CN103972315A - Integrated back plate and back contact type photovoltaic module and production method thereof - Google Patents
Integrated back plate and back contact type photovoltaic module and production method thereof Download PDFInfo
- Publication number
- CN103972315A CN103972315A CN201310028183.3A CN201310028183A CN103972315A CN 103972315 A CN103972315 A CN 103972315A CN 201310028183 A CN201310028183 A CN 201310028183A CN 103972315 A CN103972315 A CN 103972315A
- Authority
- CN
- China
- Prior art keywords
- photovoltaic module
- contact
- integrated form
- insulating barrier
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 40
- 239000011230 binding agent Substances 0.000 claims abstract description 17
- 230000004888 barrier function Effects 0.000 claims description 74
- 230000005611 electricity Effects 0.000 claims description 67
- 239000000758 substrate Substances 0.000 claims description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 31
- 229910052802 copper Inorganic materials 0.000 claims description 25
- 239000010949 copper Substances 0.000 claims description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 239000011135 tin Substances 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 14
- 229910052718 tin Inorganic materials 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 11
- 239000004411 aluminium Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- 239000010937 tungsten Substances 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 5
- 239000002322 conducting polymer Substances 0.000 claims description 5
- 229920001940 conductive polymer Polymers 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 230000001186 cumulative effect Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000011133 lead Substances 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 128
- 238000000034 method Methods 0.000 description 37
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 31
- 239000005038 ethylene vinyl acetate Substances 0.000 description 30
- 238000010276 construction Methods 0.000 description 17
- 229920001577 copolymer Polymers 0.000 description 14
- 238000007731 hot pressing Methods 0.000 description 14
- 239000011521 glass Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- 229920000554 ionomer Polymers 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 7
- 238000003475 lamination Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000007334 copolymerization reaction Methods 0.000 description 5
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- 229920002620 polyvinyl fluoride Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000004087 circulation Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 150000007942 carboxylates Chemical class 0.000 description 2
- 150000001733 carboxylic acid esters Chemical class 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 150000001261 hydroxy acids Chemical group 0.000 description 2
- 125000003010 ionic group Chemical group 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- CBECDWUDYQOTSW-UHFFFAOYSA-N 2-ethylbut-3-enal Chemical compound CCC(C=C)C=O CBECDWUDYQOTSW-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229920003313 Bynel® Polymers 0.000 description 1
- 229920003345 Elvax® Polymers 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 101000817240 Mus musculus Eosinophil cationic protein 1 Proteins 0.000 description 1
- 101000879966 Mus musculus Eosinophil cationic protein 2 Proteins 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 229920003298 Nucrel® Polymers 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002998 adhesive polymer Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- QYMGIIIPAFAFRX-UHFFFAOYSA-N butyl prop-2-enoate;ethene Chemical compound C=C.CCCCOC(=O)C=C QYMGIIIPAFAFRX-UHFFFAOYSA-N 0.000 description 1
- 230000021523 carboxylation Effects 0.000 description 1
- 238000006473 carboxylation reaction Methods 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920006228 ethylene acrylate copolymer Polymers 0.000 description 1
- 229920006245 ethylene-butyl acrylate Polymers 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- JTHNLKXLWOXOQK-UHFFFAOYSA-N n-propyl vinyl ketone Natural products CCCC(=O)C=C JTHNLKXLWOXOQK-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to an integrated back plate for a back contact type photovoltaic module and provides the back contact type photovoltaic module with the integrated back plate and a production method of the back contact type photovoltaic module. The integrated back plate for the back contact type photovoltaic module comprises a combined type electrical interconnection component for providing electric connection between a back contact type photovoltaic battery and a conductive circuit in the integrated back plate. The technology is urgently needed by manufacturers producing back contact type photovoltaic modules. Efficiency and durability of the back contact type photovoltaic module can be improved, the using quantity of conductive binding agents can be saved greatly, and accordingly manufacturing cost is reduced to a great extent.
Description
Technical field
The present invention relates to a kind of for the integrated form backboard of back-contact photovoltaic module, back-contact photovoltaic module and the production method thereof that comprises this integrated form backboard.Specifically, the present invention relates to a kind of integrated form backboard for back-contact photovoltaic module that comprises combined electrical interconnection member and production method thereof, a kind of back-contact photovoltaic module and production method thereof that comprises combined electrical interconnection member.
Background technology
Because photovoltage (or solar energy) battery can provide sustainable energy, therefore its scope of application expands rapidly.Business-like conventional silicon solar cell, emitter region and emitter region electrode are all positioned at before battery.
In the time manufacturing conventional photovoltaic module, in order to make it reach the weatherability of at least 20 years, conventionally barrier-layer cell is clipped in or is laminated between polymer encapsulated layer, and utilize header board and backboard further by the isolation of barrier-layer cell and environment, and provide mechanical support for module.Therefore, header board and backboard are also referred to as external protection plate.
In general, in the photovoltaic module being derived from based on crystalline silicon battery plate, according to from the back side (non-towards sunny side) to above the sequence of positions of (towards sunny side), it has the laminar structure that comprises following part: (1) backboard, (2) back of the body encapsulated layer, (3) barrier-layer cell, (4) front encapsulated layer, and (5) header board.
In the photovoltaic module with this structure, importantly, the material towards sunny side (being for example glass plate of header board and front encapsulated layer) that is arranged at back-contact barrier-layer cell has higher light transmission rate, to allow enough daylight to arrive barrier-layer cell.
Encapsulated layer (encapsulated layer and back of the body encapsulated layer) is made up of polymeric material conventionally, such as acid copolymer, ionomer, ethylene-vinyl acetate copolymer (EVA), poly-(vinyl acetal) (as gathered (vinyl butyral) (PVB)), polyurethane, poly-(vinyl chloride), polyethylene (as LLDPE), polyolefin block copolymer elastomer, alpha-olefin and α, β-ethylenically-unsaturated carboxylic acid ester's copolymer (as ethylene methyl acrylate copolymer and ethylene butyl acrylate copolymer), silicone elastomer, epoxy resin, and two or more combination in these polymeric materials.In these materials, EVA is the most popular selection of barrier-layer cell encapsulated layer material always.Front encapsulated layer can be by one or more layers polymeric material laminating molding, and back of the body encapsulated layer also can be by one or more layers polymeric material laminating molding.
The emitter region electrode of business-like conventional silicon barrier-layer cell is positioned at the collection efficiency that is conducive to improve charge carrier before battery.But this kind of structure has its limitation: although electrode area occupied is very little, can still can stop part sunlight, barrier-layer cell effective area of shining light is reduced; When component package, need to be with being coated with the back side that is above welded to another piece battery of tin band from a battery, this connected mode strengthens the difficulty of automated production.For this reason, the electrode that researcher's handle is positioned at before battery is transferred to cell backside, develops the back-contact barrier-layer cell that many structures are different.Back-contact barrier-layer cell refers to all or part of a kind of barrier-layer cell that is positioned at cell backside of the emitter region electrode of battery.Back-contact battery, with its unique device architecture, simple manufacturing process and higher battery efficiency, enjoys the concern in photovoltaic market.Back-contact battery has many good qualities: 1. efficiency is high.Owing to reducing or having eliminated the shading loss of gate line electrode above completely, thereby improve battery efficiency.2. suitable automatic assembling is produced.Adopt brand-new component package pattern to carry out coplanar connection, both reduced the interval between cell piece, improved packaging density, simplified again manufacture craft, reduced encapsulation difficulty.3. more attractive in appearance.The homogeneous, attractive in appearance above of back-contact barrier-layer cell, has met consumer's esthetic requirement.
And in back-contact barrier-layer cell, because electrode before battery is transferred to cell backside, the silver of light-receiving side slurry coverage has reduced before battery, thereby improve the efficiency of back-contact barrier-layer cell.
At present, the production technology of back-contact photovoltaic module extremely complexity and cost very high.For back-contact photovoltaic module, prior art is generally adopted the electrode connecting in two ways above back-contact barrier-layer cell and is arranged on backboard (or substrate) conducting channel above, the power producing in order to draw back-contact barrier-layer cell.
