CN103972315B - Integrated form backboard, back-contact photovoltaic module and its production method - Google Patents
Integrated form backboard, back-contact photovoltaic module and its production method Download PDFInfo
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
Integrated form backboard, the back-contact photovoltaic module including above-mentioned integrated form backboard and its production method the present invention relates to be used for back-contact photovoltaic module.The combined electrical interconnection member included for back-contact photovoltaic module integrated form backboard for providing the electrical connection between the conducting channel in back-contact barrier-layer cell and integrated form backboard.Technology of the invention be for the manufacturer of back-contact photovoltaic module in the urgent need to.The present invention can either improve the efficiency and durability of back-contact photovoltaic module, and the consumption of electroconductive binder can be greatlyd save again, so as to significantly reduce manufacturing cost.
Description
Technical field
The present invention relates to a kind of integrated form backboard for back-contact photovoltaic module, comprising the integrated form backboard
Back-contact photovoltaic module and its production method.In particular it relates to a kind of include combined electrical interconnection member
Integrated form backboard and its production method for back-contact photovoltaic module, a kind of including combined electrical interconnection member
Back-contact photovoltaic module and its production method.
Background technology
Due to photovoltage（Or solar energy）Battery can provide sustainable energy, therefore it uses scope to expand rapidly
Greatly.Commercialized conventional silicon solar cell, launch site and transmitting region electrode are respectively positioned on before battery.
In the conventional photovoltaic module of manufacture, in order to reach the weatherability of at least 20 years, generally photoproduction is lied prostrate
Beat battery folders or between being laminated to polymer encapsulation layer, and using foreboard and backboard further by barrier-layer cell and environment
Isolation, and for module provides mechanical support.Therefore, foreboard and backboard are also referred to as external protection plate.
In general, in from the photovoltaic module based on crystalline silicon battery plate, according to from the back side（It is non-towards sunny side）
To above（Towards sunny side）Sequence of positions, it has the laminar structure including following part：(1) backboard, (2) back of the body encapsulated layer, (3)
Barrier-layer cell, encapsulated layer before (4), and (5) foreboard.
In the photovoltaic module with the structure, it is important that be arranged at the court of back-contact barrier-layer cell
The material of sunny side（That is foreboard such as glass plate and preceding encapsulated layer）With light transmission rate higher, to allow enough daylight to reach
Barrier-layer cell.
Encapsulated layer（I.e. preceding encapsulated layer and back of the body encapsulated layer）Generally it is made up of polymeric material, such as acid copolymer, ionomer, second
Alkene-acetate ethylene copolymer (EVA）, it is poly-（Vinyl acetal)（As gathered（Vinyl butyral）(PVB)）, it is polyurethane, poly-（Chloroethene
Alkene）, polyethylene（Such as LLDPE）, polyolefin block copolymer elastomer, alpha-olefin and α, β-ethylenic insatiable hunger
With the copolymer of carboxylate（Such as ethylene methyl acrylate copolymer and ethylene butyl acrylate copolymer）, silicone elastomer, ring
The combination of two or more in oxygen tree fat and these polymeric materials.In these materials, EVA is always photovoltage
The most popular selection of cell package layer material.Preceding encapsulated layer by one or more layers polymeric material laminating molding, and can carry on the back envelope
Dress layer can also be by one or more layers polymeric material laminating molding.
The transmitting region electrode of commercialized conventional silicon optical life voltaic cell is located at before battery and is conducive to improving current-carrying
The collection efficiency of son.But this kind of structure has its limitation：Although electrode occupied area very little, but can still block part
Sunlight, reduces barrier-layer cell effective area of shining light；, it is necessary to be welded from before one piece of battery with tin band is applied during component package
Another piece of back side of battery is connected to, this connected mode increases the difficulty of automated production.Therefore, researcher is electric being located at
Electrode before pond is transferred to cell backside, develops the different back-contact barrier-layer cell of many structures.Back-contact
Barrier-layer cell refers to a kind of barrier-layer cell for being located fully or partially at cell backside of the transmitting region electrode of battery.The back of the body
Contact battery enjoys the pass of photovoltaic market with its unique device architecture, simple manufacturing process and battery efficiency higher
Note.Back-contact battery has many good qualities：1. efficiency high.Because the shading for reducing or completely eliminating above gate line electrode is damaged
Lose, so as to improve battery efficiency.2. suitable automatic assembling production.Coplanar company is carried out using brand-new component package pattern
Connect, both reduced the interval between cell piece, improve packaging density, in turn simplify manufacture craft, reduce encapsulation difficulty.3. more
It is attractive in appearance.It is homogeneous, attractive in appearance before back-contact barrier-layer cell, meet the esthetic requirement of consumer.
And in back-contact barrier-layer cell, due to battery front electrode is transferred into cell backside, before battery
The silver paste coverage of light-receiving side is reduced, so as to improve the efficiency of back-contact barrier-layer cell.
At present, the production technology of back-contact photovoltaic module is extremely complex and cost is very high.For back-contact
For photovoltaic module, prior art typically using two ways connection back-contact barrier-layer cell above electrode with
It is arranged on backboard（Or substrate）Conducting channel above, is used to draw the power produced by back-contact barrier-layer cell.
First way is that the through hole during EVA carries on the back encapsulated layer and/or back of the body insulating barrier is filled with electroconductive binder.This company
Connecing the shortcoming of mode is：Need to use substantial amounts of electroconductive binder.As a rule, a large amount of silver are included in electroconductive binder
Grain, it is with high costs, so as to cause manufacturing cost to be substantially increased.Fig. 1 is the layer of the back-contact photovoltaic module of prior art
The decomposing schematic representation of laminated structure.Fig. 2 is the schematic cross-sectional view of the back-contact photovoltaic module of prior art, in Fig. 2 in detail
Show between the electric contact and conducting channel on the rear side of the back-contact barrier-layer cell
The electrical interconnection member of electrical connection is provided.Be can see from Fig. 1 and Fig. 2：Back-contact photovoltaic module 1000 is along from the back of the body
Face（It is non-towards sunny side）To above（Towards sunny side）Direction order include layers below：Backboard（Or substrate）1010th, it is arranged on backboard
On conducting channel 1011, the back of the body insulating barrier（Or back of the body encapsulated layer）1020th, back-contact barrier-layer cell 1030, preceding encapsulated layer
1040 and foreboard 1050.As shown in Figure 2, there are multiple electric contacts above the rear side of back-contact barrier-layer cell 1030
1031, it aligns with the multiple through holes 1021 on insulating backside layer 1020, also has on back-contact barrier-layer cell 1030
There are multiple guiding electrode holes 1032 that rear side is extended to from front face side, its back side with back-contact barrier-layer cell 1030
Side upper part electric contact 1031 aligns.It is arranged on the electric contact in the rear side of back-contact barrier-layer cell 1030
Electrical connection between 1031 and conducting channel 1011 is by being filled in the multiple through holes 1021 on insulating backside layer 1020
Electrical interconnection member（That is electroconductive binder）1022 offers.It is conductive for the production of back-contact photovoltaic module
The consumption of adhesive would generally be very big.
The second way is interconnecting strip to be welded direct on the electrode at the back-contact barrier-layer cell back side and mutual
Bracing is simultaneously used as back-side circuit.Although this connected mode cost is relatively low, the production efficiency of module is relatively low.And it is high
Temperature welding can be in back-contact barrier-layer cell thermal stress higher incorporated above, so as to cause battery breakage rate higher.By
There is specific both positive and negative polarity counter structure between interconnecting strip circuit and back-contact barrier-layer cell, therefore also need to solve
Electric insulation problem between back-contact barrier-layer cell and interconnecting strip.
Therefore, for the manufacturer of back-contact photovoltaic module, in the urgent need to one kind can either be carried further
Battery efficiency high, while the use of electroconductive binder can be saved again, with cost-benefit for back-contact photovoltage
The integrated form backboard of module, the back-contact photovoltaic module including above-mentioned integrated form backboard and its production method.
The content of the invention
The present invention is by the electric contact above a kind of rear side for providing back-contact barrier-layer cell and conduction
The combined electrical interconnection member of the electrical connection between circuit, successfully solves the above-mentioned problems in the prior art.
