JP6133603B2 - Inspection data processing equipment for charged particle beam equipment - Google Patents

Description

  The present invention relates to an inspection data processing apparatus that manages inspection data of an inspection apparatus in a charged particle beam apparatus.

  A charged particle beam apparatus represented by a scanning electron microscope (SEM) detects charged particles (secondary electrons, etc.) obtained by scanning a charged particle beam such as an electron beam on a sample, and forms an image. Device. In particular, in an SEM for measuring or inspecting a semiconductor, a program storing an operation condition of an apparatus called a recipe is created in advance in order to measure a circuit pattern existing at a desired position on a semiconductor device. In SEM, measurement or inspection is performed based on the conditions set in the recipe.

  Patent Document 1 discloses an electron beam inspection apparatus capable of observing the shape of a fine pattern and dimensional inspection. In Patent Document 1, the user selects a clearer image by adjusting the signal amounts of the secondary electron signal and the reflected electron signal on the screen, and measurement or inspection is performed using this image.

JP 2000-260380 A

  Conventionally, an operator visually observes an image captured by the SEM as described above. That is, the operator determines the circuit pattern manufacturing result based on experience and intuition. Therefore, there are individual differences in the determination results. In addition, with the recent increase in functionality and multifunction of electronic devices, the inspection condition data used in the semiconductor device inspection apparatus has become more complex, and the amount of data has been steadily increasing. Therefore, it takes time for the determination by the operator.

  The present invention has been made in view of such a situation, and provides a technique for automating visual classification for length measurement or shape observation and supporting an operator's determination.

  In order to solve the above problems, for example, the configuration described in the claims is adopted. The present application includes a plurality of means for solving the above-described problems. To give an example, an inspection data processing apparatus for a charged particle beam apparatus is provided. The inspection data processing device uses a length measurement data from the charged particle beam device to calculate a length measurement value of a pattern to be measured in an observation image captured by the charged particle beam device; and A contour line extraction unit that extracts a contour line of a length measurement target pattern in the observation image and calculates a shape error value between design data of the length measurement target pattern and the contour line, the length measurement value, and the shape Statistical processing is performed on the error value, and information corresponding to the first value indicating the variation of the length measurement value, the second value indicating the variation of the shape error value, and the position information of the length measurement target pattern is generated. And a display unit that displays at least information created by the statistical calculation unit.

  According to another example, an inspection data processing apparatus for a charged particle beam apparatus uses a length measurement data from the charged particle beam apparatus to measure a length in an observation image captured by the charged particle beam apparatus. A length measurement unit that calculates a length measurement value of the pattern, and statistically processes the length measurement value, and creates information in which the first value indicating variation in the length measurement value and the position information of the pattern to be measured correspond to each other. And a display unit that displays at least information created by the statistical calculation unit.

  According to another example, the inspection data processing device for the charged particle beam device extracts a contour line of the inspection target pattern in the observation image from the charged particle beam device, and the design data of the inspection target pattern A contour line extraction unit that calculates a shape error value between the contour line, a statistical processing of the shape error value, a first value indicating variation in the shape error value, and position information of the inspection target pattern A statistical calculation unit that generates corresponding information; and a display unit that displays at least the information generated by the statistical calculation unit.

According to the present invention, it is possible to automate classification relating to length measurement or shape observation, and to support determination by an operator.
Further features related to the present invention will become apparent from the description of the present specification and the accompanying drawings. Further, problems, configurations and effects other than those described above will be clarified by the description of the following examples.

It is a figure which shows an example of a structure of the charged particle beam apparatus which concerns on embodiment of this invention. It is a figure which shows an example of a structure of the test | inspection data processing apparatus which concerns on embodiment of this invention. It is a figure explaining the process of the length measurement part of the test | inspection data processing apparatus which concerns on embodiment of this invention. It is a figure explaining the process of the outline extraction part of the test | inspection data processing apparatus which concerns on embodiment of this invention. It is a figure which shows an example of the screen for parameter settings. It is a figure which shows an example of the screen for parameter settings. It is a figure which shows an example of the information output by the statistical process in a statistical calculation part. It is a figure which shows an example of the image information produced by a statistics calculation part. It is a figure which shows an example of the screen which displayed the information output by the statistics calculation part.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. The accompanying drawings show specific embodiments in accordance with the principle of the present invention, but these are for the understanding of the present invention, and are never used to interpret the present invention in a limited manner. is not.

