CN103905962B

CN103905962B - Micro-electro-mechanical microphone packaging structure

Info

Publication number: CN103905962B
Application number: CN201210582610.8A
Authority: CN
Inventors: 陈振颐
Original assignee: Merry Electronics Shenzhen Co ltd
Current assignee: Merry Electronics Shenzhen Co ltd
Priority date: 2012-12-28
Filing date: 2012-12-28
Publication date: 2017-12-26
Anticipated expiration: 2032-12-28
Also published as: CN103905962A

Abstract

The invention discloses a kind of micro-electro-mechanical microphone packaging structure, includes a base, has a surface, and the base has a perforation；One MEMS microphone chip, the MEMS microphone chip have a first surface and a second surface, and the first surface is electrically connected to the surface of the base, and the MEMS microphone chip is provided with a deep hole by the second surface towards the first surface direction；One control chip, the control chip have a first surface and a second surface, and the first surface of the wherein control chip is fixed on the second surface of the MEMS microphone chip, and the second surface of the control chip is electrically connected to the base by plural wires；And an encapsulating material, it covers the base, the MEMS microphone chip, the control chip and wire.The advantages of present invention possesses small volume but do not detract performance, effectively reduce encapsulation volume and reduce manufacturing cost.

Description

Micro-electro-mechanical microphone packaging structure

Technical field

The invention relates to a kind of micro electronmechanical (microelectromechanical system, hereinafter referred to as MEMS) Microphone packaging scheme, control chip and MEMS microphone chip storehouse are set in particular to one kind, can separately controlled The deep hole that the coremaking platelet back of the body etches groove to be etched with the brilliant back of the body of MEMS microphone chip forms the back of the body chamber increased, and utilizes Weld pad in sealing or primer protection micro-electro-mechanical microphone packaging structure in exposure atmospheric environment from that may cause the micro- of corrosion Electromechanical microphone packaging scheme.

Background technology

Because the demand of mobile phone increasingly increases, and requirement of the mobile phone in sound quality also increasingly improves, then Also gradually ripe plus Hearing aid technology, these factors cause the demand of high quality mini microphone rapidly to increase.Due to adopting Have the advantages that in light weight, small volume and signal quality are good with the Electret Condencer Microphone made by micro-electromechanical technology, so microcomputer Electric microphone is increasingly becoming the main flow of mini microphone.

Fig. 5 show the structural representation of existing micro-electro-mechanical microphone packaging structure, the micro electronmechanical Mike shown in figure Wind encapsulating structure includes a base 90, a MEMS microphone chip 91, a control chip 92 and a cap 93, wherein micro- Electromechanical microphone chip 91 is coated on the package interior that cap 93 combines to form with base 90 and by adjacent control chip 92 are controlled, and MEMS microphone chip 91 and control chip 92 are separately attached on base 90 by this traditional handicraft, reuse envelope Capping 93, which covers, to be protected by, but this embodiment has three missings：First, MEMS microphone chip 91 typically with control Coremaking piece 92 must have the base 90 of enough large area to be used for accommodating to be disposed adjacent, so that micro-electro-mechanical microphone Encapsulating structure overall dimensions are difficult to reduce；Second, because MEMS microphone chip 91 and control chip 92 are connected to base 90 Wire and weld pad etc. are naked to be placed in a room 94 of micro-electro-mechanical microphone packaging structure, so extraneous moisture and dust easily passes through Sound hole 95 on base 90 enters in room 94, so cause the wire 96 of the chip 91,92 and weld pad 97 produce oxidation or Destroy, and decline reliability, thus must be with high costs and be difficult to ensure using noble metals such as gold in order to avoid corrosion such as weld pad 97 if Routing is not fallen off；Third, be cap 93 and base 90 engineering properties difference it is quite big, cause for the deformation that keeps from heat it is bad, So the thickness of base 90 is difficult to reduce so that overall package thickness is difficult to reduce, and overall cost and reliability have improvement empty Between.

The content of the invention

It is larger and noble metal with high costs need to be used as gold in view of encapsulation volume produced by existing encapsulating structure The problem of belonging to contact, the present invention propose a micro-electro-mechanical microphone packaging structure for being applicable integrated circuit Plastic Package process technique, For reducing package area and thickness, cost is low and impact resistance is good, more reduces the potentiality of volume.

