CN103913953A - Apparatus for detecting focusing and leveling - Google Patents
Apparatus for detecting focusing and leveling Download PDFInfo
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- CN103913953A CN103913953A CN201210594380.7A CN201210594380A CN103913953A CN 103913953 A CN103913953 A CN 103913953A CN 201210594380 A CN201210594380 A CN 201210594380A CN 103913953 A CN103913953 A CN 103913953A
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Abstract
The invention provides an apparatus for detecting focusing and leveling, and the apparatus is used for focusing and leveling of a photolithographic system with the magnification of 1. The apparatus comprises a light source system, a mask plate, a mask bench, a projection lens, a silicon wafer, a workpiece bench and the like, and is characterized in that the apparatus also comprises a pneumatic difference measure sensor which comprises two groups of measuring heads, one group of the measuring heads is used to measure the position of a mask plane, and the other group of the measuring heads is used to measure the position of the silicon wafer plane, the air pressure value variation caused by different spaces measured by the two groups of the measuring heads is sensed and converted into an electric signal by a pneumatic-electrical converter, the electric signal is subjected to signal processing and is transmitted to an integral machine control system, so that the adjusting of the workpiece bench is controlled.
Description
Technical field
The present invention relates to a kind of integrated circuit equipment manufacture field, relate in particular to a kind of focusing-levelling detection device for lithographic equipment.
Background technology
In recent years, along with the development of semiconductor technology, silicon chip complexity and cost price improve constantly, and Photolithography Technology requires also constantly to improve, so the accuracy requirement detecting at focusing and leveling and exposure quality requirements also increase substantially.Particularly in Hou road photoetching process litho machine, the exposure camera lens that object distance and image distance ratio are 1 due to what adopt, it is 1 o'clock according to the known enlargement ratio of optical principle, the object distance of exposure camera lens and image distance are bound to exist equivalent variation relation (what wherein object distance was corresponding is exactly the position of mask face, the position of the corresponding focal plane of image distance).As shown in Figure 1, in the time there is a δ displacement in the lower surface of mask face 302, focal plane 309 correspondences also produce δ displacement, and the zero-bit of sensor can not followed movement, now after focusing and leveling sensor is measured, making the exposure position that silicon chip 308 arrives is still the position before out of focus, so there is relative position value of delta between silicon chip 308 and best focal plane 309 ＇ after measuring, will badly influence the exposure quality of imaging resolution and silicon chip of system.
Existing focusing and leveling detecting sensor just detects silicon chip face, not relating to mask face detects, first-selected or mask face and mask platform thermal expansion and thermal deformation are controlled, reduce mask face because illuminator is irradiated lower thermal expansion and the thermal deformation producing by intense light source for a long time thereby reach.The method of controlling thermal expansion and thermal deformation mainly realizes by two approach, one is that by adopting, thermal expansivity is low, the good material of stability solves thermal expansion and thermal deformation, the feature of this material is that thermal expansion and the distortion under long-time intense light source is irradiated is less, and material cost and part processing cost are higher; Another is by mask surrounding environment is regulated, and makes mask surrounding environment change as much as possible little, thereby reduces the mask face drift causing because of temperature variation; The combination of these two kinds of methods can very large limit the temperature drift of reduction mask face, but can not fundamentally eliminate the drift of mask surface temperature, from the actual service condition litho machine, really also there is temperature drift in mask face, causes focusing and leveling sensor zero-bit and best focal plane to be departed from and to produce sensor silicon wafer exposure quality unstable.
The impact of drifting about on exposure system imaging resolution in order fundamentally to eliminate mask, this pick-up unit utilizes proximity vapour-pressure type difference measurement sensor opposite end to measure mask face as reference amount, measure silicon chip face as measured value for one section, so just can solve cleverly mask face and cannot measure problem with respect to focusing and leveling sensor zero shift, can guarantee all the time the real effectiveness of detected value, guarantee silicon wafer exposure quality.The principle of this measuring technique is exactly pneumatic gauging technology.As shown in Figure 2, have two kinds of modes in pneumatic gauging principle, a kind of is to detect the relation of flow with measured workpiece gap, and a kind of is the relation of detected pressures with measured workpiece gap; These two relations be exactly air mass flow and pressure all with being in proportion of measured gap, the relation and air pressure and flow are inversely proportional to each other.Pneumatic gauging is exactly to utilize such measuring principle, and when gauge head is fixed, measuring pipeline can extend arbitrarily, and aspect is measured mask face and silicon chip face simultaneously.