  A charged particle beam apparatus is an apparatus that accelerates particles (charged particles) having a charge such as electrons and cations with an electric field and irradiates a sample. A charged particle beam apparatus performs observation, analysis, processing, and the like of a sample by utilizing an interaction between the sample and charged particles. Examples of the charged particle beam apparatus include an electron microscope, an electron beam drawing apparatus, an ion processing apparatus, and an ion microscope. The present invention is applicable to these charged particle beam apparatuses.

<Configuration of charged particle beam device>
FIG. 1 is a diagram illustrating an example of a configuration of a charged particle beam apparatus according to an embodiment of the present invention. As shown in FIG. 1, the charged particle beam device 100 includes a charged particle optical system device 10, a control computer 20, and a control device 30. The control computer 20 includes a storage device (not shown), and this storage device stores information such as design data 21 on the pattern design of the sample 8. The control computer 20 includes an image processing device 22, a display device (display, etc.) 23, and an input device (keyboard, mouse, etc.) 24.

  The charged particle optical system device 10 includes a charged particle source 1, a focusing lens 3, a deflection lens 4, an objective lens 5, a secondary electron detector 6, and a sample stage 7. In the charged particle optical system device 10, the charged particle beam 2 emitted from the charged particle source 1 is focused by the focusing lens 3, and the focused charged particle beam 2 is scanned and deflected by the deflection lens 4. Then, the charged particle beam 2 is focused by the objective lens 5, and the charged particle beam 2 is irradiated onto the sample 8 held on the sample stage 7. Then, the secondary electron detector 6 detects the secondary electrons 9 emitted from the irradiated part of the charged particle beam 2 of the sample 8.

  Then, a detection signal of the secondary electrons 9 detected by the secondary electron detector 6 is transmitted to the image processing device 22 via an amplifier, an A / D (Analog to Digital) converter, etc. (not shown). The image processing device 22 generates an image based on the secondary electrons 9 from the surface of the sample 8 as an observation image based on the detection signal from the secondary electron detector 6 and the scanning control signal of the deflection lens 4. The generated observation image is displayed on the display device 23.

  The control computer 20 is connected to the charged particle optical system device 10 via the control device 30. The control computer 20 acquires information about various imaging conditions (observation region, magnification, brightness, etc.) input by the user to acquire an observation image via the input device 24 and transmits the information to the control device 30. The control device 30 controls operations of the charged particle source 1, the focusing lens 3, the deflection lens 4, the objective lens 5, and the sample stage 7 in the charged particle optical system device 10 based on such information. Further, the control computer 20 further performs image processing on the observation image generated by the image processing device 22 to generate an image for more advanced observation, length measurement, and inspection, and the result is displayed on the display device 23. May be displayed.

  Further, the control computer 20 includes a length measuring unit (not shown) that measures a circuit pattern existing at a desired position on the semiconductor device as the sample 8. The storage device of the control computer 20 stores in advance a program that stores operation conditions of the device called a recipe. The length measurement unit of the control computer 20 performs a length measurement process on the observation image based on the conditions set in the recipe, and outputs a length measurement file.

<Configuration of inspection data processing device>
FIG. 2 is a diagram showing an example of the configuration of the inspection data processing apparatus according to the embodiment of the present invention. The inspection data processing device 200 is an information processing device such as a workstation or a personal computer. The inspection data processing device 200 includes a central processing unit, an auxiliary storage device, a main storage device, and an input / output device. For example, the central processing unit is configured by a processor (or a calculation unit) such as a CPU (Central Processing Unit). For example, the auxiliary storage device is a hard disk, the main storage device is a memory, and the input / output devices are a keyboard, a pointing device (such as a mouse), and a display. In FIG. 2, drawing of these components is omitted for simplicity.

