CN104011854A - 医用装置及x射线高压装置 - Google Patents
医用装置及x射线高压装置 Download PDFInfo
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- CN104011854A CN104011854A CN201380004458.8A CN201380004458A CN104011854A CN 104011854 A CN104011854 A CN 104011854A CN 201380004458 A CN201380004458 A CN 201380004458A CN 104011854 A CN104011854 A CN 104011854A
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Abstract
医用装置具有:功率器件;温度传感器,检测温度数据;变换处理单元,在将覆盖功率器件的外壳内部的温度数据和粘接于功率器件的焊丝的温度数据中的至少一方与实测的温度数据建立了对应的表中,参照由温度传感器得到的温度数据,由此得到外壳内部的温度数据和焊丝的温度数据中的至少一方;以及预测时间运算单元,基于所述得到的温度数据,计算到功率器件故障为止的预测时间。
Description
技术领域
作为本发明的一个形态的本实施方式涉及具备功率器件的医用装置及X射线高压装置。
背景技术
X射线CT(computed tomography)装置、X射线装置等那样的医用图像诊断装置为了产生向X射线管供给的高压,而在X射线高压装置的转换器及逆变器中具备大电力的功率器件(适于电力设备的半导体元件)。该医用图像诊断装置运转时,每当产生X射线时X射线高压装置的功率器件中都会引起急剧的温度上升。
X射线高压装置的输出电力为几十千瓦至一百千瓦,很大。因此,作为X射线高压装置的转换器及逆变器的功率器件,多数情况下使用IGBT(insulated gate bipolar transistor:绝缘栅双极型晶体管)模块、MOSFET(metal-oxide-semiconductor field-effect transistor:金属-氧化层-半导体-场效晶体管)模块等。
作为以往的X射线高压装置,有将转换器形成为即使输入交流电源电压发生变动功率因数也稳定的装置(例如参照专利文献1。)。
先行技术文献
专利文献
专利文献1:特开2005-259486号公报
发明内容
发明要解决的课题
然而,在现有技术中,在X射线CT装置、X射线装置等那样的医用图像诊断装置中,X射线高压装置的转换器及逆变器中具备的功率器件及与其接合的焊丝的损伤的累积是X射线高压装置故障的主要因素之一。并且,若在摄影中突然产生这样的故障,则会产生基于摄影而得到的图像数据变没用而需要再次摄影的问题。
已知功率器件的损伤的起因是由于因温度振幅引起的内部构成构件的膨胀和收缩而产生的变形。但是,在医用图像诊断装置的情况下,使用条件根据诊断目的或患者的体格等而CT扫描的次数、X射线摄影的张数变化,从而功率器件、焊丝的温度振幅较大地变化。因此,无法根据恒定的温度振幅来求出功率器件的热循环寿命或功率循环寿命,很难判断功率器件的损伤及损伤预测。
附图说明
图1是表示作为本实施方式的医用装置的X射线CT装置的构成例的图。
图2是表示X射线CT装置中具备的X射线高压装置的构成例的概要图。
图3是表示图2所示的逆变器内的功率器件的构造例的示意图。
图4是表示图3的I-I剖面的示意图。
图5是表示X射线CT装置中具备的X射线高压装置的构成及功能的框图。
图6是表示外壳温度变化的数据的一个例子的图。
图7是表示焊丝温度变化的数据的一个例子的图。
图8是用于说明功率器件预测时间的计算方法的图。
图9是用于说明焊丝预测时间的计算方法的图。
具体实施方式
参照附图对本实施方式的医用装置及X射线高压装置进行说明。
为了解决上述的课题,本实施方式的医用装置具备:功率器件;温度传感器,检测温度数据;变换处理单元,在将覆盖所述功率器件的外壳内部的温度数据和粘接于所述功率器件的焊丝的温度数据中的至少一方与实测的温度数据建立了对应的表中,参照由所述温度传感器得到的温度数据,由此得到所述外壳内部的温度数据和所述焊丝的温度数据中的至少一方;以及预测时间运算单元,基于得到的所述温度数据,计算到所述功率器件故障为止的预测时间。