Partially electronically conductive adhesive is substituted by the applied metal conductive component in the combined electrical interconnection member, is improve
Electrical efficiency between back-contact barrier-layer cell and conducting channel, so as to improve the light of back-contact photovoltaic module
Photoelectric transformation efficiency.In addition, applying this combined electrical interconnection member in back-contact photovoltaic module, system can also be reduced
Cause this.
Specifically, the present invention relates to the content of following many aspects：
1. a kind of integrated form backboard for back-contact photovoltaic module, the integrated form backboard is along from the back side
Include to direction order above：
Substrate with rear side and front face side relative to each other；
It is arranged on the conducting channel in the front face side of the substrate；
The back of the body insulating barrier adjacent with the conducting channel, the back of the body insulating barrier has the back of the body adjacent with the conducting channel
Surface side and the front face side away from the conducting channel, and there are the back of the body insulating barrier multiple rear sides from the back of the body insulating barrier to prolong
The through hole of the front face side of the back of the body insulating barrier is extended, the through hole aligns with the conducting channel；
Wherein, the type electrical interconnection member that is combined of each through hole in the multiple through hole is full of, the combination
Type electrical interconnection member includes that the first electricity bonds part and bonds at least one complementary conductive part of component shape with the described first electricity
Part, and for position of at least one conductive component in the through hole, the first conductive bond part
Near the front face side of the back of the body insulating barrier；
When back-contact photovoltaic module is produced using the integrated form backboard, the combined electrical interconnection member
First electricity bonds part and is adhered on the electric contact above the rear side of back-contact barrier-layer cell.
2. the integrated form backboard according to aspect 1, it is characterised in that at least one conductive component by a kind of or
Various metals material is made.
3. the integrated form backboard according to aspect 2, it is characterised in that one or more metal material is selected from bag
Include copper, aluminium, tungsten, tin, nickel, titanium, silver-plated copper, nickel-clad copper, tin-coated copper, tin plating aluminium, gold-plated nickel, stainless steel and their alloy and
The material group of combination.
4. the integrated form backboard according to aspect 3, it is characterised in that at least one conductive component be include piece,
One or more of form in block, net and combinations thereof.
5. the integrated form backboard according to aspect 1, it is characterised in that described in the combined electrical interconnection member
At least one conductive component accounts for the 3-95 % of the combined electrical interconnection member cumulative volume.
6. the integrated form backboard according to aspect 1, it is characterised in that first electricity bonds part by including at least
5%（Volumn concentration）The conductive material of macromolecular material be made.
7. the integrated form backboard according to aspect 6, it is characterised in that first electricity bonds part by conductive polymer
Sub- material is made.
8. the integrated form backboard according to aspect 6, it is characterised in that first electricity bonds part by conductive adhesion
Agent is made, and the electroconductive binder includes macromolecular material and disperses conducting particles therein.
9. the integrated form backboard according to aspect 7, it is characterised in that the conducting particles be selected from include gold, silver, nickel,
The group of copper, aluminium, tin, zinc, titanium, tin, bismuth, tungsten, lead and its alloy.
10. the integrated form backboard according to any one of aspect 1-9, it is characterised in that at least one conductive part
Part is directly adhered in the conducting channel.
The 11. integrated form backboard according to any one of aspect 1-9, it is characterised in that the combined electrical interconnection structure
Part further include the second electricity bond part, position relative at least one conductive component in the through hole and
Speech, second electricity bonds part near the rear side of the back of the body insulating barrier and is adhered in the conducting channel, and described
It is complementary with least one conductive component shape that second electricity bonds part.
The 12. integrated form backboard according to aspect 11, it is characterised in that it is viscous by conduction that second electricity bonds part
Mixture, conducting polymer composite or solder are made.
The 13. integrated form backboard according to aspect 1, it is characterised in that the back of the body insulating barrier is by comprising ethyl vinyl acetate
Ethylene copolymer（EVA）, ionomer (ionomer) or poly-（Vinyl butyral）(PVB) polymer composition is made.
A kind of 14. back-contact photovoltaic modules, the back-contact photovoltaic module is along from the back side to above
Direction order include：
Integrated form backboard according to any one of aspect 1-13；
Back-contact barrier-layer cell, the back-contact barrier-layer cell has light-receiving before relative to each other
Side and rear side, and multiple electric contact is formed in above the rear side of the back-contact barrier-layer cell, the back of the body
The rear side of contact barrier-layer cell is abutted with the back of the body insulating barrier of the integrated form backboard；
The preceding encapsulated layer adjacent with the front face side of the back-contact barrier-layer cell；With
The transparent front plate adjacent with the preceding encapsulated layer.
The 15. back-contact photovoltaic module according to aspect 14, it is characterised in that the back-contact photoproduction
Voltaic cell is to be processed through winding by metallizing（MWT）Barrier-layer cell.
A kind of 16. methods for producing the integrated form backboard for back-contact photovoltaic module, methods described include with
Lower step：
A () provides the substrate with rear side and front face side relative to each other；
B () sets conducting channel in the front face side of the substrate；
C () is stacked in insulating barrier is carried on the back in the conducting channel, wherein the back of the body insulating barrier has multiple exhausted from the back of the body
The rear side of edge layer extends to the through hole of the front face side of the back of the body insulating barrier, the through hole is directed at the conducting channel,
Wherein, filled in each through hole of the multiple through hole at least one conductive component and first electricity bond part so as to
Full of the through hole, at least one conductive component is near the back side neighbouring with the conducting channel of the back of the body insulating barrier
Side, first electricity bonds front face side away from the conducting channel of the part near the back of the body insulating barrier, and described at least one
Individual conductive component and the first electricity bond component shape complementation and the jointly part as combined electrical interconnection member；
D the laminated sandwich construction obtained by step (c) of () hot pressing is to obtain the integrated form backboard.
The method that 17. production according to aspect 16 is used for the integrated form backboard of back-contact photovoltaic module, its
It is characterised by, at least one of multiple through holes conductive component and conduction described in step (c) and step (d)
Circuit directly contact.
The method that 18. production according to aspect 16 is used for the integrated form backboard of back-contact photovoltaic module, its
It is characterised by, in step (c), the second electric binding part is further filled in each through hole of the multiple through hole
Part makes it be disposed close to rear side and at least one conductive component shape complementation for carrying on the back insulating barrier and be led with described
Circuit directly contact so that at least one conductive component be placed in it is described first and second electricity bond parts between simultaneously
It is collectively forming the part of the combined electrical interconnection member, and the combined electrical interconnection member described in step (d)
Part is bonded by means of the described second electricity to be adhered in the conducting channel.
A kind of 19. methods for producing back-contact photovoltaic module, the described method comprises the following steps：
A () provides the substrate with rear side and front face side relative to each other；
B () sets conducting channel in the front face side of the substrate；
C () is stacked in insulating barrier is carried on the back in the conducting channel, wherein the back of the body insulating barrier has multiple exhausted from the back of the body
The rear side of edge layer extends to the through hole of the front face side of the back of the body insulating barrier, the through hole is directed at the conducting channel,
Wherein, at least filled in each hole of the multiple through hole at least one conductive component and first electricity bond part so as to
Full of the through hole, at least one conductive component is near the back side neighbouring with the conducting channel of the back of the body insulating barrier
Side, first electricity bonds front face side away from the conducting channel of the part near the back of the body insulating barrier, and described at least one
Individual conductive component and the first electricity bond component shape complementation and the jointly part as combined electrical interconnection member；
D () with light-receiving side before relative to each other and rear side and will be formed in the multiple electricity of the rear side and touch
The back-contact barrier-layer cell of point is stacked on the back of the body insulating barrier and bonds the first electricity in the multiple through hole
Multiple electric contact directly contacts of part and the back-contact barrier-layer cell rear side；
E be stacked in before described in the back-contact barrier-layer cell preceding encapsulated layer on light-receiving side by ()；
F be stacked in transparent front plate above the preceding encapsulated layer by ()；
G the laminated sandwich construction obtained by step (f) of () hot pressing is to obtain the back-contact photovoltaic module.
The method of the 20. production back-contact photovoltaic module according to aspect 19, it is characterised in that in step
At least one of multiple through holes conductive component and conducting channel directly contact described in (c), and in step (g)
First electricity bonds part and is adhered on multiple electric contacts of the back-contact barrier-layer cell rear side.