First kind of way is to fill EVA with electroconductive binder and carry on the back the through hole in encapsulated layer and/or back of the body insulating barrier.The shortcoming of this connected mode is: need to use a large amount of electroconductive binders.As a rule, in electroconductive binder, include a large amount of silver-colored particles, with high costs, thus cause manufacturing cost significantly to rise.Fig. 1 is the decomposing schematic representation of the laminar structure of the back-contact photovoltaic module of prior art.Fig. 2 is the cross-sectional schematic of the back-contact photovoltaic module of prior art, at length shows for the electrical interconnection being electrically connected member is provided between the electric contact on the described rear side of described back-contact barrier-layer cell and conducting channel in Fig. 2.From Fig. 1 and Fig. 2, can see: back-contact photovoltaic module 1000 along from the back side (non-towards sunny side) to above, the direction order of (towards sunny side) comprises following layer: backboard (or substrate) 1010, be arranged on conducting channel 1011, back of the body insulating barrier (or back of the body encapsulated layer) 1020, back-contact barrier-layer cell 1030, front encapsulated layer 1040 and header board 1050 backboard.As shown in Figure 2, above the rear side of back-contact barrier-layer cell 1030, there are multiple electric contacts 1031, it aligns with the multiple through holes 1021 on back side insulating barrier 1020, on back-contact barrier-layer cell 1030, also have multiple guiding electrode holes 1032 that extend to rear side from front face side, it aligns with the rear side upper part electric contact 1031 of back-contact barrier-layer cell 1030.The electrical interconnection member (being electroconductive binder) 1022 that is arranged on being electrically connected between electric contact 1031 in the rear side of back-contact barrier-layer cell 1030 and conducting channel 1011 and is by being filled in the multiple through holes 1021 on back side insulating barrier 1020 provides.For the production of back-contact photovoltaic module, the consumption of electroconductive binder conventionally can be very large.
The second way is, interconnecting strip is welded direct on the electrode at the back-contact barrier-layer cell back side and interconnecting strip is used as back side circuit simultaneously.Although this connected mode cost is lower, the production efficiency of module is lower.And high-temperature soldering can introduce higher thermal stress on back-contact barrier-layer cell, thereby cause battery breakage rate higher.Owing to there is specific both positive and negative polarity counter structure between interconnecting strip circuit and back-contact barrier-layer cell, therefore also need to solve the electric insulation problem between back-contact barrier-layer cell and interconnecting strip.
Therefore, for the manufacturer of back-contact photovoltaic module, can either further improve battery efficiency in the urgent need to one, the use that simultaneously can save again electroconductive binder, has the cost-benefit integrated form backboard for back-contact photovoltaic module, comprises back-contact photovoltaic module and the production method thereof of above-mentioned integrated form backboard.
Summary of the invention
The present invention for electric contact above the rear side of back-contact barrier-layer cell and the combined electrical interconnection member being electrically connected between conducting channel are provided, has successfully solved the above-mentioned problems in the prior art by a kind of.
By applied metal conductive component Substitute For Partial electroconductive binder in described combined electrical interconnection member, improve electrical efficiency between back-contact barrier-layer cell and conducting channel, thereby improved the photoelectric conversion efficiency of back-contact photovoltaic module.In addition, in back-contact photovoltaic module, apply this combined electrical interconnection member, can also reduce manufacturing cost.
Particularly, the present invention relates to the content of following many aspects:
1. for an integrated form backboard for back-contact photovoltaic module, described integrated form backboard is along comprising from the back side to direction order above:
There is the substrate of rear side respect to one another and front face side;
Be arranged on the conducting channel in the described front face side of described substrate;
The back of the body insulating barrier adjacent with described conducting channel, described back of the body insulating barrier has the rear side adjacent with described conducting channel and the front face side away from described conducting channel, and described back of the body insulating barrier has multiple rear side from described back of the body insulating barrier and extends to the through hole of the front face side of described back of the body insulating barrier, and described through hole aligns with described conducting channel;
Wherein, each through hole in described multiple through hole type electrical interconnection member that is combined is full of, described combined electrical interconnection member comprises the first electricity bonding parts and at least one conductive component with described the first electricity bonding parts shape complementarity, and for the position with respect to described at least one conductive component in described through hole, described the first conduction bonding parts are near the front face side of described back of the body insulating barrier;
In the time using described integrated form backboard to produce back-contact photovoltaic module, the first electricity bonding parts of described combined electrical interconnection member are adhered on the electric contact above the rear side of back-contact barrier-layer cell.
2. according to the integrated form backboard described in aspect 1, it is characterized in that, described at least one conductive component is made up of one or more metal materials.
3. according to the integrated form backboard described in aspect 2, it is characterized in that, described one or more metal materials are selected from the material group that comprises copper, aluminium, tungsten, tin, nickel, titanium, silver-plated copper, nickel-clad copper, tin-coated copper, zinc-plated aluminium, gold-plated nickel, stainless steel and their alloy and combination.
4. according to the integrated form backboard described in aspect 3, it is characterized in that, described at least one conductive component is one or more the form comprising in sheet, piece, net and combination thereof.
5. according to the integrated form backboard described in aspect 1, it is characterized in that, in described combined electrical interconnection member, described at least one conductive component accounts for the 3-95 % of described combined electrical interconnection member cumulative volume.
6. according to the integrated form backboard described in aspect 1, it is characterized in that, described the first electricity bonding parts are by comprising at least 5%(volumn concentration) the electric conducting material of macromolecular material make.
7. according to the integrated form backboard described in aspect 6, it is characterized in that, described the first electricity bonding parts are made up of conducting polymer composite.
8. according to the integrated form backboard described in aspect 6, it is characterized in that, described the first electricity bonding parts are made up of electroconductive binder, and described electroconductive binder comprises macromolecular material and disperses conducting particles wherein.
9. according to the integrated form backboard described in aspect 7, it is characterized in that, described conducting particles is selected from the group that comprises gold, silver, nickel, copper, aluminium, tin, zinc, titanium, tin, bismuth, tungsten, lead and alloy thereof.
10. according to the integrated form backboard described in any one in aspect 1-9, it is characterized in that, described at least one conductive component is directly adhered in described conducting channel.
11. according to the integrated form backboard described in any one in aspect 1-9, it is characterized in that, described combined electrical interconnection member further comprises the second electricity bonding parts, for position with respect to described at least one conductive component in described through hole, described the second electricity bonding parts are near the rear side of described back of the body insulating barrier and be adhered in described conducting channel, and described second electricity bonding parts and described at least one conductive component shape complementarity.
12. according to the integrated form backboard described in aspect 11, it is characterized in that, described the second electricity bonding parts are made up of electroconductive binder, conducting polymer composite or scolder.
13. according to the integrated form backboard described in aspect 1, it is characterized in that, described back of the body insulating barrier is made by comprising ethylene-vinyl acetate copolymer (EVA), ionomer (ionomer) or poly-(vinyl butyral) polymer composition (PVB).
14. 1 kinds of back-contact photovoltaic modules, described back-contact photovoltaic module is along comprising from the back side to direction order above:
According to the integrated form backboard described in any one in aspect 1-13;
Back-contact barrier-layer cell, described back-contact barrier-layer cell has light-receiving side and rear side above respect to one another, and multiple electric contacts are formed in above the described rear side of described back-contact barrier-layer cell, the back of the body insulating barrier adjacency of the described rear side of described back-contact barrier-layer cell and described integrated form backboard;
The front encapsulated layer adjacent with the described front face side of described back-contact barrier-layer cell; With
The transparent front plate adjacent with described front encapsulated layer.
15. according to the back-contact photovoltaic module described in aspect 14, it is characterized in that, described back-contact barrier-layer cell is for running through and be wound around the barrier-layer cell of processing (MWT) through metallization.