In U.S. Pat 7124624 B2, provide a kind of for litho machine proximity difference measurement sensor, as shown in Figure 3.102-gas is supplied with; 106-mass flow controller; 108-accumulator; 110/120/122--impact damper; 138-mass flow sensor/pressure transducer; 128-gaging nozzle; 130-with reference to nozzle; 134-reference member; 132-measured workpiece.Principle of work is as follows: gas passes through gas supply system 102 to internal system supply gas, by vent line 112, 116, 118, 136 link together each element, the gas of supplying with is regulated and is had through impact damper 110/120/122 again by mass flow controller 106, finally by spraying with reference to nozzle 130 and gaging nozzle 128, in the time measuring standoff distance 140 and known reference standoff distance 142 and have difference, pressure transducer 138 will be converted into electric signal by sensing pipeline 118 and 116 pressure variations, so just can obtain the positional information of measured workpiece any time, last complete machine obtains after information, send steering order and regulate measured workpiece position.The differential type proximity transducer of mentioning in patent can not solve the out of focus problem of its zero-bit, can not directly solve exposure quality problems.
Summary of the invention
The object of the invention is to adopt in the litho machine that enlargement ratio is 1 in order to solve projection exposure camera lens in later process, the drift that focusing and leveling sensor cannot detect mask face declines the imaging resolution of projection exposure system therefor, and the problem such as the silicon wafer exposure quality causing is unstable.Reduce thermal expansivity and stability and environment for use requirement around to mask platform and the selected material of mask, reach and meet complete machine low cost control requirement thereby reduce its material and processing cost.
In order to achieve the above object, the present invention proposes a kind of focusing-levelling detection device, the focusing and leveling of the etching system that is 1 for enlargement ratio, comprise light-source system, mask plate, mask platform, projection objective, silicon chip, work stage, also comprise a pneumatic difference measurement sensor, described pneumatic difference measurement sensor comprises two groups of measuring heads, first group of measuring head is used for measuring mask face position, second group of measuring head is used for measuring silicon chip face position, the atmospheric pressure value that the difference of the spacing that one pneumoelectric conversion sensor records by two groups of measuring heads of sensing causes changes, described atmospheric pressure value changing value is converted to electric signal, after processing, signal flows to complete machine control system, thereby control the adjustment of work stage.
Wherein, described two groups of measuring heads comprise respectively three measuring heads, and three measuring head installation sites are corresponding one by one respectively.
More preferably, described first group of measuring head along mask center each other 120 ° of angles arrange, be arranged near mask edge part.
More preferably, described second group of measuring head each other hexagonal angle be distributed on silicon chip face circumference.
More preferably, wherein, comprise an auxiliary union piece, described auxiliary union piece is connected on the complete machine framework of mask plate top, and described first group of measuring head is arranged on described auxiliary union piece.
More preferably, also comprise an auxiliary union piece, described auxiliary union piece is connected with the physical construction arranging on projection objective camera lens, and described second group of measuring head is arranged on described auxiliary union piece.
Technical scheme of the present invention proposes a kind of novel proximity air pressure focusing and leveling detecting sensor, can measure mask installed surface and silicon chip face simultaneously, solve the change in location relation between mask face, best focal plane, focusing and leveling sensor zero plane and silicon chip face from focusing and leveling technology source cleverly, well guaranteed the exposure quality stability of photo-etching machine silicon chip.
Accompanying drawing explanation
Can be by following detailed Description Of The Invention and appended graphic being further understood about the advantages and spirit of the present invention.
Fig. 1 is object distance and image distance variation floor map in projection exposure system therefor;
Fig. 2 is pneumatic gauging mask skew principle schematic;
Fig. 3 is proximity difference measurement sensor schematic diagram;
Fig. 4 is that in projection exposure system therefor, mask face drifts about with focal plane of lens displacement relation figure;
Fig. 5 is the structural representation of focusing and leveling sensor in projection exposure system therefor in the present invention;
Fig. 6 is focusing and leveling sensor principle of work schematic diagram of the present invention;
Fig. 7 is the gauge head flat distribution map of measuring mask face;
Fig. 8 is the gauge head flat distribution map of measuring silicon chip face.
Embodiment
Describe the specific embodiment of the present invention in detail below in conjunction with accompanying drawing.