The method of the 21. production back-contact photovoltaic module according to aspect 20, it is characterised in that in step
C in (), further the electricity of filling second bonds part to be disposed close to it described in each hole of the multiple through hole
Carry on the back insulating barrier rear side and at least one conductive component shape it is complementary and with the conducting channel directly contact so that
It is placed at least one conductive component between the first electricity bonding part and the second electricity bonding part and common
The part of the combined electrical interconnection member is formed, and in step (g), second electricity bonds part and is attached
Onto the conducting channel.
A kind of 22. methods for producing back-contact photovoltaic module, the described method comprises the following steps：
A () prepares integrated form backboard using the method as in terms of any one of 16-18；
B () with light-receiving side before relative to each other and rear side and will be formed in the multiple electricity of the rear side and touch
The back-contact barrier-layer cell of point is stacked on the integrated form backboard and makes the first electricity in the multiple through hole viscous
Multiple electric contact directly contacts of knot part and the back-contact barrier-layer cell rear side；
C be stacked in before described in the back-contact barrier-layer cell preceding encapsulated layer on light-receiving side by ()；
D be stacked in transparent front plate above the preceding encapsulated layer by ()；
E the laminated sandwich construction obtained by step (d) of () hot pressing is to obtain the back-contact photovoltaic module.
The present invention especially has the advantages that：
Technology of the invention be for the manufacturer of back-contact photovoltaic module in the urgent need to.The present invention was both
The efficiency and durability of back-contact photovoltaic module can be improved, the consumption of electroconductive binder can be greatlyd save again, together
When significantly reduce manufacturing cost and with considerable cost benefit.
Advantages of the present invention and novel feature is characterized specifically to be attached to herein and constituting claim a part of herein
Indicated in book.However, for a better understanding of the present invention, its advantage and by its apply reached target, structure should be referred to
Into the accompanying drawing and the item of the descriptive nature enclosed of this paper another part, wherein illustrate and describing one of the invention
Or multiple preferred embodiments.
Brief description of the drawings
With reference to Figure of description, the present invention will be described in detail.Figure of description not necessarily in strict accordance with than
Example is drawn and Figure of description is only schematical diagram.In the drawings in the descriptive section of the present application, using identical or
Similar drawing reference numeral represents same or analogous element.
Fig. 1 is the decomposing schematic representation of the laminar structure of the back-contact photovoltaic module of prior art；
Fig. 2 is the schematic cross-sectional view of the back-contact photovoltaic module of prior art, and use is illustrate in detail in the figure
Electricity is provided between the electric contact and the conducting channel on the rear side of the back-contact barrier-layer cell
The electrical interconnection member of connection；
Fig. 3 is the back-contact photovoltaic module of the first embodiment for including combined electrical interconnection member of the invention
Generalized section；
Fig. 4 is the back-contact photovoltaic module of the second embodiment for including combined electrical interconnection member of the invention
Generalized section；With
Fig. 5 a-5e are the schematic flow sheets of the production method of the back-contact photovoltaic module shown in Fig. 4.
Part and reference numerals list
| 1000 | Back-contact photovoltaic module |
| 1010 | Substrate |
| 1011 | Conducting channel |
| 1020 | Back of the body insulating barrier |
| 1021 | Through hole |
| 1022 | Electrical interconnection member |
| 1030 | Back-contact barrier-layer cell |
| 1031 | Electric contact |
| 1032 | Guiding electrode hole |
| 1040 | Preceding encapsulated layer |
| 1050 | Foreboard |
| 2000 | Back-contact photovoltaic module |
| 2010 | Substrate |
| 2011 | Conducting channel |
| 2020 | Back of the body insulating barrier |
| 2021 | Through hole |
| 2022 | Electrical interconnection member |
| 2022a | First electricity bonds part |
| 2022b | Conductive component |
| 2030 | Back-contact barrier-layer cell |
| 2031 | Electric contact |
| 2040 | Preceding encapsulated layer |
| 2050 | Foreboard |
| 3000 | Back-contact photovoltaic module |
| 3010 | Substrate |
| 3011 | Conducting channel |
| 3020 | Back of the body insulating barrier |
| 3021 | Through hole |
| 3022 | Electrical interconnection member |
| 3022a | First electricity bonds part |
| 3022b | Conductive component |
| 3022c | Second electricity bonds part |
| 3030 | Back-contact barrier-layer cell |
| 3031 | Electric contact |
| 3040 | Preceding encapsulated layer |
| 3050 | Foreboard |
| 3000a | Back-contact photovoltaic module assemblies in the first production stage（Substrate with conducting channel） |
| 3000b | Back-contact photovoltaic module assemblies in the second production stage |
| 3000c | Back-contact photovoltaic module assemblies in third production step（Integrated form backboard） |
| 3000d | Back-contact photovoltaic module assemblies in the 4th production stage |
| 3000e | Back-contact photovoltaic module assemblies in the 5th production stage |
Specific embodiment
Unless special circumstances have other to limit, the term that otherwise following definition is used suitable for this specification.
Additionally, unless otherwise defined, the implication of all scientific and technical terminologies otherwise used herein with it is of the art
It is the same that technical staff is generally understood that.If conflict occurs, by this specification and its including definition be defined.
Although the method similar or equivalent with methods described herein and material and material be used equally to it is of the invention practice or
Inspection, but suitable method and material are for as those described herein.
Some terms used in this application are defined as follows：
As used herein, directional terminology " on ", the specific direction on D score and Figure of description paper is consistent with.
As used herein, directional terminology " above ", " back side ", " front face side ", " rear side " with it is right in the art
What the usual call of back-contact photovoltaic module was consistent with.
As used herein, term " about " is exponential quantity, size, formula, parameter and other quantity and characteristic is inaccurate
And need not be accurate value, but can be approximate with exact value and/or more than or less than exact value, allow to reflect
Deviation, conversion factor, the numerical value revision of the convention, measurement error etc., and the known other factors of those skilled in the art.Typically
For, quantity, size, formula, parameter or other amounts or characteristic for " about " or " approximate ", regardless of whether carrying out such bright
Really statement.
Additionally, ranges described herein includes their end points, unless clearly stated on rare occasions.Additionally, when one
Individual quantity, concentration or other numerical value or parameter are with scope, one or more preferred scopes or preferred upper limit numerical value and preferred lower limit
When the tabular form of numerical value is given, it is interpreted as disclosing particularly by under any range limit or preferred value and any scope
Whether any pair of constituted all scopes of limit or preferred value, individually disclosed but regardless of such scope.
Additionally, herein when number range is enumerated, the scope is intended to include its end points and all integers in the range of this
And fraction, unless indicated other in particular situations.When a scope is defined, it is not intended to which the scope of the present invention is defined in into institute
The occurrence enumerated.Finally, when term " about " is used to describe the end points of numerical value or scope, content of this disclosure should be understood
Including the specific numerical value or involved end points.
When this paper is short with " those skilled in the art is known " when material, method or plant equipment is described
When language or synonymous word or phrase, the term represents that the material, method and machine equipment are normal when present patent application is submitted to
Rule, and be included in this explanation.It is likewise covered by the description, not conventional at present still working as is applied to similar mesh
When will turn into art-recognized material, method and machinery.
As used herein, term "comprising", " containing ", " including ", " covering ", " being characterised by ", " having " or it is any its
His synonym or their any other deformation refer both to including for nonexcludability.For example, technique, side including specific factor list
Method, product or equipment are not necessarily limited to the key element that those are specifically listed, and can be including other not expressly listed key elements, or
Such technique, method, product or the intrinsic key element of equipment.
The scope of claim is limited in transition phrase "consisting essentially of ..." the material or step specified, and not
The essential characteristic and new feature that can have to claimed invention cause those materials or step of materially affect
Suddenly." claim of ' substantially by ... constitute ' be in ' by ... constitute ' closed claims of format writing and ' to wrap
Containing/include ' between the scope of full open model claim write of form.”
When applicant describes invention or one part using open-ended term such as "comprising", it should be appreciated that the explanation
Also the description carried out to this invention using term "consisting essentially of ..." defined above is included, unless in concrete condition
Under indicated.
