CN106633675A - High-heat-conduction resin composition and application thereof - Google Patents

High-heat-conduction resin composition and application thereof Download PDF

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Publication number
CN106633675A
CN106633675A CN201611091425.3A CN201611091425A CN106633675A CN 106633675 A CN106633675 A CN 106633675A CN 201611091425 A CN201611091425 A CN 201611091425A CN 106633675 A CN106633675 A CN 106633675A
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epoxy resin
resin
parts
resin composition
type
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CN106633675B (en
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郑浩
王波
武伟
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SHAANXI SHENGYI SCI TECH Co Ltd
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SHAANXI SHENGYI SCI TECH Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2363/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/22—Halogen free composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

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  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
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  • Epoxy Resins (AREA)

Abstract

The invention discloses a high-heat-conduction resin composition, which is prepared from the following ingredients in parts by weight: 35 to 70 parts of bismaleimide modified epoxy resin, 5 to 20 parts of phenoxy resin, 10 to 30 parts of flexible modified epoxy resin, 360 to 480 parts of thermal conducting filler, 8 to 14 parts of curing agents, 2 to 5 parts of coupling agents, 0.05 to 0.85 part of curing accelerators and 2 to 6 parts of additives. The high-heat-conduction resin composition has high heat resistant performance of bismaleimide and good process performance of epoxy resin; meanwhile, the phenoxy resin and the flexible epoxy resin are added, so that a novel resin composition has excellent adhesivity, flexibility, heat conductivity, heat resistant performance, insulation performance and flame retardance. A prepreg and a copper-cladding plate prepared by using the resin composition have excellent comprehensive performance of good impact resistant performance, good heat conduction performance, high peeling strength, halogen-free flame retardance, good heat resistant performance, good insulation performance and the like.