A kind of focusing-levelling detection device that the present invention proposes utilizes proximity baroceptor measuring principle exactly, adopt difference measurement mode that mask installed surface is made reference to plane, the other end detects silicon chip, change position of silicon wafer by work stage adjustment, so only need once debug the locking of the absolute position in complete machine by gauge head, while then measuring use, only need measure the relative position between mask and silicon chip, when mask position changes δ, the corresponding measured value of the measurement branches on focal plane position variation and silicon chip is δ, and change direction is identical, so just can guarantee no matter what drift mask looks like, all the time can guarantee that focusing and leveling sensor zero plane overlaps with best focal plane, thereby silicon wafer exposure quality and stability are well guaranteed.
Fig. 4 is that in projection exposure system therefor of the present invention, mask face drifts about with focal plane of lens displacement relation schematic diagram, the known quantity of confirming when the distance H 1 between distance H and mask face gauge head nozzle face 322 and mask face 321 between mask face gauge head nozzle face 322 and silicon chip face gauge head nozzle member 323 is design.When completing the best focal plane of focusing and leveling zero-bit and object lens while mate, silicon chip face gauge head nozzle member 323 and silicon chip face 324(optimal focal plane, silicon chip face and the coincidence of focusing and leveling zero-bit) spacing H2 is known.When mask face is because long-time strong illumination occurs
displacement time, from difference measurement principle, the zero-bit of this sensor also can produce one in the same way
displacement.Due to the skew of mask face, optimal focal plane will move to position 328 by position 326, produces one
variable quantity.Because the enlargement ratio of the projection exposure system therefor in later process projection mask aligner is generally 1, now just have:
so zero-bit and the optimal focal plane of sensor remain coincidence, sensor can distortion in measuring process like this, and position that silicon chip is put is also adjusted on optimal focal plane position 328, so just can well guarantee silicon wafer exposure quality.
The structural representation of focusing and leveling sensor of the present invention in projection exposure system therefor as shown in Figure 5, comprises light-source system 1, mask plate 2, mask platform 3, projection objective 4, silicon chip 5, work stage 6.Also comprise a pneumatic difference measurement sensor, described pneumatic difference measurement sensor comprises two groups of gauge head groups 7 and 8, is arranged on auxiliary union piece 12 and 13 respectively by diagram by corresponding adjusting mechanism.Auxiliary union piece 12 is connected on the complete machine framework of mask plate 2 tops, and auxiliary union piece 13 is connected with the physical construction arranging on projection objective 4 camera lenses.Pneumoelectric conversion sensor 9 is connected with 8 with gauge head group 7 by admission line, pneumoelectric conversion sensor 9 is converted to magnitude of voltage by the force value sensing and is transferred to analog to digital conversion control processor 10 by RS232, the measured value independent sample of control processor 10 to gauge head group 7 and 8,7 signal value is used for calculating mask face positional information, and 8 measuring-signal is for reflecting the positional information of silicon chip face.Because of the compensation that do not adjust of the position of the relative mask plate of gauge head group 7 and installed surface in measurement, so as a reference; So just form take the differential type air pressure focusing and leveling sensor as benchmark with reference to gauge head group 7.When system works, be converted to electric signal with reference to corresponding pressure differential in gauge head group 7 and measurement gauge head group 8, after signal is processed, flow to complete machine control system, thereby control the adjustment of work stage.
Fig. 6 is focusing and leveling sensor principle of work schematic diagram of the present invention.As shown in Figure 6, the extraneous air of supplying with enters in air accumulator 502 by gauge tap 501, by the tracheae with flow control valve, be connected with 6 gauge heads 515,516,517,518,519,520 of measuring mask face and silicon chip face respectively, wherein the installation site of gauge head 518 and 515,519 and 516,520 and 517 is mutually corresponding.Measure respectively pressure difference value in 518 and 515,519 and 516,520 and 517 by pneumatic-to-current converter 523,524,525, then be converted to magnitude of voltage, flow in sensor signal processing system 527 through Transmission Fibers 526, after settling signal is processed, flow to whole control system 529 by Transmission Fibers 528, then send and can control order-driven work stage 6 and carry out the adjustment of Z, RX, RY by complete machine control system.