Measure word " one " and " one kind " are used to describe key element of the invention or component.Presence is intended to suggest that using these measure word
A kind of or these key elements of at least one or component.Although typically to the noun for showing to be modified being odd number using such measure word
Noun, but as used herein, measure word " one " and " one kind " also include plural number, unless otherwise indicated in particular situations.Together
Sample, as used herein, demonstrative pronoun " being somebody's turn to do " also illustrates that the noun being modified can be odd number or plural number, unless in particular situations
It is otherwise indicated.
As used herein, term " back-contact photovoltaic module " means to include for example shown in the application Fig. 3 and Fig. 4
The feature finished device of multilayer laminate；Term " back-contact photovoltaic module assemblies " means in production back-contact
The multilayer semi-finished product assembly formed in the lamination process of photovoltaic module；Term " back-contact barrier-layer cell " means
The core functional components that luminous energy is changed into electric energy effect are played in back-contact photovoltaic module.
In addition, term " back of the body insulating barrier " means to be located at conducting channel and back contacts in back-contact photovoltaic module
One or more layers polymer film or piece between formula barrier-layer cell, its effect for serving encapsulation and insulation.
Term " copolymer " refers to comprising copolymerization units or carries out copolymerisation by two or more comonomers and generated
Residue polymer.In this connection, copolymer can combine its component comonomer or the quantity of its component comonomer exists
Described herein, for example " copolymer includes ethene and 9 %（Weight percentage）Acrylic acid ", or one similar retouched
State.Such description can be considered as informal because it not comonomer as copolymerization units；Because it does not include copolymerization
The conventional name of thing, such as name of IUPAC (IUPAC)；Because its not application method qualifier
Product term；Or because other reasonses.However, as used herein, with reference to its component comonomer or its component comonomer
The description that amount is carried out to copolymer refers to the copolymerization units that the copolymer contains specified comonomer（Have when specified and specify
Amount）.Thus following inference is drawn, copolymer is not the product of the reactant mixture of the given comonomer comprising specified rate, is removed
It is non-to carry out such clearly stating in the case of restriction.
Term " acid copolymer " refers to β-ethylenic unsaturated carboxylic acid and optionally other are suitable comprising alpha-olefin, α
Comonomer（Such as α, β-ethylenically-unsaturated carboxylic acid ester）Copolymerization units polymer.
Term " ionomer " refers to the polymer prepared by partially or completely neutralizing acid copolymer as described above.More
Specifically, ionomer includes ionic group, and the ionic group is metal ion carboxylate, such as alkali metal carboxylate, alkali
The mixture of earth metal carboxylate, transition metal carboxylate and such carboxylate.As defined herein, such polymer generally leads to
Cross and partially or completely neutralize（For example reacted by with alkali）It is prepared by the hydroxy-acid group of precursor or matrix polymer, wherein precursor or
Matrix polymer is acid copolymer.The example of alkali metal ionomer used herein is sodium ionomer（Or the ionomer that sodium is neutralized）,
The whole of the hydroxy-acid group of the methacrylic acid unit of the copolymer of such as ethene and methacrylic acid, wherein copolymerization or one
It is divided into carboxylic acid na form.
As herein in form alone or in combination（Such as " lamination " or " lamination "）Used, term " layered product " refers to have
The structure of at least two-layer of adhesion firmly with each other or bonding.These layers can be adhered to directly to each other or indirectly." directly
Ground " means do not have additional materials, such as interlayer or adhesive phase between two-layer；" indirectly " mean there is additional between two-layer
Material.
The material of this paper, method and embodiment are merely illustrative, it is not intended that limited, unless otherwise specified.
Finally, listed herein all percentages, number etc. are by weight, unless separately had in specific example
It is bright.
Multiple embodiments of the invention are described in detail with reference to Figure of description.
Fig. 3 is the back-contact photovoltaic module of the first embodiment for including combined electrical interconnection member of the invention
2000 generalized section.Back-contact photovoltaic module 2000 of the invention is made up of laminated multi-layer.Such as institute in Fig. 3
Show, back-contact photovoltaic module 2000 of the invention is along from the back side（It is non-towards sunny side）To above（Towards sunny side）Direction it is suitable
Sequence includes layers below：Substrate 2010, the conducting channel 2011 being arranged on substrate 2010, it is provided with multiple through holes（In figure
Not shown reference）Back of the body insulating barrier 2020, back-contact barrier-layer cell 2030, preceding encapsulated layer 2040, foreboard 2050,
And any of which layer is respectively provided with front face side（Towards sunny side）And rear side（It is non-towards sunny side）.The back-contact barrier-layer cell
2030 have light-receiving side before relative to each other（The upside of back-contact barrier-layer cell 2030 in Fig. 3）And rear side
（The downside of back-contact barrier-layer cell 2030 in Fig. 3）, and multiple electric contacts 2031 are formed in the back-contact photoproduction
Above the rear side of voltaic cell, the rear side of the back-contact barrier-layer cell 2030 and the back of the body insulate
Layer is 2020 adjacent, and the multiple through holes 2021 in multiple electric contacts 2031 in its rear side and back of the body insulating barrier 2020（Figure
Not shown in）Alignment；Each through hole in the multiple through hole is combined type electrical interconnection member 2022（Do not show in figure
Go out）It is full of, and the electrical connection between electric contact 2031 and conducting channel 2011 is to be filled in multiple through holes by these
2021（Not shown in figure）In electrical interconnection member 2022 provide.The electrical interconnection member 2022 includes that the first electricity bonds part
2022a and one or more conductive component 2022b complementary with its shape.In back-contact photovoltaic module 2000, should
First electricity bond part 2022a be adhered on electric contact 2031, and one or more conductive components 2022b be arranged on base
Directly contact in conducting channel 2011 on plate 2010, so as to via the first embodiment of combined electrical interconnection member of the invention
Realize the conducting channel on the electric contact 2031 and substrate 2010 in the rear side of back-contact barrier-layer cell 2030
Electrical connection between 2011.
Such as glass plate of foreboard 2050 and preceding encapsulated layer 2040 of back-contact photovoltaic module 2000 preferably have compared with
Light transmission rate high, to allow enough daylight to reach back-contact barrier-layer cell 2030.Of the invention shown in Fig. 3
In back-contact photovoltaic module 2000, foreboard 2050 and preceding encapsulated layer 2040 are all transparent.Preceding encapsulated layer 2040 and the back of the body
Insulating barrier 2020 can respectively by polymeric material such as ethylene-vinyl acetate copolymer (EVA）It is made.Preceding encapsulated layer 2040 and the back of the body are exhausted
Edge layer 2020 each can be by one or more layers polymeric material laminating molding.Specifically, for shape preceding encapsulated layer 2040 and/
Or the material of back of the body insulating barrier 2020 can be selected from comprising ethylene-vinyl acetate copolymer（EVA）, ionomer (ionomer) or poly-
（Vinyl butyral）(PVB) composition of polymer.Wherein, back of the body insulating barrier 2020 can be single or multiple lift structure, both
The encapsulation effect to battery is served, the electric insulation effect between battery and conducting channel is served again.In back-contact light
In raw photovoltaic module 2000, back-contact barrier-layer cell 2030 is to be processed through winding by metallizing（MWT）Photoproduction
Voltaic cell.In electrical interconnection member 2022, the first electricity bonds part 2022a by conductive adhesive or conducting polymer composite system
Include macromolecular material into, the electroconductive binder and disperse conducting particles therein, the conducting particles be selected from include it is golden,
The group of silver, nickel, copper, aluminium, tin, zinc, titanium, tin, bismuth, tungsten, lead and its alloy.Such as first electricity bonds part 2022a can be by wrapping
Include at least 5%（Volumn concentration）The conductive material of macromolecular material be made.One or more of conductive component 2022b
Can be made up of one or more metal material, one or more metal material be selected from include copper, aluminium, tungsten, tin, nickel, titanium,
Silver-plated copper, nickel-clad copper, tin-coated copper, tin plating aluminium, gold-plated nickel, stainless steel and their alloy and the material group of combination.Described one
Individual or multiple conductive components can be in the form of one or more included in piece, block, net and combinations thereof.In the combined electricity
In interconnecting component 2022, at least one conductive component accounts for the 3-95 % of the combined electrical interconnection member cumulative volume.For example
In combined electrical interconnection member 2022, conductive component 2022b can be metal（Such as copper）Piece or net.Preferably, the combination
The electrical conductivity of the conductive component in type electrical interconnection member bonds the electrical conductivity of part more than the described first electricity.So it is more beneficial for carrying
The efficiency of back-contact photovoltaic module high.
