CN106633675B - A kind of highly thermal-conductive resin composition and its application - Google Patents
A kind of highly thermal-conductive resin composition and its application Download PDFInfo
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/558—Impact strength, toughness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/10—Epoxy resins modified by unsaturated compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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Abstract
The invention discloses a kind of highly thermal-conductive resin compositions, it by weight include following component: bi-maleimide modified epoxy resin 35-70 parts, it is 5-20 parts of phenoxy resin, modified epoxy 10-30 parts flexible, 360-480 parts of heat filling, 8-14 parts of curing agent, 2-5 parts of coupling agent, 0.05-0.85 parts of curing accelerator, 2-6 parts of additive.Highly thermal-conductive resin composition of the present invention, the high-fire resistance and epoxy resin good process for having bismaleimide, phenoxy resin and flexibilized epoxies is added simultaneously, makes new resin combination that there is excellent adhesiveness, flexibility, thermal conductivity, heat resistance, insulating properties and anti-flammability.The prepreg prepared using resin combination of the invention and copper-clad plate have the Good All-around Properties such as impact resistance is good, thermal conductivity is good, peel strength is high, halogen-free flameproof, heat-resist, good insulating.
Description
Technical field
The invention belongs to copper-clad plate fields, and in particular to a kind of highly thermal-conductive resin composition, the invention further relates to the height to lead
The application of hot resin composition.
Background technique
Traditional FR-4 thermal conductivity is lower, is not able to satisfy demand of the PCB industry to heat dissipation.In order to improve copper-clad plate thermal conductivity,
Generally require addition mass filler.Under normal circumstances, filler additive amount is 70%, and copper-clad plate thermal conductivity is 1W/mK；Filler adds
Dosage is 80%, copper-clad plate thermal conductivity 1.5W/mK；Filler additive amount is 82-84%, copper-clad plate thermal conductivity 1.8-2.0W/m
K；Amount of filler is greater than 84%, and copper-clad plate thermal conductivity is greater than 2W/mK.
With the increase of amount of filler, copper-clad plate thermal conductivity is significantly improved, but improves amount of filler bring negative effect
It is that plate peel strength reduces, brittleness becomes larger, heat resistance, insulating properties, poor processability.
Application No. is 201511016722.7 (applying date: 2015.12.29, publication number: CN105623198, publication date:
2016.6.1 heat filling preparation gold is added in Chinese patent) in the modified span of allyl and flexibilized epoxies system
Belong to substrate, there is good thermal diffusivity and heat resistance, though the flexibility of metal substrate makes moderate progress, still tortoise after bending
It splits, in addition plate peel strength is less than 1.4N/mm, and does not have flame retarding function.
Summary of the invention
The object of the present invention is to provide a kind of highly thermal-conductive resin composition, which can satisfy high filler filling
System has excellent adhesiveness, flexibility, anti-flammability, heat resistance, insulating properties and processing with excellent thermal diffusivity simultaneously
Property.
It is a further object to provide a kind of above-mentioned highly thermal-conductive resin compositions in prepreg, laminate, covers copper
Application in foil laminate, printed circuit board.
The technical scheme adopted by the invention is that a kind of highly thermal-conductive resin composition, includes following component: double by weight
Maleimide-modified epoxy resin 35-70 parts, 5-20 parts of phenoxy resin, modified epoxy 10-30 parts flexible, heat filling
360-480 parts, 8-14 parts of curing agent, 2-5 parts of coupling agent, 0.05-0.85 parts of curing accelerator, 2-6 parts of additive.
The features of the present invention also characterized in that:
Bi-maleimide modified epoxy resin is bismaleimide, allyl compound, epoxy resin, phosphorous chemical combination
The prepolymer of object.
Bismaleimide is that diphenyl methane dimaleimide, Diphenyl Ether Bismaleimide or diphenyl sulphone (DPS) span come
In acid imide any one or at least two mixture.
Allyl compound is diallyl bisphenol or diallyl bisphenol S.
Epoxy resin is bisphenol A epoxide resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, biphenyl type epoxy tree
Rouge, alicyclic based epoxy resin, epoxy resins of phenol formaldehyde type, Study On O-cresol Epoxy Resin, bisphenol-A phenolic epoxy resin,
Dicyclopentadiene type novolac epoxy resin, aralkylphenol type epoxy resin, the polyfunctional epoxy resin of class containing naphthalene nucleus contain anthracene nucleus
In class polyfunctional epoxy resin any one or at least two mixture.
Phosphorus-containing compound is cyclic annular phenoxy phosphazene compound or hydroxymethyl phenyl phosphinates.
Phenoxy resin number-average molecular weight is 5000-15000.
