CN103974607B - Use the EMI alternative techniques of flexible ink - Google Patents
Use the EMI alternative techniques of flexible ink Download PDFInfo
- Publication number
- CN103974607B CN103974607B CN201310399184.9A CN201310399184A CN103974607B CN 103974607 B CN103974607 B CN 103974607B CN 201310399184 A CN201310399184 A CN 201310399184A CN 103974607 B CN103974607 B CN 103974607B
- Authority
- CN
- China
- Prior art keywords
- silver paste
- psr
- emi
- ink
- mentioned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Dispersion Chemistry (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to a kind of EMI alternative techniques using flexible ink, it comprises the following steps：The step of pattern is formed on substrate (S10)；Forming (S20) the step of the top of substrate of pattern applies silver paste (SILVER PASTE)；In the step (S30) of whole coating of substrates PSR ink；The step (S470) gold-plated for PSR parts that are exposed and developed and being eliminated are carried out on the PSR layers for having applied；Operation is reduced due to carrying out PSR operations after top first applies silver paste, moreover it is possible to ensure the pliability and resistance value of EMI shielding band (EMI Shield Tape) modes.
Description
Technical field
The present invention relates to a kind of EMI alternative techniques using flexible ink, more specifically, the present invention uses flexible ink
EMI alternative techniques carry out PSR operations after the top of the pattern of substrate implementation silver paste (Silver Paste) operation is formed at, because
This eliminates inking (OVER INK) operation carried out to insulate in the part for being coated with above-mentioned silver paste, such that it is able to reduce
Operation and reduces cost.
Background technology
Silver paste (Silver Paste) or EMI is used to shield for the noise (Noise) occurred when preventing and producing mobile phone
Band (EMI Shield Tape) mode.
Mobile phone is usually taken flip-shell (FLIP Type) and straight-plate-type (BAR Type), Bar patterns be it is a kind of from button to
Show no sign of separately constituting a form for entirety untill antenna independent movable part, therefore to flexible less demanding,
When carrying out operation silver paste (Silver Paste) is applied in order to prevent noise (Noise).But, since straight-plate-type (BAR Type)
After being transformed into Clamshell Type (also referred to as Folder) and sliding cover type (Slide Type), due to sliding (Sliding) neck
The increase in domain and improve to flexible requirement, so as to change adopt EMI shielding band (EMI Shield Tape) mode carry out.
The operational method of existing silver paste (Silver Paste) is as shown in figure 1, be formed at the figure on substrate top in order to protect
Case and carry out PSR operations, be dried on the PSR of coating, exposed and developed and the PSR parts being eliminated occur, it is clear at this
The part removed is gold-plated, does not have gold-plated part that inking (OVER INK) work must be carried out for the purpose of insulation after then applying silver paste
Industry.
And, EMI shielding band (EMI Shield Tape) modes then shown in Fig. 2, substrate top are formed in order to protect
Pattern and carry out PSR operations, be dried on the PSR of coating, exposed and developed and the PSR parts being eliminated occur, at this
The part of removing carries out gold-plated, and not having gold-plated part that then the EMI films being die cut are processed and checked using manual working is
No to bias, product is placed between hot plate carries out heating crimping.After heating crimping is finished, then EMI is removed with manual working
Release liners.
Above-mentioned EMI shielding band (EMI Shield Tape) mode is because the price of EMI films is more expensive than silver paste and except being applicable
Part beyond Film modes then needs discarded and causes that significant loss is huge.In addition, it is desirable to operator carries out manual working
And H/P operations and reduce productivity.Operator is susceptible to partially when being processed EMI coatings field in manual working mode
Put, the possibility of impurity is mixed into due to improve and is susceptible to that impurity is bad, it is caused due to the manual working of operator
Required time is more than other operations with manpower, needs to carry out heating crimping and H/P operations to firmly closely attach EMI films
Deng so as to extra operation and cost occur.
The content of the invention
Prior art document
Patent document
(patent document 1) Korean Patent Room registered patent publication the 10-0887134th
The technical task of solution
In order to solve above-mentioned existing issue, flexible black EMI alternative techniques are used it is an object of the invention to provide a kind of,
The top for foring the substrate of circuit first applies and carry out again after silver paste PSR operations, therefore can reduce operation and ensure that EMI shields band
The pliability and resistance value of (EMI Shield Tape) mode.
Solve the technical scheme of problem
Here is to realize the embodiment of the present invention of object defined above.
