CN116247129A - Preparation method of non-main grid XBC battery assembly and battery assembly thereof - Google Patents
Preparation method of non-main grid XBC battery assembly and battery assembly thereof Download PDFInfo
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- CN116247129A CN116247129A CN202310406262.7A CN202310406262A CN116247129A CN 116247129 A CN116247129 A CN 116247129A CN 202310406262 A CN202310406262 A CN 202310406262A CN 116247129 A CN116247129 A CN 116247129A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 238000003466 welding Methods 0.000 claims abstract description 120
- 229910000679 solder Inorganic materials 0.000 claims abstract description 96
- 239000000853 adhesive Substances 0.000 claims abstract description 20
- 230000001070 adhesive effect Effects 0.000 claims abstract description 20
- 238000007639 printing Methods 0.000 claims abstract description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 33
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 claims description 23
- 239000002131 composite material Substances 0.000 claims description 21
- 239000011888 foil Substances 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
- 239000011889 copper foil Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000003475 lamination Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 19
- 230000008569 process Effects 0.000 description 13
- 239000002313 adhesive film Substances 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000504 luminescence detection Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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Abstract
The invention relates to the technical field of photovoltaic cells, in particular to a preparation method of a non-main grid XBC battery assembly and the battery assembly thereof, comprising the following steps: printing a solder paste layer on the back of the battery; printing a curing adhesive around the tin paste layer on the back of the battery; prefabricating a welding strip, namely correspondingly placing the welding strip on the solder paste layer, wherein the welding strip is respectively contacted with the solder paste layer and the curing adhesive; fixing the welding strip and the battery through the curing adhesive; and laminating the batteries to form a battery assembly. According to the scheme of the invention, the battery assembly cost can be greatly reduced by combining the XBC battery technology and the main grid-free technology.
Description
Technical Field
The invention relates to the technical field of photovoltaic cells, in particular to a preparation method of a non-main grid XBC battery assembly and the battery assembly.
Background
IBC cells, also known as all back electrode contact crystalline silicon solar cells, were proposed by Schwartz and lamert in 1975. The battery technology with the special structure has the characteristics and advantages that the front surface of the battery is not shielded by the metal electrode, so that the shielding of the metal electrode to sunlight can be completely avoided, and meanwhile, the positive electrode and the negative electrode are arranged on the back surface of the battery.
The IBC battery has excellent process superposition capability, can be organically combined with technologies such as TOPCon, HJT and perovskite, and the like, and further improves the battery conversion efficiency, and the brand new battery superposed by the process is called an XBC battery;
in the traditional technology, the photovoltaic module adopting the XBC technology can select more photovoltaic welding belts to reduce the electrical loss and improve the power generation. Selecting more coarser circular solder strips is a common practice that brings about a significant metallization cost increase compared to conventional components; the welding strip is generally more than or equal to 0.25mm in size, so that a thicker EVA adhesive film is needed to be selected on the back of the welding strip, and the lower scrap rate (more than 400g per square meter gram) in the lamination process can be ensured, so that the cost is higher;
regarding cost reduction, smartWire intelligent grid connection technology (SWCT) uses innovative film-grid electrode and up to 24 precisely arranged grid lines to connect battery pieces, so that silver consumption of HJT assemblies is reduced by more than 50%, but the technology itself needs a layer of adhesive film to be combined with an extremely fine low-temperature circular welding strip, and the added adhesive film can bring certain power generation loss besides directly increasing cost, and besides the relatively fine low-temperature circular welding strip has higher value, the welding point is extremely small, so that the long-time stability of welding of the welding strip also has hidden danger.
Disclosure of Invention
The invention aims to solve at least one technical problem in the background art and provides a preparation method of a main grid-free XBC battery assembly and the battery assembly thereof.
In order to achieve the above object, the preparation method of the no-main-grid XBC battery assembly of the invention comprises the following steps:
printing a solder paste layer on the back of the battery;
printing a curing adhesive around the tin paste layer on the back of the battery;
prefabricating a welding strip, namely correspondingly placing the welding strip on the solder paste layer, wherein the welding strip is respectively contacted with the solder paste layer and the curing adhesive;
fixing the welding strip and the battery through the curing adhesive;
and laminating the batteries to form a battery assembly.