Fig. 4 is the back-contact photovoltaic module of the second embodiment for including combined electrical interconnection member of the invention
The generalized section of 3000 laminar structure.Back-contact photovoltaic module 3000 and the back-contact photoproduction shown in Fig. 3
Photovoltaic module 2000 has similar structure, and difference is, for being filled in the multiple through holes 3021 on back of the body insulating barrier 3020
Electrical interconnection member 3022 include that the first electricity bonds complementary one or more conductive components 3022b of part 3022a and its shape
And second electricity complementary with conductive component 3022b shapes bonds part 3022c.Second electricity bonds part 3022c can be by
Electroconductive binder, conducting polymer composite or solder are made.In the laminar structure of back-contact photovoltaic module 3000, should
First electricity bonds part 3022a and is adhered on electric contact 3031, and second electricity bonds part 3022c and is adhered to conductive electricity
On road 3011, so as to realize back-contact photovoltage electricity via the second embodiment of combined electrical interconnection member of the invention
The electrical connection between the conducting channel 3011 on electric contact 3031 and substrate in the rear side in pond 3030.For art
For technical staff, it is also conceivable to：The conductive component 3022b can be copper sheet（Paper tinsel）, copper mesh, stainless (steel) wire（Piece）, shape
One or more parts such as metallic conduction part, the metallic conduction part in irregular shape of shape rule, as long as meeting following
Condition：It is mutual that at least one conductive component bonds part 3022a, the second electricity bonding part 3022c shapes with the first electricity
It is filled in through hole 3021 with mending.As can be seen here, the second electricity bonds part 3022c and plays makes electrical interconnection member 3022 and substrate
The effect of the electric connection of the conducting channel 3011 on 3010.Preferably, conductive component in the combined electrical interconnection member
Electrical conductivity bonds the electrical conductivity of part more than the electrical conductivity and/or second electricity that the described first electricity bonds part.So more have
Beneficial to the efficiency for improving back-contact photovoltaic module.
In this application, back-contact photovoltage electricity can will be removed in back-contact photovoltaic module 2000,3000
Pond 2030,3030, preceding encapsulated layer 2040,3040, foreboard 2050, the unit metaplasia outside 3050 are produced, and the unit is claimed
Make " integrated form backboard ", as shown in Figure 5 c.The cellular manufacturing of integrated form backboard is for back-contact photovoltage of the invention
It is very favorable for the production of module 2000,3000.
The present invention discloses a kind of integrated form backboard for back-contact photovoltaic module, the integrated form backboard edge
From the back side includes to direction order above：Substrate 2010 with rear side and front face side relative to each other；It is arranged on
Conducting channel 2011 in the front face side of the substrate；The back of the body insulating barrier 2020 adjacent with the conducting channel, it is described
Back of the body insulating barrier has the rear side and front face side away from the conducting channel adjacent with the conducting channel, and the back of the body insulation
There are layer multiple rear sides from the back of the body insulating barrier to extend to the through hole 2021 of the front face side of the back of the body insulating barrier（In figure not
Show）；Wherein, the type electrical interconnection member that is combined of each through hole in the multiple through hole is full of, described combined
Electrical interconnection member includes the first electric bonding part 2022a and bonds at least one complementary conduction of component shape with the described first electricity
Part 2022b, and for position of at least one conductive component in the through hole, described first is conductive viscous
Front face side of the knot part near the back of the body insulating barrier；Back-contact photovoltaic module is produced when the integrated form backboard is used
When 2000, the first electricity of the combined electrical interconnection member bonds the back side that part is adhered to back-contact barrier-layer cell
On electric contact 2031 above side.
In the integrated form backboard, the combined electrical interconnection member may further include the second electricity and bond part
3022c, for position of at least one conductive component in the through hole, second electricity bonds part and leans on
The rear side of the nearly back of the body insulating barrier is simultaneously adhered in the conducting channel 3011, and the second point bond part with it is described
At least one conductive component shape is complementary.
Invention further discloses a kind of producer of the integrated form backboard 3000c for barrier-layer cell module 3000
Method, the described method comprises the following steps（See Fig. 5 a-5c）：
A () provides the substrate 3010 with rear side and front face side relative to each other；
(b) setting conducting channel 3011 in the front face side of the substrate 3010, the component 3000a being consequently formed,
As shown in Figure 5 a；
C () is stacked in insulating barrier 3020 is carried on the back in the conducting channel, wherein the back of the body insulating barrier 3020 has multiple certainly
The rear side of the back of the body insulating barrier extends to the through hole 3021 of the front face side of the back of the body insulating barrier, makes the through hole 3021 pairs
The accurate conducting channel 3011, the component 3000b being consequently formed, as shown in Figure 5 b；
D () further, the second electricity is filled in each through hole of the multiple through hole 3021 and bonds part
3022c, at least one conductive component and the first electricity bond part 3022a, and it is full of the through hole 3021, described first
Electricity bonds front face sides away from the conducting channel 3011 of the part 3022a near the back of the body insulating barrier 3020, second electricity
Rear sides of the part 3022c near the back of the body insulating barrier 3020 is bonded, at least one conductive component 3022b is placed in described
First electricity bonds the electricity of part 3022a and second and bonds between part 3022c, and complementary with its shape and turn into combined electricity jointly
The part of interconnecting component；
E the laminated sandwich construction obtained by step (d) of () hot pressing is to obtain the integrated form backboard 3000c（Fig. 5 c）,
Wherein, second electricity bonds part 3022c and sticks in the conducting channel 3011.
In another optional mode of the production method of integrated form backboard of the invention（Produce for photovoltage electricity
The method of the integrated form backboard of pond module 2000）, the described method comprises the following steps：
A () provides the substrate with dorsal surface and leading flank relative to each other；
B () sets conducting channel on the front face side of the substrate；
C () is stacked in insulating barrier is carried on the back in the conducting channel, wherein the back of the body insulating barrier has multiple exhausted from the back of the body
The rear side of edge layer extends to the through hole of the front face side of the back of the body insulating barrier, the through hole is directed at the conducting channel；
(d) further, filled in each through hole in the multiple through hole at least one conductive component and
First electricity bonds part, and it is full of the through hole, and first electricity bonds part near the back side of the back of the body insulating barrier
Side, at least one conductive component bonds component shape complementation and turns into combined electrical interconnection member jointly with the described first electricity
Part；
The laminated sandwich construction obtained by step (d) of (e) hot pressing to obtain integrated form backboard, wherein the conductive component
Directly contacted with conducting channel.
Invention further discloses a kind of method for producing back-contact photovoltaic module 3000, methods described includes following
Step（Reference can be made to Fig. 5 c-5e）：
（f）After above-mentioned integrated form backboard 3000c is as above produced, further by back-contact barrier-layer cell
3030 are stacked in before the back of the body insulating barrier 3020, and make the electric contact of the rear side of back-contact barrier-layer cell 3030
3031 are aligned with the through hole 3021 on the back of the body insulating barrier 3020, and the component being consequently formed is as fig 5d；
（g）Preceding encapsulated layer 3040 is stacked in before the back-contact barrier-layer cell 3030 on light-receiving side,
The component being consequently formed is as depicted in fig. 5e；
（h）Transparent front plate 3050 is stacked in the front face side of the preceding encapsulated layer 3040；And the multilayer that will as above obtain
Structure is laminated to obtain back-contact photovoltaic module 3000（See Fig. 4）.
In so obtained back-contact photovoltaic module 3000, in multiple combined electrical interconnection members 3022
The one electricity electricity bondings of bonding part 3022a and second part 3022c is adhered to back-contact barrier-layer cell 3030 and carries on the back respectively
On the electric contact 3031 of surface side and in conducting channel 3011, so that the back-contact barrier-layer cell 3030 and conduction electricity
Electrical connection is realized between road 3011.