16. 1 kinds of productions are used for the method for the integrated form backboard of back-contact photovoltaic module, said method comprising the steps of:
(a) provide the substrate with rear side respect to one another and front face side;
(b) in the described front face side of described substrate, conducting channel is set;
(c) back of the body insulating barrier is stacked in described conducting channel, wherein said back of the body insulating barrier has multiple rear side from described back of the body insulating barrier and extends to the through hole of the front face side of described back of the body insulating barrier, make described through hole aim at described conducting channel, wherein, in each through hole of described multiple through holes, fill at least one conductive component and thereby the first electricity bonding parts are full of described through hole, described at least one conductive component is near the rear side contiguous with described conducting channel of described back of the body insulating barrier, described the first electricity bonding parts are near the front face side away from described conducting channel of described back of the body insulating barrier, and described at least one conductive component and the first electricity bonding parts shape complementarity also become the part of combined electrical interconnection member jointly,
(d) the laminated sandwich construction being obtained by step (c) of hot pressing is to obtain described integrated form backboard.
17. according to the production described in aspect 16 method for the integrated form backboard of back-contact photovoltaic module, it is characterized in that, directly contact with described conducting channel with at least one conductive component in multiple through holes described in step (d) in step (c).
18. according to the production described in aspect 16 method for the integrated form backboard of back-contact photovoltaic module, it is characterized in that, in step (c), in each through hole of described multiple through holes, further filling the second electricity bonding parts makes it be placed in the rear side near described back of the body insulating barrier, with described at least one conductive component shape complementarity and directly contact with described conducting channel, thereby make described at least one conductive component be placed between described the first and second electricity bonding parts and the common part that forms described combined electrical interconnection member, and be adhered in described conducting channel by means of described the second electricity bonding parts at combined electrical interconnection member described in step (d).
Produce the method for back-contact photovoltaic module, said method comprising the steps of for 19. 1 kinds:
(a) provide the substrate with rear side respect to one another and front face side;
(b) in the described front face side of described substrate, conducting channel is set;
(c) back of the body insulating barrier is stacked in described conducting channel, wherein said back of the body insulating barrier has multiple rear side from described back of the body insulating barrier and extends to the through hole of the front face side of described back of the body insulating barrier, make described through hole aim at described conducting channel, wherein, in each hole of described multiple through holes, at least fill at least one conductive component and thereby the first electricity bonding parts are full of described through hole, described at least one conductive component is near the rear side contiguous with described conducting channel of described back of the body insulating barrier, described the first electricity bonding parts are near the front face side away from described conducting channel of described back of the body insulating barrier, and described at least one conductive component and the first electricity bonding parts shape complementarity also become the part of combined electrical interconnection member jointly,
(d) be stacked on described back of the body insulating barrier and the electricity of first in described multiple through hole bonding parts are directly contacted with multiple electric contacts of described back-contact barrier-layer cell rear side with the back-contact barrier-layer cell of the multiple electric contacts that are formed in described rear side with rear side thering is light-receiving side above respect to one another;
(e) front encapsulated layer is stacked in the described light-receiving side above of described back-contact barrier-layer cell;
(f) transparent front plate is stacked in above described front encapsulated layer;
(g) the laminated sandwich construction being obtained by step (f) of hot pressing is to obtain described back-contact photovoltaic module.
20. according to the method for the production back-contact photovoltaic module described in aspect 19, it is characterized in that, at least one conductive component in multiple through holes described in step (c) directly contacts with described conducting channel, and is adhered on multiple electric contacts of described back-contact barrier-layer cell rear side at described the first electricity bonding parts of step (g).
21. according to the method for the production back-contact photovoltaic module described in aspect 20, it is characterized in that, in step (c), in each hole of described multiple through holes, further filling the second electricity bonding parts makes it be placed in the rear side near described back of the body insulating barrier, with described at least one conductive component shape complementarity and directly contact with described conducting channel, thereby make described at least one conductive component be placed between described the first electricity bonding parts and described the second electricity bonding parts and the common part that forms described combined electrical interconnection member, and in step (g), described the second electricity bonding parts are adhered in described conducting channel.
Produce the method for back-contact photovoltaic module, said method comprising the steps of for 22. 1 kinds:
(a) adopt the method as described in any one in aspect 16-18 to prepare integrated form backboard;
(b) be stacked on described integrated form backboard and the electricity of first in described multiple through hole bonding parts are directly contacted with multiple electric contacts of described back-contact barrier-layer cell rear side with the back-contact barrier-layer cell of the multiple electric contacts that are formed in described rear side with rear side thering is light-receiving side above respect to one another;
(c) front encapsulated layer is stacked in the described light-receiving side above of described back-contact barrier-layer cell;
(d) transparent front plate is stacked in above described front encapsulated layer;
(e) the laminated sandwich construction being obtained by step (d) of hot pressing is to obtain described back-contact photovoltaic module.
The present invention has following beneficial effect especially:
Technology of the present invention for the manufacturer of back-contact photovoltaic module in the urgent need to.The present invention can either improve usefulness and the durability of back-contact photovoltaic module, can greatly save again the consumption of electroconductive binder, has significantly reduced manufacturing cost and has had considerable cost benefit simultaneously.
Characterize advantage of the present invention and novel feature specifically indicates in being attached to herein and forming a part of claims of this paper.But, for the target of understanding better the present invention, its advantage and reaching by its application, should be with reference to the item of the descriptive nature that forms the accompanying drawing of another part herein and enclose, its illustrated and described one or more preferred embodiment of the present invention.
Brief description of the drawings
Describe the present invention below in conjunction with Figure of description.Figure of description might not be draw in strict accordance with ratio and Figure of description be only schematic diagram.In the application's Figure of description, use same or analogous drawing reference numeral to represent same or analogous element.
Fig. 1 is the decomposing schematic representation of the laminar structure of the back-contact photovoltaic module of prior art;
Fig. 2 is the cross-sectional schematic of the back-contact photovoltaic module of prior art, at length shows for the electrical interconnection being electrically connected member is provided between the electric contact on the described rear side of described back-contact barrier-layer cell and described conducting channel in this figure;
Fig. 3 is the generalized section that comprises the back-contact photovoltaic module of the first embodiment of combined electrical interconnection member of the present invention;
Fig. 4 is the generalized section that comprises the back-contact photovoltaic module of the second embodiment of combined electrical interconnection member of the present invention; With
Fig. 5 a-5e is the schematic flow sheet of the production method of the back-contact photovoltaic module shown in Fig. 4.
Parts and reference numerals list
| 1000 | Back-contact photovoltaic module |
| 1010 | Substrate |
| 1011 | Conducting channel |
| 1020 | Back of the body insulating barrier |
| 1021 | Through hole |
| 1022 | Electrical interconnection member |
| 1030 | Back-contact barrier-layer cell |
| 1031 | Electric contact |
| 1032 | Guiding electrode hole |
| 1040 | Front encapsulated layer |
| 1050 | Header board |
| 2000 | Back-contact photovoltaic module |
| 2010 | Substrate |
| 2011 | Conducting channel |
| 2020 | Back of the body insulating barrier |
| 2021 | Through hole |
| 2022 | Electrical interconnection member |
| 2022a | The first electricity bonding parts |
| 2022b | Conductive component |
| 2030 | Back-contact barrier-layer cell |
| 2031 | Electric contact |
| 2040 | Front encapsulated layer |
| 2050 | Header board |
| 3000 | Back-contact photovoltaic module |
| 3010 | Substrate |
| 3011 | Conducting channel |
| 3020 | Back of the body insulating barrier |
| 3021 | Through hole |
| 3022 | Electrical interconnection member |
| 3022a | The first electricity bonding parts |
| 3022b | Conductive component |
| 3022c | The second electricity bonding parts |
| 3030 | Back-contact barrier-layer cell |
| 3031 | Electric contact |
| 3040 | Front encapsulated layer |
| 3050 | Header board |
| 3000a | Back-contact photovoltaic module assembly (with the substrate of conducting channel) in the first production stage |
| 3000b | Back-contact photovoltaic module assembly in the second production stage |
| 3000c | Back-contact photovoltaic module assembly (integrated form backboard) in the 3rd production stage |
| 3000d | Back-contact photovoltaic module assembly in the 4th production stage |
| 3000e | Back-contact photovoltaic module assembly in the 5th production stage |
Embodiment
Unless special circumstances have other restrictions, otherwise the term that following definition is applicable to use in this specification.
In addition, unless otherwise defined, otherwise the implication of all scientific and technical terminologies used herein is the same with the common understanding of those skilled in the art in the invention.If conflict occurs, be as the criterion with this specification and the definition that comprises thereof.