Preferably, the solder paste in the solder paste layer is low-temperature solder paste.
Preferably, the solder strip is made of copper foil or copper aluminum composite foil material.
Preferably, in the prefabricated welding strip, the welding strip is cut into a plurality of welding rods with the same length;
the width of the welding rod ranges from 0.5 mm to 4mm.
Preferably, the welding strip and the battery are fixed by the solidified glue, and the welding strip and the battery are bonded by solidifying the solidified glue through cooling or ultraviolet irradiation.
Preferably, the solder paste layer is soldered to the solder tape during lamination of the battery.
Preferably, the copper-aluminum ratio of the copper-aluminum composite foil ranges from 1:9 to 1:20.
In order to achieve the above object, the present invention also provides a gateless XBC battery assembly including:
a battery string including a plurality of battery cells;
a plurality of first welding strips and a plurality of second welding strips;
the two opposite edge sides of the battery piece are provided with curing glue;
the first welding strip and the second welding strip are welded with the welding pad on the surface of the battery piece;
the first welding strip is arranged in one battery piece, and two ends of the first welding strip are respectively bonded with the curing glue at two edge sides of the battery piece;
the second welding strip is arranged across the battery piece and is adhered to the curing adhesive at the edge of the adjacent battery piece.
Preferably, the first solder strip and the second solder strip are connected with a solder paste layer and a bonding pad on the battery piece, and the solder paste in the solder paste layer is low-temperature solder paste.
Preferably, the first welding strip and the second welding strip are copper foils or copper-aluminum composite foils.
Preferably, the copper-aluminum ratio of the copper-aluminum composite foil ranges from 1:9 to 1:20.
Preferably, the width of the first welding strip and the second welding strip ranges from 0.5 mm to 4mm.
The beneficial effects of the invention are as follows:
1. the copper foil or the copper-aluminum composite foil is adopted to replace the traditional photovoltaic solder strip to manufacture the XBC component, so that the problem of high cost of the solder strip of the XBC component is solved, the cost of the solder strip is reduced by more than half, a large amount of main grid silver paste can be saved by adopting a main grid-free technology, a large amount of battery cost is saved, the thinner copper-aluminum composite foil is selected to enable the EVA thickness at the back to be thinned at the same time, the gram weight per square meter is less than or equal to 300g, the material cost of the component is further reduced, the contact area between the solder strip of the copper foil or the copper-aluminum composite foil and the back of the SBC component is larger, the welding is firmer, and the service life of the finished component is prolonged;
2. the battery assembly has the advantages of convenient preparation of the whole structure, contribution to whole series welding, capability of greatly improving the series welding efficiency of the battery assembly and capability and yield of a production line.
Drawings
Fig. 1 schematically illustrates a flowchart of a method of manufacturing a gateless XBC battery assembly according to one embodiment of the present invention;
FIGS. 2, 3, 4, 5 are exploded views schematically illustrating a fabrication process of a gateless XBC battery assembly in accordance with one embodiment of the present invention;
fig. 6 schematically shows a schematic structure of a non-main grid XBC battery pack according to an embodiment of the present invention.
Detailed Description
The present disclosure will now be discussed with reference to exemplary embodiments, it being understood that the embodiments discussed are merely for the purpose of enabling those of ordinary skill in the art to better understand and thus practice the present disclosure and do not imply any limitation to the scope of the present disclosure.
As used herein, the term "comprising" and variants thereof are to be interpreted as meaning "including but not limited to" open-ended terms. The terms "based on" and "based at least in part on" are to be construed as "at least one embodiment.
