CN103985686A - 一种igbt模块封装焊接结构 - Google Patents
一种igbt模块封装焊接结构 Download PDFInfo
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- CN103985686A CN103985686A CN201410251618.5A CN201410251618A CN103985686A CN 103985686 A CN103985686 A CN 103985686A CN 201410251618 A CN201410251618 A CN 201410251618A CN 103985686 A CN103985686 A CN 103985686A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
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Priority Applications (1)
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CN201410251618.5A CN103985686B (zh) | 2014-06-09 | 2014-06-09 | 一种igbt模块封装焊接结构 |
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CN201410251618.5A CN103985686B (zh) | 2014-06-09 | 2014-06-09 | 一种igbt模块封装焊接结构 |
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CN103985686A true CN103985686A (zh) | 2014-08-13 |
CN103985686B CN103985686B (zh) | 2016-10-12 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104900602A (zh) * | 2015-05-06 | 2015-09-09 | 嘉兴斯达微电子有限公司 | 一种功率模块和制造功率模块过程中控制焊料厚度的方法 |
CN106856180A (zh) * | 2015-12-08 | 2017-06-16 | 株洲南车时代电气股份有限公司 | 一种焊接igbt模块的方法 |
CN108971804A (zh) * | 2017-06-02 | 2018-12-11 | 株洲中车时代电气股份有限公司 | 焊层厚度控制方法及由该方法制作的功率半导体器件 |
CN110142475A (zh) * | 2019-05-07 | 2019-08-20 | 国电南瑞科技股份有限公司 | 一种用于大功率igbt模块的无工装固定焊接方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102244066A (zh) * | 2011-08-05 | 2011-11-16 | 株洲南车时代电气股份有限公司 | 一种功率半导体模块 |
CN102254886A (zh) * | 2011-08-04 | 2011-11-23 | 株洲南车时代电气股份有限公司 | 一种免引线键合igbt模块 |
CN102593111A (zh) * | 2012-02-23 | 2012-07-18 | 株洲南车时代电气股份有限公司 | Igbt模块及其制作方法 |
CN102832179A (zh) * | 2012-08-31 | 2012-12-19 | 江苏宏微科技股份有限公司 | 用于焊接功率模块的金属基板 |
CN103594458A (zh) * | 2013-11-04 | 2014-02-19 | 株洲南车时代电气股份有限公司 | 一种衬板结构 |
-
2014
- 2014-06-09 CN CN201410251618.5A patent/CN103985686B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102254886A (zh) * | 2011-08-04 | 2011-11-23 | 株洲南车时代电气股份有限公司 | 一种免引线键合igbt模块 |
CN102244066A (zh) * | 2011-08-05 | 2011-11-16 | 株洲南车时代电气股份有限公司 | 一种功率半导体模块 |
CN102593111A (zh) * | 2012-02-23 | 2012-07-18 | 株洲南车时代电气股份有限公司 | Igbt模块及其制作方法 |
CN102832179A (zh) * | 2012-08-31 | 2012-12-19 | 江苏宏微科技股份有限公司 | 用于焊接功率模块的金属基板 |
CN103594458A (zh) * | 2013-11-04 | 2014-02-19 | 株洲南车时代电气股份有限公司 | 一种衬板结构 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104900602A (zh) * | 2015-05-06 | 2015-09-09 | 嘉兴斯达微电子有限公司 | 一种功率模块和制造功率模块过程中控制焊料厚度的方法 |
CN106856180A (zh) * | 2015-12-08 | 2017-06-16 | 株洲南车时代电气股份有限公司 | 一种焊接igbt模块的方法 |
CN108971804A (zh) * | 2017-06-02 | 2018-12-11 | 株洲中车时代电气股份有限公司 | 焊层厚度控制方法及由该方法制作的功率半导体器件 |
CN110142475A (zh) * | 2019-05-07 | 2019-08-20 | 国电南瑞科技股份有限公司 | 一种用于大功率igbt模块的无工装固定焊接方法 |
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Publication number | Publication date |
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CN103985686B (zh) | 2016-10-12 |
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Address after: 412001 Room 309, floor 3, semiconductor third line office building, Tianxin hi tech park, Shifeng District, Zhuzhou City, Hunan Province Patentee after: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road Patentee before: ZHUZHOU CSR TIMES ELECTRIC Co.,Ltd. |
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Effective date of registration: 20201022 Address after: 412001 Room 309, floor 3, semiconductor third line office building, Tianxin hi tech park, Shifeng District, Zhuzhou City, Hunan Province Patentee after: Zhuzhou CRRC times Semiconductor Co.,Ltd. Address before: 412001 Room 309, floor 3, semiconductor third line office building, Tianxin hi tech park, Shifeng District, Zhuzhou City, Hunan Province Patentee before: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. |
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