CN113527837A - Low-modulus epoxy resin composition and aluminum substrate - Google Patents
Low-modulus epoxy resin composition and aluminum substrate Download PDFInfo
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- CN113527837A CN113527837A CN202010304487.8A CN202010304487A CN113527837A CN 113527837 A CN113527837 A CN 113527837A CN 202010304487 A CN202010304487 A CN 202010304487A CN 113527837 A CN113527837 A CN 113527837A
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- China
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- epoxy resin
- resin composition
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- low
- modulus
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 84
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 84
- 239000000203 mixture Substances 0.000 title claims abstract description 42
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 28
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 239000000758 substrate Substances 0.000 title claims abstract description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 239000000945 filler Substances 0.000 claims description 14
- 239000004593 Epoxy Substances 0.000 claims description 13
- 239000000654 additive Substances 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 11
- 230000000996 additive effect Effects 0.000 claims description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 10
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims description 10
- -1 alicyclic amine Chemical class 0.000 claims description 9
- 150000001412 amines Chemical class 0.000 claims description 9
- 229920001971 elastomer Polymers 0.000 claims description 9
- 239000005060 rubber Substances 0.000 claims description 9
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 229920001577 copolymer Polymers 0.000 claims description 6
- 239000005077 polysulfide Substances 0.000 claims description 6
- 229920001021 polysulfide Polymers 0.000 claims description 6
- 150000008117 polysulfides Polymers 0.000 claims description 6
- 239000004814 polyurethane Substances 0.000 claims description 6
- 229920002635 polyurethane Polymers 0.000 claims description 6
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 4
- 239000004843 novolac epoxy resin Substances 0.000 claims description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims description 4
- 229920000570 polyether Polymers 0.000 claims description 4
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- 229930185605 Bisphenol Natural products 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 239000002518 antifoaming agent Substances 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 150000002894 organic compounds Chemical class 0.000 claims description 3
- 150000001282 organosilanes Chemical class 0.000 claims description 3
- 229920006122 polyamide resin Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 239000002562 thickening agent Substances 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 2
- 239000004305 biphenyl Substances 0.000 claims description 2
- 239000013034 phenoxy resin Substances 0.000 claims description 2
- 229920006287 phenoxy resin Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000011231 conductive filler Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 4
- 150000004982 aromatic amines Chemical class 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 238000005336 cracking Methods 0.000 abstract description 3
- 238000004132 cross linking Methods 0.000 abstract description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 abstract description 3
- 230000008602 contraction Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 27
- 239000000047 product Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 6
- 230000007774 longterm Effects 0.000 description 5
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- OBNDGIHQAIXEAO-UHFFFAOYSA-N [O].[Si] Chemical compound [O].[Si] OBNDGIHQAIXEAO-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- RIAHASMJDOMQER-UHFFFAOYSA-N 5-ethyl-2-methyl-1h-imidazole Chemical compound CCC1=CN=C(C)N1 RIAHASMJDOMQER-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a low-modulus epoxy resin composition and an aluminum substrate, and relates to the technical field of metal-based copper-clad plates. According to the low-modulus epoxy resin composition provided by the invention, the epoxy resin modified by the flexible chain segment is introduced to be matched with the epoxy resin, a special flexible curing agent is adopted to be compounded with the traditional aliphatic amine and aromatic amine curing agent for crosslinking reaction, the material of the cured dielectric layer has the elasticity modulus of 1.2GPa and the thermal conductivity of 1.9 w/m.K at the room temperature of 25 ℃. According to the aluminum substrate provided by the invention, the dielectric layer can deform according to the temperature change, the stress generated by the metal substrate due to expansion caused by heat and contraction caused by cold is absorbed, the characteristic of preventing the cracking of the welding pad is excellent, the welding failure risk is reduced, and the reliability of the product is improved.
Description
Technical Field
The invention relates to the technical field of metal-based copper-clad plates, in particular to a low-modulus epoxy resin composition and an aluminum substrate.
Background
The aluminum-based copper clad laminate is one of copper clad laminates, and is widely applied to the fields of LEDs and high-power modules due to good heat dissipation performance. The traditional aluminum substrate is manufactured by bonding an aluminum plate at the bottom, a medium layer (bonding layer) in the middle and a copper foil on the surface layer together through hot pressing. The most important influencing factor of the performance of the aluminum base plate is the middle dielectric layer which determines the insulating property, the heat conducting property, the heat resistance, the long-term use reliability, the processability and the like of the aluminum base plate product.
