CN103996669A - 镀金银铕合金键合丝及其制造方法 - Google Patents

镀金银铕合金键合丝及其制造方法 Download PDF

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CN103996669A
CN103996669A CN201410235082.8A CN201410235082A CN103996669A CN 103996669 A CN103996669 A CN 103996669A CN 201410235082 A CN201410235082 A CN 201410235082A CN 103996669 A CN103996669 A CN 103996669A
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silver
gold
europium
colored
alloy
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徐云管
李湘平
彭庶瑶
梁建华
涂海情
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JIANGXI LAN WEI ELECTRONIC TECHNOLOGY Co Ltd
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Abstract

本发明提供了一种镀金银铕合金键合丝及其制造方法，该键合丝是以高纯银为主体材料，包括金和铕金属材料。其组成键合丝的材料各成分重量百分比为：银含量为：95%-96.5%、金含量为1.5%-2%、铕含量为2%-3%；其制造方法包括：提取纯度大于99.9999%的高纯银，制备成银合金铸锭，再制成铸态银铕合金母线，将母线拉制成1mm左右的银铕合金键合丝，经热处理后在其表面电镀纯金保护层，再经精密拉拔、热处理、清洗后制成不同规格的镀金银铕合金键合丝。本发明的技术效果是以高纯银为主体材料的镀金银铕合金键合丝既有银基类键合丝的优点又兼顾黄金类键合丝的优点，是一种价格相对低廉且性能又稳定可靠的一种新型键合丝。