In the preparation technology of the battery without the main grid, a battery string with a welding strip adhered and fixed on the surface of a battery piece is replaced by adopting a glue film to weld the welding strip and the battery piece in a high-temperature welding mode, the welding strip is adhered to the front side and the back side of the battery piece, and the glue film is covered and adhered to the outer sides of the front side and the back side welding strip. However, in this way, the solder strip is easily deviated when the adhesive film is heated, so that the solder strip is positioned inaccurately, and the adhesive film is heated and melted to flow between the solder strip and the battery piece, so that the solder strip and the battery piece are supported and separated, insulation is caused, or the solder strip and the battery piece are in virtual connection, and quality detection of the battery string EL (Electro Luminescence, namely electroluminescence, also called electron luminescence detection) is affected. In order to solve the problem, in the related art, the preparation of the battery string is completed by adopting a mode of 'bonding before welding' or 'bonding after welding', wherein the mode of 'bonding before welding' is to bond and fix a welding belt and a diaphragm, and then the bonded assembly and a battery piece are connected and welded; the welding before bonding is to weld and interconnect the welding belt and the battery piece, and then uniformly and pressure bond the front and back sides of the interconnected battery string with a layer of adhesive film.
However, the preparation process adopting the mode of 'welding before bonding' or 'welding before bonding' is complex, and the preparation efficiency of the battery string is reduced.
For this purpose, the present invention proposes the following solution.
Fig. 1 schematically shows a flowchart of a method for preparing a non-main grid XBC battery assembly according to an embodiment of the present invention, specifically including:
step 1, printing a solder paste layer on the back of a battery;
step 2, printing a curing adhesive around the tin paste layer on the back of the battery;
step 3, prefabricating welding strips, namely correspondingly placing the welding strips on the solder paste layer, wherein the welding strips are respectively contacted with the solder paste layer and the curing adhesive;
step 4, fixing the welding strip and the battery through the solidified glue;
and 5, laminating the batteries to form a battery assembly.
Through the steps, the invention sets the solidified glue on the back of the battery, bonds the welding strip and the battery in advance through the solidified glue, ensures that the position of the welding strip cannot be changed, and simultaneously completes bonding of the solder paste layer through lamination, so that the welding strip and the battery are welded.
The used battery is an XBC battery, the XBC battery can select a P-type silicon wafer or an N-type silicon wafer as a substrate silicon wafer, the N-type silicon wafer has the characteristics of long service life of minority carriers, no light attenuation and good weak light performance, and the P-type silicon wafer has advantages at the cost end. The special battery structure gives the XBC battery a leading efficiency advantage. The XBC battery process has a better process upgrading window, can be organically combined with technologies such as TOPCon, HJT, perovskite and the like, and can further improve the conversion efficiency by combining and accumulating.
Further, fig. 2, 3, 4, 5 schematically illustrate an exploded view of a fabrication process of a no-main-grid XBC battery assembly according to an embodiment of the present invention:
in step 1, as shown in fig. 2, a plurality of solder pastes are correspondingly printed according to the positions on the battery pads to form a solder paste layer, so that the melting of the welding copper foil and the grid line of the battery during the lamination process is realized to realize conduction. The solder paste can be further selected according to requirements, such as selecting a common low Wen Xigao with a melting point not higher than 140 ℃, which can have a composition of Sn42Bi58 and a melting point of 138 ℃; similarly, solder pastes having melting points between 140-160 ℃ can be obtained by varying the content of other components in the solder paste, which is equally applicable to the practice of the present invention.
In step 2, as shown in fig. 3, a glue dispensing machine is adopted to dispense glue or a silk screen printing machine is adopted to print curing glue at two ends of the battery, and the curing glue can be ultraviolet curing glue or thermosetting glue; when the operation of dispensing is implemented, the glue of the solidified glue on the battery piece is used for realizing the fixation of the welding strip, and the solidified glue is only at two ends of the battery; the cured glue may be provided in the form of dots, thin lines, prototypes, irregular shapes or irregular curves; for example, when applied with a dot-shaped cured glue, it may be provided in a circular size with a radius of 0.3-1.2 mm; when provided in a linear shape, the solder strips can be arranged along the direction in which the solder strips are to be placed, wherein the width of the solder strips is 0.3-1.2 mm. In the present invention it is preferably provided in the form of a strip, whereby two adhesive areas are obtained.