The dielectric layer mainly comprises thermosetting polymer and inorganic filler with higher thermal conductivity; in order to ensure that a cured product has higher heat resistance and meet various high-temperature processes (such as solder mask, tin spraying and other processes) in subsequent PCB processing, a resin polymer system with higher glass transition temperature (Tg) is generally adopted; because the heat conduction efficiency of the resin condensate is low, inorganic heat conduction filler with a high proportion needs to be added to form a heat transfer channel and improve the heat conduction coefficient of the bonding layer; these causes result in a higher modulus and greater brittleness of the cured dielectric layer.
The dielectric layer is easy to have the problems of edge crack, chip falling and the like in the processing process, and the product performance is influenced. Meanwhile, in the use process of the finished product of the aluminum substrate, as the power of components such as chips is high, the heat productivity is high, and the difference between the thermal expansion coefficients of the chips and the aluminum plate is large, large internal stress can be generated at the joint of the soldering disc during actual work; the traditional dielectric layer has low thermal expansion coefficient and high modulus, and cannot absorb the stress well, so that the tin bonding pad is easy to crack and even fall off.
Most of the traditional aluminum substrate dielectric layers are epoxy resin systems filled with heat conducting fillers such as aluminum oxide and boron nitride, and the modulus of a solidified substance is up to 15GPa, so that the stress absorption effect is worse, and the risk of failure of a welding position is high. Although the flexibility of the medium layer can be improved to a certain extent and the problem of high brittleness of the medium layer can be solved by the common rubber toughening modified epoxy, the rubber can form phase separation in a resin system to generate an isolated island structure and block a heat conduction path, so that the heat conductivity of a system with high rubber content is lower when the filling proportion of the heat conduction filler is the same.
Disclosure of Invention
The invention aims to solve the technical problems that the elastic modulus of a cured dielectric layer is reduced and the flexibility of the dielectric layer is improved by changing the formula of a resin system without reducing the thermal conductivity of the dielectric layer, and meanwhile, the dielectric layer also has better heat resistance and long-term reliability.
The invention aims to provide a low-modulus epoxy resin composition to obtain a dielectric layer with lower elastic modulus and higher thermal conductivity.
Another object of the present invention is to provide an aluminum substrate made of the above low modulus epoxy resin composition.
In order to solve the above problems, the present invention proposes the following technical solutions:
in a first aspect, the present invention provides a low modulus epoxy resin composition having the following features:
the viscosity is 4000 to 5000 cps;
the low modulus epoxy resin composition has an elastic modulus <2GPa at 25 ℃ after curing;
the thermal conductivity coefficient of the cured low-modulus epoxy resin composition is more than or equal to 1.6W/m.K;
the low-modulus epoxy resin composition comprises the following components in parts by weight:
20-30 parts of flexible epoxy resin;
10-20 parts of liquid epoxy resin;
10-20 parts of solid epoxy resin;
10-20 parts of a flexible curing agent;
wherein the flexible epoxy resin is a copolymer of epoxy resin and a flexible chain segment;
the flexible curing agent is a polymer modified aliphatic or alicyclic amine curing agent with a long-chain structure.
The further technical proposal is that the flexible chain segment is a copolymer of a substance A and BPA epoxy;
the substance A is selected from at least one of polyether, polyurethane, acrylate, liquid polysulfide rubber, hydroxyl-containing long-chain organic compound and carboxyl-terminated polyester.
The flexible curing agent is further characterized by being at least one polymer selected from polyetheramines, aliphatic acid anhydrides, alicyclic acid anhydrides, polyamide resins, polysulfide rubbers, polyurethanes and silicon-oxygen-containing chains.
The liquid epoxy resin is selected from at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol AD epoxy resin, bisphenol S epoxy resin and resorcinol epoxy resin.
The further technical scheme is that the solid epoxy resin is at least one selected from phenoxy resin, biphenyl type epoxy resin, bisphenol A type novolac epoxy resin and o-cresol type novolac epoxy resin.
The further technical scheme is that the low-modulus epoxy resin composition also comprises the following components in parts by weight:
1-10 parts of epoxy amine curing agent;
20-25 parts of a solvent;
0.5-2 parts of an accelerator;
3-5 parts of an additive;
600-800 parts of high-thermal-conductivity filler.
