departing from technical solution of the present invention, be technical scheme of the present invention.
Claims (1)
1. an anion insulated compound board manufacturing method, is characterized in that:
1., the preparation of anion compound adhesive: using heat-resistant fireproof epoxy resin 100 weight portions, tourmaline nano material 2-50 weight portion, strange ice stone nano material 2-50 weight portion, the dicyandiamide 1-3 weight portion as curing agent, curing accelerator imidazoles 0.01-0.1 weight portion, to make anion compound adhesive after mixing under 30-80 ℃ of condition as the acetone 30-50 weight portion of solvent stand-by;
2., impregnation: with cement dipping machine by described anion compound adhesive evenly soak overlay in glass fabric stand-by;
3., the preparation of anion insulating trip: by the glass fabric that is soaked with anion compound adhesive in vacuum state, with 170 ℃, after 20 minutes dry, to make anion insulating trip stand-by;
4., the preparation of anion insulated composite board: according to thickness demand by several 2-5 open for the anion insulating trip after drying stack neat, in vacuum state, make anion insulated composite board to suppress under 180 ℃, 4.5Mpa pressure after 90 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410254773.2A CN104015456B (en) | 2014-06-11 | 2014-06-11 | Anion insulated compound board manufacturing method |
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| CN201410254773.2A CN104015456B (en) | 2014-06-11 | 2014-06-11 | Anion insulated compound board manufacturing method |
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| CN104015456A true CN104015456A (en) | 2014-09-03 |
| CN104015456B CN104015456B (en) | 2016-08-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106088525A (en) * | 2016-07-27 | 2016-11-09 | 湖北鸿连实业有限公司 | A kind of anion solid wooden compound floor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004074799A (en) * | 2003-08-11 | 2004-03-11 | Hitachi Chem Co Ltd | Insulating substrate to which copper is bonded |
| CN202225492U (en) * | 2011-06-27 | 2012-05-23 | 广东有金宋地板制造有限公司 | Novel insulating composite board |
| CN202242159U (en) * | 2011-06-27 | 2012-05-30 | 广东有金宋地板制造有限公司 | Novel composite decoration board |
| JP2013052666A (en) * | 2011-08-10 | 2013-03-21 | Sekisui Chem Co Ltd | Polyethylene naphthalate film to which softening agent adheres, polyethylene naphthalate film to which softening is processed, insulating film with metal foil, method of manufacturing the same, method of manufacturing laminated structure, and laminated structure |
-
2014
- 2014-06-11 CN CN201410254773.2A patent/CN104015456B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004074799A (en) * | 2003-08-11 | 2004-03-11 | Hitachi Chem Co Ltd | Insulating substrate to which copper is bonded |
| CN202225492U (en) * | 2011-06-27 | 2012-05-23 | 广东有金宋地板制造有限公司 | Novel insulating composite board |
| CN202242159U (en) * | 2011-06-27 | 2012-05-30 | 广东有金宋地板制造有限公司 | Novel composite decoration board |
| JP2013052666A (en) * | 2011-08-10 | 2013-03-21 | Sekisui Chem Co Ltd | Polyethylene naphthalate film to which softening agent adheres, polyethylene naphthalate film to which softening is processed, insulating film with metal foil, method of manufacturing the same, method of manufacturing laminated structure, and laminated structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106088525A (en) * | 2016-07-27 | 2016-11-09 | 湖北鸿连实业有限公司 | A kind of anion solid wooden compound floor |
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Effective date of registration: 20170714 Address after: 518000, Guangdong, Shenzhen, Baoan District manhole street, West Ring Road, 99 industrial city, A District, C building, west of the first floor Patentee after: SHENZHEN JUMBO COPPER LAMINATE TECHNOLOGY CO., LTD. Address before: 518000 Guangdong Province, Shenzhen Baoan District manhole Galaxy gardens B1 2102 Co-patentee before: Guo Kaihua Patentee before: Guo Changqi |
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Granted publication date: 20160817 Termination date: 20210611 |
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