CN103969104B - Vibration reduction device and method for focusing ion beam machine probe - Google Patents
Vibration reduction device and method for focusing ion beam machine probe Download PDFInfo
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- CN103969104B CN103969104B CN201410217853.0A CN201410217853A CN103969104B CN 103969104 B CN103969104 B CN 103969104B CN 201410217853 A CN201410217853 A CN 201410217853A CN 103969104 B CN103969104 B CN 103969104B
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- probe
- vacuum
- shock dropping
- focused ion
- confined space
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Abstract
The invention relates to a vibration reduction device for a focusing ion beam machine probe, which comprises a vacuum hood, wherein the vacuum hood is buckled to the outer end of the probe and forms a closed space with the probe; and the closed space is in a vacuum state. In conclusion, the vacuum hood is arranged outside the outer end of the probe and forms the closed space with the probe, and the closed space is in a vacuum state, thereby preventing the vibration waves from transmission, greatly improving the influence of the external environment on the vibrations of the focusing ion beam machine probe, lowering the possibility of sample shake-off, and improving the sample preparation efficiency and the circulation time of the technical product.
Description
Technical field
The present invention relates to the technical field of measurement and test of semiconductor devices, more particularly, to a kind of probe of focused ion bundle board
Shock dropping device and its shock dropping method.
Background technology
With the market demand, the size of wafer is becoming larger, and process is less and less, and critical defect is also little to be arrived
Micron, Nano grade, a lot of defects pass through ESEM (Scanning Electron Microscope, SEM), focused ion
The methods of data capture such as bundle (Focused Ion Beam, FIB) can not analyze the source of defect completely, and transmitted electron shows
Micro mirror (Transmission Electron Microscope, TEM) become for the indispensable means of defect source analysis it
One.But, wafer fragmentation to be tested will be gone to carry out sample preparation by traditional TEM first again, and the wafer of fragmentation can not return to
Production line carries out follow-up processing, and then largely causes the wasting of resources.
On the other hand, FIB board has been used for carrying out full inspection analysis to wafer exception defect on production line, and this board does not need
Carry out fragmentation, product does not need to scrap.But, when carrying out sample preparation, user need to utilize the probe (Omni of FIB board
Probe) extract sample, and be attached on sample support, be directly embedded in FIB board.During sample product, described spy
Pin will have part and expose to FIB board.It is apparent that the peripheral vibrations of board and the sympathetic response of noise certainly will cause described probe it
Exposed parts are shaken.More seriously, it will cause the sample of described extraction to come off, greatly reduce the efficiency of sample preparation
Circulation time with handicraft product.
Therefore it is directed to the problem that prior art exists, this case designer, by being engaged in the industry experience for many years, actively studies
Improvement, then has a kind of shock dropping device of the probe of focused ion bundle board of the present invention and its shock dropping method.
Content of the invention
The present invention be directed in prior art, the probe of traditional focused ion bundle board is susceptible to the shake of peripheral board
Dynamic and noise sympathetic response produces shake, and the more serious sample that will cause described extraction comes off, and greatly reduces sample preparation
Efficiency and the defect such as circulation time of handicraft product a kind of shock dropping device of the probe of focused ion bundle board is provided.
The further object of the present invention is that the probe of traditional focused ion bundle board is susceptible to outward in prior art
The sympathetic response of the vibrations and noise of enclosing board produces shake, and the more serious sample that will cause described extraction comes off, and substantially reduces
The defects such as the circulation time of the efficiency of sample preparation and handicraft product provide a kind of shock dropping of the probe of focused ion bundle board
Method.
In order to solve the above problems, the present invention provides a kind of shock dropping device of the probe of focused ion bundle board, described poly-
The shock dropping device of the probe of pyrophosphate ion bundle board includes：Vacuum (-tight) housing, described vacuum (-tight) housing is fastened at the outer end of probe, and with described
Probe encloses formation confined space, and described confined space is in that vacuum is arranged.
Alternatively, the vacuum bottom of described confined space is less than 10-3mbar.
Alternatively, the vacuum of described confined space is less than 10-5mbar.