  The inspection data processing apparatus 200 includes a length measurement unit 202, a contour line extraction unit 204, a statistical calculation unit 206, a repository 208, a transmission processing unit 209, a setting processing unit 210, and a search processing unit 212. Here, these processing units 202, 204, 206, 209, 210, and 212 may be realized as functions of a program executed on the computer. That is, the processing of these processing units 202, 204, 206, 209, 210, and 212 may be stored in a memory as program codes, and the CPU may execute each program code. Further, these processing units 202, 204, 206, 209, 210, and 212 may be realized by hardware, for example, by designing with an integrated circuit.

  The repository 208 is stored in the auxiliary storage device described above. In the following description (FIG. 7), the information in the repository 208 will be described using a “table” structure. However, such information does not necessarily have to be represented by a data structure of a table, such as a list, a queue, etc. It may be expressed in the data structure or other than that. Therefore, “table”, “list”, “DB”, “queue”, etc. may be simply referred to as “information” to indicate that they do not depend on the data structure.

  The inspection data processing apparatus 200 is connected to the charged particle beam apparatus 100 via a network such as a LAN. The inspection data processing apparatus 200 receives the first length measurement data 201 and the design data 21 from the charged particle beam apparatus 100. Design data 211 is acquired. The method for acquiring the first length measurement data 201 uses a function provided by the charged particle beam apparatus 100 and is not particularly described here.

  The first length measurement data 201 includes a length measurement file, an observation image, and a file of imaging conditions for the observation image. Here, the length measurement file includes information on the measured pattern, the measured position, and the length measurement value, and is output by the length measurement unit in the charged particle beam apparatus 100. The observation image may be an image actually captured by the charged particle beam device 100 or an image after a predetermined image processing is executed. The observation condition imaging condition file includes imaging condition information set by the user via the input device 24. Further, the design data 211 includes coordinate information of patterns included in the design data 21.

  Next, processing of each component of the inspection data processing apparatus 200 will be described with reference to the drawings. FIG. 3 is a diagram for explaining the processing of the length measuring unit 202 of the inspection data processing apparatus 200. The length measurement unit 202 creates a profile image 213 for the length measurement target pattern in the observation image of the first length measurement data 201, and executes a length measurement process. In FIG. 3, a hole is used as a length measurement target pattern as an example, but other length measurement target patterns may be used.

  Here, the profile defines the X direction of the image on the horizontal axis and the signal value of the detection signal from the secondary electron detector 6 on the vertical axis, and the charged particle beam 2 with respect to a desired pattern. The amount of secondary electrons 9 generated when scanning irradiation is plotted. In the example of FIG. 3, the profile image 213 is obtained by superimposing the profile on the observation image. It is not always necessary to create the illustrated profile image 213, and at least the above-described profile information may be calculated. The length measurement unit 202 calculates a length measurement value again using the profile.

  The length measurement unit 202 outputs the first length measurement data 201, the profile image 213, and the calculated length measurement value to the contour line extraction unit 204 as second length measurement data 203. The length measuring unit 202 also outputs the design data 211 to the contour line extracting unit 204.

  FIG. 4 is a diagram for explaining the processing of the contour line extraction unit 204 of the inspection data processing apparatus 200. The contour line extraction unit 204 performs a contour line extraction process on the profile image 213 in the second length measurement data 203 to create an image 214 with a contour line added thereto. The contour line extraction unit 204 extracts a white band contour line of the profile image 213. An existing process can be used for the outline extraction process. For example, the brightness distribution of the white band is recognized as a waveform, and the brightness value can be extracted by plotting a predetermined threshold value. The contour line extraction process is not limited to this, and may be extracted by other methods.