为了解决上述的课题,本实施方式的X射线高压装置具备:功率器件;温度传感器,检测温度数据;变换处理单元,在将覆盖所述功率器件的外壳内部的温度数据和粘接于所述功率器件的焊丝的温度数据中的至少一方与实测的温度数据建立了对应的表中,参照由所述温度传感器得到的温度数据,由此得到所述外壳内部的温度数据和所述焊丝的温度数据中的至少一方;以及预测时间运算单元,基于得到的所述温度数据,计算到所述功率器件故障为止的预测时间。
根据本实施方式的医用装置及X射线高压装置,从热循环寿命及功率循环寿命的观点来看,能够预测功率器件的寿命。根据本实施方式的医用装置及X射线高压装置,通过预测功率器件的寿命,能够避免在摄影中突然产生功率器件的故障的事态,因此,不需要再次摄影,能够避免对患者的不被希望的辐射。
本实施方式的医用装置是在电源电路等中具备功率器件的装置。具体地说,本实施方式的医用装置包括:放射线治疗装置等治疗装置、以及MRI(magnetic resonance imaging)装置、X射线装置及X射线CT装置等医用图像诊断装置。在医用装置为放射线治疗装置的情况下,在用于产生放射线的电源电路中配设功率器件。此外,在医用装置为MRI装置的情况下,在用于产生梯度磁场的电源电路或用于产生高频脉冲的电源电路中配设功率器件。进而,在医用装置为X射线装置及X射线CT装置的情况下,在用于产生X射线的电源电路(X射线高压装置)中配设功率器件。以下,作为本实施方式的医用装置,使用X射线CT装置来进行说明,但是不限于该情况。医用装置1只要是具备功率器件的装置即可。
另外,本实施方式的作为医用装置的X射线CT装置具有:X射线管与检测器作为1体而在被检体的周围旋转的旋转/旋转(ROTATE/ROTATE)类型、以及大量检测元件排列为环状、仅X射线管在被检体的周围旋转的固定/旋转(STATIONARY/ROTATE)类型等各种类型,哪种类型都能够应用本发明。在此,说明当前占主流的旋转/旋转类型。
图1是表示本实施方式的作为医用装置的X射线CT装置的构成例的图。
图1示出了本实施方式的作为医用装置1的X射线CT装置1A。X射线CT装置1A大体上由扫描仪装置11及图像处理装置(控制台)12构成。X射线CT装置1A的扫描仪装置11通常设置在检查室,为了生成与患者O(被检体)有关的X射线的透射数据而构成。另一方面,图像处理装置12通常设置在与检查室相邻的控制室,为了基于透射数据生成投影数据来进行重构图像的生成·显示而构成。
X射线CT装置1A的扫描仪装置11设置有X射线管21、光阑22、X射线检测器23、DAS(data acquisition system)24、旋转部25、X射线高压装置26、光阑驱动机构27、旋转驱动机构28、顶板30、顶板驱动装置31及控制器32。
X射线管21与从X射线高压装置26供给的管电压相对应地使电子线撞击金属制的靶来产生X射线,并朝向X射线检测器23进行照射。通过从X射线管21照射的X射线,而形成扇形束X射线或锥形束X射线。X射线管21在经由了X射线高压装置26的控制器32的控制下,被供给X射线的照射所需的电力。
光阑22通过光阑驱动机构27,来调整从X射线管21照射的X射线的切片方向(z轴方向)的照射范围。即,通过光阑驱动机构27调整光阑22的开口,由此,能够改变切片方向的X射线照射范围。
X射线检测器23是在通道方向上具有多个检测元件、并在列(切片)方向上具有单个检测元件的1维阵列型的检测器。或者,X射线检测器23为矩阵状,即在通道方向上具有多个检测元件且在切片方向上具有多个检测元件的二维阵列型的检测器(也称作多切片型检测器。)。X射线检测器23检测被从X射线管21照射且透射了患者O的X射线。
DAS24将X射线检测器23的各检测元件所检测的透射数据的信号放大并变换为数字信号。DAS24的输出数据经由扫描仪装置11的控制器32被向图像处理装置12供给。
旋转部25将X射线管21、光阑22、X射线检测器23、DAS24及光阑驱动机构28作为一体来保持。旋转部25构成为,能够在使X射线管21与X射线检测器23对置的状态下使X射线管21、光阑22、X射线检测器23、DAS24及光阑驱动机构28作为一体在患者O的周围旋转。X射线高压装置27也可以被保持于旋转部25。另外,将与旋转部25的旋转中心轴平行的方向作为z轴方向,将与该z轴方向正交的平面用x轴方向、y轴方向来定义。