For the production method of the back-contact photovoltaic module 2000 shown in Fig. 3, only need to be to above back contacts
The production method of formula photovoltaic module 3000 is slightly improved.Specifically, the described method comprises the following steps：
F () further will after the above-mentioned integrated form backboard for barrier-layer cell module 2000 is as above produced
On back-contact barrier-layer cell is stacked in before the back of the body insulating barrier, and make back-contact barrier-layer cell rear side
Electric contact with it is described the back of the body insulating barrier on through hole be aligned；
G be stacked in before the back-contact barrier-layer cell preceding encapsulated layer on light-receiving side by ()；
H () transparent front plate is stacked in the front face side of the preceding encapsulated layer；And the sandwich construction that will as above obtain is carried out
It is laminated to obtain back-contact photovoltaic module 2000（See Fig. 3）.
Another optional mode is, in the method for the back-contact photovoltaic module shown in production Fig. 3 and Fig. 4,
Can be filled with after combined electrical interconnection member in through hole on to the back of the body insulating barrier, be not laminated, but directly
Connect and further back-contact barrier-layer cell is stacked in before the back of the body insulating barrier, and make back-contact photovoltage
The electric contact of cell backside side is aligned with the through hole on the back of the body insulating barrier；
Preceding encapsulated layer is stacked in before the back-contact barrier-layer cell on light-receiving side；
Transparent front plate is stacked in the front face side of the encapsulated layer；And
The sandwich construction that will as above obtain is laminated to obtain back-contact photovoltaic module 3000.
Those skilled in the art can be appreciated that：The method for manufacturing above-mentioned back-contact photovoltaic module is not limited
Due to this.For example, it is also possible to will first have the back of the body insulating barrier 3020 and back-contact barrier-layer cell of multiple through holes 3021
3030 is laminated, the combined electrical interconnection member of filling, is then respectively closed layer by layer with other.
Technology of the invention be for the manufacturer of back-contact photovoltaic module in the urgent need to.Institute of the present invention
The back-contact photovoltaic module including combined electrical interconnection member, the back contacts including combined electrical interconnection member for using
Formula photovoltaic module and its production method can greatly save the consumption of electroconductive binder, significantly reduce manufacturing cost,
The efficiency of back-contact photovoltaic module can be improved again simultaneously.
Example
Advantageous Effects of the invention are described in further detail below by way of example, but the present invention is not limited
In following these examples.
Photovoltaic module of the invention（Photovoltaic module）The specific material for being used is as follows：
MWT battery：156 millimeters of polycrystalline silicon metals are through winding（MWT）Back contacts photovoltaic cell is bought in Shanghai crystalline substance Australia too
Yang Neng photovoltaics Science and Technology Ltd.；
Glass plate：3.2 millimeters of ultra-clear glasses are bought and are thought up to new energy Co., Ltd in Henan；
EVA film -1：With " Rui Fu "（RevaxTM）Trade (brand) name is purchased from 450 microns of thickness of Wenzhou Ruiyang Photovoltaic Material Co., Ltd.
Ethylene-vinyl acetate copolymer（EVA）Film；
EVA film -2：EVA film -1 is pressed into 250 micron films under the pressure of 100 DEG C of temperature and 20 MPa and is obtained；
PET film：With MelinexTMS trade (brand) names are purchased from Du Pont's Supreme Being people's film（DuPont Teijin Films）（U.S.A.）
The warp of company（Both sides）The polyethylene terephthalate of sided corona treatment（polyethylene terephthalate）Film（It is thick
It is 250 microns to spend, and density is 1.40 g/cm3）;
ECP-1：The modified ethylene acrylate copolymer tree of E.I.Du Pont Company is purchased from trade name Bynel 22E757
Fat（ethylene/acrylate copolymer）, density is 0.94 g/cm3, melt index（MFI）It is 8.0 g/10 min,
Fusing point is 92 DEG C；
ECP-2：The ethylene methacrylic acid copolymer resin of E.I.Du Pont Company is purchased from trade name Nucrel 0910
(Ethylene methacrylic acid copolymer）, contain 9%（Weight percentage）Methacrylic acid, density is
0.93 g/cm3, melt index（MFI is）10.0 g/10 min, fusing point is 100 DEG C;
PVF films：The polyvinyl fluoride of E.I.Du Pont Company is purchased from trade name Tedlar（polyvinyl fluoride）Orientation
Film, thickness is 38 microns；
Bonding agent：Three wells are purchased from trade name PP-5430 and A50（Mitsui）The two-part polyurethane of company
（polyurethane）Bonding agent；
Copper Foil -1：Purchased from 35 microns of Copper Foils of thickness of Co., Ltd of Chinese Suzhou FUKUDA METAL；
Copper Foil -2：Purchased from 105 microns of Copper Foils of thickness of Co., Ltd of Chinese Suzhou FUKUDA METAL；
Copper mesh：Purchased from 310 mesh of Hebei Yingkaimo Metal Net Co., Ltd., the phosphor-copper wire netting that string diameter is 30 microns；
Stainless (steel) wire：Purchased from 300 mesh of Hebei Yingkaimo Metal Net Co., Ltd., string diameter be 40 microns, by 316 stainless steels
The wire netting being made；
Conducting resinl -1：LORD Corporation are purchased from trade name Thermoset MD-140（The U.S.）Contain
The conducting resinl of silver particles；
Conducting resinl -2：The conducting resinl of the following film containing silver particles for preparing：Now by 33 grams of ethylene-vinyl acetate copolymers（EVA,
E.I.Du Pont Company is purchased from trade name Elvax PV1650）With 0.4 gram of peroxide（In being purchased from trade name LQ-TBEC
Lanzhou auxiliary reagent factory of state）, 0.3 gram of silane coupler（Japanese Shin-Etsu Chemial Co., Ltd is purchased from trade name KBM403）With
0.12 gram of antioxidant（With trade name IrganoxTMMD1024 is purchased from BASF Aktiengesellschaft）Premix;Then it is again that gained is pre-
Mixed thing and the amorphous silver powder that 92 gram particle footpaths are 3-5 microns（Kunming Nuo Man Electron Material Co., Ltd）It is with 25 gram particle footpaths
5.4-11 microns of ball shape silver powder（Du pont company）Banburying is blended 10 minutes systems and obtains at 80 DEG C；
Soldering paste：The lead-free tin cream of Daikin sakata company is purchased from trade name DK-309Bi；
Substrate with conducting channel：Prepared by following methods：I () suppresses PET film and PVF films by adhesive layer
Into substrate；(ii) the extrusion laminate machine manufactured by Davis Standared companies, at a temperature of 285 DEG C, by 35 microns of thickness
Copper Foil is laminated on the PET film of substrate, adhesive phase therebetween（60 microns of thickness）By the 1 of ECP-1 and ECP-2:1（Weight by weight）
Blend is made；(iii) the plane die hobbing press for being produced using Chinese Suzhou Chuan Machinery Co., Ltd.s cut metal foil and
Adhesive phase is forming conducting channel.
Output power of photovoltaic module method of testing
The power output of photovoltaic module be by using SPI-SUN Simulators 3500SLP types solar simulators and
PV module QA detectors measure what is obtained.
Comparative example 1 and example 1-2
In comparative example 1, by hot pressing two minutes at 65 DEG C, by the EVA of the through hole with multiple a diameter of 3 mm
Film -1 is laminated in MWT battery rear side, and answers the electrode pair of through hole and cell backside side.Then, conducting resinl -1 is injected
To in through hole, highly remained basically stable with edge on through hole.After drying at room temperature half an hour, by EVA film -1 and glass laminated to MWT
Battery front face side, band conducting channel substrate to its rear side.Finally, stepped construction is applied at 145 DEG C using vacuum laminator
Pressure 15 minutes, obtains monolithic MWT photovoltaic modules.Its power output is 3.65 watts.