Description

A kind of highly thermal-conductive resin composition and its application
Technical field
The invention belongs to copper-clad plate field, and in particular to a kind of highly thermal-conductive resin composition, the invention further relates to the height is led The application of hot resin compositionss.
Background technology
Traditional FR-4 thermal conductivities are relatively low, it is impossible to meet demand of the PCB industries to radiating.In order to improve copper-clad plate thermal conductivity, Generally require to add mass filler.Generally, filler addition is 70%, and copper-clad plate thermal conductivity is 1W/mK；Filler adds Dosage is 80%, copper-clad plate thermal conductivity 1.5W/mK；Filler addition be 82-84%, copper-clad plate thermal conductivity 1.8-2.0W/m K；Amount of filler is more than 84%, and copper-clad plate thermal conductivity is more than 2W/mK.
With the increase of amount of filler, copper-clad plate thermal conductivity is significantly improved, but improves the negative effect that amount of filler is brought It is that sheet material peel strength is reduced, fragility becomes big, thermostability, insulating properties, poor processability.
(the applying date of Application No. 201511016722.7：2015.12.29, publication number：CN105623198, publication date： 2016.6.1 Chinese patent), adds heat filling to prepare gold in the modified span of pi-allyl with flexibilized epoxies system Category substrate, with good thermal diffusivity and thermostability, though the pliability of its metal basal board makes moderate progress, still Testudiniss after bending Split, in addition sheet material peel strength is less than 1.4N/mm, and does not possess anti-flaming function.
The content of the invention
It is an object of the invention to provide a kind of highly thermal-conductive resin composition, the resin combination disclosure satisfy that high filler filling System, has excellent adhesiveness, pliability, anti-flammability, thermostability, insulating properties and processing simultaneously with excellent thermal diffusivity Property.
It is a further object to provide a kind of above-mentioned highly thermal-conductive resin composition in prepreg, laminate, cover copper Application in foil laminate, printed circuit board.
The technical solution adopted in the present invention is, a kind of highly thermal-conductive resin composition, by weight including following component：It is double Maleimide-modified epoxy resin 35-70 parts, phenoxy resin 5-20 parts, flexible modified epoxy 10-30 parts, heat filling 360-480 parts, firming agent 8-14 parts, coupling agent 2-5 parts, curing accelerator 0.05-0.85 parts, additive 2-6 parts.
Of the invention the characteristics of, also resides in：
Bi-maleimide modified epoxy resin is BMI, allyl compound, epoxy resin, phosphorous chemical combination The prepolymer of thing.
BMI comes for diphenyl methane dimaleimide, Diphenyl Ether Bismaleimide or diphenyl sulphone (DPS) span In acid imide any one or at least two mixture.
Allyl compound is diallyl bisphenol or diallyl bisphenol S.
Epoxy resin is bisphenol A epoxide resin, bisphenol f type epoxy resin, bisphenol S type type epoxy resin, biphenyl type epoxy Resin, alicyclic based epoxy resin, epoxy resins of phenol formaldehyde type, Study On O-cresol Epoxy Resin, bisphenol-A phenolic asphalt mixtures modified by epoxy resin Fat, dicyclopentadiene type novolac epoxy resin, aralkylphenol type epoxy resin, the polyfunctional epoxy resin of class containing naphthalene nucleus or containing anthracene In ring class polyfunctional epoxy resin any one or at least two mixture.
Phosphorus-containing compound is ring-type phenoxy phosphazene compound or hydroxymethyl phenyl phosphinates.
Phenoxy resin number-average molecular weight is 5000-15000.
Flexible modified epoxy is polyurethane modified epoxy, modifying epoxy resin by organosilicon, acrylonitrile butadiene rubber modified epoxy Any one in resin, dimer acid modified epoxy resin, long-chain fatty alcohol modified epoxy or two or more mixture.
Firming agent is phenol Linear phenolic resin, ortho-cresol novolac resin, bisphenol A phenolic resin, dicyclopentadiene type Phenolic resin, phenolic resin containing naphthalene nucleus, aralkylphenol type phenolic resin, two amine type benzoxazinyl, bisphenol A-type benzoxazinyl, In bisphenol-f type benzoxazinyl or modified by cardanol benzoxazinyl any one or at least two mixing.
