CN103929562B - Imaging sensor, image scanning and thickness detecting method - Google Patents
Imaging sensor, image scanning and thickness detecting method Download PDFInfo
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- CN103929562B CN103929562B CN201410183056.5A CN201410183056A CN103929562B CN 103929562 B CN103929562 B CN 103929562B CN 201410183056 A CN201410183056 A CN 201410183056A CN 103929562 B CN103929562 B CN 103929562B
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Abstract
The invention discloses a kind of imaging sensor, image scanning and thickness detecting method.Wherein, imaging sensor includes：First substrate, for accepting article to be detected, and first substrate is transparency carrier；First light source；Lens, wherein, incident side and the first substrate of lens are correspondingly arranged, for receiving reflected light or transmitted light of the article to be detected under the irradiation of the first light source；Converter, is arranged on the light emission side of lens, for the optical signal from lens to be converted into electric signal；Live end；Test side, and interval setting relative with live end, for producing electrical signal of reaction；And detection circuit, it is connected with test side, for detecting that article to be detected passes through the electrical signal of reaction of test side during transmission channel.By the present invention, the problem of imaging sensor of the prior art can not carry out Thickness sensitivity is solved, and then realizes the integration of Thickness sensitivity and image scanning, the volume for greatly reducing equipment has been reached.
Description
Technical field
The present invention relates to field of image detection, in particular to a kind of imaging sensor, image scanning and Thickness sensitivity
Method.
Background technology
In recent years, used as image reading touch sensor (Contact Image Sensor, abbreviation CIS, with
Call in the following text and make imaging sensor) practical development is obtained in many fields, it is the flat objects such as current paper printing article
The mainstream technology of image reading.On the other hand, flat thin sheet article, such as paper, bill, plastic sheeting, textile fabric etc.
On-line continuous thickness measure, in increasingly consequence during the production of its product, detection, processing, recovery etc., and
Current imaging sensor can not still carry out the measurement of thickness.Currently, the Thickness sensitivity technology that every profession and trade is used mainly includes making
Laminar article is tested with technologies such as hall device, reflection-type ultrasonic wave, transmission-type ultrasonic wave, induction, eddy current types
Thickness.But these technologies are as online measuring technique in use, its detection means volume is big, and cost height is its major defect,
Limit the application of these technologies.
In recent years, the technology of thickness measure is carried out also among continuous research and probe by interelectrode electrostatic induction, example
A kind of capacitive paper thickness sensor as disclosed in publication number CN210302446Y patent, it is mainly by the capacity of capacitor
Change changes into the change of frequency of oscillation, then by pressing modular converter that the change of frequency is converted into the change of voltage frequently.It is open
Number a kind of detection method of material thickness is also disclosed that for CN103363887A patent, the pole plate by the use of capacity plate antenna is used as thickness
The Sensitive Apparatus of detection is spent, electric capacity movable polar plate caused by the thickness change of object is surveyed and produces displacement, cause plate condenser
Capacity change.These reduce device to a certain extent by the thickness measurement technique of interelectrode electrostatic induction
Volume, but transmission mechanism is stilled need, therefore it is also unbecoming with the development of the miniaturization of equipment, and these measurement apparatus and image
It is also to be unable to reach device miniaturization, the purpose of cost degradation that reading device is relatively independent in structure, is existed very using upper
Big limitation.
The problem of can not carrying out Thickness sensitivity for imaging sensor in correlation technique, not yet proposes effective solve at present
Scheme.
The content of the invention
It is a primary object of the present invention to provide a kind of imaging sensor, image scanning and thickness detecting method, to solve
The problem of imaging sensor can not carry out Thickness sensitivity in the prior art.
According to an aspect of the invention, there is provided a kind of imaging sensor.
Included according to the imaging sensor of the present invention：First substrate, for accepting article to be detected, and first base
Plate is transparency carrier；First light source；Lens, wherein, the incident side of the lens is correspondingly arranged with the first substrate, for connecing
Receive reflected light or transmitted light of the article to be detected under first light source irradiation；Converter, is arranged on the lens
Light emission side, for the optical signal from the lens to be converted into electric signal；Live end；Test side, it is relative with the live end
And be arranged at intervals, for producing electrical signal of reaction；And detection circuit, it is connected with the test side, for detecting described treat
Detect that article passes through the electrical signal of reaction of the test side during transmission channel, wherein, the transmission channel is described powered
Interval between end and the test side.
