CN103924216B - 等离子发生器混气管路 - Google Patents

等离子发生器混气管路 Download PDF

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CN103924216B
CN103924216B CN201410140942.XA CN201410140942A CN103924216B CN 103924216 B CN103924216 B CN 103924216B CN 201410140942 A CN201410140942 A CN 201410140942A CN 103924216 B CN103924216 B CN 103924216B
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CN103924216A (zh
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凌复华
张孝勇
苏欣
吴凤丽
姜崴
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Piotech Inc
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Piotech Shenyang Co Ltd
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45512Premixing before introduction in the reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
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    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3244Gas supply means

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Abstract

一种等离子发生器混气管路,包括上端焊接加工件、中部混气块、底部陶瓷座及进气管路。所述上端焊接加工件由等离子体进气法兰连接管、三通连接件、圆柱管路及管路端头连接件焊接而成。三通连接件的底部设有水路进出口,用于混气管路的冷却。中部设有对称的混气块,内部分别嵌有倒锥形挡块,使混气块的内部形成了倒锥形的环状气道。焊接加工件分别与混气块用螺钉连接。末端两侧的陶瓷座,用于混气管路和腔室间的绝缘。本发明实现了等离子体与工艺气体的隔离,冷却等离子体产生的高温及工艺气体能够平稳流动的功能。通过中部倒锥形挡块的设置,使工艺气体在其周围平稳旋转流入,并被其导流向下进入反应腔室,在晶圆表面形成均匀性良好的介质膜。具有结构合理,实用性强,可广泛应用于半导体镀膜技术领域。

Description

等离子发生器混气管路
技术领域
本发明涉及一种混气管路,主要应用于半导体镀膜设备的等离子发生器与腔体之间,属于半导体薄膜沉积应用及制备技术领域。
背景技术
现有的12英寸半导体镀膜设备普遍采用等离子增强化学气相沉积技术(即PECVD),化学气体通过辉光放电产生的等离子体,增强反应物质的化学活性,在反应腔内部的晶圆表面,生成介质膜。工艺气体一般为两种或多种气体,需充分混合后均匀进入腔室,以保证镀膜性能的均匀性。
工艺气体与等离子体都要从圆形喷淋头的中心处进入腔室内,这需要在喷淋头和工艺气体源、等离子体源之间设置一种混气管路来连接,而且,工艺气体在进入混气管路并在其内部流动时,不能在混气管路内大量的扩散和回流,因此,混气管路内需要设置两个相互隔离的通道,即:工艺气体流动通道和等离子体流动通道。工艺气体在混气管路内流动时,应避免其直接撞击管道内壁形成湍流;等离子体在混气管路内流动时,在遇到转弯和撞击内壁时会产生高温。这就要求混气管路具备三重功能:隔离等离子体和工艺气体两个气道,防止工艺气体扩散和回流到整个混气管路;冷却等离子体因流动损失而产生的高温;防止工艺气体在混气管路内湍流流动。
发明内容
本发明以解决上述问题为目的,提供了一种用于防止工艺气体扩散和倒流,能够在晶圆表面形成均匀性良好介质膜的等离子发生器混气管路。
为实现上述目的,本发明采用下述技术方案:等离子发生器混气管路,包括上端焊接加工件、中部混气块、底部陶瓷座及进气管路。所述上端焊接加工件,它由等离子体进气法兰连接管(2)、三通连接件(3)、圆柱管路A(4)、圆柱管路B(18)及管路端头连接件A(5)、管路端头连接件B(14)焊接而成。三通连接件(3)的底部设有水路进出口A(15)和水路进出口B(16),用于混气管路的冷却。中部设有对称的混气块A(8)和混气块B(13),内部分别嵌有倒锥形挡块A(7)与倒锥形挡块B(21),使混气块A(8)和混气块B(13)的内部形成了倒锥形的环状气道。焊接加工件分别与混气块A(8)和混气块B(13)用螺钉连接,二者分别用胶圈A(6)、胶圈B(20)密封。工艺气体进气管路A(11)和工艺气体进气管路B(12)分别与混气块A(8)和混气块B(13)连接,二者分别用胶圈C(9)、胶圈D(19)密封。工艺气体由气体通道(17)处切线方向进入混气块内的环状气道,在倒锥形挡块A(7)和倒锥形挡块B(21)周围旋转向下进入腔室内部,末端为两侧的陶瓷座A(10)及陶瓷座B(22),用于混气管路和腔室间的绝缘,上述陶瓷座A(10)与混气块A(8)、陶瓷座B(22)与混气块B(13)分别用螺钉连接,并分别通过胶圈(1)密封。
本发明的有益效果及特点在于:
主要实现了等离子体与工艺气体的隔离及冷却等离子体产生的高温及工艺气体能够平稳流动的功能。通过中部倒锥形挡块的设置,使工艺气体在其周围平稳旋转流入,并被其导流向下进入反应腔室,在晶圆表面形成均匀性良好的介质膜。本发明所设置的水路进出口,可以通入冷水进行管路冷却,也可以通入恒温流体,保持混气管路内部气体的恒温。具有结构合理,实用性强,可广泛应用于半导体镀膜技术领域。
附图说明
图1是本发明的主视图。
图2是图1的仰视图。
图3是图1中A-A的局部放大示意图。
图4是图2中B-B的局部放大示意图。
图5是本发明的装配示意图。
具体实施方式
实施例
参照图1-5,等离子发生器混气管路,包括上端焊接加工件、中部混气块、底部陶瓷座及进气管路。所述上端焊接加工件,它由等离子体进气法兰连接管2、三通连接件3、圆柱管路A4、圆柱管路B18及管路端头连接件A5、管路端头连接件B14焊接而成。三通连接件3的底部设有水路进出口A15和水路进出口B16,用于混气管路的冷却。中部设有对称的混气块A8和混气块B13,内部分别嵌有倒锥形挡块A7与倒锥形挡块B21,使混气块A8和混气块B13的内部形成了倒锥形的环状气道。焊接加工件分别与混气块A8和混气块B13用螺钉连接,二者分别用胶圈A6、胶圈B20密封。工艺气体进气管路A11和工艺气体进气管路B12分别与混气块A8和混气块B13连接,二者分别用胶圈C9、胶圈D19密封,工艺气体由气体通道17处切线方向进入混气块内的环状气道,在倒锥形挡块A7和倒锥形挡块B21周围旋转向下进入腔室内部,末端为两侧的陶瓷座A10及陶瓷座B22,用于混气管路和腔室间的绝缘。上述陶瓷座A10与混气块A8、陶瓷座B22与混气块B13分别用螺钉连接,并分别通过胶圈1密封。
装配时,首先将倒锥形挡块放入中部混气块内(如图3、图4所示),混气块内加工了一个比倒锥形挡块稍大的倒锥形孔,这样混气块内部就形成一个倒锥形的环状气道。再将陶瓷座与中部混气块用螺钉连接,连接处密封面使用胶圈密封,然后,将中部混气块与上端焊接加工件用螺钉连接固定,连接处密封面使用胶圈密封,最后安装工艺气体进气管路,使工艺气体进气管路连接在混气块内加工的一个与环道相切的孔上,工艺气体进气管路与混气块使用胶圈密封,上述胶圈密封处都采用全氟橡胶圈密封。
本发明的独特设计结构使等离子体经过焊接加工件的等离子体进气法兰连接管进入,经三通连接件分向两侧,最后经过陶瓷座进入腔体,等离子体流动中产生的高温由三通连接件内的水路来冷却。工艺气体经工艺管路进入混气块,沿其内部的环道切线方向流入,在混气块中倒锥形挡块周围形成平稳的旋转气流,使工艺气体进入腔室,在进入的过程中被倒锥形环道向下导流,防止大量扩散及回流。