  The contour extraction unit 204 compares the extracted contour with the design data 211 and calculates a shape error as a numerical value. The shape error is calculated from the difference between the extracted contour line and the design data 211, and can be calculated by comparing the coordinate information of the extracted contour line with the coordinate information of the pattern included in the design data 211. Then, the contour line extraction unit 204 outputs the second length measurement data 203, the image 214, and the calculated shape error to the statistical calculation unit 206 as third length measurement data 205.

  The statistical calculation unit 206 performs statistical processing on the third length measurement data 205. In statistical processing, a value indicating variation in length measurement value and a value indicating variation in shape error are calculated. Note that the statistical processing is not limited to the calculation of these values.

  In order to execute the above-described statistical processing, parameters are registered in the statistical calculation unit 206 in advance. Hereinafter, an example in which “error range” is set as a parameter will be described. The parameter may be registered in advance as a fixed value, or may be set by a user operation. For example, the setting processing unit 210 displays a parameter setting screen on the display screen of the inspection data processing apparatus 200. FIG. 5 is a diagram illustrating an example of a parameter setting screen. The parameter setting screen 221 includes a calculation type display field 222, an error range display field 223, a parameter setting button 224, an OK button 228, and a cancel button 229.

  In the calculation type display field 222, the type of statistical processing executed in the statistical calculation unit 206 is displayed. In the error range display field 223, an error range corresponding to the type in the calculation type display field 222 is displayed. In the error range display field 223, initial parameters of the system are registered, but can be arbitrarily changed by the user. When setting a parameter, when the calculation type display field 222 is double-clicked or the parameter setting button 224 is clicked, a transition is made to the screen of FIG.

  FIG. 6 shows a screen for setting the value in the error range display field 223 of FIG. The error range setting screen 231 includes a graph display field 232, a notification member list 234, an OK button 235, and a cancel button 236. The error range setting screen 231 displays the name of the calculation type targeted in the parameter setting screen 221 (here, “measurement variation in the same pattern”).

  In addition, a normal distribution graph is displayed in the graph display field 232 of the error range setting screen 231. Here, μ is an average value and σ is a standard deviation. In this normal distribution graph, a range corresponding to the value in the error range display field 223 in FIG. 5 is visually displayed as an arrow 233. The arrow 233 indicating the error range can be changed by a mouse drag operation. When the arrow 233 indicating the error range is changed and the OK button 235 is clicked, the screen changes to the parameter setting screen 221 in FIG. 5 and the changed value is reflected in the error range display field 223 in FIG.

  In the error range setting screen 231, a user who is a mail notification target after processing by the statistical calculation unit 206 can also be set. The user can select a user in the notification member list 234 as appropriate. When the setting processing of FIG. 5 and FIG. 6 described above is completed, the setting processing unit 210 records the set parameter in a predetermined storage unit of the auxiliary storage device or outputs it to the statistical calculation unit 206.

  The statistical calculation unit 206 calculates a value indicating variation in length measurement value and a value indicating variation in shape error by statistical processing. Then, the statistical calculation unit 206 creates the data structure shown in FIG. 7 using the calculated values and the parameters set on the screen of FIG.

  FIG. 7 is a diagram illustrating an example of information output by statistical processing in the statistical calculation unit. The data structure 250 includes a sequence number 251 sequentially assigned to data, a pattern number 252 for identifying a length measurement target pattern, a length measurement value 253, a value 254 indicating variation in the length measurement value, and a value 254. The configuration item includes a level 255 indicating whether it is in the error range, a shape error value 256, a value 257 indicating variation in the shape error value, and a level 258 indicating whether the value 257 is in the error range. The data structure 250 is not limited to these pieces of information, and may include, for example, information on the measurement position corresponding to the measurement value 253 and other information.

  The length measurement value 253 is a length measurement value calculated by the length measurement unit 202. The value 254 may be a value indicating variation in the measured value, for example, a value indicating a deviation from the average. For example, the value 254 may be a value that can be calculated by existing statistical processing such as a deviation from the average, a deviation value, or a Z value. In the level 255, the flag “E” is set when the error range corresponds to the error range display field 223 in FIG.