Further, the live end includes：Second substrate and charged electrode, wherein, the charged electrode is arranged on institute
State on the first face of second substrate, the test side includes：The first substrate and induction electrode, wherein, the induction electrode
It is arranged on the first face of the first substrate, the induction electrode is transparency electrode, and the first face of the first substrate is court
To or the dorsad face of the transmission channel, the first face of the second substrate is the face toward or away from the transmission channel.
Further, the area in the face of second substrate first is less than or equal to the area in the face of first substrate first.
Further, the live end includes：Second substrate and charged electrode, wherein, the charged electrode is arranged on institute
State on the first face of second substrate, the test side includes：3rd substrate and induction electrode, wherein, the 3rd substrate and institute
First substrate is stated positioned at same level, the induction electrode is arranged on the first face of the 3rd substrate, the 3rd base
First face of plate is the face toward or away from the transmission channel, and the first face of the second substrate is to be passed toward or away from described
The face of defeated passage.
Further, the charged electrode is electret electrode.
Further, the second substrate is transparency carrier, and described image sensor also includes：Secondary light source, is arranged on
First side of the second substrate, wherein, the first side of the second substrate is towards the one of the second face of the second substrate
Side, the second face of the second substrate dorsad transmission channel.
Further, first light source includes：First sub-light source and the second sub-light source, are arranged at the first substrate
The first side, wherein, the first side of the first substrate is the side towards the second face of the first substrate, first base
Second face of the plate dorsad transmission channel.
Further, described image sensor also includes：Regulating part, be connected to the live end and the test side it
Between, the size for adjusting the transmission channel.
There is provided a kind of image scanning and thickness detecting method according to another aspect of the present invention.
Included according to the image scanning of the present invention and thickness detecting method：Any provided by the above of the present invention
Plant imaging sensor and carry out image scanning and Thickness sensitivity.
In the present invention, using the imaging sensor with following structure：First substrate, for accepting article to be detected,
And the first substrate is transparency carrier；First light source；Lens, wherein, the incident side of the lens and the first substrate
It is correspondingly arranged, for receiving reflected light or transmitted light of the article to be detected under first light source irradiation；Converter, if
The light emission side in the lens is put, for the optical signal from the lens to be converted into electric signal；Live end；Test side, with
The live end is relative and is arranged at intervals, for producing electrical signal of reaction；And detection circuit, it is connected with the test side,
For detecting that the article to be detected passes through the electrical signal of reaction of the test side during transmission channel, wherein, the transmission
Passage is the interval between the live end and the test side.By set in the image sensor live end, test side and
Circuit is detected, the test section of Thickness sensitivity can be carried out by realizing addition in the image sensor, be solved of the prior art
The problem of imaging sensor can not carry out Thickness sensitivity, and then the integration of Thickness sensitivity and image scanning is realized, reach
The volume of equipment is greatly reduced, the function of online high-speed continuous measurement thickness and image reading is realized.
Brief description of the drawings
The accompanying drawing for constituting the part of the application is used for providing a further understanding of the present invention, schematic reality of the invention
Apply example and its illustrate to be used to explain the present invention, do not constitute inappropriate limitation of the present invention.In the accompanying drawings：
Fig. 1 is the sectional schematic diagram of imaging sensor according to a first embodiment of the present invention；
Fig. 2 is the side schematic view of imaging sensor according to a first embodiment of the present invention；
Fig. 3 is the sectional schematic diagram of imaging sensor according to a second embodiment of the present invention；
Fig. 4 is the sectional schematic diagram of imaging sensor according to a third embodiment of the present invention；
Fig. 5 is the sectional schematic diagram of imaging sensor according to a fourth embodiment of the present invention；And
Fig. 6 is the sectional schematic diagram of imaging sensor according to a fifth embodiment of the present invention.
Embodiment
In order that those skilled in the art more fully understand the present invention program, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment that member is obtained under the premise of creative work is not made, should all belong to the model that the present invention is protected
Enclose.
It should be noted that term " first " in description and claims of this specification and above-mentioned accompanying drawing, "
Two " etc. be for distinguishing similar object, without for describing specific order or precedence.It should be appreciated that so using
Data can exchange in the appropriate case, so as to embodiments of the invention described herein can with except illustrating herein or
Order beyond those of description is implemented.In addition, term " comprising " and " having " and their any deformation, it is intended that cover
Lid is non-exclusive to be included, for example, the process, method, system, product or the equipment that contain series of steps or unit are not necessarily limited to
Those steps or unit clearly listed, but may include not list clearly or for these processes, method, product
Or the intrinsic other steps of equipment or unit.