X射线高压装置26在控制器32的控制下,向X射线管21供给X射线的照射所需要的电力。
图2是表示X射线CT装置1A中具备的X射线高压装置26的构成例的概要图。
如图2所示,X射线高压装置26具备与电源(单相200V商用电源)连接的、电压检测单元26a、转换器26b、电容器26c、逆变器26d、电容器26e及高压产生装置26f。
X射线高压装置26通过转换器26b将电源电压直流化,通过逆变器26d实现该直流输出的电力控制,通过高压产生装置26f进行高压化、整流化,向X射线管21施加高压。转换器26b的直流控制及逆变器26d中的交流输出的电力控制例如通过PWM(pulse width modulation)方式来进行,其目标值等从未图示的控制电路被赋予。
高压产生装置26f具备升压变压器26f1、整流电路26f2及电容器26f3。通过升压变压器26f1进行升压,通过整流电路26f2进行整流。另外,电容器26f3在输出电压的平滑化中被使用。
电容器26c进行转换器26b的输出电压的稳定化,电容器26e在与升压变压器26f1的泄露电感共振的共振用中被使用。
图3是表示图2所示的逆变器26d(或者,转换器26b)内的功率器件的构造例的示意图。图4是表示图3的I-I剖面的示意图。
如图3及图4所示,X射线高压装置26具备散热板261、基板(铜图案、绝缘基板及导体层等)262、功率器件263、焊丝264及温度传感器265,以将功率器件263、焊丝264及温度传感器265覆盖的方式,在散热板261接合有树脂外壳(以下,仅称作“外壳”。)266。
基板262被焊锡接合在散热板261之上。功率器件263的芯片在基板262上的接合部S1被焊锡接合。焊丝264在功率器件263上的接合部S2被焊锡接合。
功率器件263形成电阻器与热敏电阻的串联电路,将电阻器与电源连接并将热敏电阻接地。功率器件263例如是作为功率晶体管的IGBT(insulated gate bipolar transistor)模块。另外,功率器件263不限于IGBT模块。功率器件263例如也可以是,整流二极管、功率MOSFET(metal-oxide-semiconductor field-effect transistor)、半导体闸流管、GTO(gateturn-off thyristor)及三端双向可控硅开关元件等。
在此,功率器件263的温度振幅与寿命之间的关系作为由于功率器件263整体(对功率器件263进行覆盖的外壳266内部)的温度振幅而导致在基板262与功率器件263的芯片的焊锡接合部S1等产生龟裂的热循环寿命、以及由于瞬间的大电流而导致在功率器件263与焊丝264的接合部S2等产生龟裂的功率循环寿命而被知晓。在X射线CT装置1A的扫描、X射线装置(未图示)的透视等相对持续性的X射线照射的情况下,热循环寿命占支配性地位。另一方面,在X射线装置(未图示)的摄影等的暂时性的X射线照射的情况下,功率循环寿命占支配性地位。
然而,温度振幅与寿命之间的关系是一定的发热以一定时间间隔单调地反复的情况下的关系。另一方面,在X射线CT装置1A及X射线装置(未图示)等医用装置1的情况下,使用条件因诊断目的或患者体格而较大地不同,很难根据CT扫描的次数或者X射线摄影的张数来判断功率器件263的寿命。于是,在本实施方式中,通过将医用装置1的使用中的温度传感器265的传感器温度变换为外壳266内部的外壳温度和焊丝264的温度,来推测热循环寿命及功率循环寿命。
温度传感器265通过感测温度来测定温度数据。作为温度传感器265,能够列举出热敏电阻。温度传感器265可以组装在功率器件263的内部,也可以如图3所示那样在功率器件263的外部配设在功率器件263的周边。
另外,在X射线照射中及X射线照射刚刚结束的情况下,基于由温度传感器265测定到的温度数据的温度变化较大,因此,通过较短地设定收集传感器温度的时间间隔,能够正确地收集温度的时间序列变化。另一方面,在除此以外的情况下,温度的变化较小,因此,也可以较长地设定收集温度数据的时间间隔。此外,通过记录X射线照射开始时刻和在X射线照射结束后且温度降低·稳定并结束了温度的数据收集的时刻,能够使得在X射线高压装置26休止的期间,温度的数据收集也休止。根据这样的方法,能够一边详细地收集X射线照射中的传感器温度一边将遍及长时间的传感器温度的变化以较少的容量存储在存储装置268中。