The present invention comprises the following steps：The step of pattern (pattern) is formed on substrate (S10)；Forming pattern
The step of top coating silver paste (SILVER PASTE) of substrate (S20)；In the step (S30) of whole coating of substrates PSR ink；Pin
To carrying out the gold-plated step (S470) in PSR parts that are exposed and developed and being eliminated on the PSR layers that have applied.
Foregoing silver paste (SILVERPASTE) applying step is carried out in silk-screen (silk screen) mode, in the profile of product
Applied after inwards ensuring 100~300 μm or so of tolerance.
Foregoing PSR ink applying step (S30) is to be able to protect above-mentioned in the top coating of silver paste (SILVER PASTE)
Silver paste (SILVER PASTE).
Foregoing PSR ink applying step (S30) more extends 500~1000 μm than the application width of silver paste (SILVER PASTE)
Ground coating.
The PSR ink of coating in foregoing PSR ink applying step (S30) with the addition of Flexible additives on epoxy resin.
Beneficial effect
As it was previously stated, the present invention can by silver paste (SILVERPASTE) operation using the EMI alternative techniques of flexible ink
Ink is applied just for required part, so as to significant loss hardly occur, it is not necessary to made manually as EMI modes
Industry, moreover it is possible to reduce operation.Therefore, it is possible to save about 45~60% human cost and process cost.
And, the present invention can be greatly decreased operation traveling time and be improved productivity, due to being entered by mode of printing
Go and be achieved tight (TIGHT) tolerance management, it is bad so as to biasing is greatly decreased, because the possibility that impurity is flowed into subtracts
It is able to prevent the bad situation of impurity in advance less.
Brief description of the drawings
Fig. 1 is the schematic configuration diagram of the silver paste operation method of existing printed circuit board (PCB)；
Fig. 2 is the schematic configuration diagram of EMI shielding band (EMI Shield Tape) operation methods of existing printed circuit board (PCB)；
Fig. 3 is the schematic configuration diagram of the EMI alternative techniques using flexible ink of one embodiment of the invention；
Fig. 4 is the shape that silver paste and PSR ink are coated with using flexible black EMI alternative techniques by one embodiment of the invention
State photo.
Specific embodiment
The invention will now be described in detail with reference to the accompanying drawings uses flexible black EMI alternative techniques.Same inscape in figure
To be illustrated using same pictorial symbolization as far as possible in any figure.When the present invention is illustrated, if it is considered on known features or
The explanation of function may obscure purport of the invention, by description is omitted.
Fig. 3 is the schematic configuration diagram of the EMI alternative techniques using flexible ink of one embodiment of the invention, and Fig. 4 is by this
The EMI alternative techniques using flexible ink for inventing an embodiment are coated with the state photo of silver paste and PSRR ink.
The EMI alternative techniques using flexible ink of one embodiment of the invention comprise the following steps：Pattern is formed on substrate
The step of (S10)；Forming (S20) the step of the top of substrate of pattern applies silver paste (SILVER PASTE)；In whole base
The step (S30) of plate coating PSR ink；For being carried out on the PSR layers for having applied, PSR parts that are exposed and developed and being eliminated are gold-plated
The step of (S470).
Above-mentioned pattern forming step (S10) applies C/L in being formed after layer pattern, then carries out lamination operation and makes product many
Stratification, then hole is formed by machinery or UV laser (laser) for the purpose of energization, then form pattern after copper facing.
Above-mentioned silver paste (SILVER PASTE) applying step (S20) is a kind of top silver coating in the substrate for forming pattern
The step of cream (SILVER PASTE), applied after the profile of product inwards ensures 100~300 μm or so of tolerance.
Silver paste (SILVER PASTE) coating method is carried out in silk-screen (silk screen) mode, and liquid phase cream is coated to
Formd in the making sheet of stomata according to printing shape, allow scraper to move and apply pressure and be able to be printed in required part
Brush.The silver paste (SILVER PASTE) of printing is allowed to dry and harden it.
Above-mentioned PSR ink applying step (S30) is the step in whole product coating PSR ink, the purpose for applying PSR be in order to
The circuit on protective substrate surface and the short circuit for preventing between circuit, use silk-screen (silk as above-mentioned silver paste coating method
Screen) mode is carried out, and formed using UV light the exposure process of solder mask (SOLDER MASK) after coating PSR ink.
Then carry out the surface treatment in hole etc and carry out development to allow pattern to manifest, then harden it.Above-mentioned PSR ink are in silver paste
The top of (SILVER PASTE) applies and is able to protect above-mentioned silver paste (SILVER after further expanding 500~1000 μm
PASTE).On the other hand, above-mentioned PSR ink with the addition of flexible (Flexible) additive on epoxy resin and be able to assign softness
Property, therefore in addition to rigid section, moreover it is possible to suitable for flexible section.
Above-mentioned gold-plated step (S40) is to be exposed at above-mentioned PSR layers and developed and removing needs to carry out gold-plated part
After the PSR in (Rigid fields), for what is drilled to realize interlayer electrical connection (CONNECTION) on multi-layered product (MLB)
HOLE carries out acid copper (Cu).By liquid process with non-electrolytic copper facing->The order of electrolytic copper plating is carried out.
Applicant is being described above various embodiments of the present invention, but above-described embodiment is to realize that the technology of the present invention is thought
The embodiment thought, as long as technological thought of the invention can be realized, deformation in any year or modification are regarded as belonging to the present invention
Scope.
The explanation of main graphical mark
S10：Pattern forming step
S20：Silver paste (SILVER PASTE) applying step
S30：PSR ink applying steps
S40：Gold-plated step
Claims (1)
- It is 1. a kind of to use flexible black EMI alternative techniques, it is characterised in thatComprise the following steps：The step of pattern is formed on substrate (S10)；Silver paste (SILVER PASTE) is applied on the top for forming the substrate of pattern The step of (S20)；In the step (S30) of whole coating of substrates PSR ink；It is exposed and developed for being carried out on PSR layers for having applied And the gold-plated step (S40) in the PSR parts that are eliminated；Above-mentioned PSR ink applying step (S30) more extends 500~1000 μm of ground and applies than the application width of silver paste (SILVER PASTE) Apply；Above-mentioned silver paste (SILVER PASTE) applying step is carried out in silk-screen (silk screen) mode, in the profile court of product Inner side applies after ensuring 100~300 μm of tolerance；Above-mentioned PSR ink applying step (S30) is able to protect above-mentioned silver paste in the top coating of silver paste (SILVER PASTE) (SILVER PASTE)；AndPSR ink coated by above-mentioned PSR ink applying step (S30) with the addition of flexible (Flexible) addition on epoxy resin Agent.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130010384A KR101285278B1 (en) | 2013-01-30 | 2013-01-30 | Emi substitution method using flexible ink |
| KR10-2013-0010384 | 2013-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103974607A CN103974607A (en) | 2014-08-06 |
| CN103974607B true CN103974607B (en) | 2017-07-11 |
Family
ID=48997196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310399184.9A Active CN103974607B (en) | 2013-01-30 | 2013-09-05 | Use the EMI alternative techniques of flexible ink |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101285278B1 (en) |
| CN (1) | CN103974607B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101330803A (en) * | 2007-06-18 | 2008-12-24 | 比亚迪股份有限公司 | Assistance processing method for printed circuit board |
| CN101588677A (en) * | 2008-05-19 | 2009-11-25 | 比亚迪股份有限公司 | A kind of manufacture method of flexible circuit board |
| CN101646307A (en) * | 2008-08-04 | 2010-02-10 | 比亚迪股份有限公司 | Method for manufacturing FPC and FPC |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100778665B1 (en) * | 2006-08-09 | 2007-11-23 | 주식회사 심텍 | Construction method for perimeter of thin plate rigid pcb |
| JP2011138935A (en) | 2009-12-28 | 2011-07-14 | Hitachi Cable Ltd | Method of manufacturing wiring board for semiconductor device |
| KR20120027958A (en) * | 2010-09-14 | 2012-03-22 | (주)와이에스썸텍 | Printed circuit board comprising discontinuous insulating pattern and processing method of the same |
| KR20120048983A (en) * | 2010-11-08 | 2012-05-16 | 에스케이하이닉스 주식회사 | Method for fabricating printed circuit board |
-
2013
- 2013-01-30 KR KR1020130010384A patent/KR101285278B1/en active IP Right Grant
- 2013-09-05 CN CN201310399184.9A patent/CN103974607B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101330803A (en) * | 2007-06-18 | 2008-12-24 | 比亚迪股份有限公司 | Assistance processing method for printed circuit board |
| CN101588677A (en) * | 2008-05-19 | 2009-11-25 | 比亚迪股份有限公司 | A kind of manufacture method of flexible circuit board |
| CN101646307A (en) * | 2008-08-04 | 2010-02-10 | 比亚迪股份有限公司 | Method for manufacturing FPC and FPC |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103974607A (en) | 2014-08-06 |
| KR101285278B1 (en) | 2013-07-11 |
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