For realizing the further object of the present invention, the present invention provides a kind of shock dropping method of the probe of focused ion bundle board,
Described shock dropping method includes：Vacuum (-tight) housing is set at the outer end of described probe, and described vacuum (-tight) housing being enclosed with described probe is formed
Confined space, and described confined space is in that vacuum is arranged.
Alternatively, the vacuum bottom of described confined space is less than 10-3mbar.
Alternatively, the vacuum bottom of described confined space is less than 10-5mbar.
In sum, the present invention pass through at the periphery of the outer end of probe setting vacuum (-tight) housing, described vacuum (-tight) housing and with described
Probe encloses formation confined space, and described confined space is in that vacuum is arranged, and hinders the propagation of shock wave, greatly improves
The vibration influence that external environment condition is brought to the probe of described focused ion bundle board, reduces the chance that sample is shaken off, improves sample
The efficiency of product preparation and the circulation time of handicraft product.
Brief description
Fig. 1 show the shock dropping apparatus structure schematic diagram of the probe of focused ion bundle board of the present invention；
The probe that Fig. 2 show focused ion bundle of the present invention is subject to vibrations schematic diagram；
Fig. 3 show the test result figure of the shock dropping device being not provided with the present invention；
Fig. 4 show the test result figure of the shock dropping device with the present invention.
Specific embodiment
For describing technology contents, structural feature, institute's reached purpose and effect of the invention in detail, below in conjunction with reality
Apply example and coordinate accompanying drawing to be described in detail.
Refer to Fig. 1, and combine refering to Fig. 2, Fig. 1 show the shock dropping device of the probe of focused ion bundle board of the present invention
Structural representation.The probe that Fig. 2 show focused ion bundle of the present invention is subject to vibrations schematic diagram.In focused ion bundle board 2, institute
The probe 20 stating focused ion bundle board 2 tilts to be located in the cavity 21 of described focused ion bundle board 2, and described probe 20
Outer end 201 be exposed to external environment condition.When the vibrations of other board and the noise sympathetic response of described external environment condition, then certainly will cause described
The outer end 201 of probe 20 is shaken, and semiconducter device testing is adversely affected, or even shakes off sample to be tested.
In order to effectively avoid extraneous board vibrations and noise sympathetic response, lead to the outer end 201 of probe 20 to be shaken, and then make
Semiconducter device testing is adversely affected, the shock dropping device 1 of the probe of focused ion bundle board of the present invention, including true
Empty cover 11, described vacuum (-tight) housing 11 is fastened at the outer end 201 of described probe 20, and encloses formation confined space with described probe 20
12, and described confined space 12 is in that vacuum is arranged.
As those skilled in the art it is readily appreciated that ground, the vacuum of described confined space 12 is more low better.Preferably,
The vacuum bottom of described confined space 12 is less than 10-3mbar.It is highly preferred that the vacuum of described confined space 12 is less than 10- 5mbar.It is apparent that described confined space 12 is in vacuum arranging, hindering the propagation of shock wave, greatly improving external environment condition
The vibration influence that the probe 20 of described focused ion bundle board is brought, reduces the chance that sample is shaken off, improves sample preparation
Efficiency and handicraft product circulation time.
For the more intuitive technical scheme disclosing the present invention, highlight the beneficial effect of the present invention, now with specific experiment result
Proved.The shock dropping method of the probe of described focused ion bundle board, including：Arrange at the outer end 201 of described probe 20
Vacuum (-tight) housing 11, described vacuum (-tight) housing 11 simultaneously encloses formation confined space 12 with described probe 20, and described confined space 12 is in vacuum
Setting.As specifically embodiment, the vacuum of described confined space 12 is more low better.Preferably, described confined space 12
Vacuum bottom be less than 10-3mbar.It is highly preferred that the vacuum of described confined space 12 is less than 10-5mbar.
Refer to Fig. 3, Fig. 4, and combine refering to Fig. 1 and Fig. 2, Fig. 3 show the survey of the shock dropping device being not provided with the present invention
Test result figure.Fig. 4 show the test result figure of the shock dropping device with the present invention.From Fig. 3 and Fig. 4 it will be apparent that, there is this
The focused ion bundle board of the shock dropping device of invention is in test sample 3, and described sample 3 is attached on the process of sample support 4
In less there is the present invention the focused ion bundle board of shock dropping device there is in test process more excellent stability, described
Probe 20 is shaken.Conversely, the focused ion bundle board without the shock dropping device of the present invention is serious in test process
Shake, leads to observation fuzzy.