In the case where not conflicting, the feature in embodiment and embodiment in the application can be mutually combined.Below will
The present invention will be described in detail with reference to the accompanying drawings and embodiments.
According to embodiments of the present invention there is provided a kind of imaging sensor, the image provided below the embodiment of the present invention
Sensor does specific introduction：
Fig. 1 is the sectional drawing of imaging sensor according to a first embodiment of the present invention, as shown in figure 1, the imaging sensor
Mainly include first substrate 15, the first light source 11, lens 12, converter 13, live end 21, test side 22 and detection circuit 25,
Wherein：
First substrate 15, the first light source 11, lens 12 and converter 13 are the masters for constituting the first test section of image sensor 1
Part is wanted, first test section 1 is mainly used in treating the detection progress image scanning of article 4, live end 21, test side 22 and detection
Circuit 25 is the critical piece for constituting the second test section of imaging sensor 2, and second test section 2 is mainly used in treating detection article
4 carry out Thickness sensitivity, specifically, and first substrate 15 is used to accept article 4 to be detected, and is the first test section 1 and the second inspection
The shared transparency carrier in survey portion 2, as the transparency carrier for carrying article 4 to be detected in the first test section 1, in the second test section
Used in 2 as detection electrode base board, in order to not influence on the image reading function of imaging sensor, first substrate 15 using saturating
The detecting electrode of test side 22 has been made in bright ITO conducting films.In embodiments of the present invention, imaging sensor also includes accommodating the
The framework 16 of one light source 11, lens 12 and sensor base plate 14, wherein, sensor base plate 14 is the substrate for accepting converter 13.
The incident side of lens 12 is correspondingly arranged with first substrate 15, is shone for receiving article 4 to be detected in the first light source 11
Reflected light or transmitted light under penetrating, converter 13 are arranged on the light emission side of lens 12, for the optical signal from lens 12 to be turned
Electric signal is changed to, the converter 13 can be light sensor, or other to convert optical signals to electric signal
Device.
Test side 22 and live end 21 are staggered relatively and at intervals, make to form a kind of capacity plate antenna therebetween
Structure, and filled without mounting medium therebetween but form a sense channel 27, carrying out image reading or thickness
During the on-line checking for spending measurement, article 4 to be detected is transmitted by sense channel 27 between live end 21 and test side 22,
So as to reach the purpose of image reading and measurement thickness.
Detection circuit 25 is connected with test side 22, for detecting article 4 to be detected by being examined during transmission channel 27
The electrical signal of reaction at end 22 is surveyed, wherein, electrical signal of reaction can be charge inducing or induced voltage.Due to induced electricity
Signal is a kind of faint signal of comparison, so needing after being amplified processing subsequent conditioning circuit could be supplied to be digitized and computing
Processing, to calculate the thickness for obtaining article to be detected, in embodiments of the present invention, thing to be detected is calculated with specific reference to induced signal
The calculation of product thickness, can be using any side that thickness is carried out according to charge inducing or induced voltage of the prior art
Formula, here is omitted.
The thickness transducer that the detailed description below embodiment of the present invention is provided detects the principle of thickness：
Live end 21 and test side 22 are staggered relatively, constitute the structure similar to capacity plate antenna, due on live end 21
Electric charge can also be induced by being applied with voltage, test side 22, the number of the electric charge induced on test side 22, depending on two bases
The voltage that the area of plate, two substrates are separated by a distance, applied on live end 21 charged electrode, and between two substrates
Dielectric constant.In the case where structure is certain, only dielectric constant is relevant between two substrates, therefore when article 4 to be detected
During by sense channel 27, the dielectric constant of the medium between two substrates is just changed, the electric charge for making to sense on test side 22
Quantity also changes therewith, the thickness of article 4 to be detected is different, and the dielectric constant between live end 21 and test side 22 changes
Change is also differed, and the electric charge sensed on test side 22 is also differed, thus according on test side 22 charge inducing number can be with
Calculate the thickness of article 4 to be detected.
