CN104006941B - A kind of CBGA encapsulated circuit constant acceleration test device - Google Patents
A kind of CBGA encapsulated circuit constant acceleration test device Download PDFInfo
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- CN104006941B CN104006941B CN201410188935.7A CN201410188935A CN104006941B CN 104006941 B CN104006941 B CN 104006941B CN 201410188935 A CN201410188935 A CN 201410188935A CN 104006941 B CN104006941 B CN 104006941B
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- cbga
- base
- encapsulated circuit
- constant acceleration
- glued membrane
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Abstract
The present invention relates to a kind of CBGA encapsulated circuit constant acceleration test device; including base, cover plate and soldered ball protection device; wherein base is platy structure; the center of platy structure arranges projection; groove is formed around protruding surrounding; one lateral edges of base extends outward the baffle plate being perpendicular to base; the other two ends of base form slot; cover plate is slab construction; by slot and base engagement; and contact with the baffle plate of base side, form the cavity structure of one end open, be used for placing CBGA encapsulated circuit；Soldered ball protection device includes pad and glued membrane; glued membrane sticks on bottom portion of groove; pad is pasted onto on glued membrane; for the soldered ball on CBGA encapsulated circuit is protected; this test device achieves dribbling degree of the being accelerated test of CBGA encapsulated circuit, effectively solves the soldered ball damage problem that the extruding between fixture and CBGA soldered ball brings in constant acceleration.
Description
Technical field
The present invention relates to a kind of CBGA encapsulated circuit constant acceleration test device, particularly relate to a kind of cavity downward
CBGA encapsulated circuit constant acceleration test device, for cover plate and soldered ball homonymy CBGA circuit constant acceleration certification test.
Background technology
When integrated circuit is carried out Constant Acceleration Test, need to be faced out by cover plate one, to prevent at centrifugal process
In there is stepping on a phenomenon, but for CBGA circuit, owing to soldered ball and cover plate are usually located at homonymy, therefore in constant acceleration process
In, cover plate and soldered ball are all outside, so cover plate and soldered ball all can be acted on by power, and CBGA circuit soldered ball material is usually
PbSn alloy, its material is softer, is susceptible to deformation.It is thus desirable to protect during constant acceleration, to prevent from becoming
The generation of shape.
When at present CBGA circuit degree of being accelerated being tested, after the most first testing, then CBGA circuit is planted ball,
Easily cause the deviation of test data and truth.
Summary of the invention
It is an object of the invention to overcome the above-mentioned deficiency of prior art, it is provided that the CBGA encapsulated circuit that a kind of cavity is downward
Constant acceleration test device, this test device achieves dribbling degree of the being accelerated test of CBGA encapsulated circuit, at Constant Acceleration
Degree effectively solves the soldered ball damage problem that the extruding between fixture and CBGA soldered ball brings.
The above-mentioned purpose of the present invention is mainly achieved by following technical solution:
A kind of CBGA encapsulated circuit constant acceleration test device, including base, cover plate and soldered ball protection device, the wherein end
Seat is platy structure, and the center of platy structure arranges projection, forms groove, a lateral edges of base around protruding surrounding
Extending outward the baffle plate being perpendicular to base, the other two ends of base form slot, and cover plate is slab construction, by slot and the end
Seat coordinates, and contacts with the baffle plate of base side, forms the cavity structure of one end open, is used for placing CBGA encapsulated circuit；Weldering
Ball protection device includes pad and glued membrane, and glued membrane sticks on bottom portion of groove, and pad is pasted onto on glued membrane, for CBGA encapsulation electricity
Soldered ball on road is protected.
In above-mentioned CBGA encapsulated circuit constant acceleration test device, degree of depth C of groove meets following relation:
The degree of depth C=Diameter of Solder Ball+film thickness+spacer thickness-h of groove,
Wherein: h is 10 μm～20 μm.
Above-mentioned CBGA encapsulated circuit constant acceleration test device in, the width E that groove is parallel on baffle plate direction with
The CBGA encapsulated circuit outer casing width of assembling matches, and meets following relation:
Recess width E-circuit case width≤0.1mm
In above-mentioned CBGA encapsulated circuit constant acceleration test device, protruding flatness is less than 100 microns.
In above-mentioned CBGA encapsulated circuit constant acceleration test device, pad uses styrene-butadiene rubber；Glued membrane uses
Epoxy jelly membrane, epoxy jelly membrane preferably employs ESP7660-W model.
In above-mentioned CBGA encapsulated circuit constant acceleration test device, the thickness of pad is 0.5mm～2mm, glued membrane
Thickness is 0.01～0.03mm.
