CN103963381A - Metal-based CCL (copper clad laminate) and preparation method thereof - Google Patents
Metal-based CCL (copper clad laminate) and preparation method thereof Download PDFInfo
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- CN103963381A CN103963381A CN201410078764.2A CN201410078764A CN103963381A CN 103963381 A CN103963381 A CN 103963381A CN 201410078764 A CN201410078764 A CN 201410078764A CN 103963381 A CN103963381 A CN 103963381A
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Abstract
The invention discloses a metal-based CCL (copper clad laminate) and a preparation method thereof. The metal-based CCL comprises a copper foil layer, an insulation layer and a metal base layer which are sequentially stacked, wherein the insulation layer contains no glass fiber and is a coating formed by directly smearing a glue solution on the metal base layer with a silk-screen printing manner, and the thickness of the insulation layer is 50-200 mu m. The heat conductivity coefficient of the metal-based CCL is increased, heat resistance is reduced, and the heat conductivity of a product is improved.
Description
Technical field
The present invention relates to printed circuit board field, relate in particular to a kind of metal-based copper-clad plate and preparation method thereof.
Background technology
Along with the develop rapidly of printed circuit board industry and LED industry, the power of electronic product is more and more higher, and placement density is increasing, how to solve heat radiation and Structure Designing Problem, has become a huge challenge of current electronics industry design.Metal-based copper-clad plate solves one of effective means of heat dissipation problem beyond doubt.Compare with CEM-3 sheet material with traditional FR-4, metal-based copper-clad plate has higher thermal diffusivity, makes metal-based copper-clad plate have fabulous thermal conducting function, meanwhile, and the feature that it also possesses good dimensional stability and easily processes.In the middle of the metal-based copper-clad plate of domestic a large amount of uses at present, insulating barrier is made up of glass fabric gluing, strong request metal-based copper-clad plate has the technology trends of high heat radiation on the one hand, on the other hand, in insulating barrier, glass fibre has reduced metal-based copper-clad plate overall thermal conductivity as hot non-conductor.Therefore,, for research and the solution of above-mentioned technical problem, become the research topic of those skilled in the art's a outbalance.
Summary of the invention
Technical problem to be solved by this invention has been to overcome the defect of the poor thermal conductivity of insulating barrier in metal-based copper-clad plate of the prior art, and a kind of metal-based copper-clad plate and preparation method thereof is provided.Metal-based copper-clad plate of the present invention has improved the thermal conductivity factor of metal-based copper-clad plate, has reduced thermal resistance, has improved product thermal conductivity.
The present invention solves above-mentioned technical problem by following technical proposals:
The invention provides a kind of metal-based copper-clad plate; Described metal-based copper-clad plate is made up of stacked successively copper foil layer, insulating barrier and metal-based layer; Described insulating barrier does not contain glass fibre; The coating of described insulating barrier for glue is directly spread upon on metal-based layer to be formed in the mode of serigraphy; The thickness of described insulating barrier is 50-200 μ m.
In the present invention, described metal-based layer is preferably aluminium sheet, copper coin, silicon steel plate, corrosion resistant plate or aluminium alloy plate.
In the present invention, the composition of raw materials of described glue preferably comprises the component of following mass parts: resin 450-500 part, curing agent 8-12 part, curing accelerator 0.2-0.3 part, solvent 100-120 part and the inorganic filler that accounts for the 0-75% of the gross mass of described glue.
Wherein, described resin can be the conventional various resins that use of this area glue used for printed circuit board, is preferably that epoxy resin, span carry out one or more in amide resin and polyurethane resin.Described epoxy resin preferably comprises one or more in novolac epoxy resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin, brominated epoxy resin and phosphorous epoxy resin.The epoxide equivalent of described epoxy resin is preferably 400-550.
Wherein, described curing agent can be printed circuit board field conventional various curing agent that use while preparing glue, are preferably one or more in amine curing agent, acid anhydride type curing agent and high score subclass curing agent.Described amine curing agent can be selected the amine curing agent of the various routines in this area, is preferably one or more in ethylenediamine, 2-ethene-3-amine, 2-amino-2-phenylmethane, dicyandiamide, 2-amino-2-phenol and organic hydrazides.Described acid anhydride type curing agent can be selected the acid anhydride type curing agent of the various routines in this area, is preferably phthalic anhydride and/or 2-phenylate-4-acid anhydrides.Described high score subclass curing agent can be selected the high score subclass curing agent of the various routines in this area, is preferably phenolic resins and/or benzoxazine resin.