Meanwhile, when article 4 (original copy) to be detected is by sense channel, the light that the first light source 11 is sent, through the first base
Plate 15, is irradiated on the article to be detected 4 in sense channel, and the word black region light on article 4 to be detected is absorbed, and
The other white-based color regions of article to be detected 4, light almost 100% is reflected, and these reflected lights are then passed through first substrate 15, quilt
Lens array 12 is collected, and is irradiated on the converter 13 carried on sensor base plate 14.Converter 13 is by the optical signal received
Electric signal is converted into, and is exported through overdrive circuit, is outwards exported as image (word) information eventually through interface.It is to be detected
Article 4 is constantly mobile, and described image (word) information, which will be read continuously, thereon takes off.
In embodiments of the present invention, article 4 (original copy) to be detected enters after sense channel 27, the first test section 1 and second
Test section 2 can work simultaneously, treat detection article 4 thickness detected and treated detect article 4 image be scanned
Read.
The imaging sensor that the embodiment of the present invention is provided, by set in the image sensor live end, test side and
Circuit is detected, the test section of Thickness sensitivity can be carried out by realizing addition in the image sensor, be solved of the prior art
The problem of imaging sensor can not carry out Thickness sensitivity, and then the integration of Thickness sensitivity and image scanning is realized, reach
The volume of equipment is substantially reduced, the function of online high-speed continuous measurement thickness and image reading is realized.
Specifically, live end 21 mainly includes second substrate 211 and charged electrode 212, wherein, charged electrode 212 is set
On the first face of second substrate 211, i.e. second substrate 211 is the charged electrode substrate of charged electrode 212, charged electrode 212
On make electrode powered by applying certain voltage, according to the requirement of the sensitivity to different testing sample product, the electricity generally applied
Several volts are pressed in tens volts or so, the imaging sensor of the embodiment of the present invention on bank note and bank note mainly for detection of being attached
Adhesive tape, it is desirable to have the high sensitivity of comparison to distinguish adhesive tape whether is posted on bank note, the voltage of application reaches 20V or so.The
Two substrates 211 are the carriers of charged electrode 212, and with the composition sense channel staggered relatively of first substrate 15.Its material is general
For glass, PCB, metallic plate or ceramic wafer etc., PCB is used to be set in advance as charged electrode substrate, and on PCB in the present embodiment
The good required electrode image of meter.
Test side 22 mainly includes first substrate 15 and induction electrode 221, wherein, induction electrode 221 is arranged on the first base
On first face of plate 15, i.e. first substrate 15 is the substrate of induction electrode 221, induction electrode 221 is in detecting electrode substrate
What is formed in setting face forms the electrode of electrostatic induction electric charge, and glass, PCB, metal can also be used in the material of first substrate 15
Plate or ceramic wafer etc., because Thickness sensitivity and image scanning share first substrate 15 in the present embodiment, therefore can only be used transparent
Glass plate is used in substrate, the present embodiment as detection electrode base board.And ito film thickness is formed on a glass is used as induced electricity
Pole 221.
Figure 1 illustrates first embodiment imaging sensor in, the first face of second substrate 211 and first substrate 15
The first face be face towards transmission channel.Article 4 to be detected passes through the transmitting procedure between two electrodes of transmission channel 27
In, detection circuit 25 is mainly the charge inducing or induced voltage circuit detected on induction electrode 221.It should be noted that band
Electrode 212 and induction electrode 221 have to not necessarily be arranged on the side of the close sense channel 27 of two substrates, charged electrode
212 and an electrode or two electrodes in induction electrode 221 be arranged on the other side of corresponding substrate and also there is same work(
Energy.That is, charged electrode 212 can be arranged on second substrate 211 dorsad in the one side of transmission channel 27, and induction electrode 221 also may be used
To be arranged on first substrate 15 dorsad in the one side of transmission channel 27.
Fig. 2 is the side schematic view of imaging sensor according to a first embodiment of the present invention, as shown in Fig. 2 the present invention the
The imaging sensor of one embodiment can also include regulating part 26, the regulating part 26 be connected to live end 21 and test side 22 it
Between, the size for adjusting transmission channel 27, i.e. regulating part 26 is imaging sensor two ends channel width adjusting means, for
Relatively-stationary detection object, can be arranged to level altitude by transmission channel by regulating part 26, keep thickness transducer
The transmission channel of one fixed width, so as to simplify the structure of sensor, reduce volume.For detection article thickness range
Compare wide applicable cases, regulating part 26 can set the regulating part with bascule, to be carried out to the width of transmission channel
Activity adjustment, adapts to different detection objects.
