CN103946314A - 具有改善的热稳定性的凝胶 - Google Patents

具有改善的热稳定性的凝胶 Download PDF

Info

Publication number
CN103946314A
CN103946314A CN201280056431.9A CN201280056431A CN103946314A CN 103946314 A CN103946314 A CN 103946314A CN 201280056431 A CN201280056431 A CN 201280056431A CN 103946314 A CN103946314 A CN 103946314A
Authority
CN
China
Prior art keywords
gel
phthalocyanine
hardness
grams
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280056431.9A
Other languages
English (en)
Chinese (zh)
Inventor
德瑞布·E·巴瓦格尔
玄大涉
凯利·J·梅辛
肯特·R·拉森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Corning Korea Ltd
Dow Silicones Corp
Original Assignee
Dow Corning Korea Ltd
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Korea Ltd, Dow Corning Corp filed Critical Dow Corning Korea Ltd
Publication of CN103946314A publication Critical patent/CN103946314A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2220/00—Compositions for preparing gels other than hydrogels, aerogels and xerogels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411—Insulated-gate bipolar transistors [IGBT]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)
CN201280056431.9A 2011-10-06 2012-02-09 具有改善的热稳定性的凝胶 Pending CN103946314A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161543985P 2011-10-06 2011-10-06
US61/543,985 2011-10-06
PCT/US2012/024498 WO2013052147A1 (en) 2011-10-06 2012-02-09 Gel having improved thermal stability

Publications (1)

Publication Number Publication Date
CN103946314A true CN103946314A (zh) 2014-07-23

Family

ID=45757203

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280056431.9A Pending CN103946314A (zh) 2011-10-06 2012-02-09 具有改善的热稳定性的凝胶

Country Status (7)

Country Link
US (1) US20150130086A1 (https=)
EP (1) EP2764051B1 (https=)
JP (1) JP2014534292A (https=)
KR (1) KR101994081B1 (https=)
CN (1) CN103946314A (https=)
TW (1) TWI605094B (https=)
WO (1) WO2013052147A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109318116A (zh) * 2018-09-30 2019-02-12 深圳昊天龙邦复合材料有限公司 基于对位芳纶纸的复合材料晶圆载板及其制造方法
WO2020133374A1 (en) * 2018-12-29 2020-07-02 Dow Global Technologies Llc Thermally conductive composition containing mgo filler and methods and devices in which said composition is used

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017057386A (ja) * 2015-09-15 2017-03-23 国立大学法人信州大学 縮合硬化型オルガノポリシロキサン組成物、縮合硬化型オルガノポリシロキサン組成物キットおよびシリコーンゴム
JP6956697B2 (ja) * 2018-09-18 2021-11-02 住友理工株式会社 シリコーンゴム組成物およびシリコーンゴム架橋体
EP3929240A4 (en) * 2020-02-13 2022-04-27 Fuji Polymer Industries Co., Ltd. HEAT RESISTANT SILICONE RESIN COMPOSITION AND HEAT RESISTANT SILICONE RESIN COMPOSITE
WO2025039204A1 (en) * 2023-08-23 2025-02-27 Dow Silicones Corporation High temperature stable thermally conductive materials

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0426137A1 (en) * 1989-10-31 1991-05-08 Dow Corning Toray Silicone Company, Limited Curable organosiloxane composition yielding elastomers exhibiting reduced compression set values
US20040092655A1 (en) * 2001-04-02 2004-05-13 Takayoshi Otomo Mouldable silicone gel compositions

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB731166A (en) * 1952-05-27 1955-06-01 Midland Silicones Ltd Improvements in or relating to organosiloxane elastomers
US4374967A (en) 1981-07-06 1983-02-22 Dow Corning Corporation Low temperature silicone gel
US6020409A (en) 1997-09-19 2000-02-01 Dow Corning Corporation Routes to dielectric gel for protection of electronic modules
JP2002294076A (ja) * 2001-04-02 2002-10-09 Dow Corning Toray Silicone Co Ltd 金型成形用シリコーンゲル組成物
TWI242584B (en) * 2001-07-03 2005-11-01 Lord Corp High thermal conductivity spin castable potting compound
JP5538872B2 (ja) * 2009-12-24 2014-07-02 東レ・ダウコーニング株式会社 シリコーンエラストマー組成物
KR101866299B1 (ko) * 2011-01-26 2018-06-12 다우 실리콘즈 코포레이션 고온 안정성 열 전도성 재료

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0426137A1 (en) * 1989-10-31 1991-05-08 Dow Corning Toray Silicone Company, Limited Curable organosiloxane composition yielding elastomers exhibiting reduced compression set values
US20040092655A1 (en) * 2001-04-02 2004-05-13 Takayoshi Otomo Mouldable silicone gel compositions

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109318116A (zh) * 2018-09-30 2019-02-12 深圳昊天龙邦复合材料有限公司 基于对位芳纶纸的复合材料晶圆载板及其制造方法
WO2020133374A1 (en) * 2018-12-29 2020-07-02 Dow Global Technologies Llc Thermally conductive composition containing mgo filler and methods and devices in which said composition is used

Also Published As

Publication number Publication date
KR20140094533A (ko) 2014-07-30
WO2013052147A1 (en) 2013-04-11
TW201315775A (zh) 2013-04-16
EP2764051B1 (en) 2018-10-24
TWI605094B (zh) 2017-11-11
KR101994081B1 (ko) 2019-07-01
US20150130086A1 (en) 2015-05-14
JP2014534292A (ja) 2014-12-18
EP2764051A1 (en) 2014-08-13

Similar Documents

Publication Publication Date Title
TWI787350B (zh) 包含填料之聚矽氧組成物
CN102234431B (zh) 高接着性硅氧树脂组成物以及使用该组成物的光半导体装置
CN103917603B (zh) 形成具有改善的热稳定性的凝胶的方法
CN103946313B (zh) 具有改善的热稳定性的凝胶
TWI867684B (zh) 具有熱傳導性黏著層的熱傳導性聚矽氧橡膠片及其製造方法
US20100140538A1 (en) Silicone elastomer composition and silicone elastomer
JP6658428B2 (ja) シリコーンゲル組成物及びその硬化物並びにパワーモジュール
CN102159647A (zh) 液体小片粘合剂
CN103087528A (zh) 有机硅树脂组合物、片及其制法、光半导体元件装置
JP6965346B2 (ja) ダイボンディング用硬化性シリコーン組成物
CN109476128B (zh) 热传导性硅酮橡胶复合片材
CN103946314A (zh) 具有改善的热稳定性的凝胶
JP2013221082A (ja) 付加硬化型シリコーン樹脂組成物、並びに該組成物からなるシート、シート状硬化物、及びダイアタッチ材
CN101096565B (zh) 改进有机硅凝胶的耐助焊剂能力的方法及其形成方法
TW202321374A (zh) 含有鑽石粒子之可固化導熱組成物
JP7359761B2 (ja) １剤型硬化性シリコーン組成物
JP2020070402A (ja) 付加硬化型シリコーン樹脂組成物、その硬化物、及び光半導体装置
JP6520851B2 (ja) シリコーンゲル組成物
JP5697160B2 (ja) オルガノポリシロキサン組成物及びその硬化物
US20180127552A1 (en) Method Of Forming A Gel Having Improved Thermal Stability
TW202540336A (zh) 隔熱矽酮組合物及使用該組合物製備隔熱固化產物的方法
WO2023136188A1 (ja) スポットポッティング用チキソ性シリコーンゲル組成物及びその硬化物並びにフォトカプラ

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20140723