Heat filling is any one in aluminium oxide, aluminium nitride, boron nitride, magnesium oxide or carborundum or at least two Mixing.
Curing accelerator is 2-methylimidazole, the Methylimidazole. of 2- ethyls -4,2- phenylimidazoles, 2- undecyl imidazoles, 1- Benzyl -2-methylimidazole, 2- heptadecyl imidazoles, 2 isopropyl imidazole, 2- phenyl -4-methylimidazole, 2- dodecyl imidazoles Or in 1- 1-cyanoethyl-2-methylimidazoles any one or at least two mixing.
Coupling agent is amino silicane coupling agent epoxy radicals silicon, alkane coupling agent, isocyanates silane coupler or titanate esters In class coupling agent any one or at least two mixture.
The highly thermal-conductive resin composition also include solvent, solvent be acetone, butanone, methanol, ethanol, toluene, dimethylbenzene, N, Any one in dinethylformamide, glycol monoethyl ether, propylene glycol monomethyl ether, ethyl acetate or Ketohexamethylene or at least two Mixture.
The invention has the beneficial effects as follows：
(1) the resin combination viscosity is little, and heat filling loading is high, the bonding sheet made by it and copper-clad plate thermal conductivity In more than 2.0W/mK.
(2) resin combination has excellent adhesiveness, and by its copper-clad plate peel strength for making 1.56N/mm is more than.
(3) resin combination has excellent pliability, and the prepreg and copper-clad plate resistance to impact made by it is excellent It is different.
(4) the resin combination halogen-free flameproof, the fire-retardant V-0 levels of copper-clad plate made by it.
(5) the resin combination excellent heat resistance, 150 DEG C of Tg ＞ after the resin composition, 410 DEG C of Td ＞, by it The copper-clad plate T300 ＞ 30min of making.
(6) the resin combination insulating properties is excellent, and by its copper-clad plate breakdown strength for making 50kV/mm is more than.
Specific embodiment
With reference to specific embodiment, the present invention is described in detail.
Highly thermal-conductive resin composition of the present invention, by weight including following component：Bi-maleimide modified epoxy resin 35-70 parts, phenoxy resin 5-20 parts, flexible modified epoxy 10-30 parts, heat filling 360-480 parts, firming agent 8-14 Part, coupling agent 2-5 parts, curing accelerator 0.05-0.85 parts, additive 2-6 parts.
Bi-maleimide modified epoxy resin is BMI, allyl compound, epoxy resin, phosphorous chemical combination The prepolymer of thing.
BMI comes for diphenyl methane dimaleimide, Diphenyl Ether Bismaleimide or diphenyl sulphone (DPS) span In acid imide any one or at least two mixture.
Allyl compound is diallyl bisphenol or diallyl bisphenol S.
Epoxy resin is bisphenol A epoxide resin, bisphenol f type epoxy resin, bisphenol S type type epoxy resin, biphenyl type epoxy Resin, alicyclic based epoxy resin, epoxy resins of phenol formaldehyde type, Study On O-cresol Epoxy Resin, bisphenol-A phenolic asphalt mixtures modified by epoxy resin Fat, dicyclopentadiene type novolac epoxy resin, aralkylphenol type epoxy resin, the polyfunctional epoxy resin of class containing naphthalene nucleus or containing anthracene In ring class polyfunctional epoxy resin any one or at least two mixture.
Phosphorus-containing compound is ring-type phenoxy phosphazene compound or hydroxymethyl phenyl phosphinates.
Phenoxy resin number-average molecular weight is 5000-15000.
Flexible modified epoxy is polyurethane modified epoxy, modifying epoxy resin by organosilicon, acrylonitrile butadiene rubber modified epoxy Any one in resin, dimer acid modified epoxy resin, long-chain fatty alcohol modified epoxy or two or more mixture.
Firming agent is phenol Linear phenolic resin, ortho-cresol novolac resin, bisphenol A phenolic resin, dicyclopentadiene type Phenolic resin, phenolic resin containing naphthalene nucleus, aralkylphenol type phenolic resin, two amine type benzoxazinyl, bisphenol A-type benzoxazinyl, In bisphenol-f type benzoxazinyl or modified by cardanol benzoxazinyl any one or at least two mixture.
Heat filling is any one in aluminium oxide, aluminium nitride, boron nitride, magnesium oxide or carborundum or at least two Mixture.