In embodiments of the present invention, smoothly transmitted between two electrodes for the ease of article 4 to be detected, according to thing to be detected
The difference of the thickness of product 4, two interelectrode distances are in 1mm to 10mm degree or so, i.e. the size of transmission channel is (in other words
Width) 1mm to 10mm degree or so.
Preferably, in embodiments of the present invention, charged electrode 212 can be the electret band being made of electret
Electrode.
Because electret is per se with electric charge, therefore electret electrode does not need the external world to be powered, so as to disappear
Unstable and noise the influence come except extraneous Power supply belt.Highly stable powered electricity is provided by using electret electrode
Pressure, is eliminated by electrified voltage formed by additional power source, so that electrode outside need not provide voltage, reduces outside
Power supply and external environment condition influence, using the teaching of the invention it is possible to provide high-precision accurate measurement.
Wherein, forming the material of electret electrode has many types, such as fluoride polymer series, polyolefin series etc.,
As long as a certain amount of fixed charge can be carried, the thickness detection image sensor of the embodiment of the present invention, this reality are all applied to
The Teflon material that the electret used in example is polytetrafluoroethylene (PTFE) is applied, is first printed or is coated in second substrate 211
On, it is carried electric charge by electrion mode at high temperature.
Fig. 3 is the sectional schematic diagram of imaging sensor according to a second embodiment of the present invention, as shown in figure 3, second reality
The difference for applying the imaging sensor of the first embodiment shown in the imaging sensor and Fig. 1 that example provided is：Second implements
In the imaging sensor of example, the first light source 11 includes the first sub-light source 11a and the second sub-light source 11b.The image of this structure is passed
First light source 11 is set to include two sub-light sources by sensor according to the requirement of the image of the article to be detected to being read, this
Two sub-light sources can be with identical, can also be different, reaches the requirement for adapting to different articles to be detected.
Fig. 4 is the sectional schematic diagram of imaging sensor according to a third embodiment of the present invention, as shown in figure 4, the 3rd is real
The difference for applying the imaging sensor of the first embodiment shown in the imaging sensor and Fig. 1 that example provided is：3rd implements
The image sensor of example also includes secondary light source 3, and the secondary light source 3 is arranged on the first side of second substrate 211, wherein, second
Dorsad transmitted for the second face towards the side in the second face of second substrate 211, second substrate 211 logical in first side of substrate 211
Road 27.
Wherein, the charged electrode substrate 211 of the light-passing board of secondary light source 3 and imaging sensor is shared, due to image sensing
Device will receive the image of the transmission light of external secondary light source 3, therefore the second substrate 211 in the present embodiment is also using transparent
Glass plate constitute, transparent charged electrode 212 is made on a glass, the transparent first substrate 15 with imaging sensor side
(that is, detecting electrode substrate) and detecting electrode 221 constitute two electrodes that Thickness sensitivity is carried out in imaging sensor.
In this embodiment, equally can be according to the requirement of the image of the article to be detected to being read, by the first light source
11 are set to include the first sub-light source 11a and the second sub-light source 11b, and the two sub-light sources can be with identical, can also be different, reaches
Adapt to the requirement of different articles to be detected.
Fig. 5 is the sectional schematic diagram of imaging sensor according to a fourth embodiment of the present invention, as shown in figure 5, the 4th is real
The difference for applying the imaging sensor of the first embodiment shown in the imaging sensor and Fig. 1 that example provided is：Test side 22
Including the 3rd substrate 222 and induction electrode 221, wherein, the 3rd substrate 222 is located at same level, sensing with first substrate 15
Electrode 221 is arranged on the first face of the 3rd substrate 222, and the first face of the 3rd substrate 222 is toward or away from transmission channel 27
Face, induction electrode 221 is diagrammatically illustrated in Fig. 5 and is arranged on the 3rd substrate 222 towards in the one side of transmission channel 27.
By being separately provided the 3rd substrate 222, realize and the second test section 2 for carrying out Thickness sensitivity is individually placed in progress
The side on the top of the first test section 1 of image scanning, makes original copy (or article 4 to be measured) first pass through the position of image reading, then
Carry out progress sense channel (or opposite order), makes original copy in transmitting procedure, and the reading of image and the measurement of thickness are mutual not
Influence, i.e., do not increase volume, also reduce interference each other, the reading quality of image and the measurement accuracy of thickness is all obtained
Raising is arrived.