Flexible modified epoxy is polyurethane modified epoxy, modifying epoxy resin by organosilicon, acrylonitrile butadiene rubber modified epoxy
Resin, dimer acid modified epoxy resin, any one or two or more mixtures in long-chain fatty alcohol modified epoxy.
Curing agent is phenol Linear phenolic resin, ortho-cresol novolac resin, bisphenol A phenolic resin, dicyclopentadiene type
Phenolic resin, phenolic resin containing naphthalene nucleus, aralkylphenol type phenolic resin, two amine type benzoxazines, bisphenol A-type benzoxazine,
In bisphenol-f type benzoxazine or modified by cardanol benzoxazine any one or at least two mixing.
Heat filling is any one or at least two in aluminium oxide, aluminium nitride, boron nitride, magnesia or silicon carbide
Mixing.
Curing accelerator is 2-methylimidazole, -4 methylimidazole of 2- ethyl, 2- phenylimidazole, 2- undecyl imidazole, 1-
Benzyl -2-methylimidazole, 2- heptadecyl imidazole, 2 isopropyl imidazole, 2- phenyl -4-methylimidazole, 2- dodecyl imidazole
Or in 1- 1-cyanoethyl-2-methylimidazole any one or at least two mixing.
Coupling agent is amino silicane coupling agent, epoxy silane coupling, isocyanates silane coupling agent or titanate esters
In class coupling agent any one or at least two mixture.
The highly thermal-conductive resin composition further includes solvent, and solvent is acetone, butanone, methanol, alcohol, toluene, dimethylbenzene, N,
Any one in dinethylformamide, glycol monoethyl ether, propylene glycol monomethyl ether, ethyl acetate or cyclohexanone or at least two
Mixture.
The beneficial effects of the present invention are:
(1) the resin combination viscosity is small, and heat filling loading is high, by the bonding sheet and copper-clad plate thermal conductivity of its production
In 2.0W/mK or more.
(2) resin combination has excellent adhesiveness, is greater than 1.56N/mm by the copper-clad plate peel strength of its production.
(3) resin combination has excellent flexibility, excellent by the prepreg and copper-clad plate impact resistance of its production
It is different.
(4) the resin combination halogen-free flameproof, the copper-clad plate made by it are V-0 grades fire-retardant.
(5) the resin combination excellent heat resistance, 150 DEG C of Tg > after resin combination solidification, 410 DEG C of Td >, by it
The copper-clad plate T300 > 30min of production.
(6) the resin combination insulating properties is excellent, is greater than 50kV/mm by the copper-clad plate breakdown strength of its production.
Specific embodiment
The present invention is described in detail With reference to embodiment.
Highly thermal-conductive resin composition of the present invention includes following component: bi-maleimide modified epoxy resin by weight
It is 35-70 parts, 5-20 parts of phenoxy resin, modified epoxy 10-30 parts flexible, 360-480 parts of heat filling, curing agent 8-14
Part, 2-5 parts of coupling agent, 0.05-0.85 parts of curing accelerator, 2-6 parts of additive.
Bi-maleimide modified epoxy resin is bismaleimide, allyl compound, epoxy resin, phosphorous chemical combination
The prepolymer of object.
Bismaleimide is that diphenyl methane dimaleimide, Diphenyl Ether Bismaleimide or diphenyl sulphone (DPS) span come
In acid imide any one or at least two mixture.
Allyl compound is diallyl bisphenol or diallyl bisphenol S.
Epoxy resin is bisphenol A epoxide resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, biphenyl type epoxy tree
Rouge, alicyclic based epoxy resin, epoxy resins of phenol formaldehyde type, Study On O-cresol Epoxy Resin, bisphenol-A phenolic epoxy resin,
Dicyclopentadiene type novolac epoxy resin, aralkylphenol type epoxy resin, the polyfunctional epoxy resin of class containing naphthalene nucleus contain anthracene nucleus
In class polyfunctional epoxy resin any one or at least two mixture.
Phosphorus-containing compound is cyclic annular phenoxy phosphazene compound or hydroxymethyl phenyl phosphinates.
Phenoxy resin number-average molecular weight is 5000-15000.
Flexible modified epoxy is polyurethane modified epoxy, modifying epoxy resin by organosilicon, acrylonitrile butadiene rubber modified epoxy
Resin, dimer acid modified epoxy resin, any one or two or more mixtures in long-chain fatty alcohol modified epoxy.
Curing agent is phenol Linear phenolic resin, ortho-cresol novolac resin, bisphenol A phenolic resin, dicyclopentadiene type
Phenolic resin, phenolic resin containing naphthalene nucleus, aralkylphenol type phenolic resin, two amine type benzoxazines, bisphenol A-type benzoxazine,
In bisphenol-f type benzoxazine or modified by cardanol benzoxazine any one or at least two mixture.