The further technical proposal is that the additive is at least one of organosilane thickening agents, flatting agents and defoaming agents.
The further technical scheme is that the high heat conduction filler is selected from at least one of boron nitride, spherical alumina, angular alumina, aluminum hydroxide and aluminum nitride.
The further technical proposal is that the grain diameter of the high heat conduction filler is 5-10 μm.
The invention also provides application of the low-modulus epoxy resin composition in a high-thermal-conductivity metal-based copper-clad plate.
In a second aspect, the present invention provides an aluminum substrate, including a dielectric layer, wherein the dielectric layer is obtained by curing the low modulus epoxy resin composition of the first aspect.
The further technical scheme is that the thickness of the dielectric layer is 80-120 um.
Compared with the prior art, the invention can achieve the following technical effects:
according to the low-modulus epoxy resin composition provided by the invention, the epoxy resin modified by the flexible chain segment is introduced to be matched with the epoxy resin, a special flexible curing agent is adopted to be compounded with the traditional aliphatic amine and aromatic amine curing agent for crosslinking reaction, the material of the cured dielectric layer has the elasticity modulus of 1.2GPa and the thermal conductivity of 1.9 w/m.K at the room temperature of 25 ℃.
The low-modulus epoxy resin composition provided by the invention has low elastic modulus, high thermal conductivity and strong heat dissipation after being cured, can deform according to temperature change, absorbs stress generated by expansion with heat and contraction with cold of a metal substrate, and is suitable for metal-based copper clad laminate products with high insulation and high thermal conductivity.
According to the heat-conducting aluminum substrate provided by the invention, the dielectric layer is the low-modulus epoxy resin composition, the stability is good, the low elastic modulus and the high heat conductivity are realized, the problems of cracking, chip falling and the like are solved in the processing process, and the product quality is further improved. And the dielectric layer has higher heat resistance and long-term use reliability. The aluminum substrate has excellent solder pad cracking resistance due to the characteristics of the dielectric layers, the welding failure risk is reduced, and the use reliability of the product is improved.
Detailed Description
The technical solutions in the examples will be clearly and completely described below. It is apparent that the embodiments to be described below are only a part of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the embodiments of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the invention. As used in the description of embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Embodiments of the present invention provide a low modulus epoxy resin composition having the following characteristics:
the viscosity is 4000 to 5000 cps;
the low modulus epoxy resin composition has an elastic modulus <2GPa at 25 ℃ after curing;
the thermal conductivity coefficient of the cured low-modulus epoxy resin composition is more than or equal to 1.6W/m.K;
the paint comprises the following components in parts by weight:
20-30 parts of flexible epoxy resin;
10-20 parts of liquid epoxy resin;
10-20 parts of solid epoxy resin;
10-20 parts of a flexible curing agent;
wherein the flexible epoxy resin is a copolymer of epoxy resin and a flexible chain segment;
the flexible curing agent is a polymer modified aliphatic or alicyclic amine curing agent with a long-chain structure.
In this embodiment, screening is performed according to the characteristics of the low-modulus epoxy resin composition, the epoxy resin modified by the flexible chain segment is introduced to match with the epoxy resin, a special flexible curing agent is adopted, and the special flexible curing agent is compounded with the conventional aliphatic amine and aromatic amine curing agent to perform a crosslinking reaction, wherein the cured dielectric layer material has an elastic modulus of 1.2GPa and a thermal conductivity of 1.9w/m · K at room temperature of 25 ℃.
In a specific embodiment, a copolymer of substance a and BPA epoxy;
the substance A is selected from at least one of polyether, polyurethane, acrylate, liquid polysulfide rubber, hydroxyl-containing long-chain organic compound and carboxyl-terminated polyester.
The flexible curing agent is at least one polymer selected from polyether amines, aliphatic acid anhydrides, alicyclic acid anhydrides, polyamide resins, polysulfide rubbers, polyurethanes and silicon-oxygen chain-containing polymers.
For example, in one embodiment, the flexible curing agent is selected from polyetheramine-based polymers.
In one embodiment, the flexible curing agent is selected from cycloaliphatic anhydride polymers.
In one embodiment, the flexible curing agent is selected from silicone-containing chain type polymers.
In specific embodiments, the liquid epoxy resin may be a bisphenol a type epoxy resin, a bisphenol F type epoxy resin, a bisphenol AD type epoxy resin, a bisphenol S type epoxy resin, a resorcinol type epoxy resin, or the like.
For example, in one embodiment, the liquid epoxy resin is a bisphenol a type epoxy resin.
In one embodiment, the liquid epoxy resin is a resorcinol type epoxy resin.
The embodiment of the invention also provides a low-modulus epoxy resin composition, which comprises the following components in parts by weight:
20-30 parts of flexible epoxy resin;
10-20 parts of liquid epoxy resin;
10-20 parts of solid epoxy resin;
10-20 parts of a flexible curing agent;
1-10 parts of epoxy amine curing agent;
25-30 parts of a solvent;
0.5-2 parts of an accelerator;
3-5 parts of an additive;
600-800 parts of high-thermal-conductivity filler.
In other embodiments, the low modulus epoxy resin composition comprises the following components in parts by weight:
25-28 parts of flexible epoxy resin;
12-18 parts of liquid epoxy resin;
12-18 parts of solid epoxy resin;
12-18 parts of a flexible curing agent;
3-7 parts of epoxy amine curing agent;
28 parts of a solvent;
1 part of an accelerator;
4 parts of an additive;
650 portions and 750 portions of high heat conduction filler.
It is understood that the selection of the epoxy amine curing agent, the solvent, the accelerator, the additive and the high thermal conductivity filler is within the ability of those skilled in the art to select the curing agent, the solvent, the accelerator, the additive and the high thermal conductivity filler according to the present disclosure, and the specific substances of the epoxy amine curing agent, the solvent, the accelerator, the additive and the high thermal conductivity filler are not limited by the present invention. For example:
the epoxy amine curing agent may be publicly known epoxy amine curing agents, such as Diethylenetriamine (DETA), triethylenetetramine (TETA), diaminodiphenylmethane (DDM), diaminodiphenylsulfone (DDS), Dicyandiamide (DICY), and the like.
The solvent is prepared from different volatile solvents, and the solvent is common organic solvent, such as ethyl acetate, benzene, toluene, acetone, butanone, ethanol, butanol, propylene glycol methyl ether, N, N-dimethylformamide, etc.
The accelerator is commonly used imidazole such as 2-methylimidazole, 2-ethylimidazole, 2-methyl-4-ethylimidazole, 2-phenylimidazole, 2-heptadecylimidazole and the like.
The additive is at least one of an organosilane thickening agent, a leveling agent and a defoaming agent.
The high heat conduction filler is at least one selected from boron nitride, spherical alumina, angular alumina, aluminum hydroxide and aluminum nitride, and the particle size is 5-10 mu m.
The epoxy resin composition provided by the embodiment has the following characteristics:
a. the viscosity is proper, after a large amount of heat-conducting filler is added, the viscosity can still be kept at 4000-5000 cps, the coating operability is good, and the film forming property is good.
b. After curing, the material has flexibility and can be bent, the elastic modulus at 25 ℃ is less than 2GPa, the heat resistance and the stability are good, and the long-term use reliability is good.
c. After curing, the material has high heat conductivity up to 1.6 w/m.K, high insulating strength and high voltage resistance up to 7000V (100 um).
The embodiment of the invention also provides application of the low-modulus epoxy resin composition in a high-thermal-conductivity metal-based copper-clad plate.
The invention provides an aluminum substrate which comprises a dielectric layer, wherein the dielectric layer is obtained by curing the low-modulus epoxy resin composition in the first aspect.
The further technical scheme is that the thickness of the dielectric layer is 80-120 um.
The embodiment also provides a method for preparing the aluminum substrate, which includes the following steps:
1. weighing the components according to the proportion of the low-modulus epoxy resin composition, uniformly mixing, carrying out high-speed shearing and stirring for 1 hour, carrying out sanding, dispersing and mixing, and carrying out standing and defoaming treatment to obtain the required low-modulus epoxy resin composition, wherein the viscosity is 4000-5500 cps.
2. The obtained low-modulus epoxy resin composition is uniformly coated on a PET release film, and is baked for 6min at 155 ℃ to obtain semi-solidified PP with the thickness of 100 mu m and good appearance without defects such as cavities.
3. Cutting the PP semi-finished product obtained by coating into a proper size, superposing the PP semi-finished product with 4045 series aluminum plates and copper foils with corresponding sizes, putting the superposed product into a high-temperature vacuum laminating machine, carrying out hot-pressing curing to obtain a finished product aluminum substrate,
the components used in the specific examples and comparative examples of the present invention are shown in table 1, and the dispersants, additives and solvents used in the examples are conventional additives in the art, and the present invention is not limited thereto, and do not affect the technical effects of the present invention.
TABLE 1 Low modulus epoxy resin composition Components of examples and comparative examples
Performance testing
The aluminum substrate is prepared by the method using the low-modulus epoxy resin composition obtained in the first to fourth examples and the first to second comparative examples and the traditional epoxy system, and the finished aluminum substrate is tested for peel strength, voltage resistance, thermal conductivity, DMA modulus and DMA glass transition temperature according to the performance requirement test standard of the heat-conducting aluminum substrate. The results of the performance tests are shown in table 2 below:
TABLE 2 test results
As shown in Table 2, the aluminum substrate prepared by using the low-modulus epoxy resin composition provided by the invention has high thermal conductivity, low elastic modulus and excellent solder crack resistance.
According to the formula proportion determined in the example 1, the finished product of the aluminum substrate is manufactured, cut into a square with the size of 100mm × 100mm, the surface copper foil is etched, and a high-temperature aging sample with breakdown voltage and peel strength is manufactured, and the test results are shown in the following table 3:
TABLE 3 breakdown Voltage and Peel Strength high temperature aging test data
As can be seen from the test results shown in Table 3, after aging at 220 ℃ for 1000h or more, the aluminum substrate provided by the invention still has a breakdown voltage and peel strength retention rate of 50% or more, and thus has high insulation reliability for long-term use.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
While the invention has been described with reference to specific embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The low-modulus epoxy resin composition is characterized by comprising the following components in parts by weight:
20-30 parts of flexible epoxy resin;
10-20 parts of liquid epoxy resin;
10-20 parts of solid epoxy resin;
10-20 parts of a flexible curing agent;
wherein the flexible epoxy resin is a copolymer of epoxy resin and a flexible chain segment;
the flexible curing agent is a polymer modified aliphatic or alicyclic amine curing agent with a long-chain structure.
2. The low modulus epoxy resin composition of claim 1, wherein said soft segment is a copolymer of substance a and BPA epoxy;
the substance A is selected from at least one of polyether, polyurethane, acrylate, liquid polysulfide rubber, hydroxyl-containing long-chain organic compound and carboxyl-terminated polyester.
3. The low-modulus epoxy resin composition according to claim 1, wherein the flexible curing agent is at least one polymer selected from the group consisting of polyetheramines, aliphatic acid anhydrides, alicyclic acid anhydrides, polyamide resins, polysulfide rubbers, polyurethanes, and silicone-containing chains.
4. The low-modulus epoxy resin composition according to claim 1, wherein the liquid epoxy resin is at least one selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, bisphenol S type epoxy resin, and resorcinol type epoxy resin.
5. The low modulus epoxy resin composition according to claim 1, wherein said solid epoxy resin is at least one selected from the group consisting of phenoxy resin, biphenyl type epoxy resin, bisphenol a type novolac epoxy resin, and o-cresol type novolac epoxy resin.
6. The low modulus epoxy resin composition of claim 1, further comprising the following components in parts by weight:
1-10 parts of epoxy amine curing agent;
20-25 parts of a solvent;
0.5-2 parts of an accelerator;
3-5 parts of an additive;
600-800 parts of high-thermal-conductivity filler.
7. The low-modulus epoxy resin composition according to claim 6, wherein the additive is at least one selected from the group consisting of an organosilane-based thickener, a leveling agent, and an antifoaming agent.
8. The low modulus epoxy resin composition according to claim 6, wherein said high thermal conductive filler is selected from at least one of boron nitride, spherical alumina, angular alumina, aluminum hydroxide, aluminum nitride.
9. The use of the low-modulus epoxy resin composition according to any one of claims 1 to 8 in a high thermal conductivity metal-based copper clad laminate.
10. An aluminum substrate comprising a dielectric layer cured from the low modulus epoxy resin composition of any of claims 1-8.
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Application publication date: 20211022 |