In example 1, by hot pressing two minutes at 65 DEG C, will carry the EVA film of the through hole of multiple a diameter of 3 mm-
1 is laminated in MWT battery rear side, and answers the electrode pair of through hole and cell backside side.Then, first by a part of conducting resinl -1
It is injected into through hole, adds 105 microns thick Copper Foil disks（Diameter is identical with through hole）, it is finally that another part is conductive
On the copper foil of the injection through hole of glue -1, total height remains basically stable with edge on through hole.After drying at room temperature half an hour, by EVA film-
1 and glass laminated to MWT battery front face side, band conducting channel substrate to its rear side.Finally, using vacuum laminator 145
Stepped construction is pressed 15 minutes at DEG C, obtains monolithic MWT photovoltaic modules.After tested, the power output of example 1 is 3.72 relative
In 3.65 watts of comparative example 1,2% is increased.
In example 2, by hot pressing two minutes at 65 DEG C, will carry the EVA film of the through hole of multiple a diameter of 3 mm-
1 is laminated in MWT battery rear side, and answers the electrode pair of through hole and cell backside side.Then, first by a part of conducting resinl -1
It is injected into through hole, adds 410 microns thick metal disks（It is plating purchased from the structure of Wuxi Southwick Science and Technology Ltd.
Layer 15（µm）/ copper（170 µm）/ coating（40 µm）/ copper（170 µm）/ coating（15 µm）Sandwich construction sheet metal, its
Middle Coating composition is Sn/Pd/Ag alloys, and the weight ratio of Sn/Pd/Ag is 62/36/2 in alloy, and its diameter is slightly less than and runs through
Hole）, finally by the copper foil of the injection through hole of another part conducting resinl -1, total height remains basically stable with edge on through hole.Room
After temperature dries half an hour, by EVA film -1 and glass laminated to MWT battery front face side, band conducting channel substrate to its rear side.Most
Afterwards, stepped construction is pressed 15 minutes at 145 DEG C using vacuum laminator, obtains monolithic MWT photovoltaic modules.After tested, it is real
The power output of example 2 is 3.7 relative to 3.65 watts of comparative example 1, to increase 1.4%.
Comparative example 2 and example 3
In comparative example 2, the EVA film -2 of the through hole with multiple a diameter of 3 mm is laminated in the base with conducting channel
On plate, and make through hole corresponding with conducting channel.Then, by the hot pressing of conducting resinl -2（100℃）And thickness is die-cut to for 250 microns
The conductive glue slice of a diameter of 2.5 mm, and put it into each through hole, then hot pressing 2.5 minutes is solid at a temperature of 65 DEG C
It is fixed.Finally MWT battery, EVA film -1 and glass are stacked gradually to the back of the body insulating barrier for installing conducting resinl, vacuum laminator is used
Stepped construction is pressed 15 minutes at 145 DEG C, obtains monolithic MWT photovoltaic modules.Its power output is 3.6 watts.
In example 3, first Solder-Paste Printing is bonded in conducting channel, keeps area of section, number and the position of soldering paste point
Put and match with the back electrode of MWT battery.Then the EVA film -2 of the through hole with multiple a diameter of 3 mm is laminated in and is carried
On the substrate of conducting channel, its through hole is aligned with soldering paste point.The Copper Foil of the μ m-thick of hot pressing conducting resinl -2 to 105 at 100 DEG C
On, and keep gross thickness for 150 μm, then it is die-cut to the conductive glue slice of a diameter of 2.5 mm.Conductive glue slice is put into each
In through hole, copper sheet face is set to be connected with soldering paste, upper surface and the edge on through hole of conducting resinl are remained basically stable.Finally by MWT battery,
EVA film -1 and glass are stacked gradually to the back of the body insulating barrier for installing conducting resinl, and stacking is tied at 145 DEG C using vacuum laminator
Structure presses 15 minutes, obtains monolithic MWT photovoltaic modules.After tested, the power output of example 3 is 3.74 watts relative to comparative example
3.6 watts of 2, increase 3.9%.
Comparative example 3 and example 4-5
In comparative example 3, by hot pressing two minutes at 63 DEG C, by the EVA of the through hole with multiple a diameter of 3 mm
Film -1 is laminated in MWT battery rear side, and answers the electrode pair of through hole and cell backside side.Then, conducting resinl -1 is injected
To in through hole, highly remained basically stable with edge on through hole.After drying at room temperature half an hour, by EVA film -1 and glass laminated to MWT
Battery front face side, band conducting channel substrate to its rear side.Finally, stepped construction is applied at 145 DEG C using vacuum laminator
Pressure 15 minutes, obtains monolithic MWT photovoltaic modules.Its power output is 3.63 watts.Through 100 thermal cycles（IEC61215 standards
Testing process, -40 DEG C to 85 DEG C circulations）After aging, its power output is 3.48 watts.
In example 4, by hot pressing two minutes at 63 DEG C, will carry the EVA film of the through hole of multiple a diameter of 3 mm-
1 is laminated in MWT battery rear side, and answers the electrode pair of through hole and cell backside side.Then, conducting resinl -1 is injected into and is passed through
In perforation, diameter and through hole identical copper mesh disk are then placed in.After drying at room temperature half an hour, by EVA film -1 and glassy layer
It is stacked to MWT battery front face side, band conducting channel substrate to its rear side.Finally, using vacuum laminator at 145 DEG C to stacking
Pressuring structure 15 minutes, obtains monolithic MWT photovoltaic modules.After tested, the power output of example 4 is 3.71 watts.And through 100
Thermal cycle（IEC61215 standard testing flows, -40 DEG C to 85 DEG C circulations）After aging, its power output is 3.56 watts.Relatively
In comparative example 3,2.2% and 2.3% has been respectively increased.
In example 5, by hot pressing two minutes at 63 DEG C, will carry the EVA film of the through hole of multiple a diameter of 3 mm-
1 is laminated in MWT battery rear side, and answers the electrode pair of through hole and cell backside side.Then, conducting resinl -1 is injected into and is passed through
In perforation, diameter and through hole identical stainless (steel) wire disk are then placed in.After drying at room temperature half an hour, by EVA film -1 and glass
Glass is laminated to MWT battery front face side, band conducting channel substrate to its rear side.Finally, it is right at 145 DEG C using vacuum laminator
Stepped construction presses 15 minutes, obtains monolithic MWT photovoltaic modules.After tested, the power output of example 5 is 3.75 watts.And pass through
100 thermal cycles（IEC61215 standard testing flows, -40 DEG C to 85 DEG C circulations）After aging, its power output is 3.61 watts.
Relative to comparative example 3,3.3% and 3.7% has been respectively increased.
Although having been described above and particular instantiation certain preferred embodiments of the invention, it is not intended as the present invention
It is limited to such embodiment.Although moreover, it will be appreciated that had been shown that in described above many features of the invention and
Advantage, and the structure details and function of the invention, but the disclosure is exemplary only, and can not depart from this hair
On the basis of bright principle, in the extensive general implication scope according to term used in appended claims, to of the invention
Details is farthest changed, especially to shape, size and arrangement of parts in terms of modification.
Claims (22)
1. a kind of integrated form backboard for back-contact photovoltaic module, the integrated form backboard is along from the back side to above
Direction order include：
Substrate with rear side and front face side relative to each other；
It is arranged on the conducting channel in the front face side of the substrate；
The back of the body insulating barrier adjacent with the conducting channel, the back of the body insulating barrier has the rear side adjacent with the conducting channel
Extended to multiple rear sides from the back of the body insulating barrier with the front face side away from the conducting channel, and the back of the body insulating barrier
The through hole of the front face side of the back of the body insulating barrier, the through hole aligns with the conducting channel；
Wherein, the type electrical interconnection member that is combined of each through hole in the multiple through hole is full of, the combined electricity
Interconnecting component includes that the first electricity bonds part and bonds at least one complementary conductive component of component shape with the described first electricity, and
For position of at least one conductive component in the through hole, first electricity bonds part near described
Carry on the back the front face side of insulating barrier；
When back-contact photovoltaic module is produced using the integrated form backboard, the first of the combined electrical interconnection member
Electricity bonds part and is adhered on the electric contact above the rear side of back-contact barrier-layer cell.
2. integrated form backboard according to claim 1, it is characterised in that at least one conductive component is by a kind of or many
Metal material is planted to be made.
3. integrated form backboard according to claim 2, it is characterised in that one or more metal material is selected to be included
Copper, aluminium, tungsten, tin, nickel, titanium, silver-plated copper, nickel-clad copper, tin-coated copper, tin plating aluminium, gold-plated nickel, stainless steel and their alloy and group
The material group of conjunction.