Heat filling is any one or at least two in aluminium oxide, aluminium nitride, boron nitride, magnesia or silicon carbide
Mixture.
Curing accelerator is 2-methylimidazole, -4 methylimidazole of 2- ethyl, 2- phenylimidazole, 2- undecyl imidazole, 1-
Benzyl -2-methylimidazole, 2- heptadecyl imidazole, 2 isopropyl imidazole, 2- phenyl -4-methylimidazole, 2- dodecyl imidazole
Or in 1- 1-cyanoethyl-2-methylimidazole any one or at least two mixture.
Coupling agent is amino silicane coupling agent, epoxy silane coupling, isocyanates silane coupling agent or titanate esters
In class coupling agent any one or at least two mixture.
The highly thermal-conductive resin composition further includes solvent, and solvent is acetone, butanone, methanol, alcohol, toluene, dimethylbenzene, N,
Any one in dinethylformamide, glycol monoethyl ether, propylene glycol monomethyl ether, ethyl acetate or cyclohexanone or at least two
Mixture.
The specific preparation process of high thermal conductivity FR-4 copper-clad plate is as follows:
Step 1: weigh coupling agent, wetting dispersing agent is added in solvent, stirred evenly using general mixer；
It is slowly added to heat filling while stirring step 2: measuring according to the ratio, first uses the high-speed shearing machine of 2000rpm/min
Disperse 20-60min, then scattered filler slurry is injected in ball milling axe and 1500rpm/min disperses 5-25min；
Step 3: sequentially adding bi-maleimide modified epoxy resin, phenoxy resin, flexibilized epoxies, solidification
Agent, curing accelerator, additive and normal agitation cure 8h-12h, prepare highly thermal-conductive resin composition；
Step 4: the resin combination impregnated glass fiber cloth that will be made, it is solid to dry 3-7min preparation half at 160-190 DEG C
Change piece；
Step 5: copper foil is covered with by above-mentioned prepreg is two-sided, and 170 DEG C -200 DEG C in the vacuum press, 15-40kg/
cm2, after suppressing 90-200min, obtain heat-conductive copper-clad plate.
Examples 1 to 5 and comparative example 1~2
Each component used in the composition epoxy resin of Examples 1 to 5 and comparative example 1~2 and its content are (by weight
Meter) as shown in table 1, each component code name and its corresponding ingredient names are as follows:
(A) bi-maleimide modified epoxy resin:
(A1) bisphenol A epoxide resin, diallyl bisphenol, 4,4 ' diphenyl methane dimaleimides, phosphorus-containing compound are pre-
Polymers
(A2) bisphenol F epoxy resin, diallyl bisphenol S, 4,4 ' diphenyl methane dimaleimides, phosphorus-containing compound are pre-
Polymers
(A3) bisphenol-A phenolic epoxy resin, diallyl bisphenol, 4,4 ' Diphenyl Ether Bismaleimides, phosphorus-containing compound
Prepolymer
(B) phenoxy resin:
(B1) number-average molecular weight 5000
(B2) number-average molecular weight 8000
(B3) number-average molecular weight 15000
(C) flexible modified epoxy:
(C1) modifying epoxy resin by organosilicon
(C2) dimer acid modified flexibilized epoxies
(D) curing agent: bisphenol A phenolic resin
(E) heat filling:
(E1) aluminium oxide, DAW-07, Deuki Kagaku Kogyo Co., Ltd
(E2) aluminium nitride, H05, the production of day Bender mountain company
(E3) magnesia, RF-10C, UBE Industries Ltd.
(F) curing agent promotor: 2- phenylimidazole, the production of Japanese four countries' chemical conversion company
(G) coupling agent, epoxy silane coupling, Japanese chemical company of SHIN-ETSU HANTOTAI production
(H) additive:
(H1) dispersing agent: BYK-W996, German BYK company production
(H2) thixotropic agent: BYK-R606, German BYK company production
(I) solvent: ethylene glycol monomethyl ether, DOW Chemical Co., Ltd
Highly heat-conductive copper-clad plate is prepared using above-mentioned preparation process, each component content of Examples 1 to 5 and comparative example 1~2 is such as
Shown in table 1.
Table 1: 1~2 each component content of Examples 1 to 5 and comparative example
The thermal conductivity of copper-clad plate made of testing example 1~5 and comparative example 1~2, peel strength, thermal stress, T300,
The performances such as Tg, Td, dielectric strength and flexibility, the results are shown in Table 2.