Description

镀金银铕合金键合丝及其制造方法
技术领域
本发明属于微电子技术领域，涉及微电子后道封装工序用金属键合丝及其制造方法，尤其涉及一种镀金银铕等合金材料制作的镀金银铕合金键合丝及其制造方法。
背景技术
目前用于集成电路、半导体分立器件等领域的引线封装键合丝最为广泛采用的是黄金类键合丝。由于黄金属贵重金属，价格昂贵且日益上涨，给用量最大的中低端LED、IC封装用户带来沉重的成本压力。因而业界急需成本相对低廉、性能稳定可靠的新型键合丝材料用以取代黄金键合丝。以高纯银为主体材料的镀金银铕合金键合丝既有银基类键合丝的优点又兼顾黄金类键合丝的优点，是一种价格相对低廉且性能又稳定可靠的一种新型键合丝。
发明内容
本发明的目的是提供一种以高纯银为主体材料的镀金银铕合金键合丝及其制造方法，它克服现有合金类键合铜丝、铝丝表面易氧化、高温稳定性差和拉拔断线问题，以及黄金类键合丝生产成本高等不足。
为达到上述目的，本发明所采用的技术方案是：一种镀金银铕合金键合丝，组成键合丝的材料各成分重量百分比为：金（Au）占1.5%-2%、铕（Eu）占2%-3%，银（Ag）占95%-96.5%。
要求金的纯度大于99.99%、银的纯度大于99.9999%、铕的纯度大于99.9%。
所述镀金银铕合金键合丝的制造方法步骤如下：
① 提取高纯银：将1号银（IC-Ag99.99）作为阳极浸入电解液中，以高纯银箔作为阴极浸入电解液中；在阳极、阴极之间输入（7-9）V、（2.5-3.5）A的直流电，以补充新鲜电解液方式维持电解液温度不超过60℃，待阴极积聚一定重量的纯度大于99.9999%的高纯银时及时更换高纯银箔，再经清洗、烘干备用。
② 制备成银合金铸锭：提取纯度大于99.9999%的高纯银，然后加入金和铕，成分含量按照重量百分比分别为：金占0.7%-1%、铕占2%-3%，银占95%-96.5%，因为留有后续工艺中电镀金的余量，所以这里各项材料质量百分比之和不等于100%。这些金属经机械混合后放入高纯石墨坩埚中，在惰性气体保护条件下使用感应电炉加热使其熔化，进而制备成银合金铸锭。
③ 连铸成铸态银铕合金母线：将制备好的银合金铸锭加入有氮气保护的水平连铸金属连铸室，应用中频感应加热至（1100-1150）℃，待完全熔化、精炼和除气后，将熔液注入连铸室中间的储液池保温，在维持（2-5）L/min净化氮气流量的连铸室中，完成对银铕合金熔液的水平连铸，得到Φ3mm左右的铸态银铕合金母线。
④ 粗拔：将Φ3mm左右的银铕合金母线拉拔成直径为1mm左右的银铕合金丝。
⑤ 热处理：将直径为1mm左右的银铕合金丝进行退火处理。
⑥ 表面镀金：采用常规电镀设备和工艺，将退火后的1mm左右的银铕合金丝电镀纯金防氧化保护层，电镀用金的纯度大于99.99%；电流密度（4-4.5）A/dm2，镀层厚度控制在0.9μm-1.4μm，收线速度为（4-5）m/min；经镀金后的镀金银铕合金丝中金占总重量的百分比控制在1.5%-2%。
⑦ 精拔：将直径为1mm左右的镀金银铕合金丝精密拉拔成不同规格的（0.013mm-0.050mm）镀金银铕合金键合丝。
⑧ 热处理：将精拔后的镀金银铕合金键合丝进行退火处理。
⑨ 表面清洗：将退火处理后的镀金银铕合金键合丝先经稀释后的酸液中进行清洗，然后经超声波清洗，再经高纯水清洗、烘干。
⑩ 分卷：将成品镀金银铕合金键合丝进行复绕、分卷、包装。
本发明的技术效果是：以高纯银为主体材料的镀金银铕合金键合丝既有银基类键合丝的优点又兼顾黄金类键合丝的优点，是一种价格相对低廉且性能又稳定可靠的一种新型键合丝。它它克服现有合金类键合铜丝、铝丝表面易氧化、高温稳定性差和拉拔断线问题，以及黄金类键合丝生产成本高等不足。
具体实施方式
为了便于理解，下面结合具体实施例对本发明予以进一步说明。
实施例1
一种以高纯银为主体材料的镀金银铕合金键合丝，组成该键合丝的材料由下列重量百分比的原材料组成：金（Au)占1.5%、铕（Eu）占2%，银（Ag）占96.5%；要求金的纯度大于99.99%、银的纯度大于99.9999%、铕的纯度大于99.9%。
其制作工艺步骤和方法如下：
① 提取高纯银：以国家标准GB/T4135中1号银（IC-Ag99.99）为基材，提取纯度大于99.9999%的高纯银，经清洗、烘干备用。
② 制备成银合金铸锭：按前述的键合丝组成成分重量百分比准备原材料（这里的重量百分比是指各原材料占键合丝总质量的百分比而不是各原材料占制备银合金铸锭的原材料总质量的百分比），其中金（Au)所占重量百分比为0.7%而不是1.5%（金占1.5%指的是包括了后续工序中表面镀金的重量百分比），在高纯银内加入高纯金和钯，这些金属经机械混合后放入高纯石墨坩埚中，在惰性气体保护条件下使用感应电炉加热使其熔化，进而制备成银合金铸锭。
③ 连铸成铸态银铕合金母线：将制备好的银合金铸锭加入有氮气保护的水平连铸金属连铸室，应用中频感应加热、熔化、精炼和除气后，将熔液注入储液池保温，完成对银铕合金熔液的水平连铸，得到Φ3mm左右的铸态银铕合金母线。
④ 粗拔：将Φ3mm左右的银铕合金母线拉拔成直径为1mm左右的银铕合金丝。
⑤ 热处理：将直径为1mm左右的银铕合金丝进行退火处理。
⑥ 表面镀金：采用常规电镀设备和工艺，对经过热处理的1mm左右的银铕合金丝电镀纯金防氧化保护层，要求金的纯度大于99.99%，电镀时电流密度4A/dm2，收线速度为4m/min，表面镀金层的厚度控制在0.9μm，经镀金后的镀金银铕合金丝中金占总重量的百分比为1.5%。
⑦ 精拔：将经退火处理的镀金银铕合金丝精密拉拔成不同规格的（0.013mm-0.050mm）镀金银铕合金键合丝。
⑧ 热处理：将精拔后的镀金银铕合金键合丝进行退火处理。
⑨ 表面清洗：将退火处理后的镀金银铕合金键合丝先经稀释后的酸液中进行清洗，然后经超声波清洗，再经高纯水清洗、烘干。
实施例2
本发明是这样实现的，一种以高纯银为主体材料的镀金银铕合金键合丝，组成该键合丝的材料由下列重量百分比的原材料组成：金（Au)占2%、铕（Eu）占3%，银（Ag）占95%；要求金的纯度大于99.99%、银的纯度大于99.9999%、铕的纯度大于99.9%。
其制作工艺步骤和方法如下：
① 提取高纯银：以国家标准GB/T4135中1号银（IC-Ag99.99）为基材，提取纯度大于99.9999%的高纯银，经清洗、烘干备用。
② 制备成银合金铸锭：按前述的键合丝组成成分重量百分比准备原材料，其中金（Au)所占重量百分比为1%，在高纯银内加入高纯金和钯，这些金属经机械混合后放入高纯石墨坩埚中，在惰性气体保护条件下使用感应电炉加热使其熔化，进而制备成银合金铸锭。
③ 连铸成铸态银铕合金母线：将制备好的银合金铸锭加入有氮气保护的水平连铸金属连铸室，应用中频感应加热、熔化、精炼和除气后，将熔液注入储液池保温，完成对银铕合金熔液的水平连铸，得到Φ3mm左右的铸态银铕合金母线。
④ 粗拔：将Φ3mm左右的银铕合金母线拉拔成直径为1mm左右的银铕合金丝。
⑤ 热处理：将直径为1mm左右的银铕合金丝进行退火处理。
⑥ 表面镀金：采用常规电镀设备和工艺，对经过热处理的1mm左右的银铕合金丝电镀纯金防氧化保护层，要求金的纯度大于99.99%，电镀时电流密度4.5A/dm2，收线速度为5m/min，表面镀金层的厚度控制在1.4μm，经镀金后的镀金银铕合金丝中金占总重量的百分比为2%。
⑦ 精拔：将经退火处理的镀金银铕合金丝精密拉拔成不同规格的（0.013mm-0.050mm）银铕合金键合丝。
⑧ 热处理：将精拔后的镀金银铕合金键合丝进行退火处理。
⑨ 表面清洗：将退火处理后的镀金银铕合金键合丝先经稀释后的酸液中进行清洗，然后经超声波清洗，再经高纯水清洗、烘干。
实施例3
本发明是这样实现的，一种以高纯银为主体材料的镀金银铕合金键合丝，组成该键合丝的材料由下列重量百分比的原材料组成：金（Au)占1.7%、铕（Eu）占2.6%，银（Ag）占95.7%。要求金的纯度大于99.99%、银的纯度大于99.9999%、铕的纯度大于99.9%。
其制作工艺步骤和方法如下：                
① 提取高纯银：以国家标准GB/T4135中1号银（IC-Ag99.99）为基材，提取纯度大于99.9999%的高纯银，经清洗、烘干备用。
② 制备成银合金铸锭：按前述的键合丝组成成分重量百分比准备原材料，其中金（Au)所占重量百分比为0.8%，在高纯银内加入高纯金和铕，这些金属经机械混合后放入高纯石墨坩埚中，在惰性气体保护条件下使用感应电炉加热使其熔化，进而制备成银合金铸锭。
③ 连铸成铸态银铕合金母线：将制备好的银合金铸锭加入有氮气保护的水平连铸金属连铸室，应用中频感应加热、熔化、精炼和除气后，将熔液注入储液池保温，完成对银铕合金熔液的水平连铸，得到Φ3mm左右的铸态银铕合金母线。
④ 粗拔：将Φ3mm左右的银铕合金母线拉拔成直径为1mm左右的银铕合金丝。
⑤ 热处理：将直径为1mm左右的银铕合金丝进行退火处理。
⑥ 表面镀金：采用常规电镀设备和工艺，对经过热处理的1mm左右的银铕合金丝电镀纯金防氧化保护层，要求金的纯度大于99.99%，电镀时电流密度4A/dm2，收线速度为5m/min，表面镀金层的厚度控制在1.15μm，经镀金后的镀金银铕合金丝中金占总重量的百分比为1.7%。
⑦ 精拔：将经退火处理的镀金银铕合金丝精密拉拔成不同规格的（0.013mm-0.050mm）镀金银铕合金键合丝。
⑧ 热处理：将精拔后的镀金银铕合金键合丝进行退火处理。
⑨ 表面清洗：将退火处理后的镀金银铕合金键合丝先经稀释后的酸液中进行清洗，然后经超声波清洗，再经高纯水清洗、烘干。

