CN104610701B - Insulating layer material, stainless base steel copper-clad plate, surface treatment method and preparation method - Google Patents
Insulating layer material, stainless base steel copper-clad plate, surface treatment method and preparation method Download PDFInfo
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Abstract
The present invention discloses insulating layer material, stainless base steel copper-clad plate, surface treatment method and preparation method, high heat conductive insulating layer material, its in parts by mass, including following components：80 120 parts of epoxy resin；1 50 parts of curing agent；0.05 5 parts of curing accelerator；1 40 parts of additive；Ultrapure 1 500 parts of high heat conduction filler；1 50 parts of organic solvent.The stainless base steel copper-clad plate of high heat conduction prepared by the present invention, there is advantages below in it：1st, thermal conductivity is high, better than market like product；2nd, good insulating, it is breakdown voltage resistant to can reach more than 6KV；3rd, high heat conductive insulating layer is well combined with stainless steel base, and thermal shock is without layering plate bursting phenomenon；4th, machining property is good, and no dielectric layer is layered phenomenon of bursting apart；5th, production efficiency is high；6th, cost is low, is about the 1/2 of product on the market.
Description
Technical field
Copper is covered the present invention relates to the manufacture technology field of metal-based copper-clad plate, more particularly to insulating layer material, stainless base steel
Plate, surface treatment method and preparation method.
Background technology
Recently as developing rapidly for LED illumination, high-power electric appliance, LED, TV backlight and various power supplys, and
Recovery after economic crisis so that high heat conduction metal-based copper-clad plate market demand drastically rises, and formed with high thermal conductivity aluminum matrix
Copper-clad plate is main body, and copper-based copper-clad plate, stainless base steel copper-clad plate and special composite-based copper clad plate are high heat conduction metal-based for tributary
The market architecture.The stainless base steel copper-clad plate of high heat conduction is mainly used in operating condition and compares relatively rugged environment.Traditional aluminium base and copper-based
Highly heat-conductive copper-clad plate is long-term under moist acid or alkali environment, micro cell effect is easily produced, so as to easily corrode component, greatly
Ground shortens the service life of component；And use the stainless base steel copper-clad plate of acid and alkali-resistance to make, then it can be reduced with high degree
Because of corrosion and caused by the component lost of life probability.
The booming time of high heat conduction metal-based copper-clad plate is shorter, and manufacturing technology level is ripe not enough in the industry, especially
It is the stainless base steel copper-clad plate of high heat conduction as tributary product, is more a lack of the technological process of system.There is presently no grope to
The surface treatment mode that entirely appropriate stainless base steel is combined with high heat conductive insulating layer.Under normal circumstances, all it is directly to apply mechanically aluminium base
The aluminium face processing mode of copper-clad plate to carry out stainless base steel processing physically or chemically, so as to ensure stainless base steel and high heat conduction
The adhesion of insulating barrier meets production needs.But pass through actual production checking and Market Feedback, this method can not be avoided completely
Still there is layering plate bursting after the generation of defect, Reflow Soldering and thermal shock, be machined and burst apart there is also the layering of more serious dielectric layer
Phenomenon.
Therefore, prior art has yet to be improved and developed.
The content of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide insulating layer material, stainless base steel copper-clad plate,
Surface treatment method and preparation method, it is intended to solve the stainless base steel copper-clad plate of existing high heat conduction and there is layering plate bursting, be layered and collapse
The problem of phenomenon such as splitting.
Technical scheme is as follows：
A kind of high heat conductive insulating layer material, wherein, in parts by mass, including following components：
80-120 parts of epoxy resin；
1-50 parts of curing agent；
0.05-5 parts of curing accelerator；
1-40 parts of additive；
Ultrapure 1-500 parts of high heat conduction filler；
1-50 parts of organic solvent.
Described high heat conductive insulating layer material, wherein, the epoxy resin is bisphenol A epoxide resin, glycidol ether ring
In oxygen tree fat, ethylene oxidic ester epoxy resin, glycidyl amine epoxy resin, phosphorous epoxy resin, rubber modified epoxy resin
One or more.
Described high heat conductive insulating layer material, wherein, the curing agent is polyamine, acid anhydrides, macromolecule prepolymer, imidazoles
In one or more.
Described high heat conductive insulating layer material, wherein, the curing accelerator is imidazoles, 2-methylimidazole, 2- ethyl miaows
Azoles, 2- phenylimidazoles, 2-ethyl-4-methylimidazole, 1- cyanoethyls -2-ethyl-4-methylimidazole, 2- ethyl -4- phenylimidazoles
One or more.
Described high heat conductive insulating layer material, wherein, the additive is silane coupler, titanate coupling agent, aluminic acid
Ester coupling agent, levelling agent, defoamer, the one or more promoted in change agent, thickener, anti-settling agent.
Described high heat conductive insulating layer material, wherein, the ultrapure high heat conduction filler be zinc oxide, magnesia, aluminum oxide,
Bismuth oxide, beryllium oxide, magnesium hydroxide, aluminium hydroxide, silica, iron oxide boron nitride, silicon nitride, carborundum, diamond, four
Nitrogenize the one or more in three silicon.
Described high heat conductive insulating layer material, wherein, the organic solvent is benzene,toluene,xylene, acetone, methyl fourth
One or more in ketone, methylisobutylketone, ethylene glycol monoethyl ether, cyclohexanone, toluene cyclohexanone.
A kind of stainless steel substrate surface processing method, wherein, including step：
S1, using amary tape grinding machine stainless base steel is ground；
S2, using adhesive-bonded fabric polish-brush to stainless base steel carry out nog plate；
S3, by the solid constituent and liquid component of high heat conductive insulating as claimed in claim 1 layer, to be mixed to form granularity equal
First, finely dispersed liquid glue；
S4, using screen process press in the stainless above-mentioned liquid glue of one layer of steel substrate surface silk-screen；
S5, the stainless base steel that silk-screen is had into above-mentioned liquid glue pass through arch hot-air oven, and the height for forming semi-solid preparation state is led
Thermal insulation layer.
A kind of preparation method of the stainless base steel copper-clad plate of high heat conduction, wherein, comprise the following steps：
T1, using coating machine liquid glue as described above is coated on copper foil mat surface；
T2, the copper foil for making to be coated with the liquid glue pass through arch hot-air oven, form the serialization gluing of semi-solid preparation state
Copper foil；
T3, above-mentioned serialization adhesive coated foil cut into required size；
T4, the copper foil cut overlap with stainless base steel as described above, heat pressurization the stainless base steel of high heat conduction is made and cover
Copper coin.
A kind of stainless base steel copper-clad plate of high heat conduction, wherein, it is made of preparation method as described above.
Beneficial effect：The stainless base steel copper-clad plate of high heat conduction prepared by the present invention, there is advantages below in it：1st, thermal conductivity
Height, better than market like product；2nd, good insulating, it is breakdown voltage resistant to can reach more than 6KV；3rd, high heat conductive insulating layer and stainless steel
Base is well combined, and thermal shock is without layering plate bursting phenomenon；4th, machining property is good, and no dielectric layer is layered phenomenon of bursting apart；5th, it is raw
Produce efficiency high；6th, cost is low, is about the 1/2 of product on the market.
Embodiment
The present invention provides insulating layer material, stainless base steel copper-clad plate, surface treatment method and preparation method, to make the present invention
Purpose, technical scheme and effect it is clearer, clear and definite, the present invention is described in more detail below.It should be appreciated that this place
The specific embodiment of description only to explain the present invention, is not intended to limit the present invention.
A kind of high heat conductive insulating layer material provided by the present invention, its in parts by mass, including following components：
80-120 parts of epoxy resin；
1-50 parts of curing agent；
0.05-5 parts of curing accelerator；
1-40 parts of additive；
Ultrapure 1-500 parts of high heat conduction filler；
1-50 parts of organic solvent.
Wherein, the epoxy resin is bisphenol A epoxide resin, tetraglycidel ether epoxy resin, glycidyl ester epoxy tree
One or more in fat, glycidyl amine epoxy resin, phosphorous epoxy resin, rubber modified epoxy resin.
The curing agent is the one or more in polyamine, modified multicomponent amine, acid anhydrides, macromolecule prepolymer, imidazoles.
The curing accelerator is imidazoles, 2-methylimidazole, 2- ethyl imidazol(e)s, 2- phenylimidazoles, 2- ethyl -4- methyl miaows
Azoles, 1- cyanoethyls -2-ethyl-4-methylimidazole, the one or more of 2- ethyl -4- phenylimidazoles.
The additive is silane coupler, titanate coupling agent, aluminate coupling agent, levelling agent, defoamer, rush change
One or more in agent, thickener, anti-settling agent.
The ultrapure high heat conduction filler is zinc oxide, magnesia, aluminum oxide, bismuth oxide, beryllium oxide, magnesium hydroxide, hydrogen-oxygen
Change aluminium, silica, iron oxide, bismuth oxide, boron nitride, silicon nitride, carborundum, diamond, one kind in silicon nitride or
It is a variety of.
The organic solvent is benzene,toluene,xylene, acetone, espeleton, methylisobutylketone, ethylene glycol monoethyl ether, ring
One or more in hexanone, toluene cyclohexanone.
Embodiment 1：
A kind of high heat conductive insulating layer material, in parts by mass, including following components：
120 parts of bisphenol A epoxide resin；
1 part of acid anhydrides；
5 parts of 2- ethyl imidazol(e)s；
40 parts of titanate coupling agent；
500 parts of aluminum oxide；
1 part of toluene.
Embodiment 2：
A kind of high heat conductive insulating layer material, in parts by mass, including following components：
100 parts of tetraglycidel ether epoxy resin；
28 parts of polyamine；
1- cyanoethyls -3 parts of 2-ethyl-4-methylimidazole；
24 parts of silane coupler；
20 parts of silica 1；
30 parts of cyclohexanone.
Embodiment 3：
A kind of high heat conductive insulating layer material, in parts by mass, including following components：
80 parts of phosphorous epoxy resin；
50 parts of acid anhydrides；
0.05 part of 2-ethyl-4-methylimidazole；
1 part of aluminate coupling agent；
1 part of beryllium oxide；
50 parts of espeleton.
Embodiment 4：
A kind of high heat conductive insulating layer material, in parts by mass, including following components：
100 parts of rubber modified epoxy resin；
20 parts of acid anhydrides；
3 parts of 2- phenylimidazoles；
15 parts of titanate coupling agent；
300 parts of silica；
20 parts of methylisobutylketone.
The present invention also provides a kind of stainless steel substrate surface processing method embodiment, and it comprises the following steps：
S1, using amary tape grinding machine stainless base steel is ground；
Abrasive band specification 100-800 mesh, grinding rate 1000-4000mm/min；Preferably, the mesh of abrasive band specification 400, grinding speed
Spend 2000mm/min.
S2, using adhesive-bonded fabric polish-brush to stainless base steel carry out nog plate；
Adhesive-bonded fabric polish-brush specification 100-800 mesh, nog plate speed 500-3500mm/min；Preferably, adhesive-bonded fabric polish-brush specification
400 mesh, nog plate speed 1500mm/min.
S3, solid constituent and the liquid component of high heat conductive insulating as described above layer be mixed to form homogeneous grain diameter, is disperseed
Uniform liquid glue；
S4, using screen process press in the stainless above-mentioned liquid glue of one layer of steel substrate surface silk-screen；
10-20 μm of silk-screen thickness；Preferably, 15 μm of silk-screen thickness.
S5, the stainless base steel that silk-screen is had into above-mentioned liquid glue pass through arch hot-air oven, and the height for forming semi-solid preparation state is led
Thermal insulation layer.
70-190 DEG C of oven temperature, baking time 1-10min obtains treated stainless base steel.Preferably, baking oven temperature
160 DEG C of degree, baking time 5min.
In addition, the present invention also provides a kind of preparation method embodiment of the stainless base steel copper-clad plate of high heat conduction, it includes following
Step：
T1, using coating machine by above-mentioned high heat conductive insulating layer glue be coated on copper foil mat surface；
20-200 μm of coating thickness, thickness deviation ± 2 μm；Preferably, 80 μm of coating thickness.
T2, the copper foil for making to be coated with the glue pass through arch hot-air oven, form the serialization adhesive coated foil of semi-solid preparation state；
70-190 DEG C of oven temperature, baking time 2-20min, preferably, 150 DEG C of oven temperature, baking time 5min.
T3, above-mentioned serialization adhesive coated foil cut into required size；
T4, the copper foil cut and above-mentioned treated stainless base steel overlap, heat pressurization and high heat conduction stainless steel is made
Base copper-clad plate.
Finally, the present invention also provides a kind of high heat conduction stainless base steel copper-clad plate embodiment, and it uses preparation as described above
Method is made.
Embodiment 5：
S1, using amary tape grinding machine stainless base steel is ground；
The mesh of abrasive band specification 400, grinding rate 2000mm/min.
S2, using adhesive-bonded fabric polish-brush to stainless base steel carry out nog plate；
The mesh of adhesive-bonded fabric polish-brush specification 400, nog plate speed 1500mm/min.
S3, solid constituent and the liquid component of the high heat conductive insulating layer described in embodiment 4 be mixed to form homogeneous grain diameter, is divided
Dissipate uniform liquid glue；
S4, using screen process press in the stainless above-mentioned liquid glue of one layer of steel substrate surface silk-screen；
15 μm of silk-screen thickness.
S5, the stainless base steel that silk-screen is had into above-mentioned liquid glue pass through arch hot-air oven, and the height for forming semi-solid preparation state is led
Thermal insulation layer.160 DEG C of oven temperature, baking time 5min.
Embodiment 6：
Formula according to embodiment 4 weighs raw material, is placed in a clean container, and high-speed stirred scattered 6 is small at normal temperatures
When, form homogeneous grain diameter, finely dispersed liquid glue.Above-mentioned liquid glue is coated using coating equipment（Coating thickness is
80μm）Onto the mat surface of 35 μ m-thick copper foils, the serialization adhesive coated foil of semi-solid preparation state is formed after 150 DEG C of baking 5min, so
After take an obtained serialization adhesive coated foil to cut, overlapped with its glue surface with untreated stainless base steel, heating pressurization
The stainless base steel copper-clad plate of high heat conduction is made.
Embodiment 7：
Title weighs raw material according to the formula of embodiment 4, is placed in a clean container, at normal temperatures high-speed stirred scattered 6
Hour, form homogeneous grain diameter, finely dispersed liquid glue.Stainless base steel is ground using 400 mesh abrasive bands（Grinding rate
2000mm/min）, then with 400 mesh adhesive-bonded fabric polish-brushes carry out nog plate（Nog plate speed 1500mm/min）, existed using screen process press
The stainless above-mentioned liquid glue of one layer of steel substrate surface silk-screen（15 μm of silk-screen thickness）, by 160 DEG C of baking 5min of arch hot-air oven
Semi-solid preparation state high heat conductive insulating layer is formed afterwards, and treated stainless base steel is made.Above-mentioned glue is coated using coating equipment
（Coating thickness is 80 μm）Onto the mat surface of 35 μ m-thick copper foils, the serialization of semi-solid preparation state is formed after 150 DEG C of baking 5min
Adhesive coated foil, then takes an obtained serialization adhesive coated foil to cut, with its glue surface and stainless base steel roughening face overlapping, heating
The stainless base steel copper-clad plate of high heat conduction is made in pressurization.
Embodiment 8：
Title weighs raw material according to the formula of embodiment 4, is placed in a clean container, at normal temperatures high-speed stirred scattered 6
Hour, form homogeneous grain diameter, finely dispersed liquid glue.Stainless base steel is ground using 200 mesh abrasive bands（Grinding rate
2000mm/min）, then with 300 mesh adhesive-bonded fabric polish-brushes carry out nog plate（Nog plate speed 1500mm/min）, then use screen process press
In one layer of above-mentioned liquid glue of stainless steel surfaces silk-screen（15 μm of silk-screen thickness）, by 160 DEG C of baking 5min of arch hot-air oven
Semi-solid preparation state high heat conductive insulating layer is formed afterwards, and treated stainless base steel is made.Will be upper using import ultraprecise coating equipment
State glue coating（Coating thickness is 80 μm）Onto the mat surface of 35 μ m-thick copper foils, semi-solid preparation is formed after 150 DEG C of baking 5min
The serialization adhesive coated foil of state, then takes an obtained serialization adhesive coated foil to cut, with the stainless of its glue surface and embodiment 5
Base steel silk-screen face is overlapped, and the stainless base steel copper-clad plate of high heat conduction is made in heating pressurization.
