CN103958140B - 用于晶片切割的晶片切割牺牲基板 - Google Patents

用于晶片切割的晶片切割牺牲基板 Download PDF

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Publication number
CN103958140B
CN103958140B CN201280057521.XA CN201280057521A CN103958140B CN 103958140 B CN103958140 B CN 103958140B CN 201280057521 A CN201280057521 A CN 201280057521A CN 103958140 B CN103958140 B CN 103958140B
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CN
China
Prior art keywords
wafer
sacrificial substrate
cutting
dicing
wafer dicing
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201280057521.XA
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English (en)
Chinese (zh)
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CN103958140A (zh
Inventor
梅耶德·克里斯特
扎内蒂·于尓格
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Precision Surfacing Solutions GmbH
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Precision Surfacing Solutions GmbH
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Publication of CN103958140A publication Critical patent/CN103958140A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201280057521.XA 2011-09-23 2012-09-19 用于晶片切割的晶片切割牺牲基板 Expired - Fee Related CN103958140B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP11182589 2011-09-23
EP11182589.9 2011-09-23
EP11190570.9 2011-11-24
EP11190570A EP2572850A1 (en) 2011-09-23 2011-11-24 Sacrificial substrate for use in wafer cutting
PCT/IB2012/054972 WO2013042055A1 (en) 2011-09-23 2012-09-19 Wafer cutting sacrificial substrate for use in wafer cutting

Publications (2)

Publication Number Publication Date
CN103958140A CN103958140A (zh) 2014-07-30
CN103958140B true CN103958140B (zh) 2020-06-09

Family

ID=45421834

Family Applications (1)

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CN201280057521.XA Expired - Fee Related CN103958140B (zh) 2011-09-23 2012-09-19 用于晶片切割的晶片切割牺牲基板

Country Status (4)

Country Link
EP (1) EP2572850A1 (enExample)
CN (1) CN103958140B (enExample)
IN (1) IN2014DN03101A (enExample)
WO (1) WO2013042055A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103522428A (zh) * 2013-10-16 2014-01-22 内蒙古中环光伏材料有限公司 一种太阳能硅片加工方法及装置
CN107984024B (zh) * 2016-10-26 2022-01-28 精密表面处理解决方案公司 线锯
CN108927908B (zh) * 2018-07-12 2021-01-05 阜宁协鑫光伏科技有限公司 线切割机用的切割方法
CN109808271A (zh) * 2018-12-30 2019-05-28 苏州润德新材料有限公司 一种硅片切割用塑料支撑板及其制备方法
CN110076919A (zh) * 2019-05-31 2019-08-02 江苏吉星新材料有限公司 一种蓝宝石晶棒浸没式多线切割装置及方法
CN114932636B (zh) * 2022-04-28 2023-10-24 广东先导微电子科技有限公司 一种自动取片机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2044482A1 (en) * 1970-09-08 1972-03-23 Cremer, Gottfried, Dr, 5022 Junkers dorf Slitting of ceramic plates - arranged in stacks joined by cold setting agent
WO2009040109A1 (de) * 2007-09-24 2009-04-02 Schott Ag Verfahren zur herstellung von wafern aus ingots
EP2111960A1 (en) * 2008-04-23 2009-10-28 Applied Materials Switzerland SA Mounting plate for a wire sawing device, wire sawing device comprising the same, and wire sawing process carried out by the device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1052816A (ja) * 1996-08-13 1998-02-24 M Ii M C Kk ワイヤ式切断方法
CN101970193A (zh) * 2008-02-11 2011-02-09 Memc电子材料有限公司 用于将锭线锯切片成晶片中的碳纳米管加强线锯梁
EP2427295A1 (en) 2009-05-04 2012-03-14 Meyer Burger AG Wire saw
MY155758A (en) * 2010-01-06 2015-11-30 Shinetsu Chemical Co Rare earth magnet holding jig and cutting machine

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2044482A1 (en) * 1970-09-08 1972-03-23 Cremer, Gottfried, Dr, 5022 Junkers dorf Slitting of ceramic plates - arranged in stacks joined by cold setting agent
WO2009040109A1 (de) * 2007-09-24 2009-04-02 Schott Ag Verfahren zur herstellung von wafern aus ingots
EP2111960A1 (en) * 2008-04-23 2009-10-28 Applied Materials Switzerland SA Mounting plate for a wire sawing device, wire sawing device comprising the same, and wire sawing process carried out by the device

Also Published As

Publication number Publication date
CN103958140A (zh) 2014-07-30
WO2013042055A1 (en) 2013-03-28
EP2572850A1 (en) 2013-03-27
IN2014DN03101A (enExample) 2015-05-15

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