Claims (5)

1.一种镀金银铕合金键合丝，其特征是组成键合丝的材料各成分重量百分比为：金（Au）占1.5%-2%、铕（Eu）占2%-3%，银（Ag）占95%-96.5%。
2.如权利要求1所述的镀金银铕合金键合丝，其特征是所使用的材料中，金的纯度大于99.99%、银的纯度大于99.9999%、铕的纯度大于99.9%。
3.一种权利要求1或2所述的镀金银铕合金键合丝的制造方法，其特征是其制作的工艺步骤和方法如下：
① 提取高纯银：提取纯度大于99.9999%的高纯银，再经清洗、烘干备用；
② 制备成银合金铸锭：按下述成分含量按照重量百分比准备材料：金占0.7%-1%、铕占2%-3%，银占95-96.5%，这些金属经机械混合后放入高纯石墨坩埚中，在惰性气体保护条件下使用感应电炉加热使其熔化，进而制备成银合金铸锭；
③ 连铸成铸态银铕合金母线：将制备好的银合金铸锭加入有氮气保护的水平连铸金属连铸室，应用中频感应加热熔化、精炼和除气后，将熔液注入储液池保温，完成对银铕合金熔液的水平连铸，得到Φ3mm左右的铸态银铕合金母线；
④ 粗拔：将Φ3mm左右的银铕合金母线拉拔成直径为1mm左右的银铕合金丝；
⑤ 热处理：将直径为1mm左右的银铕合金丝进行退火；
⑥ 表面镀金：对经热处理后的银铕合金丝电镀纯金保护层，电镀用金的纯度要求不低于99.99%，表面镀金层的厚度控制在0.9μm-1.4μm，经镀金后的镀金银铕合金丝中金占总重量的百分比为1.5%-2%；
⑦ 精拔：将直径为1 mm左右的经镀金后的镀金银铕合金丝精密拉拔成直径分别为13μm-50μm的镀金银铕合金键合丝；
⑧ 热处理：将精拔后的镀金银铕合金键合丝进行退火；
⑨ 表面清洗：先用稀释后的酸液对键合丝进行清洗，然后经超声波清洗，再经高纯水清洗、烘干；
 ⑩分卷：将成品镀金银铕合金键合丝进行复绕、分卷、包装。
4.如权利要3所述的一种镀金银铕合金键合丝的制造方法，其特征是：提取高纯银时以国家标准GB/T4135中1号银为基材，经电镀后提取纯度大于99.9999%的高纯银。
5.如权利要3所述的一种镀金银铕合金键合丝的制造方法，其特征是：表面镀金时电流密度（4-4.5）A/dm2，收线速度为（4-5）m/min。
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Publication number Priority date Publication date Assignee Title
CN107240551A (zh) * 2017-06-05 2017-10-10 广东工业大学 一种银合金键合丝的制备方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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