  The shape error value 256 is a shape error value calculated by the contour line extraction unit 204. The value 257 may be a value indicating variation in the shape error value, and may be a value indicating a deviation from the average, for example. For example, the value 257 may be a value that can be calculated by existing statistical processing such as a deviation from the average, a deviation value, or a Z value. The level “258” is set with a flag “E” when the error range corresponds to the error range display field 223 of FIG.

  The statistical calculation unit 206 creates the data structure 250 of FIG. 7 and determines whether the number of values corresponding to the error range (that is, the number of flags “E”) exceeds a predetermined threshold value. If the predetermined threshold is exceeded, the statistical calculation unit 206 outputs a mail notification instruction to the transmission processing unit 209. The transmission processing unit 209 transmits an email to the user selected in the notification member list 234 of FIG.

  Further, the statistical calculation unit 206 creates map information shown in FIG. 8 using information on the measurement position of the measurement file. The map information shown in FIG. 8 is image information in which the information in FIG. 7 is drawn corresponding to each measurement point. Here, the map information shown in FIG. 8 is image information in which markers corresponding to at least one of a value indicating variation in length measurement values and a value indicating variation in shape error are displayed for each position of the measurement target pattern. For example, when the flag “E” is set at levels 255 and 258, a circular marker 263 is displayed at the position of the measurement point. On the other hand, when the flag “E” is not set at the levels 255 and 258, a square marker 264 is displayed at the position of the measurement point. In addition, the statistical calculation unit 206 creates an image in which the image of the wafer 261 and the chip matrix 262 are superimposed on the image information. Thereby, the operator can know at which position on the wafer and the chip matrix there is a length measurement value and a shape error.

  Note that the image information created by the statistical calculation unit 206 is not limited to this format. The shape of the marker may be changed depending on whether the flag “E” is set at level 255 or the flag “E” is set at level 258. If the flag “E” is set at both levels 255 and 258, the shape of the marker may be further changed. Further, instead of distinguishing by shape, markers may be distinguished and displayed by a plurality of colors. In this way, by distinguishing the type of error by shape or color, the operator can easily know whether there is an abnormal value in the length measurement value or whether there is an abnormal value in the shape error.

  As shown in FIG. 2, the statistical calculation unit 206 outputs the csv file 101 including the data structure shown in FIG. 7 and the image data 102 which is the image information shown in FIG. The output csv file 101 and the image data 102 are displayed on the display of the inspection data processing device 200 or another display device connected via a network (for example, the display device 23 of the charged particle beam device 100).

  FIG. 9 shows an example of a displayed screen. As shown in FIG. 9, the image information shown in FIG. 8 is displayed on the screen 271. Further, the information of the csv file 101 may be displayed in conjunction with the image. For example, when the measurement point 274 is clicked with an input device such as a pointing device, the pattern number, measurement value, and shape error corresponding to the measurement point 274 (pattern number 252, measurement value 253, value in FIG. 7) 256, etc.) may be displayed in the length measurement data column 273.

  Further, the statistical calculation unit 206 may display information on the third length measurement data 205 on the screen in addition to the csv file 101 and the image data 102. For example, the statistical calculation unit 206 may also output the image 214 created by the contour line extraction unit 204 and display the image 214 in the image display field 272. The image display field 272 is not limited to this image, and an arbitrary image such as an image with only a contour line or a profile may be displayed.

  Further, the statistical calculation unit 206 outputs the csv file 101 and the image data 102 to the transmission processing unit 209, and the transmission processing unit 209 attaches the csv file 101 and the image data 102 to the mail, and the member list 234 in FIG. You may make it transmit to the user of.

  Further, the statistical calculation unit 206 stores the third length measurement data 205, the csv file 101, and the image data 102 in the repository 208 as the fourth length measurement data 207. At this time, the statistical calculation unit 206 also adds information about the target charged particle beam device 100, recipe, and inspection date, and stores them in the repository 208. For example, the user can use the search processing unit 212 to set search conditions (target charged particle beam device, recipe, inspection date, pattern type, etc.) and search information in the repository 108. As a result, the user can make a determination while referring to the information of the past examination.