In step 3, as shown in fig. 4, prefabricating the welding strip, cutting the welding strip into a plurality of welding rods with the same length, correspondingly placing the welding rods in place according to the positions of the solder paste on the solder paste layer, and correspondingly placing the welding rods on the solder paste layer, wherein the welding rods are respectively contacted with the solder paste and the curing adhesive at the moment;
meanwhile, when the welding rod and the solder paste layer are correspondingly placed, the back of the battery can be conveyed to the position above the placed solder strip, so that the bonding pad is fully contacted with the solder strip, as shown in fig. 5.
Wherein, the welding strip is made of copper foil or copper-aluminum composite foil material, and when the welding strip is the copper-aluminum composite foil, the proportion of copper to aluminum is 1:9-1:20; the whole thickness dimension of the welding strip is in the range of 0.05-0.12mm, the width of the welding rod is in the range of 0.5-4mm, the selection of the width of the welding rod needs to consider the resistivity of the bus conductor selected by the generating capacity of the battery to determine the sectional area of the copper foil or the copper-aluminum composite foil, and the dimension with lower resistance loss and lowest conductor cost is selected.
In step 4, according to the selection of the curing adhesive, different processes are performed to finish the bonding of the battery and the welding strip. When the battery is selected as the thermosetting adhesive, the bonding between the battery and the welding strip is completed through a heating process; when the ultraviolet curing adhesive is selected, the bonding between the battery replacement and the welding strip is completed through an ultraviolet irradiation process.
In step 5, the bus tape is welded and laminated according to the traditional technology to manufacture the final non-main grid XBC battery assembly, and when packaging is carried out, the low-fluidity adhesive film is selected as the packaging adhesive film at the back of the battery, so that the cost of the whole battery assembly can be further reduced. The activation of the solder paste layer may be performed during the printing of the solder paste layer or before the lamination process.
According to the method, the copper foil or the copper-aluminum composite foil material is used for replacing the traditional photovoltaic solder strip to manufacture the XBC battery assembly, so that the problem of large solder strip usage amount and high cost of the XBC battery assembly is solved, and the solder strip cost can be reduced by more than half; the adoption of the technology without the main grid can save a large amount of main grid silver paste, thereby further saving the cost of the battery; the thinner copper foil or copper-aluminum composite foil is selected to enable the thickness of EVA at the back to be thinned simultaneously when the battery is packaged and laminated, the gram weight per square meter is less than or equal to 300g, the material cost of the battery component is further reduced, the copper foil or copper-aluminum composite foil is used to enable the back contact area with the XBC component to be larger, welding is more firm, and the service life of a finished product is effectively guaranteed.
In order to achieve the above objective, the present invention further provides a non-main grid XBC battery assembly, please refer to fig. 6, which includes:
a battery string 10 including a plurality of battery pieces 101;
a solder paste layer 20 disposed on a surface of each of the pads of the battery chip 101;
the curing glue 30 and the solder paste layer 20 are positioned on the same surface of the battery piece 101 and are positioned on two opposite edge sides of the battery piece 101;
the solder strip 40 is positioned on one side of the solder paste layer 20 away from the battery piece 101, and is welded with the solder paste layer 20 and bonded with the curing adhesive 30;
the plurality of battery cells 101 are connected by a plurality of solder strips 40 across the battery cells to form a battery string 10.
Further, a plurality of solder pastes are correspondingly printed on the battery piece 101 according to the main grid pad patterns to form a solder paste layer 20, the solder paste is set to be low Wen Xigao, and the solder paste needs to be heated and activated after being printed so as to be in an activated state when being connected with the solder strips 40.
The battery piece 101 is a battery piece without a main grid, a bonding pad arranged on the battery piece 101 and the welding strip 40 are bonded through soldering paste and curing glue 30 to form mechanical connection, so that the welding strip is fixed on the battery piece, and the mode can realize mechanical connection among a plurality of battery pieces while ensuring the conductive function of the solar cell module. In addition, this way saves the manufacturing cost of the battery assembly and further reduces the number of battery assemblies.