As shown in FIG. 7 and 8, Fig. 7 arranges for measuring mask face gauge head the flat distribution map of this pick-up unit gauge head, because mask space of planes position is limited, so adopt measurement mask installed surface to replace mask face to carry out.Due to 3 gauge heads 515,516 and 517 in mask face gauge head group 7 can make respectively enough little, external diameter is in 3mm left and right, along mask center, 120 ° of angles are arranged each other, be arranged near mask edge part, so just can make measurement result close with direct measurement mask result, meet and measure requirement.Fig. 8 is that the gauge head on silicon chip face distributes, and 3 gauge heads 611,612 and 613 in silicon chip face gauge head group 8 each other hexagonal angle are distributed on the circumference of 180mm diameter.Gauge head in mask face gauge head group 7 and silicon chip face gauge head group 8 mutually combines, and completes whole silicon chip and detects online.
Described in this instructions is preferred embodiment of the present invention, and above embodiment is only in order to illustrate technical scheme of the present invention but not limitation of the present invention.All those skilled in the art, all should be within the scope of the present invention under this invention's idea by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (6)
1. a focusing-levelling detection device, the focusing and leveling of the etching system that is 1 for enlargement ratio, comprise light-source system, mask plate, mask platform, projection objective, silicon chip, work stage, it is characterized in that, also comprise a pneumatic difference measurement sensor, described pneumatic difference measurement sensor comprises two groups of measuring heads, first group of measuring head is used for measuring mask face position, second group of measuring head is used for measuring silicon chip face position, the atmospheric pressure value that the difference of the spacing that one pneumoelectric conversion sensor records by two groups of measuring heads of sensing causes changes, described atmospheric pressure value changing value is converted to electric signal, after processing, signal flows to complete machine control system, thereby control the adjustment of work stage.
2. focusing-levelling detection device as claimed in claim 1, is characterized in that, described two groups of measuring heads comprise respectively three measuring heads, and three measuring head installation sites are corresponding one by one respectively.
3. focusing-levelling detection device as claimed in claim 1, is characterized in that, described first group of measuring head along mask center each other 120 ° of angles arrange, be arranged near mask edge part.
4. focusing-levelling detection device as claimed in claim 1, is characterized in that, described second group of measuring head each other hexagonal angle is distributed on silicon chip face circumference.
5. focusing-levelling detection device as claimed in claim 1, is characterized in that, also comprises an auxiliary union piece, and described auxiliary union piece is connected on the complete machine framework of mask plate top, and described first group of measuring head is arranged on described auxiliary union piece.
6. focusing-levelling detection device as claimed in claim 1, it is characterized in that, also comprise an auxiliary union piece, described auxiliary union piece is connected with the physical construction arranging on projection objective camera lens, and described second group of measuring head is arranged on described auxiliary union piece.
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| CN201210594380.7A CN103913953B (en) | 2012-12-31 | 2012-12-31 | A kind of focusing-levelling detection device |
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| CN201210594380.7A CN103913953B (en) | 2012-12-31 | 2012-12-31 | A kind of focusing-levelling detection device |
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| CN103913953A true CN103913953A (en) | 2014-07-09 |
| CN103913953B CN103913953B (en) | 2016-04-20 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109974633A (en) * | 2019-04-30 | 2019-07-05 | 蚌埠传感器系统工程有限公司 | A kind of precise detection device and detection method of workpiece surface synthesis precision |
| CN111624731A (en) * | 2019-02-28 | 2020-09-04 | 上海微电子装备（集团）股份有限公司 | Objective lens device |
| CN112501581A (en) * | 2020-11-12 | 2021-03-16 | 北京北方华创微电子装备有限公司 | Shielding disc bearing device in semiconductor processing equipment and semiconductor processing equipment |
| US11237490B2 (en) | 2016-03-18 | 2022-02-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07201713A (en) * | 1993-12-28 | 1995-08-04 | Sony Corp | Aligner and aligning method |
-
2012
- 2012-12-31 CN CN201210594380.7A patent/CN103913953B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07201713A (en) * | 1993-12-28 | 1995-08-04 | Sony Corp | Aligner and aligning method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11237490B2 (en) | 2016-03-18 | 2022-02-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| CN111624731A (en) * | 2019-02-28 | 2020-09-04 | 上海微电子装备（集团）股份有限公司 | Objective lens device |
| CN109974633A (en) * | 2019-04-30 | 2019-07-05 | 蚌埠传感器系统工程有限公司 | A kind of precise detection device and detection method of workpiece surface synthesis precision |
| CN112501581A (en) * | 2020-11-12 | 2021-03-16 | 北京北方华创微电子装备有限公司 | Shielding disc bearing device in semiconductor processing equipment and semiconductor processing equipment |
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| CN103913953B (en) | 2016-04-20 |
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Address after: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |