CN103974598A - 电路板 - Google Patents

电路板 Download PDF

Info

Publication number
CN103974598A
CN103974598A CN201310045973.2A CN201310045973A CN103974598A CN 103974598 A CN103974598 A CN 103974598A CN 201310045973 A CN201310045973 A CN 201310045973A CN 103974598 A CN103974598 A CN 103974598A
Authority
CN
China
Prior art keywords
circuit board
heat dissipation
electrode zone
dissipation region
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310045973.2A
Other languages
English (en)
Chinese (zh)
Inventor
杨江辉
陈鹏
明玉生
陈海泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Priority to CN201310045973.2A priority Critical patent/CN103974598A/zh
Priority to PCT/EP2013/077489 priority patent/WO2014121878A1/fr
Publication of CN103974598A publication Critical patent/CN103974598A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
CN201310045973.2A 2013-02-05 2013-02-05 电路板 Pending CN103974598A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201310045973.2A CN103974598A (zh) 2013-02-05 2013-02-05 电路板
PCT/EP2013/077489 WO2014121878A1 (fr) 2013-02-05 2013-12-19 Carte de circuit imprimé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310045973.2A CN103974598A (zh) 2013-02-05 2013-02-05 电路板

Publications (1)

Publication Number Publication Date
CN103974598A true CN103974598A (zh) 2014-08-06

Family

ID=49880780

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310045973.2A Pending CN103974598A (zh) 2013-02-05 2013-02-05 电路板

Country Status (2)

Country Link
CN (1) CN103974598A (fr)
WO (1) WO2014121878A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105101613A (zh) * 2014-11-19 2015-11-25 芜湖蓝宙电子科技有限公司 提高表面贴装器件印制板导热能力的方法
WO2016101625A1 (fr) * 2014-12-23 2016-06-30 中兴通讯股份有限公司 Appareil dissipateur thermique, carte de circuit imprimé, et procédé de conception de cette carte de circuit imprimé
CN106714510A (zh) * 2015-11-13 2017-05-24 柯惠有限合伙公司 用于电子器件的热管理的系统和方法
WO2017128212A1 (fr) * 2016-01-28 2017-08-03 深圳市嘉合劲威电子科技有限公司 Carte de circuits imprimés et mémoire l'utilisant
CN107810368A (zh) * 2015-05-04 2018-03-16 江森自控科技公司 具有包含成角度的电路板的外壳的用户控制装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106488686B (zh) * 2015-08-31 2020-09-29 上海伯乐电子有限公司 照明器件、电气组件、柔性电路及热传递方法
CN111447728B (zh) * 2020-04-17 2022-02-25 歌尔微电子有限公司 柔性电路板及电子设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device
US20040226696A1 (en) * 2003-02-28 2004-11-18 Hong Huang Surface mount resistors as heat transfer augmentation devices
US7806574B2 (en) * 2006-04-16 2010-10-05 Albeo Technologies, Inc. Thermal management of LED-based lighting systems
EP2276329A1 (fr) * 2009-07-16 2011-01-19 ABB Research Ltd. Carte de circuit électronique dotée d'un condensateur thermique

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105101613A (zh) * 2014-11-19 2015-11-25 芜湖蓝宙电子科技有限公司 提高表面贴装器件印制板导热能力的方法
WO2016101625A1 (fr) * 2014-12-23 2016-06-30 中兴通讯股份有限公司 Appareil dissipateur thermique, carte de circuit imprimé, et procédé de conception de cette carte de circuit imprimé
CN105792597A (zh) * 2014-12-23 2016-07-20 中兴通讯股份有限公司 一种散热装置、电路板及其设计方法
CN107810368A (zh) * 2015-05-04 2018-03-16 江森自控科技公司 具有包含成角度的电路板的外壳的用户控制装置
CN106714510A (zh) * 2015-11-13 2017-05-24 柯惠有限合伙公司 用于电子器件的热管理的系统和方法
US10123460B2 (en) 2015-11-13 2018-11-06 Covidien LLP System and method for thermal management of electronic devices
WO2017128212A1 (fr) * 2016-01-28 2017-08-03 深圳市嘉合劲威电子科技有限公司 Carte de circuits imprimés et mémoire l'utilisant

Also Published As

Publication number Publication date
WO2014121878A1 (fr) 2014-08-14

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C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140806