Curing accelerator is 2-methylimidazole, the Methylimidazole. of 2- ethyls -4,2- phenylimidazoles, 2- undecyl imidazoles, 1- Benzyl -2-methylimidazole, 2- heptadecyl imidazoles, 2 isopropyl imidazole, 2- phenyl -4-methylimidazole, 2- dodecyl imidazoles Or in 1- 1-cyanoethyl-2-methylimidazoles any one or at least two mixture.
Coupling agent is amino silicane coupling agent epoxy radicals silicon, alkane coupling agent, isocyanates silane coupler or titanate esters In class coupling agent any one or at least two mixture.
The highly thermal-conductive resin composition also include solvent, solvent be acetone, butanone, methanol, ethanol, toluene, dimethylbenzene, N, Any one in dinethylformamide, glycol monoethyl ether, propylene glycol monomethyl ether, ethyl acetate or Ketohexamethylene or at least two Mixture.
The concrete preparation process of high heat conduction FR-4 copper-clad plate is as follows：
The first step：Weigh coupling agent, wetting dispersing agent to be added in solvent, stirred using general mixer；
Second step：Heat filling is slowly added to while stirring by proportional quantity, first using the high-speed shearing machine of 2000rpm/min Dispersion 20-60min, then by simultaneously 1500rpm/min disperses 5-25min in scattered filler slurry injection ball milling axe；
3rd step：Sequentially add bi-maleimide modified epoxy resin, phenoxy resin, flexibilized epoxies, solidification Agent, curing accelerator, additive and normal agitation ripening 8h-12h, prepare highly thermal-conductive resin composition；
4th step：By the resin combination impregnated glass fiber cloth for making, 3-7min is dried at 160-190 DEG C and prepares half admittedly Change piece；
5th step：Copper Foil is covered with by above-mentioned prepreg is two-sided, 170 DEG C -200 DEG C in vacuum press, 15-40kg/ cm2, after compacting 90-200min, obtain heat-conductive copper-clad plate.
Embodiment 1～5 and comparative example 1～2
Embodiment 1～5 is with each component used in the composition epoxy resin of comparative example 1～2 and its content (by weight Meter) as shown in table 1, each component code name and its corresponding ingredient names are as follows：
(A) bi-maleimide modified epoxy resin：
(A1) bisphenol A epoxide resin, diallyl bisphenol, 4,4 ' diphenyl methane dimaleimides, phosphorus-containing compound are pre- Polymers
(A2) bisphenol F epoxy resin, diallyl bisphenol S, 4,4 ' diphenyl methane dimaleimides, phosphorus-containing compound are pre- Polymers
(A3) bisphenol-A phenolic epoxy resin, diallyl bisphenol, 4,4 ' Diphenyl Ether Bismaleimides, phosphorus-containing compound Prepolymer
(B) phenoxy resin：
(B1) number-average molecular weight 5000
(B2) number-average molecular weight 8000
(B3) number-average molecular weight 15000
(C) flexible modified epoxy：
(C1) modifying epoxy resin by organosilicon
(C2) dimer acid modified flexibilized epoxies
(D) firming agent：Bisphenol A phenolic resin
(E) heat filling：
(E1) aluminium oxide, DAW-07, Deuki Kagaku Kogyo Co., Ltd
(E2) aluminium nitride, H05, the production of day Bender mountain company
(E3) magnesium oxide, RF-10C, UBE Industries Ltd.
(F) firming agent accelerator：2- phenylimidazoles, the production of Japanese four countries' chemical conversion company
(G) coupling agent, epoxy silane coupling, Japanese chemical company of SHIN-ETSU HANTOTAI production
(H) additive：
(H1) dispersant：BYK-W996, German BYK companies production
(H2) thixotropic agent：BYK-R606, German BYK companies production
(I) solvent：Ethylene glycol monomethyl ether, DOW Chemical company limited
The each component content that highly heat-conductive copper-clad plate, embodiment 1～5 and comparative example 1～2 are prepared using above-mentioned preparation process is such as Shown in table 1.
Table 1：Embodiment 1～5 and each component content of comparative example 1～2
Testing example 1～5 and the thermal conductivity of copper-clad plate made by comparative example 1～2, peel strength, thermal stress, T300, The performances such as Tg, Td, dielectric strength and pliability, its result is as shown in table 2.
Table 2：The performance test results of embodiment 1～5 and comparative example 1～2
From table 2 it can be seen that compared with prior art, height of the present invention leads the highly heat-conductive copper-clad plate heat of resin combination preparation Conductance ＞ 2.0W/mK, peel strength >=1.56N/mm, 150 DEG C of Tg ＞, 410 DEG C of Td ＞, T300 ＞ 30min, fire-retardant V-0 levels, And with excellent resistance to impact and higher dielectric strength.