The present invention compared with prior art provides the benefit that:
(1), the present invention is directed to the soldered ball damage problem that occurs during current CBGA circuit acceleration test, innovative design
Special accelerating testing device, this device is made up of base, cover plate and soldered ball protection device, soldered ball protection device is arranged on
In the cavity that base and cover plate are formed, CBGA circuit is placed in the cavities, and this structure design butt welding ball defines and is effectively protected,
Achieve dribbling degree of the being accelerated test of CBGA encapsulated circuit, effectively solve between fixture and CBGA soldered ball in constant acceleration
The soldered ball damage problem that brings of extruding.
(2), the preferred butadiene-styrene rubber of the present invention as pad, owing to the hardness of this kind of material is moderate, can be at Constant Acceleration
Degree effectively solves the hard damage problem of soldered ball that the extruding between fixture and CBGA soldered ball brings.
(3), the present invention use epoxy resin glued membrane (preferably ESP7660-W glued membrane), epoxy jelly membrane compares epoxy glue, has more
Good flatness, prevents during constant acceleration, and salient point discontinuity problem occurs.
(4), the present invention is optimized design to the degree of depth, the width of the groove in base, and is carried out by lot of experiments
Checking, gives the best solution of depth and width, further increases test effect.
(5), the present invention spacer thickness δ is optimized, spacer thickness δ and CBGA circuit bump height is relevant, to pad
Sheet thickness δ regulation mainly prevent circuit in constant acceleration motion process, due to the thickest appearance of spacer thickness δ excessive squeeze
Pressure and thin soldered ball vacant state occurs owing to spacer thickness δ crosses.
(6), the present invention recess width E is optimized, recess width E is relevant with CBGA circuit case width, it is desirable to
And the redundancy between outer casing width is less than 0.1mm, prevents that recess width E is excessive to be caused, and produces and rub more greatly between circuit and frock
Wiping power causes salient point to deform.
Accompanying drawing explanation
Fig. 1 is that the present invention tests understructure schematic diagram in device, and wherein Fig. 1 a is base stereogram, and Fig. 1 b is base master
View, Fig. 1 c is base vertical view；
Fig. 2 is that the present invention tests base and cover plate assembling stereogram in device；
Fig. 3 is that the present invention tests base and cover plate, soldered ball protection device installation diagram in device.
Detailed description of the invention
The present invention is described in further detail with specific embodiment below in conjunction with the accompanying drawings:
The CBGA encapsulated circuit constant acceleration test device that cavity of the present invention is downward, is protected by base 1, cover plate 2 and soldered ball
Protection unit forms.Testing understructure schematic diagram in device for the present invention as described in Figure 1, wherein Fig. 1 a is base stereogram, figure
1b is base front view, and Fig. 1 c is base vertical view.Base 1 is platy structure as seen from the figure, and the centre bit of platy structure installs
Putting protruding 3, the surrounding around protruding 3 forms groove 4, and a lateral edges of base 1 extends outward the baffle plate 5 being perpendicular to base 1,
The other two ends of base 1 form slot 6, and degree of depth C of its further groove 4 meets equation below:
The degree of depth C=Diameter of Solder Ball of groove (4)+glued membrane (8) thickness+pad (7) thickness-h
Wherein: h is 10 μm～20 μm；
Width E and the CBGA circuit case width of groove 4 matches, it is desirable to CBGA circuit in constant acceleration fixture,
Can not have bigger movement, prevent excessive friction from causing soldered ball to deform, groove 4 is parallel to the width E on baffle plate 5 direction and assembling
CBGA encapsulated circuit outer casing width match, meet following relation:
Recess width E-circuit case width≤0.1mm
In the projection 3 in constant acceleration test device centre, CBGA circuit is played support in constant acceleration and makees
With, in order to prevent coverplate stress during constant acceleration uneven, it is desirable to boss 3 flatness reaches 100 μm, projection 3
Width be D.
It is illustrated in figure 2 the present invention and tests base and cover plate assembling stereogram in device, use between base 1 and cover plate 2
Plug-in mounting mode, cover plate 2 is slab construction, is coordinated with base 1 by slot 6, and contacts with the baffle plate 5 of base 1 side, forms one
The cavity structure of end opening, is used for placing CBGA encapsulated circuit.
It is illustrated in figure 3 the present invention and tests base and cover plate, soldered ball protection device installation diagram, soldered ball protection device in device
Including pad 7 and glued membrane 8, glued membrane 8 sticks on bottom groove 4, and pad 7 is pasted onto on glued membrane 8, for CBGA encapsulated circuit
Soldered ball protect.Its Intermediate gasket 7 uses styrene-butadiene rubber；Glued membrane 8 uses epoxy jelly membrane, epoxy jelly membrane in the present embodiment
Use ESP7660-W model.The thickness of pad 7 is 0.5mm～2mm, and the thickness of glued membrane 8 is 0.01～0.03mm.