返回图1的说明,光阑驱动机构27具有在控制器32的控制下调整光阑22中的X射线的切片方向的照射范围的机构。
旋转驱动机构28具有在控制器32的控制下,以使旋转部25在维持其位置关系的状态下在空洞部的周围旋转的方式使旋转部25旋转的机构。
顶板30能够载置患者O。
顶板驱动装置31具备在控制器32的控制下使顶板30沿着y轴方向进行升降移动并且沿着z轴方向进行进入/退避移动的机构。旋转部25的中央部分具有开口,供载置在该开口部的顶板30上的患者O插入。
控制器32具备未图示CPU(central processing unit)及存储器等。控制器32通过来自图像处理装置12的指示,进行X射线检测器23、DAS24、X射线高压装置26、光阑驱动机构27、旋转驱动机构28及顶板驱动装置31等的控制,执行扫描。
X射线CT装置1A的图像处理装置12以计算机为基础来构成,能够与网络(local area network)N相互通信。图像处理装置12大体地讲由CPU41、存储器42、HDD(hard disc drive)43、输入装置44、显示装置45及IF(interface)46等基本硬件构成。CPU41经由作为共用信号传送路径的总线,与构成图像处理装置12的各硬件构成要素相互连接。另外,图像处理装置12有时具备存储介质驱动器47。
CPU41是具有由半导体构成的电子电路被封入在具有多个端子的封装件内而成的集成电路(LSI)的构成的控制装置。若通过医师等操作者对输入装置44进行操作等而输入了指令,则CPU41执行存储器42中存储的程序。或者,CPU41将HDD43中存储的程序、从网络N转发来且安装在HDD43中的程序、或者从存储介质驱动器47中安装的记录介质读出且安装在HDD43中的程序,加载在存储器42中来执行。
存储器42是包含ROM(read only memory)及RAM(random accessmemory)等的存储装置。存储器42存储IPL(initial program loading)、BIOS(basic input/output system)及数据,或者被用于CPU41的工作存储器或数据的暂时存储。
HDD43是具有以不可拆装的方式被内置有涂覆或者蒸镀了磁性体的金属盘的构成的存储装置。HDD43是对图像处理装置12中安装的程序(除了应用程序之外还包含OS(operating system)等)、数据进行存储的存储装置。此外,还能够使OS提供GUI(graphical user interface),该GUI在对施术者等操作者向显示装置45进行信息显示时多用图解,能够通过输入装置44来进行基础的操作。
输入装置44是能够由操作者操作的指示设备(pointing device),将与操作对应的输入信号送至CPU41。
显示装置45包含未图示的图像合成电路、VRAM(video random accessmemory)及显示器等。图像合成电路生成在图像数据中合成了各种参数的文字数据等而得的合成数据。VRAM将合成数据展开在显示器上。显示器由液晶显示器或CRT(cathode ray tube)等来构成,显示图像。
IF46由与并行连接方式或串行连接方式对应的连接器来构成。IF46进行与各标准相对应的通信控制,具有能够经由电话线路而与网络N连接的功能,由此,使X射线CT装置1A与网络N网连接。
图像处理装置12对从扫描仪装置11的DAS24输入的原始数据进行对数变换处理、灵敏度修正等修正处理(前处理)来生成投影数据,并存储在HDD43等存储装置中。此外,图像处理装置12对被前处理过的投影数据进行散射线的除去处理。图像处理装置12基于X射线辐射范围内的投影数据的值来进行散射线的除去,将根据进行散射线修正的对象的投影数据或者其相邻投影数据的值的大小推测出的散射线,从成为对象的投影数据中减去来进行散射线修正。图像处理装置12基于修正后的投影数据生成基于扫描的图像数据,并存储在HDD43等存储装置中,或者显示在显示装置45上。
图5是表示X射线CT装置1A中具备的X射线高压装置的构成及功能的框图。