The welding strip 40 is composed of a plurality of welding rods, and comprises two different welding rods, namely a first welding strip positioned in one cell 101 and a second welding strip arranged across the cell, wherein the welding strip 40 is made of copper foil or copper-aluminum composite foil, and the thickness of the welding strip 40 is in the range of 0.05-0.12mm; the welding strip 40 is cut to form a plurality of welding rods with the same length and the same size, the width range of the welding rods is 0.5-4mm, the sectional area of the copper foil or the copper-aluminum composite foil is determined by considering the resistivity of the bus conductor selected according to the generated energy of the battery in the selection of the width of the welding rods, and the scheme with lower resistance loss and lowest conductor cost is selected. The first welding strips are arranged in the same battery piece, and two ends of the first welding strips are respectively bonded with two bonding areas in the battery piece; the second welding strip is arranged across the battery piece and is adhered to an adhesion area at the joint edge of the adjacent battery piece.
When the solder strip 40 is made of a copper-aluminum composite foil material, the copper-aluminum ratio is in the range of 1:9-1:20.
In some embodiments of the invention, the first and second solder strips have a width in the range of 0.5-4mm.
When the solder strip 40 is placed on the solder paste layer 20, a plurality of solder wires need to be staggered, so that the solder wires can represent positive and negative electrodes; the length of the welding rod is longer than the width of the battery piece 101, so that one end of the welding rod can be positioned on the battery piece 101, and the other end of the welding rod extends out of the battery piece 101 and is connected with the other battery piece 101; because the welding rods are arranged in a staggered manner, one welding rod extending towards the other end is arranged between every two welding rods extending towards one end of the battery piece 101 in the same direction, so that two sides of the battery piece 101 can be connected with other battery pieces 101 through the welding rods, and a battery string 10 is formed.
The curing glue 30 is obtained by printing, dispensing or coating a thermosetting glue or an ultraviolet curing glue, the curing glue 30 is coated around the solder paste layer 20 of the battery piece 101 in a dispensing or screen printing manner by a dispensing machine, the curing glue 30 needs to be arranged at an angle, preferably vertically, with respect to the solder strips 40, and at this time, the first solder strip and the second solder strip are arranged vertically with respect to the curing glue 30. Since the solder strip 40 is composed of a plurality of solder rods, when the solder strip 40 is vertically arranged with the curing glue 30, the plurality of solder rods are in contact with the curing glue 30 and the solder paste layer 20, and the curing glue is solidified by cooling or ultraviolet irradiation, so that the battery piece 101 and the solder strip 40 are completely bonded. The width of the cured adhesive 30 is 0.5-3mm, and the width can be further increased
After the battery piece 101 is arranged, packaging and lamination are carried out by adopting a traditional technology, packaging of the back of the battery is carried out by adopting a low-fluidity adhesive film, and the welding strip 40 and the solder paste are mutually extruded by adopting the lamination technology, so that the welding of the welding strip 40 and the battery piece 101 is realized.
Through the scheme, the structure of the invention combines the IBC battery technology and the main grid-free technology, so that the single side of the battery has no shading loss, the main grid silver paste is greatly saved, the overall cost is reduced, the copper foil or the copper-aluminum composite foil is used for replacing the traditional photovoltaic welding strip, the problem of high cost of the welding strip in the traditional technology is solved, and simultaneously, the use of the copper foil or the copper-aluminum composite foil allows the thickness of the back EVA to be thinned, so that the gram weight per square meter is less than or equal to 300g, and the material cost of the component is further reduced; the whole structure is simple, the whole series welding is facilitated, the series welding efficiency of the photovoltaic module can be greatly improved, and the productivity and the yield of the production line are improved.