Although all can be used for practice of the present invention or inspection with methods described herein and materials similar or the method being equal to and material, suitable method and material for as described herein those.
Some terms that use in the application are defined as follows:
As used herein, directional terminology " on ", D score is consistent with the concrete direction on Figure of description paper.
As used herein, directional terminology " above ", " back side ", " front face side ", " rear side " are consistent with the usual call to back-contact photovoltaic module in the art.
As used herein, term " about " is that exponential quantity, size, formula, parameter and other quantity and characteristic are coarse and need not be accurate value, but can be similar to and/or be greater than or less than exact value with exact value, so that reflection allowable deviation, conversion factor, the numerical value revision of the convention, measure error etc., and known other factors of those skilled in the art.In general, quantity, size, formula, parameter or other amounts or characteristic are " approximately " or " approximate ", no matter whether carry out this type of and clearly explain.
In addition, scope as herein described comprises their end points, unless clearly stated in few situation.In addition, in the time that a quantity, concentration or other numerical value or parameter provide with the tabular form of scope, one or more preferable range or preferred upper limit numerical value and preferred lower limit numerical value, it is interpreted as disclosing particularly any a pair of the formed all scopes by any range limit or preferred value and any scope lower limit or preferred value, and no matter whether this type of scope is disclosed individually.
In addition, in the time enumerating number range, this scope is intended to comprise its end points and all integers and mark within the scope of this, unless indicated other under concrete condition herein.In the time of a scope of definition, be not intended to circumscription of the present invention in cited occurrence.Finally, in the time that term " about " is used for describing the end points of numerical value or scope, content of the present disclosure should be understood to include this concrete numerical value or related end points.
When herein in the time describing material, method or plant equipment during with the word of " those skilled in the art is known " phrase or synonym or phrase, this term represents that described material, method and plant equipment are conventional in the time submitting present patent application to, and is included in this explanation.Be covered by equally in this description, at present not conventional still will become art-recognized material, method and machinery in the time being applicable to similar object.
As used herein, term " comprises ", " containing ", " comprising ", " containing ", " being characterised in that ", " having " or any other synonym or their any other distortion all refer to comprising of nonexcludability.For example, comprise that technique, method, goods or the equipment of specific factor list needn't only limit to the key element that those are specifically listed, but can comprise the key element that other are not clearly listed, or the intrinsic key element of this type of technique, method, goods or equipment.
Transition phrase " substantially by ... composition " is limited in the scope of claim material or the step of appointment, and can be to being subject to essential characteristic that the invention of claims protection not have and new feature to cause those materials or the step of materially affect." claim of ' substantially by ... composition ' is between with ' by ... composition ' the closed claim of format writing and the scope with ' comprise/comprise ' the full open model claim that form is write.”
In the time that applicant uses open-ended term for example " to comprise " to describe invention or its part, should be appreciated that this explanation also comprises uses term defined above " substantially by ... composition " description that this invention is carried out, unless indicated under concrete condition.
Measure word " one " and " one " are for describing key element of the present invention or component.Use these measure word to be intended to show exist a kind of or at least one these key elements or component.Although adopt this type of measure word normally in order to show that adorned noun is singular noun, as used herein, measure word " " and " one " also comprise plural number, unless indicated in addition under concrete condition.Equally, as used herein, demonstrative pronoun " is somebody's turn to do " and also represents that adorned noun can be odd number or plural number, unless indicated in addition under concrete condition.
As used herein, term " back-contact photovoltaic module " means to comprise the functional finished product device of the laminated multi-layer structure shown in for example the application Fig. 3 and Fig. 4; Term " back-contact photovoltaic module assembly " means the multilayer semi-finished product assembly forming in the lamination process of back-contact photovoltaic module producing; Term " back-contact barrier-layer cell " means to play in back-contact photovoltaic module the Core Feature parts that light energy conversion become to electric energy effect.
In addition, term " back of the body insulating barrier " means one or more layers polymer film or the sheet between conducting channel and back-contact barrier-layer cell in back-contact photovoltaic module, and it has played the effect of encapsulation and insulation.
Term " copolymer " refers to comprise copolymerization units or is carried out the polymer of the residue that copolymerisation generates by two or more comonomers.In this connection, copolymer can be described in this article in conjunction with the quantity of its component comonomer or its component comonomer, for example " copolymer comprises ethene and 9 %(weight percentages) acrylic acid ", or a similar description.This class description can be regarded as informal, because it is not used as comonomer as copolymerization units; For example, because it does not comprise the routine name of copolymer, the name of IUPAC (IUPAC); Because it is using method restriction article term not; Or because other reasons.But as used herein, the description of copolymer being carried out in conjunction with the amount of its component comonomer or its component comonomer refers to that this copolymer contains the copolymerization units (having specified amount in the time specifying) of specifying comonomer.Draw thus following inference, copolymer is not the product of the reactant mixture of the given comonomer that comprises specified rate, clearly explains unless carried out this type of in restriction situation.
Term " acid copolymer " refers to and comprises alpha-olefin, α, β-ethylenic unsaturated carboxylic acid and the optionally polymer of the copolymerization units of other suitable comonomers (for example α, β-ethylenically-unsaturated carboxylic acid ester).
Term " ionomer " refers to the polymer of preparing by partially or completely neutralizing acid copolymer as above.More particularly, ionomer comprises ionic group, and described ionic group is metal ion carboxylate, for example the mixture of alkali metal carboxylate, alkaline earth metal carboxylation, transition metal carboxylate and this type of carboxylate.As defined herein, prepared by the hydroxy-acid group of this base polymer (for example by with alkali reaction) precursor or matrix polymer conventionally by partially or completely neutralizing, and wherein precursor or matrix polymer are acid copolymer.The ionomeric example of alkali metal used herein is sodium ionomer (or sodium neutralization ionomer), the copolymer of for example ethene and methacrylic acid, and wherein all or part of of the hydroxy-acid group of the methacrylic acid unit of copolymerization is carboxylic acid sodium form.
As herein, for example, so that form (" lamination " or " lamination ") is used alone or in combination, term " layered product " refers to have and adheres to securely each other or bonding at least two-layer structure.These layers can directly or indirectly adhere to each other." directly " mean between two-layer and there is no additional materials, for example interlayer or adhesive phase; " indirectly " mean between two-layer and have additional materials.
Material, method and embodiment is herein only illustrative, is not intended to limit, unless specifically indicated.
Finally, herein listed all percentages, umber etc. all by weight, unless be otherwise noted in concrete example.
Below in conjunction with Figure of description, multiple embodiment of the present invention are described in detail.
Fig. 3 is the generalized section that comprises the back-contact photovoltaic module 2000 of the first embodiment of combined electrical interconnection member of the present invention.Back-contact photovoltaic module 2000 of the present invention is made up of laminated multi-layer.As shown in Figure 3, back-contact photovoltaic module 2000 of the present invention along from the back side (non-towards sunny side) to above, the direction order of (towards sunny side) comprises following layer: substrate 2010, be arranged on the conducting channel 2011 substrate 2010, the back of the body insulating barrier 2020 that is provided with multiple through holes (not shown Reference numeral), back-contact barrier-layer cell 2030, front encapsulated layer 2040, header board 2050, and wherein arbitrary layer all has front face side (towards sunny side) and rear side (non-towards sunny side).Described back-contact barrier-layer cell 2030 has light-receiving side (upside of back-contact barrier-layer cell 2030 in Fig. 3) and rear side (downside of back-contact barrier-layer cell 2030 in Fig. 3) above respect to one another, and multiple electric contacts 2031 are formed in above the described rear side of described back-contact barrier-layer cell, the described rear side of described back-contact barrier-layer cell 2030 and described back of the body insulating barrier 2020 are adjacent, and the multiple electric contacts 2031 in its rear side are not shown with the multiple through hole 2021(in back of the body insulating barrier 2020) align, each through hole in described multiple through hole is combined type electrical interconnection member, and 2022(is not shown) institute is full of, and being electrically connected between electric contact 2031 and conducting channel 2011 is that to be filled in multiple through hole 2021(by these not shown) in electrical interconnection member 2022 provide.This electrical interconnection member 2022 comprises the first electricity bonding parts 2022a and the one or more conductive component 2022b with its shape complementarity.In back-contact photovoltaic module 2000, these the first electricity bonding parts 2022a is adhered on electric contact 2031, and these one or more conductive component 2022b directly contact with in the conducting channel 2011 being arranged on substrate 2010, thereby realize being electrically connected between the electric contact 2031 in the rear side of back-contact barrier-layer cell 2030 and the conducting channel 2011 on substrate 2010 via the first embodiment of combined electrical interconnection member of the present invention.
For example glass plate of header board 2050 and the front encapsulated layer 2040 of back-contact photovoltaic module 2000 preferably have higher light transmission rate, to allow enough daylight to arrive back-contact barrier-layer cell 2030.In the back-contact photovoltaic module 2000 of the present invention shown in Fig. 3, header board 2050 and front encapsulated layer 2040 are all transparent.Front encapsulated layer 2040 and back of the body insulating barrier 2020 can be made up of for example ethylene-vinyl acetate copolymer of polymeric material (EVA) respectively.Front encapsulated layer 2040 and back of the body insulating barrier 2020 separately can be by one or more layers polymeric material laminating moldings.Particularly, be used for being shaped before the material of encapsulated layer 2040 and/or back of the body insulating barrier 2020 can be selected from the composition that comprises ethylene-vinyl acetate copolymer (EVA), ionomer (ionomer) or poly-(vinyl butyral) polymer (PVB).Wherein, back of the body insulating barrier 2020 can be single or multiple lift structure, has both played the encapsulation effect to battery, has played again the electric insulation effect between battery and conducting channel.In back-contact photovoltaic module 2000, back-contact barrier-layer cell 2030 is for running through and be wound around the barrier-layer cell of processing (MWT) through metallization.In electrical interconnection member 2022, the first electricity bonding parts 2022a is made up of conductive adhesive or conducting polymer composite, described electroconductive binder comprises macromolecular material and dispersion conducting particles wherein, and described conducting particles is selected from the group that comprises gold, silver, nickel, copper, aluminium, tin, zinc, titanium, tin, bismuth, tungsten, lead and alloy thereof.For example the first electricity bonding parts 2022a can be by comprising at least 5%(volumn concentration) the electric conducting material of macromolecular material make.Described one or more conductive component 2022b can be made up of one or more metal materials, and described one or more metal materials are selected from the material group that comprises copper, aluminium, tungsten, tin, nickel, titanium, silver-plated copper, nickel-clad copper, tin-coated copper, zinc-plated aluminium, gold-plated nickel, stainless steel and their alloy and combination.Described one or more conductive component can be one or more the form comprising in sheet, piece, net and combination thereof.In described combined electrical interconnection member 2022, described at least one conductive component accounts for the 3-95 % of described combined electrical interconnection member cumulative volume.For example, in combined electrical interconnection member 2022, conductive component 2022b can be metal (as copper) sheet or net.Preferably, the conductivity of the conductive component in described combined electrical interconnection member is greater than the conductivity of described the first electricity bonding parts.So more be conducive to improve the usefulness of back-contact photovoltaic module.
Fig. 4 is the generalized section that comprises the laminar structure of the back-contact photovoltaic module 3000 of the second embodiment of combined electrical interconnection member of the present invention.Back-contact photovoltaic module 3000 has analog structure with the back-contact photovoltaic module 2000 shown in Fig. 3, difference is, for be filled in the electrical interconnection member 3022 of the multiple through holes 3021 on back of the body insulating barrier 3020 comprise the first electricity bonding parts 3022a, with one or more conductive component 3022b of its shape complementarity and with the second electricity bonding parts 3022c of conductive component 3022b shape complementarity.Described the second electricity bonding parts 3022c can be made up of electroconductive binder, conducting polymer composite or scolder.In the laminar structure of back-contact photovoltaic module 3000, these the first electricity bonding parts 3022a is adhered on electric contact 3031, and these the second electricity bonding parts 3022c is adhered in conducting channel 3011, thereby realize being electrically connected between the electric contact 3031 in the rear side of back-contact barrier-layer cell 3030 and the conducting channel 3011 on substrate via the second embodiment of combined electrical interconnection member of the present invention.For those skilled in the art, it will also be appreciated that: described conductive component 3022b can be one or more parts such as metallic conduction parts, metallic conduction parts in irregular shape of copper sheet (paper tinsel), copper mesh, stainless (steel) wire (sheet), regular shape, as long as meet the following conditions: be filled in through hole 3021 described at least one conductive component and the first electricity bonding parts 3022a, the second electricity bonding parts 3022c shape complementarity.As can be seen here, the second electricity bonding parts 3022c plays the effect of the electric connection that makes the conducting channel 3011 on electrical interconnection member 3022 and substrate 3010.Preferably, the conductivity of the conductive component in described combined electrical interconnection member is greater than the conductivity of described the first electricity bonding parts and/or the conductivity of described the second electricity bonding parts.So more be conducive to improve the usefulness of back-contact photovoltaic module.
In this application, can back-contact barrier-layer cell 2030,3030, front encapsulated layer 2040 will be removed in back-contact photovoltaic module 2000,3000,3040, header board 2050, part cellular manufacturing outside 3050, described unit is known as " integrated form backboard ", as shown in Figure 5 c.The cellular manufacturing of integrated form backboard is very favorable for the production of back-contact photovoltaic module 2000,3000 of the present invention.
The present invention discloses a kind of integrated form backboard for back-contact photovoltaic module, described integrated form backboard is along comprising from the back side to direction order above: the substrate 2010 with rear side respect to one another and front face side; Be arranged on the conducting channel 2011 in the described front face side of described substrate; The back of the body insulating barrier 2020 adjacent with described conducting channel, described back of the body insulating barrier has the rear side adjacent with described conducting channel and the front face side away from described conducting channel, and described back of the body insulating barrier has multiple rear side from described back of the body insulating barrier, and to extend to the through hole 2021(of front face side of described back of the body insulating barrier not shown); Wherein, each through hole in described multiple through hole type electrical interconnection member that is combined is full of, described combined electrical interconnection member comprises the first electricity bonding parts 2022a and at least one the conductive component 2022b with described the first electricity bonding parts shape complementarity, and for the position with respect to described at least one conductive component in described through hole, described the first conduction bonding parts are near the front face side of described back of the body insulating barrier; In the time using described integrated form backboard to produce back-contact photovoltaic module 2000, the first electricity bonding parts of described combined electrical interconnection member are adhered on the electric contact 2031 above the rear side of back-contact barrier-layer cell.
In described integrated form backboard, described combined electrical interconnection member may further include the second electricity bonding parts 3022c, for position with respect to described at least one conductive component in described through hole, described the second electricity bonding parts are near the rear side of described back of the body insulating barrier and be adhered in described conducting channel 3011, and described second point bonding parts and described at least one conductive component shape complementarity.
The present invention has also disclosed the production method of a kind of integrated form backboard 3000c for barrier-layer cell module 3000, said method comprising the steps of (seeing Fig. 5 a-5c):
(a) provide the substrate 3010 with rear side respect to one another and front face side;
(b) in the described front face side of described substrate 3010, conducting channel 3011 is set, the assembly 3000a forming thus, as shown in Figure 5 a;
(c) back of the body insulating barrier 3020 is stacked in described conducting channel, wherein said back of the body insulating barrier 3020 has multiple rear side from described back of the body insulating barrier and extends to the through hole 3021 of the front face side of described back of the body insulating barrier, make described through hole 3021 aim at described conducting channel 3011, the assembly 3000b forming thus, as shown in Figure 5 b;
(d) further, in each through hole of described multiple through holes 3021, fill the second electricity bonding parts 3022c, at least one conductive component and the first electricity bonding parts 3022a, and make it be full of described through hole 3021, described the first electricity bonding parts 3022a is near the front face side away from described conducting channel 3011 of described back of the body insulating barrier 3020, described the second electricity bonding parts 3022c is near the rear side of described back of the body insulating barrier 3020, described at least one conductive component 3022b is placed between described the first electricity bonding parts 3022a and the second electricity bonding parts 3022c, and jointly become the part of combined electrical interconnection member with its shape complementarity,
(e) the laminated sandwich construction being obtained by step (d) of hot pressing is to obtain described integrated form backboard 3000c(Fig. 5 c), and wherein, described the second electricity bonding parts 3022c sticks in described conducting channel 3011.
In the optional mode of another kind of the production method of integrated form backboard of the present invention, (produce the method for the integrated form backboard of barrier-layer cell module 2000), said method comprising the steps of:
(a) provide the substrate with dorsal surface respect to one another and leading flank;
(b) on the described front face side of described substrate, conducting channel is set;
(c) back of the body insulating barrier is stacked in described conducting channel, wherein said back of the body insulating barrier has multiple rear side from described back of the body insulating barrier and extends to the through hole of the front face side of described back of the body insulating barrier, makes described through hole aim at described conducting channel;
(d) further, in each through hole in described multiple through holes, fill at least one conductive component and the first electricity bonding parts, and make it be full of described through hole, described the first electricity bonding parts are near the rear side of described back of the body insulating barrier, and described at least one conductive component bonds parts shape complementarity with described the first electricity and jointly becomes the part of combined electrical interconnection member;
(e) the laminated sandwich construction being obtained by step (d) of hot pressing is to obtain integrated form backboard, and wherein said conductive component directly contacts with conducting channel.
The present invention has also disclosed a kind of method of producing back-contact photovoltaic module 3000, said method comprising the steps of (can referring to Fig. 5 c-5e):
(f) after as above producing above-mentioned integrated form backboard 3000c, further back-contact barrier-layer cell 3030 is stacked in described back of the body insulating barrier 3020 above on, and the electric contact 3031 of back-contact barrier-layer cell 3030 rear side is aimed at the through hole 3021 on described back of the body insulating barrier 3020, the assembly forming is thus as shown in Fig. 5 d;
(g) front encapsulated layer 3040 is stacked in the light-receiving side above of described back-contact barrier-layer cell 3030, the assembly forming is thus as shown in Fig. 5 e;
(h) transparent front plate 3050 is stacked in to the front face side of described front encapsulated layer 3040; And the sandwich construction as above obtaining is carried out to lamination and see Fig. 4 to obtain back-contact photovoltaic module 3000().
In the back-contact photovoltaic module 3000 so obtaining, in multiple combined electrical interconnection members 3022 first electricity bonding parts 3022a and the second electricity bonding parts 3022c are adhered to respectively on the electric contact 3031 of back-contact barrier-layer cell 3030 rear side and in conducting channel 3011, thereby make to have realized and being electrically connected between described back-contact barrier-layer cell 3030 and conducting channel 3011.
For the production method of the back-contact photovoltaic module 2000 shown in Fig. 3, only need improve a little the production method of above back-contact photovoltaic module 3000.Particularly, said method comprising the steps of:
(f) after as above producing the above-mentioned integrated form backboard for barrier-layer cell module 2000, further back-contact barrier-layer cell is stacked in to the upper of described back of the body insulating barrier above, and the electric contact of back-contact barrier-layer cell rear side is aimed at the through hole on described back of the body insulating barrier;
(g) front encapsulated layer is stacked in the light-receiving side above of described back-contact barrier-layer cell;
(h) transparent front plate is stacked in to the front face side of described front encapsulated layer; And the sandwich construction as above obtaining is carried out to lamination and see Fig. 3 to obtain back-contact photovoltaic module 2000().
Another kind of optional mode is, in the method for the back-contact photovoltaic module shown in production drawing 3 and Fig. 4, also after can having filled combined electrical interconnection member in the through hole on described back of the body insulating barrier, do not carry out lamination, but directly further back-contact barrier-layer cell is stacked in to the upper of described back of the body insulating barrier above, and the electric contact of back-contact barrier-layer cell rear side is aimed at the through hole on described back of the body insulating barrier;
Front encapsulated layer is stacked in the light-receiving side above of described back-contact barrier-layer cell;
Transparent front plate is stacked in to the front face side of described encapsulated layer; And
As above the sandwich construction obtaining is carried out to lamination to obtain back-contact photovoltaic module 3000.
Those skilled in the art can recognize: the method for manufacturing above-mentioned back-contact photovoltaic module is not limited thereto.For example, also can be first by laminated with back-contact barrier-layer cell 3030 back of the body insulating barrier 3020 with multiple through holes 3021, fill combined electrical interconnection member, then respectively close layer by layer with other.
Technology of the present invention for the manufacturer of back-contact photovoltaic module in the urgent need to.Of the present inventionly comprise that the back-contact photovoltaic module of combined electrical interconnection member, the back-contact photovoltaic module that comprises combined electrical interconnection member and production method thereof all can save the consumption of electroconductive binder greatly, significantly reduce manufacturing cost, can improve again the usefulness of back-contact photovoltaic module simultaneously.
example
In further detail useful technique effect of the present invention is described by example below, but the present invention is not limited to these examples below.
The concrete material that photovoltaic module of the present invention (photovoltaic module) uses is as follows:
mWT battery: 156 millimeters of polysilicon metals run through winding (MWT) back of the body contact photovoltaic cell to be bought in JA Solar Holdings Co., Ltd.;
glass plate: 3.2 millimeters of ultra-clear glasses are bought in Henan Si Keda new forms of energy Co., Ltd;
eVA film-1: with " Rui Fu " (Revax
tM) trade (brand) name is purchased from ethylene-vinyl acetate copolymer (EVA) film of 450 micron thick of Wenzhou Ruiyang Photovoltaic Material Co., Ltd.;
eVA film-2: under the pressure of the temperature of 100 DEG C and 20 MPa, EVA film-1 be pressed into 250 micron films and obtain;
pET film: with Melinex
tMs trade (brand) name purchased from the Supreme Being people of Du Pont film (DuPont Teijin Films) (U.S.A.) PETG through (both sides) corona treatment of company (polyethylene terephthalate) film (thickness is 250 microns, and density is 1.40 g/cm
3);
eCP-1: the ethylene acrylate copolymer resin (ethylene/acrylate copolymer) with trade name Bynel 22E757 purchased from the modification of E.I.Du Pont Company, density is 0.94 g/cm
3, melt index (MFI) is 8.0 g/10 min, fusing point is 92 DEG C;
eCP-2: the ethylene methacrylic acid copolymer resin (Ethylene methacrylic acid copolymer) with trade name Nucrel 0910 purchased from E.I.Du Pont Company, contain 9%(weight percentage) methacrylic acid, density is 0.93 g/cm
3, melt index (MFI is) 10.0 g/10 min, fusing point is 100 DEG C;
pVF film: polyvinyl fluoride (polyvinyl fluoride) oriented film with trade name Tedlar purchased from E.I.Du Pont Company, thickness is 38 microns;
bonding agent: two-part polyurethane (polyurethane) bonding agent with trade name PP-5430 and A50 purchased from Mitsui (Mitsui) company;
copper Foil-1: purchased from the Copper Foil of 35 micron thick of Chinese Suzhou Co., Ltd of FUKUDA METAL;
copper Foil-2: purchased from the Copper Foil of 105 micron thick of Chinese Suzhou Co., Ltd of FUKUDA METAL;
copper mesh: purchased from 310 orders of Hebei Yingkaimo Metal Net Co., Ltd., the phosphor-copper wire netting processed that string diameter is 30 microns;
stainless (steel) wire: the wire netting that 300 orders, the string diameter purchased from Hebei Yingkaimo Metal Net Co., Ltd. be 40 microns, be made up of 316 stainless steels;
conducting resinl-1: the conducting resinl that contains silver particles with trade name Thermoset MD-140 purchased from LORD Corporation (U.S.);
conducting resinl-2: the conducting resinl of the film containing silver particles being prepared as follows: existing by 33 grams of ethylene-vinyl acetate copolymers (EVA, with trade name Elvax PV1650 purchased from E.I.Du Pont Company) and 0.4 gram of peroxide (with trade name LQ-TBEC purchased from Lanzhou of China auxiliary reagent factory), 0.3 gram of silane coupler (with trade name KBM403 purchased from Japanese Shin-Etsu Chemial Co., Ltd) and 0.12 gram of antioxidant (with trade name Irganox
tMmD1024 is purchased from BASF Aktiengesellschaft) premix; And then be that the amorphous silver powder (Kunming Nuo Man Electron Material Co., Ltd) of 3-5 micron and 25 gram particle footpaths are that ball shape silver powder (du pont company) 10 minutes systems of banburying blend at 80 DEG C of 5.4-11 micron obtain by gained pre-composition and 92 gram particle footpaths;
soldering paste: with trade name DK-309Bi purchased from the lead-free tin cream of Daikin sakata company;
with the substrate of conducting channel: prepared by following methods: (i) PET film and PVF film are pressed into substrate by adhesive layer; (ii) the extrusion laminate machine of being manufactured by Davis Standared company, at the temperature of 285 DEG C, 35 micron thick copper foil layers are depressed on the PET film of substrate, adhesive phase (60 micron thick) is therebetween by the 1:1(weight by weight of ECP-1 and ECP-2) blend makes; (iii) the plane die hobbing press that adopts Chinese Suzhou Chuan Machinery Co., Ltd. to produce comes cutting metal paper tinsel and adhesive phase to form conducting channel.