4. integrated form backboard according to claim 3, it is characterised in that at least one conductive component be include piece,
One or more of form in block, net and combinations thereof.
5. integrated form backboard according to claim 1, it is characterised in that described in the combined electrical interconnection member
At least one conductive component accounts for the 3-95 % of the combined electrical interconnection member cumulative volume.
6. integrated form backboard according to claim 1, it is characterised in that first electricity bonds part by including at least 5%
（Volumn concentration）The conductive material of macromolecular material be made.
7. integrated form backboard according to claim 6, it is characterised in that first electricity bonds part by conducting polymer
Material is made.
8. integrated form backboard according to claim 6, it is characterised in that first electricity bonds part by electroconductive binder
It is made, the electroconductive binder includes macromolecular material and disperses conducting particles therein.
9. integrated form backboard according to claim 8, it is characterised in that the conducting particles be selected from include gold, silver, nickel,
The group of copper, aluminium, tin, zinc, titanium, bismuth, tungsten, lead and its alloy.
10. the integrated form backboard according to any one of claim 1-9, it is characterised in that at least one conductive part
Part is directly adhered in the conducting channel.
The 11. integrated form backboard according to any one of claim 1-9, it is characterised in that the combined electrical interconnection structure
Part further include the second electricity bond part, position relative at least one conductive component in the through hole and
Speech, second electricity bonds part near the rear side of the back of the body insulating barrier and is adhered in the conducting channel, and described
It is complementary with least one conductive component shape that second electricity bonds part.
12. integrated form backboards according to claim 11, it is characterised in that second electricity bonds part by conductive adhesion
Agent, conducting polymer composite or solder are made.
13. integrated form backboards according to claim 1, it is characterised in that the back of the body insulating barrier is by comprising ethyl vinyl acetate second
Alkene copolymer（EVA）, ionomer (ionomer) or poly-（Vinyl butyral）(PVB) polymer composition is made.
A kind of 14. back-contact photovoltaic modules, the back-contact photovoltaic module is along from the back side to side above
Include to order：
Integrated form backboard according to any one of claim 1-13；
Back-contact barrier-layer cell, the back-contact barrier-layer cell have before relative to each other light-receiving side and
Rear side, and multiple electric contact is formed in above the rear side of the back-contact barrier-layer cell, the back contacts
The rear side of formula barrier-layer cell is abutted with the back of the body insulating barrier of the integrated form backboard；
The preceding encapsulated layer adjacent with the front face side of the back-contact barrier-layer cell；With
The transparent front plate adjacent with the preceding encapsulated layer.
15. back-contact photovoltaic modules according to claim 14, it is characterised in that the back-contact photoproduction volt
It is to be processed through winding by metallizing to play battery（MWT）Barrier-layer cell.
A kind of 16. methods for producing the integrated form backboard for back-contact photovoltaic module, methods described includes following step
Suddenly：
A () provides the substrate with rear side and front face side relative to each other；
B () sets conducting channel in the front face side of the substrate；
C () is stacked in insulating barrier is carried on the back in the conducting channel, wherein the back of the body insulating barrier has multiple from the back of the body insulating barrier
Rear side extend to the back of the body insulating barrier front face side through hole, the through hole is directed at the conducting channel, wherein,
At least filled in each through hole of the multiple through hole at least one conductive component and first electricity bond part so as to
Full of the through hole, at least one conductive component is near the back side neighbouring with the conducting channel of the back of the body insulating barrier
Side, first electricity bonds front face side away from the conducting channel of the part near the back of the body insulating barrier, and described at least one
Individual conductive component and the first electricity bond component shape complementation and the jointly part as combined electrical interconnection member；
D the laminated sandwich construction obtained by step (c) of () hot pressing is to obtain the integrated form backboard.
17. methods for producing the integrated form backboard for back-contact photovoltaic module according to claim 16, its
It is characterised by, at least one of multiple through holes conductive component and conduction described in step (c) and step (d)
Circuit directly contact.
18. methods for producing the integrated form backboard for back-contact photovoltaic module according to claim 16, its
It is characterised by, in step (c), the second electric binding part is further filled in each through hole of the multiple through hole
Part makes it be disposed close to rear side and at least one conductive component shape complementation for carrying on the back insulating barrier and be led with described
Circuit directly contact so that at least one conductive component be placed in it is described first and second electricity bond parts between simultaneously
It is collectively forming the part of the combined electrical interconnection member, and the combined electrical interconnection member described in step (d)
Part is bonded by means of the described second electricity to be adhered in the conducting channel.
A kind of 19. methods for producing back-contact photovoltaic module, the described method comprises the following steps：
A () provides the substrate with rear side and front face side relative to each other；
B () sets conducting channel in the front face side of the substrate；
C () is stacked in insulating barrier is carried on the back in the conducting channel, wherein the back of the body insulating barrier has multiple from the back of the body insulating barrier
Rear side extend to the back of the body insulating barrier front face side through hole, the through hole is directed at the conducting channel, wherein,
At least one conductive component is at least filled in each hole of the multiple through hole and the first electricity bonds part so as to be full of
The through hole, at least one conductive component is close to the rear side neighbouring with the conducting channel of the back of the body insulating barrier,
First electricity bonds front face side away from the conducting channel of the part near the back of the body insulating barrier, and described at least one leads
Electric part and the first electricity bond component shape complementation and the jointly part as combined electrical interconnection member；
D () is by with light-receiving side before relative to each other and rear side and the multiple electric contacts for being formed in the rear side
Back-contact barrier-layer cell is stacked on the back of the body insulating barrier and the first electricity in the multiple through hole is bonded part
With multiple electric contact directly contacts of the back-contact barrier-layer cell rear side；
E be stacked in before described in the back-contact barrier-layer cell preceding encapsulated layer on light-receiving side by ()；
F be stacked in transparent front plate above the preceding encapsulated layer by ()；
G the laminated sandwich construction obtained by step (f) of () hot pressing is to obtain the back-contact photovoltaic module.
The method of 20. production back-contact photovoltaic modules according to claim 19, it is characterised in that in step
At least one of multiple through holes conductive component and conducting channel directly contact described in (c), and in step (g)
First electricity bonds part and is adhered on multiple electric contacts of the back-contact barrier-layer cell rear side.
The method of 21. production back-contact photovoltaic modules according to claim 20, it is characterised in that in step
C in (), further the electricity of filling second bonds part to be disposed close to it described in each hole of the multiple through hole
Carry on the back insulating barrier rear side and at least one conductive component shape it is complementary and with the conducting channel directly contact so that
It is placed at least one conductive component between the first electricity bonding part and the second electricity bonding part and common
The part of the combined electrical interconnection member is formed, and in step (g), second electricity bonds part and is attached
Onto the conducting channel.
A kind of 22. methods for producing back-contact photovoltaic module, the described method comprises the following steps：
A () prepares integrated form backboard using the method as any one of claim 16-18；
B () is by with light-receiving side before relative to each other and rear side and the multiple electric contacts for being formed in the rear side
Back-contact barrier-layer cell is stacked on the integrated form backboard and makes the first electric binding part in the multiple through hole
Multiple electric contact directly contacts of part and the back-contact barrier-layer cell rear side；
C be stacked in before described in the back-contact barrier-layer cell preceding encapsulated layer on light-receiving side by ()；
D be stacked in transparent front plate above the preceding encapsulated layer by ()；
E the laminated sandwich construction obtained by step (d) of () hot pressing is to obtain the back-contact photovoltaic module.
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| JP5273728B2 (en) * | 2009-06-05 | 2013-08-28 | シャープ株式会社 | Solar cell with wiring sheet and solar cell module |
| JP4678698B2 (en) * | 2009-09-15 | 2011-04-27 | シャープ株式会社 | Solar cell module and manufacturing method thereof |
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| CN101874305A (en) * | 2007-09-28 | 2010-10-27 | 夏普株式会社 | Solar battery, method for manufacturing solar battery, method for manufacturing solar battery module, and solar battery module |
| CN203277425U (en) * | 2013-01-25 | 2013-11-06 | 纳幕尔杜邦公司 | Integrated backboard and back-contact photovoltaic module |
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