Claims (2)

1.一种等离子发生器混气管路,包括上端焊接加工件、底部陶瓷座及进气管路,所述上端焊接加工件,它由等离子体进气法兰连接管(2)、三通连接件(3)、圆柱管路A(4)、圆柱管路B(18)及管路端头连接件A(5)、管路端头连接件B(14)焊接而成,三通连接件(3)的底部设有水路进出口A(15)和水路进出口B(16),用于混气管路的冷却;所述上端焊接加工件的末端为两侧的陶瓷座A(10)及陶瓷座B(22),上述陶瓷座A(10)与混气块A(8)、陶瓷座B(22)与混气块B(13)分别用螺钉连接,并分别通过胶圈(1)密封,其特征在于:中部设有对称的混气块A(8)和混气块B(13),内部分别嵌有倒锥形挡块A(7)与倒锥形挡块B(21),使混气块A(8)和混气块B(13)的内部形成了倒锥形的环状气道,焊接加工件分别与混气块A(8)和混气块B(13)用螺钉连接,二者分别用胶圈A(6)、胶圈B(20)密封,工艺气体进气管路A(11)和工艺气体进气管路B(12)分别与混气块A(8)和混气块B(13)连接,二者分别用胶圈C(9)、胶圈D(19)密封,工艺气体由气体通道(17)处切线方向进入混气块内的环状气道,在倒锥形挡块A(7)和倒锥形挡块B(21)周围旋转向下进入腔室内部。
2.如权利要求1所述的等离子发生器混气管路,其特征在于:所述的胶圈A(6)、胶圈B(20)及胶圈C(9)、胶圈D(19)采用全氟橡胶胶圈。
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CN113823545A (zh) * 2020-06-19 2021-12-21 拓荆科技股份有限公司 一种改进多腔室设备工艺偏差的装置及方法

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