如图5所示,X射线CT装置1A的X射线高压装置26具备温度传感器265(图3中也有图示)、A/D(analog to digital)转换器266、MCU(microcomputer)267及存储装置268。
A/D转换器266对根据温度而变化的、电阻器与热敏电阻的连接点的电压进行A/D变换。
由MCU267进行了变换的后述的传感器温度变化t存储在非易失性的存储装置268、例如Flash存储器中,以便即使切断X射线高压装置26的电源也不会消失。此外,通过以一定时间间隔来收集传感器温度变化t,能够时间序列地作为多个传感器温度即传感器温度变化t的数据存储在存储装置268中。
通过MCU267执行程序,X射线CT装置1A作为传感器温度变化变换部267a、波数计数部267b、累积损伤值运算部267c、预测时间运算部267d、比较部267e、输出部267f及条件变更部267g发挥功能。另外,也可以是,各部267a至267g的全部或者一部分在X射线CT装置1A中作为硬件来配设。
传感器温度变化变换部267a具有如下功能:通过由A/D转换器266进行了数字变换的电压来进行读取,进行将电压基于热敏电阻的特性、电阻值及电源电压变换为传感器温度的数据的处理,取得在功率器件263的内部或者外部配设的温度传感器265位置处的传感器温度变化t的数据。
波数计数部267b具有如下功能:基于由传感器温度变化变换部267a进行了变换的传感器温度变化t或者由存储装置268存储的传感器温度变化t,进行基于功率器件263(图2中图示)的物理模型的变换处理,计算变换后的温度变化T的数据,使用以温度变化为振幅的波数计数法,针对多个温度振幅的各温度振幅ΔTn(ΔT1、ΔT2、……)计算循环计数Cn(C1、C2、……)。作为波数计数法,能够列举出雨流法、峰值计数法、穿级计数法、平均数交叉计数法(mean crossing counting method)、量程计数法(range counting method)及程对计数法(range-pair counting method)等。在此,作为波数计数法,采用作为疲劳寿命的推测而言代表性的雨流法。
波数计数部267b基于传感器温度变化t,进行基于物理模型的变换处理,计算功率器件263的温度变化,作为外壳266内部的温度变化Tc的数据。然后,波数计数部267b使用以温度变化为振幅的波数计数法,针对多个外壳温度振幅的各外壳温度振幅ΔTcn(ΔTc1、ΔTc2、……)计算循环计数Ccn(Cc1、Cc2、……)。此外,波数计数部267b基于传感器温度变化t,进行基于物理模型的变换处理,计算焊丝264(与功率器件263的接合部)(图2中图示)的温度变化Tw的数据。然后,波数计数部267b使用以温度变化为振幅的波数计数法,针对多个焊丝温度振幅的各焊丝温度振幅ΔTwn(ΔTw1、ΔTw2、……),计算循环计数Cwn(Cw1、Cw2、……)。波数计数部267b计算外壳温度振幅ΔTc及结点温度范围ΔTj的pn的循环计数Cpn与焊丝温度振幅ΔTwn的循环计数Cwn当中的至少一方。
图6是表示外壳温度变化Tc的数据的一个例子的图。图7是表示焊丝温度变化Tw的数据的一个例子的图。
如图6及图7所示,在X射线CT装置1A的情况下,使用条件根据诊断目的或患者的体格等而CT扫描的次数、X射线摄影的张数发生变化,因此,外壳温度振幅及焊丝温度振幅不是单一而是较大地变化。
返回图5的说明,波数计数部267b实施与负载及冷却性能(表面热传递率)有关的参数检查,根据温度传感器265(热敏电阻)的传感器温度变化t,预先分别生成向外壳温度变化Tc及焊丝温度变化Tw变换的变换模型。具体地说,在覆盖功率器件263的外壳266(图4中图示)内部的温度与实测的温度建立了对应的表中,参照传感器温度变化t的各温度,由此得到外壳温度变化Tc。此外,在将粘接于功率器件263的焊丝264(图3及图4中图示)的温度数据与实测的温度数据建立了对应的表中,参照传感器温度变化t的各温度,由此得到焊丝温度变化Tw。
累积损伤值运算部267c具有如下功能:基于由波数计数部267b计算出的各温度振幅ΔTn(ΔTcn、ΔTwn)的循环计数C(Ccn、Cwn),根据线性累积损伤法则(miner's rule),计算疲劳损伤,计算作为其线性和的累积损伤值D(功率器件累积损伤值Dc及线累积损伤值Dw)。
预测时间运算部267d具有如下功能:基于由累积损伤值运算部267c计算出的累积损伤值D(Dc、Dw),计算到累积损伤值D(Dc、Dw)成为“1”的、功率器件263破坏(故障)为止的预测时间P(外壳预测时间Pc及焊丝预测时间Pw)。预测时间运算部267d针对每单位时间的多个温度振幅的各温度振幅来计算循环计数,计算到累积损伤值成为“1”为止的时间。另外,预测时间运算部267d在功率器件263的运转状况以循环单位来决定的情况下,针对每1循环的各温度振幅来计算循环计数,也能够计算到累积损伤值成为“1”为止的循环数。
图8是用于说明功率器件预测时间Pc的计算方法的图。图9是用于说明焊丝预测时间Pw的计算方法的图。
图8及图9分别示出了基于响应曲面法的热疲劳寿命预测线(S-N曲线)Lc、Lw。例如,基于功率器件263(图2中图示)的负载接通(ON)时间、负载关断(OFF)时间、发热量、环境温度及冷却性能,针对覆盖功率器件263的外壳266内部及焊丝264分别计算热疲劳寿命预测线Lc、Lw。
如图8所示,假定产生由波数计数部267b(图5中图示)计算出的各外壳温度振幅ΔTcn(ΔTc1、ΔTc2、……),则根据热疲劳寿命预测线Lc,读取各外壳温度振幅ΔTcn的情况下的到破断为止的循环计数Ncn(Nc1、Nc2、……)。然后,基于各循环计数Ncn(Nc1、Nc2、……)和各外壳温度振幅ΔTcn的实际的循环计数Ccn(Cc1、Cc2、……),利用各外壳温度振幅ΔTcn,将累积损伤度计算为Ccn/Ncn(Cc1/Nc1、Cc2/Nc2、……)。在累积损伤法中,如接下来的式(1)所示,这些各个累积损伤度的和被作为整体的累积损伤值Dc。并且,设为在累积损伤值Dc变为“1”时引起疲劳损伤。
【数式1】
如图9所示,假定产生由波数计数部267b(图5中图示)计算出的各焊丝温度振幅ΔTwn(ΔTw1、ΔTw2、……),则根据热疲劳寿命预测线Lw,读取各焊丝温度振幅ΔTwn的情况下的到破断为止的循环计数Nwn(Nw1、Nw2、……)。并且,基于各循环计数Nwn(Nw1、Nw2、……)和各焊丝温度振幅ΔTwn的实际的循环计数Cwn(Cw1、Cw2、……),利用各焊丝温度振幅ΔTwn,将累积损伤度计算为Cwn/Nwn(Cw1/Nw1、Cw2/Nw2、……)。在累积损伤法中,如接下来的式(2)所示,这些各个累积损伤度的和被作为整体的累积损伤值Dw。并且,设为累积损伤值Dw变为“1”时引起疲劳损伤。
【数式2】
返回图5的说明,比较部267e具有如下功能:将由预测时间运算部267d计算出的预测时间P(Pc、Pw)和预先设定的阈值进行比较。
输出部267f具有如下功能:在比较部267e进行比较的结果而判断为预测时间P(Pc、Pw)低于阈值(以下)的情况下,输出该情况。输出部267f在判断为外壳预测时间Pc及焊丝预测时间Pw当中的某个低于阈值、或者都低于阈值的情况下,输出该情况即可。输出部267f经由控制器32来向显示装置45等报告预测时间低于阈值的情况,或者经由控制器32、IF46及网络N来向服务中心等外部装置(未图示)发送该情况。
条件变更部267g具有如下功能:在比较部267e比较的结果而判断为预测时间P(Pc、Pw)低于阈值(以下)的情况下,经由控制器32来变更X射线高压装置26的功率器件263的动作条件。例如,条件变更部267g使功率器件263或者包含有多个功率器件263的模块(未图示)的异常电流阈值变化,或者使功率器件263或者模块的冷却性能(扇转速等)提高,或者将动作的模块切换为预备的模块。
根据本实施方式的医用装置1及X射线高压装置26,能够从在焊锡接合部S1(图4に图示)产生龟裂的热循环寿命、在焊锡接合部S2(图4中图示)产生龟裂的功率循环寿命的观点出发来预测功率器件263的寿命。根据本实施方式的医用装置1及X射线高压装置26,通过预测功率器件263的寿命,能够避免在摄影中突然产生功率器件263的故障的事态,因此,不需要再次摄影,能够避免对患者O的不被希望的辐射。
此外,根据本实施方式的医用装置1及X射线高压装置26,能够在产生功率器件26的故障之前向操作者或服务关系者进行报告。
以上,说明了本发明的几个实施方式,但这些实施方式只是作为例子来提示,并不意图限定发明的范围。这些新的实施方式能够以其他各种方式来实施,能够在不脱离发明的宗旨的范围内进行各种省略、置换和变更。这些实施方式及其变形被包含在发明的范围及宗旨内,并且,被包含在权利要求书中记载的发明及其等同的范围内。