Output power of photovoltaic module method of testing
The power output of photovoltaic module is by measuring with SPI-SUN Simulators 3500SLP type solar simulator and PV module QA detector.
comparative example 1 and example 1-2
In comparative example 1, by hot pressing at 65 DEG C two minutes, EVA film-1 of through hole that with multiple diameters is 3 mm is laminated in to MWT cell backside side, and makes the electrode pair of through hole and cell backside side should.Then, conducting resinl-1 is injected in through hole, on height and through hole along remaining basically stable.After drying at room temperature half an hour, by EVA film-1 and glass laminated to MWT battery front face side, band conducting channel substrate is to its rear side.Finally, use vacuum laminator at 145 DEG C, stepped construction to be exerted pressure 15 minutes, obtain monolithic MWT photovoltaic module.Its power output is 3.65 watts.
In example 1, by hot pressing at 65 DEG C two minutes, EVA film-1 of through hole that with multiple diameters is 3 mm is laminated in to MWT cell backside side, and makes the electrode pair of through hole and cell backside side should.Then, first a part of conducting resinl-1 is injected in through hole, then adds 105 micron thick Copper Foil disks (diameter is identical with through hole), finally another part conducting resinl-1 is injected on the copper foil of through hole, on total height and through hole, remain basically stable in edge.After drying at room temperature half an hour, by EVA film-1 and glass laminated to MWT battery front face side, band conducting channel substrate is to its rear side.Finally, use vacuum laminator at 145 DEG C, stepped construction to be exerted pressure 15 minutes, obtain monolithic MWT photovoltaic module.After tested, the power output of example 1 is 3.72 with respect to 3.65 watts of comparative example 1, has increased by 2%.
In example 2, by hot pressing at 65 DEG C two minutes, EVA film-1 of through hole that with multiple diameters is 3 mm is laminated in to MWT cell backside side, and makes the electrode pair of through hole and cell backside side should.Then, first a part of conducting resinl-1 is injected in through hole, add again 410 micron thick metal disks (purchased from the structure of Wuxi Southwick Science and Technology Ltd. be coating 15 (μ m)/copper (170 μ m)/coating (40 μ m)/copper (170 μ m)/coating (15 μ sandwich construction sheet metal m), wherein Coating composition is Sn/Pd/Ag alloy, in alloy, the weight ratio of Sn/Pd/Ag is 62/36/2, and its diameter is slightly less than through hole), finally another part conducting resinl-1 is injected on the copper foil of through hole, on total height and through hole, remain basically stable in edge.After drying at room temperature half an hour, by EVA film-1 and glass laminated to MWT battery front face side, band conducting channel substrate is to its rear side.Finally, use vacuum laminator at 145 DEG C, stepped construction to be exerted pressure 15 minutes, obtain monolithic MWT photovoltaic module.After tested, the power output of example 2 is 3.7 with respect to 3.65 watts of comparative example 1, has increased by 1.4%.
comparative example 2 and example 3
In comparative example 2, EVA film-2 of through hole that are 3 mm are laminated on the substrate with conducting channel, and make through hole and conducting channel correspondence with multiple diameters.Then, by conducting resinl-2 hot pressing (100 DEG C) and to be die-cut to thickness be that 250 micron diameters are the conductive glue slice of 2.5 mm, and put it in each through hole, then at the temperature of 65 DEG C, hot pressing 2.5 minutes is fixing.Finally MWT battery, EVA film-1 and glass are stacked gradually to installing on the back of the body insulating barrier of conducting resinl, use vacuum laminator at 145 DEG C, stepped construction to be exerted pressure 15 minutes, obtain monolithic MWT photovoltaic module.Its power output is 3.6 watts.
In example 3, first Solder-Paste Printing is bonded in conducting channel, keep area of section, number and the position of soldering paste point and the back electrode of MWT battery to match.Then EVA film-2 of through hole that with multiple diameters are 3 mm are laminated on the substrate with conducting channel, its through hole and soldering paste point align.At 100 DEG C, hot pressing conducting resinl-2 are to the thick Copper Foil of 105 μ m, and to keep gross thickness be 150 μ m, are then die-cut to the conductive glue slice that diameter is 2.5 mm.Conductive glue slice is put in each through hole, copper sheet face is connected with soldering paste, on the upper surface of conducting resinl and through hole, remain basically stable in edge.Finally MWT battery, EVA film-1 and glass are stacked gradually to installing on the back of the body insulating barrier of conducting resinl, use vacuum laminator at 145 DEG C, stepped construction to be exerted pressure 15 minutes, obtain monolithic MWT photovoltaic module.After tested, the power output of example 3 is 3.74 watts of 3.6 watts with respect to comparative example 2, has increased by 3.9%.
comparative example 3 and example 4-5
In comparative example 3, by hot pressing at 63 DEG C two minutes, EVA film-1 of through hole that with multiple diameters is 3 mm is laminated in to MWT cell backside side, and makes the electrode pair of through hole and cell backside side should.Then, conducting resinl-1 is injected in through hole, on height and through hole along remaining basically stable.After drying at room temperature half an hour, by EVA film-1 and glass laminated to MWT battery front face side, band conducting channel substrate is to its rear side.Finally, use vacuum laminator at 145 DEG C, stepped construction to be exerted pressure 15 minutes, obtain monolithic MWT photovoltaic module.Its power output is 3.63 watts.After 100 thermal cycles (IEC61215 standard testing flow process ,-40 DEG C to 85 DEG C circulations) are aging, its power output is 3.48 watts.
In example 4, by hot pressing at 63 DEG C two minutes, EVA film-1 of through hole that with multiple diameters is 3 mm is laminated in to MWT cell backside side, and makes the electrode pair of through hole and cell backside side should.Then, conducting resinl-1 is injected in through hole, then puts into the copper mesh disk that diameter is identical with through hole.After drying at room temperature half an hour, by EVA film-1 and glass laminated to MWT battery front face side, band conducting channel substrate is to its rear side.Finally, use vacuum laminator at 145 DEG C, stepped construction to be exerted pressure 15 minutes, obtain monolithic MWT photovoltaic module.After tested, the power output of example 4 is 3.71 watts.And after 100 thermal cycles (IEC61215 standard testing flow process ,-40 DEG C to 85 DEG C circulations) are aging, its power output is 3.56 watts.With respect to comparative example 3, improve respectively 2.2% and 2.3%.
In example 5, by hot pressing at 63 DEG C two minutes, EVA film-1 of through hole that with multiple diameters is 3 mm is laminated in to MWT cell backside side, and makes the electrode pair of through hole and cell backside side should.Then, conducting resinl-1 is injected in through hole, then puts into the stainless (steel) wire disk that diameter is identical with through hole.After drying at room temperature half an hour, by EVA film-1 and glass laminated to MWT battery front face side, band conducting channel substrate is to its rear side.Finally, use vacuum laminator at 145 DEG C, stepped construction to be exerted pressure 15 minutes, obtain monolithic MWT photovoltaic module.After tested, the power output of example 5 is 3.75 watts.And after 100 thermal cycles (IEC61215 standard testing flow process ,-40 DEG C to 85 DEG C circulations) are aging, its power output is 3.61 watts.With respect to comparative example 3, improve respectively 3.3% and 3.7%.
Although above described and particular instantiation some preferred embodiment of the present invention, be not intended to the present invention to be limited to this type of embodiment.In addition, be to be understood that, although shown many features and advantages of the present invention in the description above, and the details of this structure and function of the present invention, but the disclosure is only exemplary, and can not depart from the basis of the principle of the invention, in the extensive general intended scope of term used in appended claims, details of the present invention is farthest revised, especially the amendment to shape, size and arrangement of parts aspect.
Claims (10)
1. for an integrated form backboard for back-contact photovoltaic module, described integrated form backboard is along comprising from the back side to direction order above:
There is the substrate of rear side respect to one another and front face side;
Be arranged on the conducting channel in the described front face side of described substrate;
The back of the body insulating barrier adjacent with described conducting channel, described back of the body insulating barrier has the rear side adjacent with described conducting channel and the front face side away from described conducting channel, and described back of the body insulating barrier has multiple rear side from described back of the body insulating barrier and extends to the through hole of the front face side of described back of the body insulating barrier, and described through hole aligns with described conducting channel;
Wherein, each through hole in described multiple through hole type electrical interconnection member that is combined is full of, described combined electrical interconnection member comprises the first electricity bonding parts and at least one conductive component with described the first electricity bonding parts shape complementarity, and for the position with respect to described at least one conductive component in described through hole, described the first conduction bonding parts are near the front face side of described back of the body insulating barrier;
In the time using described integrated form backboard to produce back-contact photovoltaic module, the first electricity bonding parts of described combined electrical interconnection member are adhered on the electric contact above the rear side of back-contact barrier-layer cell.
2. integrated form backboard according to claim 1, is characterized in that, described at least one conductive component is made up of one or more metal materials.
3. integrated form backboard according to claim 2, it is characterized in that, described one or more metal materials are selected from the material group that comprises copper, aluminium, tungsten, tin, nickel, titanium, silver-plated copper, nickel-clad copper, tin-coated copper, zinc-plated aluminium, gold-plated nickel, stainless steel and their alloy and combination.
4. integrated form backboard according to claim 3, is characterized in that, described at least one conductive component is one or more the form comprising in sheet, piece, net and combination thereof.
5. integrated form backboard according to claim 1, is characterized in that, in described combined electrical interconnection member, described at least one conductive component accounts for the 3-95 % of described combined electrical interconnection member cumulative volume.
6. integrated form backboard according to claim 1, is characterized in that, described the first electricity bonding parts are by comprising at least 5%(volumn concentration) the electric conducting material of macromolecular material make.
7. integrated form backboard according to claim 6, is characterized in that, described the first electricity bonding parts are made up of conducting polymer composite.
8. integrated form backboard according to claim 6, is characterized in that, described the first electricity bonding parts are made up of electroconductive binder, and described electroconductive binder comprises macromolecular material and disperses conducting particles wherein.
9. integrated form backboard according to claim 7, is characterized in that, described conducting particles is selected from the group that comprises gold, silver, nickel, copper, aluminium, tin, zinc, titanium, tin, bismuth, tungsten, lead and alloy thereof.
10. according to the integrated form backboard described in any one in claim 1-9, it is characterized in that, described at least one conductive component is directly adhered in described conducting channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310028183.3A CN103972315B (en) | 2013-01-25 | 2013-01-25 | Integrated form backboard, back-contact photovoltaic module and its production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310028183.3A CN103972315B (en) | 2013-01-25 | 2013-01-25 | Integrated form backboard, back-contact photovoltaic module and its production method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103972315A true CN103972315A (en) | 2014-08-06 |
| CN103972315B CN103972315B (en) | 2017-07-04 |
Family
ID=51241604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310028183.3A Active CN103972315B (en) | 2013-01-25 | 2013-01-25 | Integrated form backboard, back-contact photovoltaic module and its production method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103972315B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108215358A (en) * | 2018-01-02 | 2018-06-29 | 苏州宝澜环保科技有限公司 | A kind of solar cell backboard and preparation method thereof |
| CN109827645A (en) * | 2018-12-26 | 2019-05-31 | 江苏日托光伏科技股份有限公司 | A kind of MWT component conducting resinl quota test method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101874305A (en) * | 2007-09-28 | 2010-10-27 | 夏普株式会社 | Solar battery, method for manufacturing solar battery, method for manufacturing solar battery module, and solar battery module |
| JP2010283201A (en) * | 2009-06-05 | 2010-12-16 | Sharp Corp | Solar cell, solar cell with wiring sheet, and solar cell module |
| US20120167940A1 (en) * | 2009-09-15 | 2012-07-05 | Sharp Kabushiki Kaisha | Solar cell module and method of manufacturing the same |
| CN203277425U (en) * | 2013-01-25 | 2013-11-06 | 纳幕尔杜邦公司 | Integrated backboard and back-contact photovoltaic module |
-
2013
- 2013-01-25 CN CN201310028183.3A patent/CN103972315B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101874305A (en) * | 2007-09-28 | 2010-10-27 | 夏普株式会社 | Solar battery, method for manufacturing solar battery, method for manufacturing solar battery module, and solar battery module |
| JP2010283201A (en) * | 2009-06-05 | 2010-12-16 | Sharp Corp | Solar cell, solar cell with wiring sheet, and solar cell module |
| US20120167940A1 (en) * | 2009-09-15 | 2012-07-05 | Sharp Kabushiki Kaisha | Solar cell module and method of manufacturing the same |
| CN203277425U (en) * | 2013-01-25 | 2013-11-06 | 纳幕尔杜邦公司 | Integrated backboard and back-contact photovoltaic module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108215358A (en) * | 2018-01-02 | 2018-06-29 | 苏州宝澜环保科技有限公司 | A kind of solar cell backboard and preparation method thereof |
| CN109827645A (en) * | 2018-12-26 | 2019-05-31 | 江苏日托光伏科技股份有限公司 | A kind of MWT component conducting resinl quota test method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103972315B (en) | 2017-07-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104701401B (en) | Integrated backboard including aluminum conductive circuit, and back contact type photovoltaic module | |
| CN107195719B (en) | Production equipment of shingled solar photovoltaic module | |
| CN113013297B (en) | Preparation method of grid-line-free heterojunction battery assembly | |
| CN112786727B (en) | Composite membrane for mutual combination of main-grid-free heterojunction solar cell modules and preparation method thereof | |
| CN113037210A (en) | Battery string structure, photovoltaic module and manufacturing method of photovoltaic module | |
| CN205177858U (en) | Two -sided battery pack of no main grid | |
| JP2014531775A (en) | Photovoltaic cell interconnection | |
| CN203277425U (en) | Integrated backboard and back-contact photovoltaic module | |
| CN103681894A (en) | Solar cell module and manufacturing method thereof | |
| CN110634978A (en) | Double-sided power generation solar cell module and preparation method thereof | |
| CN202905744U (en) | Flexible solar battery component | |
| CN214705942U (en) | Novel packaging structure of heterojunction solar cell | |
| CN103972315A (en) | Integrated back plate and back contact type photovoltaic module and production method thereof | |
| CN209785953U (en) | Photovoltaic conductive backboard and solar cell module | |
| CN101728460B (en) | Solar battery for solar mobile phone battery and preparation method thereof | |
| JP5889738B2 (en) | Solar cell module and manufacturing method thereof | |
| KR101714780B1 (en) | Solar cell module | |
| CN204834648U (en) | Solar cell module | |
| CN116404060A (en) | Photovoltaic conductive structure | |
| CN115663049A (en) | Photovoltaic module | |
| CN202678369U (en) | Solar backplane of back contact solar cell | |
| CN115172535A (en) | Preparation method of photovoltaic module and photovoltaic module | |
| CN209691766U (en) | A kind of backboard and solar components of solar components | |
| CN202324421U (en) | Photovoltaic building component of solar battery | |
| CN206961853U (en) | A kind of heterojunction solar battery module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221118 Address after: Delaware Patentee after: DuPont Electronics Address before: Wilmington, Delaware Patentee before: E. I. du Pont de Nemours and Co. |