Claims (10)

1. a kind of highly thermal-conductive resin composition, it is characterised in that by weight including following component：Bi-maleimide modified ring Oxygen tree fat 35-70 parts, phenoxy resin 5-20 parts, flexible modified epoxy 10-30 parts, heat filling 360-480 parts, firming agent 8-14 parts, coupling agent 2-5 parts, curing accelerator 0.05-0.85 parts, additive 2-6 parts.
2. highly thermal-conductive resin composition according to claim 1, it is characterised in that the bi-maleimide modified epoxy Resin is BMI, allyl compound, epoxy resin, the prepolymer of phosphorus-containing compound；
The BMI comes for diphenyl methane dimaleimide, Diphenyl Ether Bismaleimide or diphenyl sulphone (DPS) span In acid imide any one or at least two mixture；
The allyl compound is diallyl bisphenol or diallyl bisphenol S；
The epoxy resin is bisphenol A epoxide resin, bisphenol f type epoxy resin, bisphenol S type type epoxy resin, biphenyl type epoxy Resin, alicyclic based epoxy resin, epoxy resins of phenol formaldehyde type, Study On O-cresol Epoxy Resin, bisphenol-A phenolic asphalt mixtures modified by epoxy resin Fat, dicyclopentadiene type novolac epoxy resin, aralkylphenol type epoxy resin, the polyfunctional epoxy resin of class containing naphthalene nucleus or containing anthracene In ring class polyfunctional epoxy resin any one or at least two mixture；
The phosphorus-containing compound is ring-type phenoxy phosphazene compound or hydroxymethyl phenyl phosphinates.
3. highly thermal-conductive resin composition according to claim 1, it is characterised in that the phenoxy resin number-average molecular weight is 5000-15000。
4. highly thermal-conductive resin composition according to claim 1, it is characterised in that the flexible modified epoxy is poly- Urethane modified epoxy, modifying epoxy resin by organosilicon, acrylonitrile butadiene rubber modified epoxy resin, dimer acid modified epoxy resin, long-chain In fatty alcohol modified epoxy resin any one or at least two mixture.
5. highly thermal-conductive resin composition according to claim 1, it is characterised in that the firming agent is phenol Linear phenol Urea formaldehyde, ortho-cresol novolac resin, bisphenol A phenolic resin, dicyclopentadiene type phenolic resin, phenolic resin containing naphthalene nucleus, aralkyl Base phenol type phenolic resin, two amine type benzoxazinyl, bisphenol A-type benzoxazinyl, bisphenol-f type benzoxazinyl or modified by cardanol benzene In Bing oxazines any one or at least two mixture.
6. highly thermal-conductive resin composition according to claim 1, it is characterised in that the heat filling is aluminium oxide, nitrogen Change in aluminum, boron nitride, magnesium oxide or carborundum any one or at least two mixture.
7. highly thermal-conductive resin composition according to claim 1, it is characterised in that the curing accelerator is 2- methyl miaows Azoles, the Methylimidazole. of 2- ethyls -4,2- phenylimidazoles, 2- undecyl imidazoles, 1 benzyl 2 methyl imidazole, 2- heptadecyl miaows It is any in azoles, 2 isopropyl imidazole, 2- phenyl -4-methylimidazole, 2- dodecyl imidazoles or 1- 1-cyanoethyl-2-methylimidazoles It is a kind of or at least two mixture.
8. highly thermal-conductive resin composition according to claim 1, it is characterised in that described coupling agent is amino silane idol In connection agent epoxy radicals silicon, alkane coupling agent, isocyanates silane coupler or titante coupling agent any one or extremely Few two kinds mixture.
9. highly thermal-conductive resin composition according to claim 1, it is characterised in that the highly thermal-conductive resin composition is also wrapped Include solvent, solvent be acetone, butanone, methanol, ethanol, toluene, dimethylbenzene, DMF, glycol monoethyl ether, third In glycol methyl ether, ethyl acetate or Ketohexamethylene any one or at least two mixture.
10. the resin combination as described in claim 1～9 is arbitrary is in prepreg, laminate, copper-clad laminate, printing Application in circuit board.
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CN110669316A (en) * 2019-10-24 2020-01-10 瑞鑫集团有限公司 Insulating material for bus duct
CN111171771A (en) * 2020-01-20 2020-05-19 浙江华正新材料股份有限公司 Bonding sheet and preparation method thereof
CN111334131A (en) * 2020-04-17 2020-06-26 景旺电子科技(龙川)有限公司 Epoxy composition and heat-conducting aluminum substrate with solder crack resistance
CN112724598A (en) * 2020-12-28 2021-04-30 广东盈骅新材料科技有限公司 Resin composition, prepreg and preparation method and application thereof
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CN113500831A (en) * 2020-12-31 2021-10-15 苏州益可泰电子材料有限公司 High-speed copper-clad plate for server
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CN107286583A (en) * 2017-06-20 2017-10-24 苏州生益科技有限公司 A kind of resin combination and the low flow prepreg made using it
US11718708B2 (en) 2018-07-26 2023-08-08 Mitsubishi Gas Chemical Company, Inc. Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board
EP3828221A4 (en) * 2018-07-26 2021-08-25 Mitsubishi Gas Chemical Company, Inc. Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board
US11499005B2 (en) 2018-07-26 2022-11-15 Mitsubishi Gas Chemical Company, Inc. Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board
CN110669316A (en) * 2019-10-24 2020-01-10 瑞鑫集团有限公司 Insulating material for bus duct
CN110669316B (en) * 2019-10-24 2022-07-19 瑞鑫集团有限公司 Insulating material for bus duct
CN111171771B (en) * 2020-01-20 2021-11-02 浙江华正新材料股份有限公司 Bonding sheet and preparation method thereof
CN111171771A (en) * 2020-01-20 2020-05-19 浙江华正新材料股份有限公司 Bonding sheet and preparation method thereof
CN111334131A (en) * 2020-04-17 2020-06-26 景旺电子科技(龙川)有限公司 Epoxy composition and heat-conducting aluminum substrate with solder crack resistance
CN113527837A (en) * 2020-04-17 2021-10-22 景旺电子科技(龙川)有限公司 Low-modulus epoxy resin composition and aluminum substrate
CN112724598B (en) * 2020-12-28 2023-01-06 广东盈骅新材料科技有限公司 Resin composition, prepreg and preparation method and application thereof
CN112724598A (en) * 2020-12-28 2021-04-30 广东盈骅新材料科技有限公司 Resin composition, prepreg and preparation method and application thereof
CN113500831A (en) * 2020-12-31 2021-10-15 苏州益可泰电子材料有限公司 High-speed copper-clad plate for server

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