The foregoing description is only of the preferred embodiments of the present application and is presented as a description of the principles of the technology being utilized. It will be appreciated by persons skilled in the art that the scope of the invention referred to in this application is not limited to the specific combinations of features described above, but it is intended to cover other embodiments in which any combination of features described above or equivalents thereof is possible without departing from the spirit of the invention. Such as the above-described features and technical features having similar functions (but not limited to) disclosed in the present application are replaced with each other.
It should be understood that, the sequence numbers of the steps in the summary and the embodiments of the present invention do not necessarily mean the order of execution, and the execution order of the processes should be determined by the functions and the internal logic, and should not be construed as limiting the implementation process of the embodiments of the present invention.
Claims (10)
1. The preparation method of the no-main-grid XBC battery assembly is characterized by comprising the following steps:
printing a solder paste layer on the back of the battery;
printing a curing adhesive around the tin paste layer on the back of the battery;
prefabricating a welding strip, namely correspondingly placing the welding strip on the solder paste layer, wherein the welding strip is respectively contacted with the solder paste layer and the curing adhesive;
fixing the welding strip and the battery through the curing adhesive;
and laminating the batteries to form a battery assembly.
2. The method for manufacturing a no-main-grid XBC battery assembly of claim 1 where the solder paste in the solder paste layer is a low temperature solder paste.
3. The method for manufacturing a no-main-grid XBC battery assembly of claim 1 where the solder strip is made of copper foil or copper-aluminum composite foil material.
4. A method of manufacturing a no-main-grid XBC battery assembly according to claim 3 where the welding strip includes a plurality of welding rods of equal length and where the welding rods have a width in the range of 0.5-4mm.
5. The method of manufacturing a gridless XBC battery assembly of claim 1 where the cured paste is cured by cooling or uv radiation to bond the solder strip to the battery.
6. The method of claim 1, wherein the solder paste layer is soldered to the solder strip during lamination of the battery.
7. A method of manufacturing a gateless XBC battery assembly according to claim 3 where the copper to aluminum ratio of the copper to aluminum composite foil is in the range of 1:9 to 1:20.
8. A gateless XBC battery assembly comprising:
a battery string including a plurality of battery cells;
a plurality of first welding strips and a plurality of second welding strips;
the two opposite edge sides of the battery piece are provided with curing glue;
the first welding strip and the second welding strip are welded with the welding pad on the surface of the battery piece;
the first welding strip is arranged in one battery piece, and two ends of the first welding strip are respectively bonded with the curing glue at two edge sides of the battery piece;
the second welding strip is arranged across the battery piece and is adhered to the curing adhesive at the edge of the adjacent battery piece.
9. The backless XBC battery of claim 8, wherein the first and second solder strips are connected to pads on the battery cells by a solder paste layer, and the solder paste in the solder paste layer is a low temperature solder paste.
10. The no-main grid XBC battery assembly of claim 9 where the first and second solder strips are copper foil or copper aluminum composite foil.
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| CN202310406262.7A CN116247129A (en) | 2023-04-17 | 2023-04-17 | Preparation method of non-main grid XBC battery assembly and battery assembly thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117374165A (en) * | 2023-12-04 | 2024-01-09 | 正泰新能科技股份有限公司 | Preparation method of photovoltaic module without main grid, photovoltaic cell without main grid and module |
| CN117766624A (en) * | 2023-12-18 | 2024-03-26 | 江苏悦阳光伏科技有限公司 | Preparation process and preparation device of main-grid-free photovoltaic module |
-
2023
- 2023-04-17 CN CN202310406262.7A patent/CN116247129A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117374165A (en) * | 2023-12-04 | 2024-01-09 | 正泰新能科技股份有限公司 | Preparation method of photovoltaic module without main grid, photovoltaic cell without main grid and module |
| CN117766624A (en) * | 2023-12-18 | 2024-03-26 | 江苏悦阳光伏科技有限公司 | Preparation process and preparation device of main-grid-free photovoltaic module |
| CN117766624B (en) * | 2023-12-18 | 2024-06-11 | 江苏悦阳光伏科技有限公司 | Preparation process and preparation device of main-grid-free photovoltaic module |
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