Table 2: the performance test results of Examples 1 to 5 and comparative example 1~2
From table 2 it can be seen that compared with prior art, height of the present invention leads the highly heat-conductive copper-clad plate heat of resin combination preparation
Conductance > 2.0W/mK, peel strength >=1.56N/mm is 150 DEG C of Tg >, 410 DEG C of Td >, T300 > 30min, V-0 grades fire-retardant,
And there is excellent impact resistance and higher dielectric strength.
Claims (9)
1. a kind of highly thermal-conductive resin composition, which is characterized in that by weight include following component: bi-maleimide modified ring
It is 35-70 parts of oxygen resin, 5-20 parts of phenoxy resin, modified epoxy 10-30 parts flexible, 360-480 parts of heat filling, curing agent
8-14 parts, 2-5 parts of coupling agent, 0.05-0.85 parts of curing accelerator, 2-6 parts of additive；
The bi-maleimide modified epoxy resin is bismaleimide, allyl compound, epoxy resin, phosphorous chemical combination
The prepolymer of object；
The bismaleimide is that diphenyl methane dimaleimide, Diphenyl Ether Bismaleimide or diphenyl sulphone (DPS) span come
In acid imide any one or at least two mixture；
The allyl compound is diallyl bisphenol or diallyl bisphenol S；
The epoxy resin is bisphenol A epoxide resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, biphenyl type epoxy tree
Rouge, alicyclic based epoxy resin, epoxy resins of phenol formaldehyde type, Study On O-cresol Epoxy Resin, bisphenol-A phenolic epoxy resin,
Dicyclopentadiene type novolac epoxy resin, aralkylphenol type epoxy resin, the polyfunctional epoxy resin of class containing naphthalene nucleus contain anthracene nucleus
In class polyfunctional epoxy resin any one or at least two mixture；
The phosphorus-containing compound is cyclic annular phenoxy phosphazene compound or hydroxymethyl phenyl phosphinates.
2. highly thermal-conductive resin composition according to claim 1, which is characterized in that the phenoxy resin number-average molecular weight is
5000-15000。
3. highly thermal-conductive resin composition according to claim 1, which is characterized in that the flexible modified epoxy is poly-
Urethane modified epoxy, modifying epoxy resin by organosilicon, acrylonitrile butadiene rubber modified epoxy resin, dimer acid modified epoxy resin, long-chain
In fatty alcohol modified epoxy resin any one or at least two mixture.
4. highly thermal-conductive resin composition according to claim 1, which is characterized in that the curing agent is phenol Linear phenol
Urea formaldehyde, ortho-cresol novolac resin, bisphenol A phenolic resin, dicyclopentadiene type phenolic resin, phenolic resin containing naphthalene nucleus, aralkyl
Base phenol type phenolic resin, two amine type benzoxazines, bisphenol A-type benzoxazine, bisphenol-f type benzoxazine or modified by cardanol benzene
And in oxazines any one or at least two mixture.
5. highly thermal-conductive resin composition according to claim 1, which is characterized in that the heat filling is aluminium oxide, nitrogen
Change aluminium, boron nitride, in magnesia or silicon carbide any one or at least two mixture.
6. highly thermal-conductive resin composition according to claim 1, which is characterized in that the curing accelerator is 2- methyl miaow
Azoles, -4 methylimidazole of 2- ethyl, 2- phenylimidazole, 2- undecyl imidazole, 1 benzyl 2 methyl imidazole, 2- heptadecyl miaow
It is any in azoles, 2 isopropyl imidazole, 2- phenyl -4-methylimidazole, 2- dodecyl imidazole or 1- 1-cyanoethyl-2-methylimidazole
It is a kind of or at least two mixture.
7. highly thermal-conductive resin composition according to claim 1, which is characterized in that the coupling agent is that amino silane is even
Join agent, epoxy silane coupling, in isocyanates silane coupling agent or titante coupling agent any one or extremely
Few two kinds of mixture.
8. highly thermal-conductive resin composition according to claim 1, which is characterized in that the highly thermal-conductive resin composition also wraps
Solvent is included, solvent is acetone, butanone, methanol, alcohol, toluene, dimethylbenzene, n,N-Dimethylformamide, glycol monoethyl ether, third
In glycol methyl ether, ethyl acetate or cyclohexanone any one or at least two mixture.
9. the resin combination as described in claim 1~8 is any is in prepreg, laminate, copper-clad laminate, printing electricity
Application in the plate of road.
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| CN107286583B (en) * | 2017-06-20 | 2019-08-02 | 苏州生益科技有限公司 | A kind of resin combination and the low flow prepreg using its production |
| US11499005B2 (en) | 2018-07-26 | 2022-11-15 | Mitsubishi Gas Chemical Company, Inc. | Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board |
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