Detecting circuit 25 is placed within the sensor base plate 4 of imaging sensor simultaneously, reduces the noise in the external world to detection
The interference in loop, simplifies control and signal transmission of the main frame to two sensors, also reduces making an uproar in signals transmission
Sound and interference, improve detection quality.
In this embodiment, equally can be according to the requirement of the image of the article to be detected to being read, by the first light source
11 are set to include the first sub-light source 11a and the second sub-light source 11b, and the two sub-light sources can be with identical, can also be different, reaches
Adapt to the requirement of different articles to be detected.
Fig. 6 is the sectional schematic diagram of imaging sensor according to a fifth embodiment of the present invention, as shown in fig. 6, the 5th is real
The difference for applying the imaging sensor of the first embodiment shown in the imaging sensor and Fig. 1 that example provided is：Second substrate
The area in 211 first faces is less than or equal to the area in the face of first substrate 15 first.
The imaging sensor of such a structure, equally realizes the second test section 2 by Thickness sensitivity is carried out independently of progress
First test section 1 of image scanning, makes original copy in transmitting procedure, and the reading of image and the measurement of thickness are independent of each other, i.e., not
Increase volume, also reduce interference each other, the reading quality of image and the measurement accuracy of thickness is obtained for raising.
Also, in the case where the first test section 1 and the second test section 2 are separate, detecting electrode substrate and image scanning are maintained again
Sharing for transparency glass plate, can more reduce the volume of imaging sensor, and manufacturing process also more facilitates, main product structure also phase
To stable, be conducive to large-scale production.
According to embodiments of the present invention, a kind of imaging sensor provided using above-described embodiment is be provided and carries out image
Scanning and thickness detecting method, the image scanning and thickness detecting method are mainly by detecting that article to be detected passes through transmission channel
During detecting electrode electrical signal of reaction, to calculate the thickness of article to be detected, and pass through transmission channel in article to be detected
During carry out image scanning, wherein, transmission channel is the imaging sensor that the above of the embodiment of the present invention is provided
Transmission channel.
The imaging sensor provided using the above of the embodiment of the present invention, realizes offer a kind of by film thickness sensor
The measurement apparatus integrated with imaging sensor, or perhaps a kind of image reading sensor that function is detected with thickness, are used
With the thickness and image of flat thin sheet and other items under the conditions of being run at high speed to on-line continuous while carrying out high-precision detection, with
The industries such as finance, chemical industry, weaving, papermaking, printing, insurance are met for high-precision thickness measure and the demand of image reading.
Obviously, those skilled in the art should be understood that above-mentioned each module of the invention or each step can be with general
Computing device realize that they can be concentrated on single computing device, or be distributed in multiple computing devices and constituted
Network on, alternatively, the program code that they can be can perform with computing device be realized, it is thus possible to they are stored
Performed in the storage device by computing device, either they are fabricated to respectively each integrated circuit modules or by they
In multiple modules or step single integrated circuit module is fabricated to realize.So, the present invention is not restricted to any specific
Hardware and software is combined.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (9)
1. a kind of imaging sensor, it is characterised in that including：
First substrate (15), for accepting article to be detected, and the first substrate (15) is transparency carrier；
First light source (11)；
Lens (12), wherein, incident side and the first substrate (15) of the lens (12) are correspondingly arranged, described for receiving
Reflected light or transmitted light of the article to be detected in the case where first light source (11) is irradiated；
Converter (13), is arranged on the light emission side of the lens (12), for the optical signal from the lens (12) to be changed
For electric signal；
Live end (21)；
Test side (22), and interval setting relative with the live end (21), for producing electrical signal of reaction；And
Circuit (25) is detected, is connected with the test side (22), for detecting that the article to be detected passes through transmission channel
(27) electrical signal of reaction of the test side (22) during, wherein, the transmission channel (27) be the live end (21) with
Interval between the test side (22).