Wherein, described curing accelerator can be selected the conventional various curing accelerators that use in the glue used for printed circuit board of this area, preferably comprises tertiary amines curing accelerator and/or imidazoles curing accelerator.Described tertiary amines curing accelerator can be selected the tertiary amines curing accelerator of the various routines in this area, is preferably benzyl-2-aniline and/or triethanolamine.Described imidazoles curing accelerator can be selected the imidazoles curing accelerator of the various routines in this area, is preferably one or more in 1-methylimidazole, glyoxal ethyline, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and 2-undecyl imidazole.
Wherein, described solvent can be selected the conventional various solvents that use in the glue used for printed circuit board of this area, is preferably one or more in acetone, butanone, cyclohexanone, hexone, dimethyl formamide, dimethylacetylamide, EGME and propylene glycol monomethyl ether.
Wherein, the conventional various inorganic fillers that use when described inorganic filler can select printed circuit board field to prepare glue are preferably one or more in aluminium nitride, boron nitride, silicon nitride, aluminium oxide, beryllium oxide, silica, magnesia, carborundum, ceramic powder and glass dust.The particle diameter of described inorganic filler is preferably 1-100 μ m.
The composition of raw materials of described glue is preferably any in following formula: formula one: in mass parts, resin is the novolac epoxy resin of 450-460 part, curing agent is the ethylenediamine of 8-9 part, curing accelerator is benzyl-2-aniline of 0.2-0.3 part, solvent is the acetone of 105-115 part, the boron nitride that inorganic filler is 15%-20%; Formula two: in mass parts, resin is the bisphenol A type epoxy resin of 480-490 part, and curing agent is 2-amino-2-phenylmethane of 10-12 part, and curing accelerator is the glyoxal ethyline of 0.2-0.3 part, solvent is the dimethyl formamide of 95-105 part, the aluminium nitride that inorganic filler is 25%-30%; Formula three: in mass parts, resin is the brominated epoxy resin of 490-500 part, and curing agent is the phthalic anhydride of 10-12 part, and curing accelerator is the triethanolamine of 0.2-0.3 part, solvent is the EGME of 95-105 part, the ceramic powder that inorganic filler is 35%-40%; Formula four: in mass parts, resin is two maleic anhydride resins of 450-460 part, curing agent is 2-amino-2-phenylmethane of 10-12 part, curing accelerator is the 2-undecyl imidazole of 0.2-0.3 part, solvent is the hexone of 95-105 part, the carborundum that inorganic filler is 50%-55%; Formula five: in mass parts, resin is the polyurethane resin of 450-460 part, and curing agent is 2-amino-2-phenol of 8-10 part, and curing accelerator is the 2-phenyl-4-methylimidazole of 0.2-0.3 part, solvent is the propylene glycol monomethyl ether of 95-105 part, the silicon nitride that inorganic filler is 70%-75%.
In the present invention, described glue preferably makes in the steps below: (1), by described curing agent, described curing accelerator and described solvent, is stirred to and dissolves to obtain mixture A; (2), by described mixture A and described mixed with resin, mixture B stirs to obtain; (3) in the time that the composition of raw materials of described glue comprises inorganic filler, described mixture B to be mixed with described inorganic filler, high speed shear, after slaking; In the time that the composition of raw materials of described glue does not comprise inorganic filler, by described mixture B slaking.
In step (1), the time of described stirring, so that described curing agent and described curing accelerator completely dissolve and are as the criterion, is preferably 2-5 hour.The rotating speed of described stirring is preferably 800-1500rpm.
In step (2), the time of described stirring is preferably 3-5 hour.The rotating speed of described stirring is preferably 1000-1500rpm.
In step (3), the time of described high speed shear is preferably 30-120 minute.The rotating speed of described high speed shear is preferably 2500-5000rpm.Described slaking can adopt the slaking operation of this area routine, is preferably to stir 6-8 hour with the rotating speed of 1000-1500rpm.
In the present invention, the material of described silk screen can adopt the conventional material of this area, as nylon mesh, terylene silk net, stainless steel cloth or nickel plating terylene silk net.
Wherein, the weaving method of described silk screen can adopt the various conventional weaving method of this area, as plain weave, twill weave, half twist weave or full strand are knitted.
Wherein, the sizing grid of described silk screen is this area routine, is preferably 60-160 order.
The present invention also provides the preparation method of above-mentioned metal-based copper-clad plate, it comprises the steps: that (1) directly spreads upon described glue on metal-based layer by the mode of serigraphy, be placed in baking oven and heat, make glue semi-solid preparation, obtain the prepreg of containing metal basic unit; (2) prepreg step (1) Suo Shu is covered with to copper foil layer, suppresses.
In step (1), described smearing preferably carried out on silk screen gluing machine.
In step (1), described serigraphy is preferably: screen printing forme is overlayed on metal-based layer, smear again glue, and pressurization makes glue transfer on metal-based layer by the eyelet of screen printing forme, then remove screen printing forme, make glue on metal-based layer, form the very thin but fine and close uniformly glue layer of a layer thickness.
In step (1), the temperature of described heating is preferably 170-220 DEG C; The time of described heating is preferably 2-5min; The gel time of described glue is preferably 70-130s.The fluidity of described prepreg is preferably 5%-20%, and the volatile matter of described prepreg is preferably≤0.75%.In described prepreg, the thickness of glue is preferably 50-200 μ m.
In step (2), the temperature of described compacting is preferably 135-220 DEG C, and the pressure of described compacting is preferably 20-40Kg/m
2, the time of described compacting is preferably 60-150min.
Making after metal-based copper-clad plate, preferably further comprising the steps of: dismounting, processing and inspection.
Meeting on the basis of this area general knowledge, above-mentioned each optimum condition, can be combined, and obtains the preferred embodiments of the invention.
Agents useful for same of the present invention and raw material be commercially available obtaining all.
Positive progressive effect of the present invention is: metal-based copper-clad plate of the present invention has been removed the use of this hot non-conductor of glass fabric in insulating barrier, has improved the thermal conductivity factor of metal-based copper-clad plate, has reduced thermal resistance, has improved product thermal conductivity.
Detailed description of the invention
Mode below by embodiment further illustrates the present invention, but does not therefore limit the present invention among described scope of embodiments.The experimental technique of unreceipted actual conditions in the following example, according to conventional method and condition, or selects according to catalogue.
Embodiment 1
In the present embodiment, the raw material components of glue is shown in Table 1:
The material composition table of the glue of table 1 embodiment 1
| Novolac epoxy resin | 450Kg |
| Ethylenediamine | 8Kg |
| Benzyl-2-aniline | 0.2Kg |
| Acetone | 110Kg |
| Boron nitride (particle diameter D50 be 5 μ m) | 110Kg |
Wherein, inorganic filler account for described glue gross mass 16.22%.
The preparation method of glue: ethylenediamine, benzyl-2-aniline and acetone are mixed, stir 4 hours taking rotating speed as 1000rpm; After it dissolves completely, then add novolac epoxy resin, fully stir 3 hours taking rotating speed as 1200rpm; After mixing, then add boron nitride, disperse 45 minutes taking rotating speed as 3500rpm high speed shear, then stir 6 hours taking rotating speed as 1200rpm, completely after slaking.
Adopt conventional manufacture method in this area to prepare metal-based copper-clad plate, pass through successively the processing procedure of gluing, lamination, compacting, dismounting, sharp processing.
Wherein, the processing procedure of gluing is: described glue is directly spread upon on aluminium sheet by the mode of serigraphy, be dried into gel, can make prepreg (selecting sizing grid is that 60 object silk screen gluing machines carry out serigraphy).Its technological parameter is: oven for gluing machine temperature is 220 DEG C, and the heat time is 2min, gel time 70s, and fluidity 15%, volatile matter≤0.75%, the THICKNESS CONTROL of prepreg is at 45-50 μ m.
The processing procedure of lamination is: by superimposed according to the order of sequence to above-mentioned prepreg and Copper Foil, obtain applications as laminates.
The processing procedure of compacting is: applications as laminates is placed in to press and carries out vacuum pressing-combining.Technological parameter is: hot pressing temperature is 135 DEG C, and hot pressing time is 60min, and pressure is 20Kg/m
2.
Embodiment 2
In the present embodiment, the raw material components of glue is shown in Table 2:
The material composition table of the glue of table 2 embodiment 2
| Bisphenol A type epoxy resin | 480Kg |
| 2-amino-2-phenylmethane | 12Kg |
| Glyoxal ethyline | 0.25Kg |
| Dimethyl formamide | 100Kg |
| Aluminium nitride (particle diameter D50 be 20 μ m) | 200Kg |
Wherein, inorganic filler account for described glue gross mass 25.24%.
The preparation method of glue: 2-amino-2-phenylmethane, glyoxal ethyline and dimethyl formamide are mixed, stir 2 hours taking rotating speed as 1500rpm; After it dissolves completely, then add bisphenol A type epoxy resin, fully stir 5 hours taking rotating speed as 1000rpm; After mixing, then add aluminium nitride, disperse 30 minutes taking rotating speed as 5000rpm high speed shear, then stir 6 hours taking rotating speed as 1500rpm, completely after slaking.
Adopt conventional manufacture method in this area to prepare metal-based copper-clad plate, pass through successively the processing procedure of gluing, lamination, compacting, dismounting, sharp processing.
Wherein, the processing procedure of gluing is: described glue is directly spread upon on aluminium sheet by the mode of serigraphy, be placed in baking oven and heat, make glue semi-solid preparation (selecting sizing grid is that 80 object silk screen gluing machines carry out serigraphy).Its technological parameter is: oven for gluing machine temperature is 210 DEG C, and the heat time is 2.5min, gel time 130s, and fluidity 20%, volatile matter≤0.75%, the THICKNESS CONTROL of prepreg is at 70-75 μ m.
The processing procedure of lamination is: above-mentioned prepreg and Copper Foil are pressed superimposed according to the order of sequence.
The processing procedure of compacting is: the applications as laminates of above-mentioned prepreg is placed in to press and carries out vacuum pressing-combining.Technological parameter is: hot pressing temperature is 220 DEG C, and hot pressing time is 150min, and pressure is 40Kg/m
2.
Embodiment 3
In the present embodiment, the raw material components of glue is shown in Table 3:
The material composition table of the glue of table 3 embodiment 3
| Brominated epoxy resin | 500Kg |
| Phthalic anhydride | 12Kg |
| Triethanolamine | 0.3Kg |
| EGME | 100Kg |
| Ceramic powder (particle diameter D50 be 35 μ m) | 400Kg |
Wherein, inorganic filler account for described glue gross mass 39.51%.
The preparation method of glue: phthalic anhydride, triethanolamine and EGME are mixed, stir 3 hours taking rotating speed as 800rpm; After it dissolves completely, then add brominated epoxy resin, fully stir 4 hours taking rotating speed as 1300rpm; After mixing, then add ceramic powder, disperse 120 minutes taking rotating speed as 2500rpm high speed shear, then stir 8 hours taking rotating speed as 1000rpm, completely after slaking.
Adopt conventional manufacture method in this area to prepare metal-based copper-clad plate, pass through successively the processing procedure of gluing, lamination, compacting, dismounting, sharp processing.
Wherein, the processing procedure of gluing is: described glue is directly spread upon on aluminium sheet by the mode of serigraphy, be placed in baking oven and heat, make glue semi-solid preparation (selecting sizing grid is that 100 object silk screen gluing machines carry out serigraphy).Its technological parameter is: oven for gluing machine temperature is 200 DEG C, and the heat time is 3.5min, gel time 90s, and fluidity 5%, volatile matter≤0.75%, the THICKNESS CONTROL of prepreg is at 90-95 μ m.
The processing procedure of lamination is: by superimposed according to the order of sequence to above-mentioned prepreg and Copper Foil, obtain applications as laminates.
The processing procedure of compacting is: the applications as laminates of above-mentioned prepreg is placed in to press and carries out vacuum pressing-combining.Technological parameter is: hot pressing temperature is 200 DEG C, and hot pressing time is 110min, and pressure is 25Kg/m
2.
Embodiment 4
In the present embodiment, the raw material components of glue is shown in Table 4:
The material composition table of the glue of table 4 embodiment 4
| Two maleic anhydride resins | 460Kg |
| 2-amino-2-phenylmethane | 12Kg |
| 2-undecyl imidazole | 0.3Kg |
| Hexone | 100Kg |
| Carborundum (particle diameter D50 be 60 μ m) | 600Kg |
Wherein, inorganic filler account for described glue gross mass 51.18%.
The preparation method of glue: 2-amino-2-phenylmethane, 2-undecyl imidazole and hexone are mixed, stir 2 hours taking rotating speed as 1400rpm; After it dissolves completely, then add two maleic anhydride resins, fully stir 5 hours taking rotating speed as 1000rpm; After mixing, then add carborundum, disperse 90 minutes taking rotating speed as 4500rpm high speed shear, then stir 7 hours taking rotating speed as 1400rpm, completely after slaking.
Adopt conventional manufacture method in this area to prepare metal-based copper-clad plate, pass through successively the processing procedure of gluing, lamination, compacting, dismounting, sharp processing.
Wherein, the processing procedure of gluing is: described glue is directly spread upon on aluminium sheet by the mode of serigraphy, be placed in baking oven and heat, make glue semi-solid preparation (selecting sizing grid is that 140 object silk screen gluing machines carry out serigraphy).Its technological parameter is: oven for gluing machine temperature is 170 DEG C, and the heat time is 5min, gel time 90s, and fluidity 15%, volatile matter≤0.75%, the THICKNESS CONTROL of prepreg is at 135-145 μ m.
The processing procedure of lamination is: by superimposed according to the order of sequence to above-mentioned prepreg and Copper Foil, obtain applications as laminates.
The processing procedure of compacting is: the applications as laminates of above-mentioned prepreg is placed in to press and carries out vacuum pressing-combining.Technological parameter is: hot pressing temperature is 155 DEG C, and hot pressing time is 100min, and pressure is 40Kg/m
2.
Embodiment 5
In the present embodiment, the raw material components of glue is shown in Table 5:
The material composition table of the glue of table 5 embodiment 5
| Polyurethane resin | 450Kg |
| 2-amino-2-phenol | 8Kg |
| 2-phenyl-4-methylimidazole | 0.2Kg |
| Propylene glycol monomethyl ether | 100Kg |
| Silicon nitride (particle diameter D50 be 85 μ m) | 1300Kg |
Wherein, inorganic filler account for described glue gross mass 70.0%.
The preparation method of glue: 2-amino-2-phenol, 2-phenyl-4-methylimidazole and propylene glycol monomethyl ether are mixed, stir 4 hours taking rotating speed as 1300rpm; After it dissolves completely, then add polyurethane resin, fully stir 5 hours taking rotating speed as 1500rpm; After mixing, then add silicon nitride, disperse 60 minutes taking rotating speed as 4500rpm high speed shear, then stir 7 hours taking rotating speed as 1500rpm, completely after slaking.
Adopt conventional manufacture method in this area to prepare metal-based copper-clad plate, pass through successively the processing procedure of gluing, lamination, compacting, dismounting, sharp processing.
Wherein, the processing procedure of gluing is: described glue is directly spread upon on aluminium sheet by the mode of serigraphy, be placed in baking oven and heat, make glue semi-solid preparation (selecting sizing grid is that 160 object silk screen gluing machines carry out serigraphy).Its technological parameter is: oven for gluing machine temperature is 210 DEG C, and the heat time is 2.5min, gel time 130s, and fluidity 15%, volatile matter≤0.75%, the THICKNESS CONTROL of prepreg is at 180-190 μ m.
The processing procedure of lamination is: by superimposed according to the order of sequence to above-mentioned prepreg and Copper Foil, obtain applications as laminates.The processing procedure of compacting is: the applications as laminates of above-mentioned prepreg is placed in to press and carries out vacuum pressing-combining.Technological parameter is: hot pressing temperature is 220 DEG C, and hot pressing time is 60min, and pressure is 30Kg/m
2.
Embodiment 6
In the present embodiment, described metal-based layer is silicon steel plate, and in glue, the content of inorganic filler is to account for 75% of glue gross mass, and all the other processing steps and condition are all with embodiment 1.
Embodiment 7
In the present embodiment, described metal-based layer is aluminium alloy plate, and for the preparation of not containing inorganic filler in the glue of insulating barrier, all the other processing steps and condition are all with embodiment 1.
Comparative example 1
In this comparative example, the raw material components of glue is with embodiment 1.
The preparation method of glue: ethylenediamine, benzyl-2-aniline and acetone are mixed, stir 4 hours taking rotating speed as 1000rpm; After it dissolves completely, then add novolac epoxy resin, fully stir 3 hours taking rotating speed as 1200rpm; After mixing, then add boron nitride, disperse 45 minutes taking rotating speed as 3500rpm high speed shear, then stir 6 hours taking rotating speed as 1200rpm, completely after slaking.
Adopt conventional manufacture method in this area to prepare metal-based copper-clad plate, pass through successively the processing procedure of gluing, lamination, compacting, dismounting, sharp processing.
Wherein, the processing procedure of gluing is: the glass cloth (being provided by Dehong Industry Co., Ltd. or Tai Jia glass fibre company) that described glue is spread upon to 1080 these specifications by conventional gluing mode is upper, is dried into gel, can make prepreg.Its technological parameter is: oven for gluing machine temperature is 180 DEG C, and the heat time is 2.5min, gel time 70s, and fluidity 15%, volatile matter≤0.75%, the Weight control of prepreg is at 1.0g/dm
2.Prepreg becomes insulating barrier, 1.0g/dm after plate compression moulding
2the corresponding thickness of insulating layer of weight indicator be 50 μ m left and right.
The processing procedure of lamination is: above-mentioned prepreg and Copper Foil is superimposed by copper foil layer, prepreg, metal-based layer order.
The processing procedure of compacting is: applications as laminates is placed in to press and carries out vacuum pressing-combining.Technological parameter is: hot pressing temperature is 135 DEG C, and hot pressing time is 60min, and pressure is 20Kg/m
2.
Comparative example 2
In this comparative example, the raw material components of glue is shown in Table 6:
The material composition table of table 6 comparative example 2 glue
| Bisphenol A type epoxy resin | 480Kg |
| 2-amino-2-phenylmethane | 12Kg |
| Glyoxal ethyline | 0.25Kg |
| Dimethyl formamide | 100Kg |
| Aluminium nitride (particle diameter D50 be 20 μ m) | 100Kg |
Wherein, inorganic filler account for described glue gross mass 14.4%.
The preparation method of glue: 2-amino-2-phenylmethane, glyoxal ethyline and dimethyl formamide are mixed, stir 2 hours taking rotating speed as 1500rpm; After it dissolves completely, then add bisphenol A type epoxy resin, fully stir 5 hours taking rotating speed as 1000rpm; After mixing, then add aluminium nitride, disperse 30 minutes taking rotating speed as 5000rpm high speed shear, then stir 6 hours taking rotating speed as 1500rpm, completely after slaking.
Adopt conventional manufacture method in this area to prepare metal-based copper-clad plate, pass through successively the processing procedure of gluing, lamination, compacting, dismounting, sharp processing.
Wherein, the processing procedure of gluing is: described glue is spread upon on the glass cloth of 1080 these specifications by conventional gluing mode, be dried into gel, can make prepreg.Its technological parameter is: oven for gluing machine temperature is 210 DEG C, and the heat time is 2.5min, gel time 130s, and fluidity 20%, volatile matter≤0.75%, the weight indicator of prepreg is controlled at 1.5g/dm
2.Prepreg becomes insulating barrier, 1.5g/dm after plate compression moulding
2the corresponding thickness of insulating layer of weight indicator be 75 μ m left and right.
The processing procedure of lamination is: above-mentioned prepreg and Copper Foil are pressed superimposed according to the order of sequence.
The processing procedure of compacting is: the applications as laminates of above-mentioned prepreg is placed in to press and carries out vacuum pressing-combining.Technological parameter is: hot pressing temperature is 220 DEG C, and hot pressing time is 150min, and pressure is 40Kg/m
2.
Effect embodiment 1
The basic mechanical design feature testing result of the metal-based copper-clad plate that employing embodiment 1-7 and comparative example 1-2 produce is as shown in table 7 and table 8.The method of testing of the thermal conductivity factor in the present invention is stable state hot plate method, is specially the standard test method of the thin heat conduction solid insulating material of ASTM D5470(heat conductivity).The method of testing of the thermal resistance in the present invention is TO-220, and normative reference is: the testing standard of the thermal conductance solid electrically insulating material heat transfer property that ASTM D5470-2006(is thin).
The test result of the basic mechanical design feature of table 7 embodiment 1-3 and comparative example 1-2
The test result of the basic mechanical design feature of table 8 embodiment 4-7
Can be found out by table 7,8, the metal-based copper-clad plate of making by the gluing mode of serigraphy, owing to having removed the use of glass fabric, thereby has improved the thermal conductivity factor of sheet material, reduces thermal resistance.Meanwhile, the traditional performance of metal-based copper-clad plate has also obtained larger lifting.
Claims (11)
1. a metal-based copper-clad plate, is characterized in that: described metal-based copper-clad plate is made up of stacked successively copper foil layer, insulating barrier and metal-based layer; Described insulating barrier does not contain glass fibre; The coating of described insulating barrier for glue is directly spread upon on metal-based layer to be formed in the mode of serigraphy; The thickness of described insulating barrier is 50-200 μ m.
2. metal-based copper-clad plate as claimed in claim 1, is characterized in that: described metal-based layer is aluminium sheet, copper coin, silicon steel plate, corrosion resistant plate or aluminium alloy plate; The composition of raw materials of described glue comprises the component of following mass parts: resin 450-500 part, curing agent 8-12 part, curing accelerator 0.2-0.3 part, solvent 100-120 part and the inorganic filler that accounts for the 0-75% of the gross mass of described glue.
3. metal-based copper-clad plate as claimed in claim 1, is characterized in that: the material of described silk screen is nylon mesh, terylene silk net, stainless steel cloth or nickel plating terylene silk net; The weaving method of described silk screen is that plain weave, twill weave, half twist weave or full strand are knitted; The sizing grid of described silk screen is 60-160 order.
4. metal-based copper-clad plate as claimed in claim 2, is characterized in that, described resin is that epoxy resin, span carry out one or more in amide resin and polyurethane resin; Described curing agent is one or more in amine curing agent, acid anhydride type curing agent and high score subclass curing agent; Described curing accelerator comprises tertiary amines curing accelerator and/or imidazoles curing accelerator; Described solvent is one or more in acetone, butanone, cyclohexanone, hexone, dimethyl formamide, dimethylacetylamide, EGME and propylene glycol monomethyl ether; Described inorganic filler is one or more in aluminium nitride, boron nitride, silicon nitride, aluminium oxide, beryllium oxide, silica, magnesia, carborundum, ceramic powder and glass dust.
5. metal-based copper-clad plate as claimed in claim 4, is characterized in that, described epoxy resin is one or more in novolac epoxy resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin, brominated epoxy resin and phosphorous epoxy resin; The epoxide equivalent of described epoxy resin is 400～550; Described amine curing agent is one or more in ethylenediamine, 2-ethene-3-amine, 2-amino-2-phenylmethane, dicyandiamide, 2-amino-2-phenol and organic hydrazides; Described acid anhydride type curing agent is phthalic anhydride and/or 2-phenylate-4-acid anhydrides; Described high score subclass curing agent is phenolic resins and/or benzoxazine resin; Described tertiary amines curing accelerator is benzyl-2-aniline and/or triethanolamine; Described imidazoles curing accelerator is one or more in 1-methylimidazole, glyoxal ethyline, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and 2-undecyl imidazole; The particle diameter of described inorganic filler is 1～100 μ m.
6. the metal-based copper-clad plate as described in claim 2,4 or 5, is characterized in that: described glue makes in the steps below: (1), by described curing agent, described curing accelerator and described solvent, is stirred to and dissolves to obtain mixture A; (2), by described mixture A and described mixed with resin, mixture B stirs to obtain; (3) in the time that the composition of raw materials of described glue comprises inorganic filler, described mixture B to be mixed with described inorganic filler, high speed shear, after slaking; In the time that the composition of raw materials of described glue does not comprise inorganic filler, by described mixture B slaking.
7. metal-based copper-clad plate as claimed in claim 6, is characterized in that: in step (1), the time of described stirring is 2-5 hour; And/or the rotating speed of described stirring is 800-1500rpm;
And/or in step (2), the time of described stirring is 3-5 hour; And/or the rotating speed of described stirring is 1000-1500rpm;
And/or in step (3), the time of described high speed shear is 30-120 minute; And/or the rotating speed of described high speed shear is 2500-5000rpm; And/or described slaking is to stir 6-8 hour with the rotating speed of 1000-1500rpm.
8. the preparation method of the metal-based copper-clad plate as described in any one in claim 1～7, it is characterized in that: it comprises the steps: that (1) directly spreads upon described glue on metal-based layer by the mode of serigraphy, being placed in baking oven heats, make glue semi-solid preparation, obtain the prepreg of containing metal basic unit; (2) prepreg step (1) Suo Shu is covered with to copper foil layer, suppresses.
9. preparation method as claimed in claim 8, it is characterized in that: described serigraphy is for to overlay on screen printing forme on metal-based layer, smear again described glue, and pressurization makes glue transfer on metal-based layer by the eyelet of screen printing forme, then remove screen printing forme, make glue on metal-based layer, form insulating barrier.
10. preparation method as claimed in claim 9, is characterized in that: in step (1), the temperature of described heating is 170-220 DEG C; The time of described heating is 2-5min; The gel time of described glue is 70-130s; The fluidity of described prepreg is 5%-20%, the volatilization of described prepreg is divided into≤and 0.75%; In described prepreg, the thickness of glue is 50-200 μ m.
11. preparation methods as claimed in claim 8, is characterized in that: in step (2), the temperature of described compacting is 135-220 DEG C, and the pressure of described compacting is 20-40Kg/m
2, the time of described compacting is 60-150min.
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Cited By (3)
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| CN104610701A (en) * | 2015-01-14 | 2015-05-13 | 景旺电子科技(龙川)有限公司 | Insulating layer material, stainless steel based copper clad plate, surface treatment method and preparation method |
| CN112757724A (en) * | 2020-12-29 | 2021-05-07 | 宁波世一科技有限责任公司 | Flexible metal-based graphene electrothermal material and preparation method thereof |
| CN114990473A (en) * | 2022-04-22 | 2022-09-02 | 江西省航宇电子材料有限公司 | Stainless steel base surface treatment method, copper-clad plate and preparation method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104610701A (en) * | 2015-01-14 | 2015-05-13 | 景旺电子科技(龙川)有限公司 | Insulating layer material, stainless steel based copper clad plate, surface treatment method and preparation method |
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| CN112757724A (en) * | 2020-12-29 | 2021-05-07 | 宁波世一科技有限责任公司 | Flexible metal-based graphene electrothermal material and preparation method thereof |
| CN112757724B (en) * | 2020-12-29 | 2022-05-20 | 杭州宜联研仿科技有限公司 | Preparation method of flexible metal-based graphene electrothermal material |
| CN114990473A (en) * | 2022-04-22 | 2022-09-02 | 江西省航宇电子材料有限公司 | Stainless steel base surface treatment method, copper-clad plate and preparation method |
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Effective date of registration: 20180930 Address after: 201613 33 Baosheng Road, Songjiang Industrial Zone, Shanghai Patentee after: Shanghai Guoji Electronic Material Co., Ltd. Address before: 201613 Baosheng Road, Songjiang Industrial Zone, Songjiang District, Shanghai 33 Patentee before: Goldenmax International Technology Co., Ltd. |