Embodiment 1
In the present embodiment, recess width E of base 1 is 37.58mm, and depth of groove C is 1.57mm, and ledge width D is
16.7mm, Diameter of Solder Ball is 0.76mm, and film thickness is 0.02mm, and spacer thickness is 0.8mm, and circuit case width is
37.5mm, after the present embodiment has been tested, examines under a microscope circuit soldered ball pattern, none damage of display soldered ball.
The above, the detailed description of the invention that only present invention is optimal, but protection scope of the present invention is not limited thereto,
Any those familiar with the art in the technical scope that the invention discloses, the change that can readily occur in or replacement,
All should contain within protection scope of the present invention.
The content not being described in detail in description of the invention belongs to the known technology of professional and technical personnel in the field.
Claims (6)
1. a CBGA encapsulated circuit constant acceleration test device, it is characterised in that: include base (1), cover plate (2) and soldered ball
Protection device, wherein base (1) is platy structure, and the center of platy structure arranges projection (3), around the four of protruding (3)
Week forms groove (4), and a lateral edges of base (1) extends outward the baffle plate (5) being perpendicular to base (1), and base (1) is additionally
Two ends formed slot (6), cover plate (2) is slab construction, is coordinated with base (1) by slot (6), and with base (1) side
Baffle plate (5) contacts, and forms the cavity structure of one end open, is used for placing CBGA encapsulated circuit；Soldered ball protection device includes pad
And glued membrane (8) (7), glued membrane (8) sticks on groove (4) bottom, and pad (7) is pasted onto on glued membrane (8), for CBGA encapsulation electricity
Soldered ball on road is protected；
Degree of depth C of described groove (4) meets following relation:
The degree of depth C=Diameter of Solder Ball of groove (4)+glued membrane (8) thickness+pad (7) thickness-h,
Wherein: h is 10 μm～20 μm.
A kind of CBGA encapsulated circuit constant acceleration test device the most according to claim 1, it is characterised in that: described recessed
The width E that groove (4) is parallel on baffle plate (5) direction matches with the CBGA encapsulated circuit outer casing width of assembling, meets such as ShiShimonoseki
System:
Recess width E-circuit case width≤0.1mm.
A kind of CBGA encapsulated circuit constant acceleration test device the most according to claim 1, it is characterised in that: described convex
Play the flatness of (3) less than 100 microns.
A kind of CBGA encapsulated circuit constant acceleration test device the most according to claim 1, it is characterised in that: described pad
Sheet (7) uses styrene-butadiene rubber；Described glued membrane (8) uses epoxy jelly membrane.
A kind of CBGA encapsulated circuit constant acceleration test device the most according to claim 4, it is characterised in that: described ring
Oxygen glued membrane uses ESP7660-W model.
6. test device according to a kind of CBGA encapsulated circuit constant acceleration described in claim 1,4 or 5, it is characterised in that:
The thickness of described pad (7) is 0.5mm～2mm, and the thickness of glued membrane (8) is 0.01～0.03mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410188935.7A CN104006941B (en) | 2014-05-06 | 2014-05-06 | A kind of CBGA encapsulated circuit constant acceleration test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410188935.7A CN104006941B (en) | 2014-05-06 | 2014-05-06 | A kind of CBGA encapsulated circuit constant acceleration test device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104006941A CN104006941A (en) | 2014-08-27 |
| CN104006941B true CN104006941B (en) | 2016-09-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201410188935.7A Active CN104006941B (en) | 2014-05-06 | 2014-05-06 | A kind of CBGA encapsulated circuit constant acceleration test device |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108000389B (en) * | 2017-11-28 | 2019-09-24 | 中国电子科技集团公司第五十八研究所 | Integrated circuit Constant Acceleration Test fixture |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4912980A (en) * | 1988-12-05 | 1990-04-03 | Team Corporation | Modular test fixture for vibration and shock testing |
| US5424634A (en) * | 1994-02-18 | 1995-06-13 | International Business Machines Corporation | Non-destructive flex testing method and means |
| WO2007069336A1 (en) * | 2005-12-16 | 2007-06-21 | Fujitsu Limited | Impact test device |
| CN101408488B (en) * | 2008-10-31 | 2010-09-29 | 中国电子科技集团公司第五十八研究所 | Method for testing constant acceleration of microelectronic device |
| CN203479620U (en) * | 2013-09-30 | 2014-03-12 | 贵州航天计量测试技术研究所 | Constant accelerated speed test protection clamp of integrated circuit |
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| CN104006941A (en) | 2014-08-27 |
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