  According to the present embodiment, a statistical calculation result of the length measurement error value or the shape error value is obtained, and the length measurement error value or the shape error value is an abnormal value (a value corresponding to the error range) based on the statistical calculation result. Can be determined. Therefore, the operator can refer to the result automatically classified into the error range, and a pattern determination result with little influence of the individual difference of the operator can be obtained. In addition, since the result of automatic classification is displayed in a map in association with the position information of the length measurement target pattern, the operator can make a determination in association with the position information. Further, by displaying the map, the operator can know the tendency of variation in the length measurement error value or the shape error value depending on the position.

  Further, according to the present embodiment, the level is classified according to the number of abnormal values (values corresponding to the error range), and when the number of abnormal values reaches a certain level, an email is immediately sent to the user as an alarm. can do.

  In addition, this invention is not limited to the Example mentioned above, Various modifications are included. For example, the above-described embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described. In addition, a part of the configuration of one embodiment may be replaced with the configuration of another embodiment, and the configuration of another embodiment may be added to the configuration of one embodiment. Further, it is possible to add, delete, and replace other configurations for a part of the configuration of each embodiment.

  For example, the contour line extraction unit 204 may be deleted in FIG. 2, and the inspection data processing apparatus 200 may execute only the process related to the value indicating the variation in the measured value. In addition, the length measurement unit 202 may be deleted in FIG. 2, and the inspection data processing apparatus 200 may execute only the process related to the value indicating the variation in the shape error value. In terms of supporting at least one of length measurement and shape observation, it is only necessary to calculate a value relating to at least one of length measurement and shape observation, and thus it is possible to assist the user's determination.

  9 shows an example in which the image information of FIG. 8 is displayed, the information of the table structure of FIG. 7 may be displayed on the screen.

  As described above, the configuration of the embodiment can be realized by hardware, for example, by designing a part or all of them with an integrated circuit. Further, the present invention may be realized by a program code of software that realizes the functions of the embodiment. In this case, a storage medium in which the program code is recorded is provided to the information processing apparatus, and the information processing apparatus (or CPU) reads the program code stored in the storage medium. In this case, the program code itself read from the storage medium realizes the functions of the above-described embodiments, and the program code itself and the storage medium storing the program code constitute the present invention. As a storage medium for supplying such program code, for example, a flexible disk, CD-ROM, DVD-ROM, hard disk, optical disk, magneto-optical disk, CD-R, magnetic tape, nonvolatile memory card, ROM Etc. are used.

  Furthermore, by distributing the program code of the software that realizes the functions of the embodiment via a network, the program code is stored in a storage device of an information processing device or a storage medium such as a CD-RW or CD-R and used. Sometimes, the CPU of the information processing apparatus may read and execute the program code stored in the storage device or the storage medium.

  Those skilled in the art will appreciate that there are numerous combinations of hardware, software, and firmware that are suitable for implementing the present invention. For example, the program code for realizing the functions described in the present embodiment can be implemented by a wide range of programs or script languages such as assembler, C / C ++, perl, Shell, PHP, Java (registered trademark).

  Further, the control lines and information lines in the drawings are those that are considered necessary for the explanation, and not all the control lines and information lines on the product are necessarily shown. All the components may be connected to each other.