2. imaging sensor according to claim 1, it is characterised in that
The live end (21) includes：Second substrate (211) and charged electrode (212), wherein, the charged electrode (212) sets
Put on the first face of the second substrate (211),
The test side (22) includes：The first substrate (15) and induction electrode (221), wherein, the induction electrode (221)
On the first face for being arranged on the first substrate (15), the induction electrode (221) is transparency electrode, the first substrate (15)
The first face be face toward or away from the transmission channel (27), the first face of the second substrate (211) be towards or the back of the body
To the face of the transmission channel (27).
3. imaging sensor according to claim 2, it is characterised in that the area in the face of second substrate (211) first
Less than or equal to the area in the face of first substrate (15) first.
4. imaging sensor according to claim 1, it is characterised in that
The live end (21) includes：Second substrate (211) and charged electrode (212), wherein, the charged electrode (212) sets
Put on the first face of the second substrate (211),
The test side (22) includes：3rd substrate (222) and induction electrode (221), wherein, the 3rd substrate (222) with
The first substrate (15) is located at same level, and the induction electrode (221) is arranged on the first of the 3rd substrate (222)
On face, the first face of the 3rd substrate (222) is the face toward or away from the transmission channel (27), the second substrate
(211) the first face is the face toward or away from the transmission channel (27).
5. the imaging sensor according to any one of claim 2 to 4, it is characterised in that the charged electrode (212) is
Electret electrode.
6. imaging sensor according to claim 2, it is characterised in that the second substrate (211) is transparency carrier, institute
Stating imaging sensor also includes：
Secondary light source (3), is arranged on the first side of the second substrate (211), wherein, the first of the second substrate (211)
Side is the side towards the second face of the second substrate (211), the second face dorsad transmission of the second substrate (211)
Passage (27).
7. the imaging sensor according to claim 1 or 6, it is characterised in that first light source (11) includes：
First sub-light source (11a) and the second sub-light source (11b), are arranged at the first side of the first substrate (15), wherein, institute
The first side for stating first substrate (15) is the side towards the second face of the first substrate (15), the first substrate (15)
The second face dorsad transmission channel (27).
8. imaging sensor according to claim 1, it is characterised in that described image sensor also includes：
Regulating part (26), is connected between the live end (21) and the test side (22), for adjusting the transmission channel
(27) size.
9. a kind of image scanning and thickness detecting method, it is characterised in that pass through the figure any one of claim 1 to 8
As sensor carries out image scanning and Thickness sensitivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410183056.5A CN103929562B (en) | 2014-04-29 | 2014-04-29 | Imaging sensor, image scanning and thickness detecting method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410183056.5A CN103929562B (en) | 2014-04-29 | 2014-04-29 | Imaging sensor, image scanning and thickness detecting method |
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| CN103929562A CN103929562A (en) | 2014-07-16 |
| CN103929562B true CN103929562B (en) | 2017-08-01 |
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| JP6225895B2 (en) * | 2014-12-26 | 2017-11-08 | 京セラドキュメントソリューションズ株式会社 | Sheet type detection apparatus and image forming apparatus |
| CN106412465A (en) * | 2016-06-14 | 2017-02-15 | 威海华菱光电股份有限公司 | Image sensor |
| CN106101475A (en) * | 2016-08-11 | 2016-11-09 | 威海华菱光电股份有限公司 | Multifunctional image sensor |
| CN107677198A (en) * | 2017-10-31 | 2018-02-09 | 深圳市柔纬联科技有限公司 | The self-driven closely position detector of electret |
| CN109115103B (en) * | 2018-07-27 | 2020-11-06 | 威海华菱光电股份有限公司 | Detection device and detection method of thin film |
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| CN101754919A (en) * | 2007-07-26 | 2010-06-23 | 富士通株式会社 | Paper sheet thickness detection device |
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| JP5408537B2 (en) * | 2009-05-29 | 2014-02-05 | 株式会社リコー | Image reading apparatus and image forming apparatus |
| CN203800995U (en) * | 2014-04-29 | 2014-08-27 | 威海华菱光电股份有限公司 | Image sensor |
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| US4523938A (en) * | 1981-07-06 | 1985-06-18 | Cselt - Centro Studi E Laboratori Telecomunicazioni S.P.A. | Method of and apparatus for continuously monitoring diameter variations of an optical fiber being drawn |
| CN101754919A (en) * | 2007-07-26 | 2010-06-23 | 富士通株式会社 | Paper sheet thickness detection device |
| CN102739906A (en) * | 2012-06-28 | 2012-10-17 | 威海华菱光电股份有限公司 | Contact image sensor |
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