Claims (12)
1.一种医用装置,其中,具备:
功率器件;
温度传感器,检测温度数据;
变换处理单元,在将覆盖所述功率器件的外壳内部的温度数据和粘接于所述功率器件的焊丝的温度数据中的至少一方与实测的温度数据建立了对应的表中,参照由所述温度传感器得到的温度数据,由此得到所述外壳内部的温度数据和所述焊丝的温度数据中的至少一方;以及
预测时间运算单元,基于得到的所述温度数据,计算到所述功率器件故障为止的预测时间。
2.如权利要求1所述的医用装置,其中,
所述变换处理单元具有:
波数计数单元,使用以基于所述外壳内部的温度数据和所述焊丝的温度数据中的至少一方而得的温度变化为振幅的波数计数法,针对多个温度振幅的各温度振幅计算循环计数;以及
累积损伤值运算单元,基于所述多个温度振幅和与所述多个温度振幅分别对应的循环计数,计算累积损伤值;
所述预测时间运算单元基于所述累积损伤值,计算所述预测时间。
3.如权利要求1或2所述的医用装置,其中,
还具有:
比较单元,将所述预测时间与阈值进行比较;以及
输出单元,在所述预测时间低于所述阈值的情况下,输出该情况。
4.如权利要求3所述的医用装置,其中,
所述输出单元将所述预测时间低于所述阈值的情况,显示在显示装置上,或者经由通信线路向外部装置发送。
5.如权利要求1或2所述的医用装置,其中,
还具有:
比较单元,将所述预测时间与阈值进行比较;以及
条件变更单元,在所述预测时间低于所述阈值的情况下,变更所述功率器件的动作条件。
6.如权利要求2至5中任一项所述的医用装置,其中,
所述波数计数单元使用作为所述波数计数法的雨流法,计算所述累积损伤值。
7.一种X射线高压装置,其中,具备:
功率器件;
温度传感器,检测温度数据;
变换处理单元,在将覆盖所述功率器件的外壳内部的温度数据和粘接于所述功率器件的焊丝的温度数据中的至少一方与实测的温度数据建立了对应的表中,参照由所述温度传感器得到的温度数据,由此得到所述外壳内部的温度数据和所述焊丝的温度数据中的至少一方;以及
预测时间运算单元,基于得到的所述温度数据,计算到所述功率器件故障为止的预测时间。
8.如权利要求7所述的X射线高压装置,其中,
所述变换处理单元具有:
波数计数单元,使用以基于所述外壳内部的温度数据和所述焊丝的温度数据中的至少一方而得的温度变化为振幅的波数计数法,针对多个温度振幅的各温度振幅计算循环计数;以及
累积损伤值运算单元,基于所述多个温度振幅和与所述多个温度振幅分别对应的循环计数,计算累积损伤值;
所述预测时间运算单元基于所述累积损伤值,计算所述预测时间。
9.如权利要求7或8所述的X射线高压装置,其中,
还具有:
比较单元,将所述预测时间与阈值进行比较;以及
输出单元,在所述预测时间低于所述阈值的情况下,输出该情况。
10.如权利要求9所述的X射线高压装置,其中,
所述输出单元将所述预测时间低于所述阈值的情况,显示在显示装置上,或者经由通信线路向外部装置发送。
11.如权利要求7或8所述的X射线高压装置,其中,
还具有:
比较单元,将所述预测时间与阈值进行比较;以及
条件变更单元,在所述预测时间低于所述阈值的情况下,变更所述功率器件的动作条件。
12.如权利要求8至11中任一项所述的X射线高压装置,其中,
所述波数计数单元使用作为所述波数计数法的雨流法,计算所述累积损伤值。
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CN104307060A (zh) * | 2014-10-22 | 2015-01-28 | 中国科学院苏州生物医学工程技术研究所 | X射线血液辐照仪 |
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US10349507B2 (en) | 2019-07-09 |
US20140233708A1 (en) | 2014-08-21 |
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WO2014042057A1 (ja) | 2014-03-20 |
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