The stainless base steel copper-clad plate performance of high heat conduction that each embodiment of table 1. is made：
| Component（Mass parts） | Embodiment 6 | Embodiment 7 | Embodiment 8 |
| Flammability (UL-94) | V-0 | V-0 | V-0 |
| Thermal conductivity (W/mK) | 2.0 | 2.0 | 2.0 |
| Thermal resistance (m2·K/W) | 0.000050 | 0.000050 | 0.000050 |
| Peel strength（N/mm） | 1.89 | 1.90 | 1.89 |
| Reflow Soldering is tested | 100% layering plate bursting | 10% layering plate bursting | Pass through |
| Thermal stress（288 DEG C, 60s） | 100% layering plate bursting | 30% layering plate bursting | Pass through |
| Breakdown voltage（KV） | ＞ 6KV | ＞ 3KV | ＞ 6KV |
| Machining property | 100% layering is burst apart | 30% layering is burst apart | Pass through |
As can be known from the above table, according to the stainless base steel copper-clad plate of high heat conduction prepared by the method for the present invention, high heat conductive insulating layer
It is well combined with stainless steel base, thermal shock layering plate bursting phenomenon greatly reduces, and property indices reach requirement.
In summary, the stainless base steel copper-clad plate of high heat conduction prepared by the present invention, there is advantages below in it：1st, thermal conductivity
Height, better than market like product；2nd, good insulating, it is breakdown voltage resistant to can reach more than 6KV；3rd, high heat conductive insulating layer and stainless steel
Base is well combined, and thermal shock is without layering plate bursting phenomenon；4th, machining property is good, and no dielectric layer is layered phenomenon of bursting apart；5th, it is raw
Produce efficiency high；6th, cost is low, is about the 1/2 of product on the market.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can
To be improved or converted according to the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect scope.
Claims (3)
1. a kind of stainless steel substrate surface processing method, it is characterised in that including step：
S1, using amary tape grinding machine stainless base steel is ground；The mesh of abrasive band specification 200, grinding rate 2000mm/min；
S2, using adhesive-bonded fabric polish-brush to stainless base steel carry out nog plate；The mesh of adhesive-bonded fabric polish-brush specification 300, nog plate speed 1500mm/
min；
S3, the solid constituent and liquid component of high heat conductive insulating layer material be mixed to form homogeneous grain diameter, finely dispersed liquid
Glue；
S4, using screen process press in the stainless above-mentioned liquid glue of one layer of steel substrate surface silk-screen；15 μm of silk-screen thickness；
S5, the stainless base steel that silk-screen is had into above-mentioned liquid glue pass through arch hot-air oven, and the high heat conduction for forming semi-solid preparation state is exhausted
Edge layer；160 DEG C of oven temperature, baking time 5min；
In the step S3, the high heat conductive insulating layer material component is：
100 parts of rubber modified epoxy resin；
20 parts of acid anhydrides；
3 parts of 2- phenylimidazoles；
15 parts of titanate coupling agent；
300 parts of silica；
20 parts of methylisobutylketone.
2. a kind of preparation method of the stainless base steel copper-clad plate of high heat conduction, it is characterised in that comprise the following steps：
T1, using coating machine liquid glue as claimed in claim 1 is coated on copper foil mat surface；80 μm of coating thickness；
T2, the copper foil for making to be coated with the liquid glue pass through arch hot-air oven, form the serialization adhesive coated foil of semi-solid preparation state；
150 DEG C of oven temperature, baking time 5min；
T3, above-mentioned serialization adhesive coated foil cut into required size；
T4, the stainless base steel described in the copper foil and claim 1 that cut overlapped, heating pressurization is made the stainless base steel of high heat conduction and covered
Copper coin.
3. a kind of stainless base steel copper-clad plate of high heat conduction, it is characterised in that be made of preparation method as claimed in claim 2.
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Denomination of invention: Insulation layer material, stainless steel based copper clad plate, surface treatment method and preparation method Effective date of registration: 20230920 Granted publication date: 20170825 Pledgee: Heyuan branch of China Guangfa Bank Co.,Ltd. Pledgor: KINWONG ELECTRONIC TECHNOLOGY (LONGCHUAN) Co.,Ltd. Registration number: Y2023980057639 |