In sum, the present invention pass through at the periphery of the outer end of probe setting vacuum (-tight) housing, described vacuum (-tight) housing and with described
Probe encloses formation confined space, and described confined space is in that vacuum is arranged, and hinders the propagation of shock wave, greatly improves
The vibration influence that external environment condition is brought to the probe of described focused ion bundle board, reduces the chance that sample is shaken off, improves sample
The efficiency of product preparation and the circulation time of handicraft product.
Those skilled in the art all it will be appreciated that without departing from the spirit or scope of the present invention, can be to this
Bright carry out various modifications and variations.Thus, if any modification or modification fall into the protection of appended claims and equivalent
In the range of when it is believed that the present invention cover these modification and modification.
Claims (6)
1. a kind of shock dropping device of the probe of focused ion bundle board is it is characterised in that the probe of described focused ion bundle board
Shock dropping device include：Vacuum (-tight) housing, described vacuum (-tight) housing is fastened at the outer end of probe, and encloses formation confined air with described probe
Between, and described confined space is in that vacuum is arranged, the near-end of described probe is outside vacuum (-tight) housing.
2. the shock dropping device of the probe of focused ion bundle board as claimed in claim 1 is it is characterised in that described confined space
Vacuum bottom be less than 10-3mbar.
3. the shock dropping device of the probe of focused ion bundle board as claimed in claim 2 is it is characterised in that described confined space
Vacuum be less than 10-5mbar.
4. a kind of shock dropping method of the shock dropping device of the probe of focused ion bundle board as claimed in claim 1, its feature exists
In described shock dropping method includes：Vacuum (-tight) housing is set at the outer end of described probe, and described vacuum (-tight) housing simultaneously encloses shape with described probe
Become confined space, and described confined space is in that vacuum is arranged, the near-end of described probe is outside vacuum (-tight) housing.
5. the shock dropping method of the shock dropping device of the probe of focused ion bundle board as claimed in claim 4 is it is characterised in that institute
The vacuum bottom stating confined space is less than 10-3mbar.
6. the shock dropping method of the shock dropping device of the probe of focused ion bundle board as claimed in claim 4 is it is characterised in that institute
The vacuum bottom stating confined space is less than 10-5mbar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410217853.0A CN103969104B (en) | 2014-05-21 | 2014-05-21 | Vibration reduction device and method for focusing ion beam machine probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410217853.0A CN103969104B (en) | 2014-05-21 | 2014-05-21 | Vibration reduction device and method for focusing ion beam machine probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103969104A CN103969104A (en) | 2014-08-06 |
| CN103969104B true CN103969104B (en) | 2017-02-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410217853.0A Active CN103969104B (en) | 2014-05-21 | 2014-05-21 | Vibration reduction device and method for focusing ion beam machine probe |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107389455B (en) * | 2017-09-05 | 2023-06-06 | 中国工程物理研究院流体物理研究所 | Cooling device and method for initial temperature of sample in magnetic drive oblique wave compression |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6777674B2 (en) * | 2002-09-23 | 2004-08-17 | Omniprobe, Inc. | Method for manipulating microscopic particles and analyzing |
| JP4177176B2 (en) * | 2003-06-04 | 2008-11-05 | 株式会社日立ハイテクノロジーズ | Micro hand |
| US7356900B2 (en) * | 2003-10-27 | 2008-04-15 | Sii Nanotechnology Inc. | Manipulator needle portion repairing method |
| CN100491967C (en) * | 2004-11-29 | 2009-05-27 | 陆轻锂 | Micro mirror box for scan probe microscope |
| JP4573794B2 (en) * | 2005-03-31 | 2010-11-04 | 東京エレクトロン株式会社 | Probe card and microstructure inspection device |
| US7423263B2 (en) * | 2006-06-23 | 2008-09-09 | Fei Company | Planar view sample preparation |
| CN102749570A (en) * | 2012-07-26 | 2012-10-24 | 上海宏力半导体制造有限公司 | Wafer test device and wafer test method for probe station |
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| CN103969104A (en) | 2014-08-06 |
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