100 charged particle beam device 10 charged particle optical system device 20 control computer 30 control device 1 charged particle source 2 charged particle beam 3 focusing lens 4 deflection lens 5 objective lens 6 secondary electron detector 7 sample stage 8 sample 9 secondary electron 200 Inspection data processing apparatus 201 First length measurement data 202 Length measurement unit 203 Second length measurement data 204 Outline extraction unit 205 Third length measurement data 206 Statistical calculation unit 207 Fourth length measurement data 208 Repository 209 Transmission processing Unit 210 setting processing unit 211 design data 212 search processing unit

Claims (14)

An inspection data processing device for a charged particle beam device,
Using the length measurement data from the charged particle beam device, a length measurement unit that calculates a length measurement value of a length measurement target pattern in an observation image captured by the charged particle beam device;
A contour line extraction unit that extracts a contour line of a length measurement target pattern in the observation image and calculates a shape error value between design data of the length measurement target pattern and the contour line;
The length measurement value and the shape error value are statistically processed, a first value indicating variation in the length measurement value, a second value indicating variation in the shape error value, and position information of the length measurement target pattern A statistical calculator that creates information corresponding to
A display unit that displays at least one of the measurement value variation and the shape error value variation created by the statistical calculation unit at a corresponding position on a wafer or chip;
An inspection data processing apparatus comprising: The inspection data processing apparatus according to claim 1,
The information created by the statistical calculation unit is image information in which a marker corresponding to at least one of the first value and the second value is displayed for each position of the length measurement target pattern. Inspection data processing device. In the inspection data processing apparatus according to claim 2,
The inspection data processing apparatus, wherein the marker is displayed by changing a shape or a color when at least one of the first value and the second value is within a predetermined error range. In the inspection data processing apparatus according to claim 2,
The image information, test data processing apparatus, characterized in that it was created an image and the image of the chip matrix inspected wafer further Te heavy ne Align. The inspection data processing apparatus according to claim 1,
The statistical calculation unit calculates a determination value for determining whether each of the first value and the second value is within a predetermined error range, and calculates the first value, the second value, and the determination An inspection data processing apparatus characterized by creating information corresponding to a value. In the inspection data processing apparatus according to claim 5,
A transmission processing unit configured to transmit a mail to a user selected in advance when the number of the first value and the second value within the predetermined error range exceeds a predetermined threshold value; A characteristic inspection data processing apparatus. In the inspection data processing apparatus according to claim 5,
An inspection data processing apparatus, further comprising a setting processing unit for setting the predetermined error range on a screen of the display unit. In the inspection data processing apparatus according to claim 7,
The setting processing unit, inspection and displaying a graph of the normal distribution for setting each of the predetermined error range of the first value and said second value on the screen of the display unit Data processing device. In the inspection data processing apparatus according to claim 2,
The display unit further displays the length measurement value and the shape error value,
An inspection data processing apparatus, wherein when the position of the pattern for length measurement on the image information displayed on the display unit is designated, the corresponding length measurement value and the shape error value are displayed. The inspection data processing apparatus according to claim 1,
Inspection data processing characterized in that the display unit further displays an image in which at least one of a profile image created by the length measurement unit and a contour line extracted by the contour line extraction unit is superimposed on the observation image apparatus. The inspection data processing apparatus according to claim 1,
The inspection data processing apparatus further comprising a storage unit for storing information created by the statistical calculation unit. The inspection data processing apparatus according to claim 11,
An inspection data processing apparatus, further comprising: a search processing unit for searching for information stored in the storage unit. An inspection data processing device for a charged particle beam device,
Using the length measurement data from the charged particle beam device, a length measurement unit that calculates a length measurement value of a length measurement target pattern in an observation image captured by the charged particle beam device;
A statistical calculator that statistically processes the length measurement value and creates information in which the first value indicating variation in the length measurement value and the position information of the length measurement target pattern correspond to each other;
A display unit that displays at least information on variations in the measured length value created by the statistical calculation unit at a corresponding position on a wafer or a chip;
An inspection data processing apparatus comprising: An inspection data processing device for a charged particle beam device,
An outline extracting unit that extracts an outline of an inspection target pattern in an observation image from the charged particle beam device and calculates a shape error value between design data of the inspection target pattern and the outline; and A statistical calculation unit that statistically processes an error value and creates information in which the first value indicating variation in the shape error value and the position information of the inspection target pattern correspond to each other;
A display unit that displays at least information on the variation of the shape error value created by the statistical calculation unit at a corresponding position on a wafer or a chip;
An inspection data processing apparatus comprising:

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