The technical scheme that micro-electro-mechanical microphone packaging structure of the present invention uses for：

Micro-electro-mechanical microphone packaging structure, include a base, there is a surface, the base has a perforation；

One MEMS microphone chip, the MEMS microphone chip have a first surface and a second surface, and this first Surface electrical behavior is connected to the surface of the base, and the MEMS microphone chip is set by the second surface towards the first surface direction It is equipped with a deep hole；

One control chip, the control chip have the first table of a first surface and a second surface, the wherein control chip The second surface of the MEMS microphone chip is fixed in face, and the second surface of the control chip passes through plural wires electricity Property is connected to the base；And

One encapsulating material, it covers the base, the MEMS microphone chip, the control chip and wire.

The present invention sets control chip and MEMS microphone chip storehouse, and utilizes applicable integrated circuit Plastic Package Technique comes sealing protection control chip and MEMS microphone chip, also may be such that weld pad is protected by sealing or primer, from By the risk of oxidation corrosion caused by possibility in exposed atmospheric environment, that is, it is not necessary to using expensive metal pad, furthermore, this knot Structure can also be used etching control chip back and form groove is coupled to MEMS microphone chip again, and with micro-electro-mechanical microphone core The deep hole of piece is collectively forming the back of the body chamber of increasing.

Generally speaking, the advantages of present invention possesses small volume but do not detract performance, effectively reduce encapsulation volume and reduce system Cause this.

Brief description of the drawings

Fig. 1 is the structural representation of micro-electro-mechanical microphone packaging structure first embodiment of the present invention；

Fig. 2 is the structural representation of micro-electro-mechanical microphone packaging structure second embodiment of the present invention；

Fig. 3 is the structural representation of micro-electro-mechanical microphone packaging structure 3rd embodiment of the present invention；

Fig. 4 is the structural representation of micro-electro-mechanical microphone packaging structure fourth embodiment of the present invention；And

Fig. 5 is the schematic diagram of this existing micro-electro-mechanical microphone packaging structure.

【Primary clustering symbol description】

10 ：Micro-electro-mechanical microphone packaging structure

18 ：MEMS microphone chip

181：First surface

182：Second surface

183：Vibrating diaphragm

19 ：Deep hole

20 ：Base

201：Susceptor surface

21 ：Perforation

22 ：Wire

23 ：Weld pad

30 ：Control chip

301：Second surface

302：First surface

31 ：Groove

40 ：Carry on the back chamber

50 ：Metal coupling

60 ：Stick brilliant adhesion layer

70 ：Encapsulating material

80 ：Metal cover

81 ：Inner space

90：Base

91：MEMS microphone chip

92：Control chip

93：Cap

94：Room

95：Sound hole

96：Wire

97：Weld pad

Embodiment

The present invention is described in further details with specific embodiment below in conjunction with the accompanying drawings.

First embodiment

Fig. 1 show the sectional view of micro-electro-mechanical microphone packaging structure of the present invention.Herein among figure, micro electronmechanical wheat Gram wind encapsulating structure 10 includes a base 20, a MEMS microphone chip 18, a control chip 30 and an encapsulating material 70.

Base 20 has a perforation 21, and a plurality of weld pads 23 and micro electronmechanical wheat are provided with a surface 201 of base 20 Gram wind chip 18 is electrically connected with.

Also there is MEMS microphone chip 18 deep hole 19 to be communicated in the perforation 21 of base 20, and micro-electro-mechanical microphone The first surface 181 of chip 18 is electrically connected to the surface 201 of base 20, and there is first surface 181 vibrating diaphragm 183 to be used for connecing The sound wave come in through the transmission of perforation 21 is received, in addition, among the present embodiment, first surface 181 is even more to pass through a plurality of metals Projection 50 is electrically connected with the weld pad 23 with base 20.

Control chip 30 has a first surface 302 and a second surface 301, and wherein first surface 302 is electrically connected at The second surface 182 of MEMS microphone chip 18, and it is stacked over MEMS microphone chip 18 here with control chip 30 On be equal to and can protect MEMS microphone chip 18, the effect of reaching effectively decrement encapsulation volume；Furthermore in the present embodiment In, control chip 30 more permeable one sticks brilliant adhesion layer 60 and is fixed in MEMS microphone chip 18；In addition, control chip 30 Second surface 301 be then to be electrically connected to base 20 through plural wires 22.

Encapsulating material 70 is utilized and formed in herein on base 20, and covers MEMS microphone chip 18, control chip 30 And plural wires 22, low frequency leakage problem is avoided, and utilize sealing or the metal of primer protection MEMS microphone chip 18 Projection 50 from oxidation corrosion caused by possibility in exposed atmospheric environment is not necessary to that, using expensive gold weld pad, manufacture can be reduced Cost, wherein encapsulating material 70 are formed on base 20 through integrated circuit plastic encapsulation process herein.

Second embodiment

Fig. 2 show second embodiment of the invention structural representation, and agent structure is generally same as aforementioned first embodiment, but this The place that embodiment is different from aforementioned first embodiment is that control chip 30 can etch a groove 31 by the crystalline substance back of the body, and can be with The deep hole 19 that MEMS microphone chip 18 etches by the brilliant back of the body communicates, and carries on the back chamber 40 simultaneously as the increasing of vibrating diaphragm 183, i.e., Micro-electro-mechanical microphone can be caused to obtain preferable sensitivity, lift overall acoustic efficiency.

3rd embodiment

Fig. 3 show third embodiment of the invention structural representation, and agent structure is generally same as aforementioned second embodiment, but this The place that embodiment is different from aforementioned second embodiment is that micro-electro-mechanical microphone packaging structure 10 is separately provided with a metal herein Lid 80, it is incorporated into base 20, and the inner space 81 wherein formed between metal cover 80 and base 20 sets wire 22, control core Piece 30, MEMS microphone chip 18 and encapsulating material 70.Here for protecting MEMS microphone chip 18 not by radio frequency (RF) interference or electromagnetic interference (EMI) are so add metal cover 80, and metal cover 80 can use conductive of material to form, such as make Made of metal material or conductibility material coated on plastic material, can so carry out radio frequency electromagnetic field radiation and resist Disturb, in the manufacture craft stage, encapsulating material 70 can be first formed in a manner of dispensing, for protecting MEMS microphone chip 18, control Coremaking piece 30 and plural wires 22, encapsulation is completed along with metal cover 80 is connected to base 20, except as the anti-radio frequency of reinforcing The effect of interference or electromagnetic interference, stability being improved, the manufacture craft of this embodiment is more easy, also more saves manufacturing cost, And do not detract its performance.

Fourth embodiment

Fig. 4 show fourth embodiment of the invention structural representation, and agent structure is generally same as aforementioned third embodiment, but this The place that embodiment is different from aforementioned third embodiment is that the manufacture craft of the present embodiment is first to make the encapsulating material of Founder 70 and then plate metal level on its surface with formed metal cover 80 be used for completely cut off radio frequency (RF) interference or electromagnetic interference (EMI), The effect of as anti-Radio frequency interference or electromagnetic interference is strengthened, improve the stability of micro-electro-mechanical microphone packaging structure 10, package material Material 70 can be made with plastics forming technique, wherein except plural wires 22, control chip 30 between metal cover 80 and base 20 And outside MEMS microphone chip 18, remaining inner space is all filled up by encapsulating material 70.

The different specific embodiments of described above, prior art or device can be improved with other modes, such as by general Control chip adopts stacked manner to reduce the area occupied on base with MEMS microphone chip, and then can reduce packaging body Size；Furthermore the deep hole of MEMS microphone chip is connect using the groove lotus root of control chip can increase back of the body chamber volume, and cause Overall sensitivity lifting, promotes acoustic effect；In addition, encapsulating material is formed to protect such as metal coupling using sealing or primer Metal material object is from oxidation corrosion caused by possibility in exposed atmospheric environment, it is not necessary to uses the noble metal of such as gold As metal coupling, manufacturing cost can be reduced.

Although described above disclose the present invention different specific representative embodiments, it is any without departing from the present invention spirit and Category, and the equivalent modifications carried out to it or change, are intended to be limited solely by the protection domain of the application.

Claims

1. a kind of micro-electro-mechanical microphone packaging structure, it is characterized in that, including：

One base, has a surface, and the base has a perforation；

One MEMS microphone chip, the MEMS microphone chip have a first surface and a second surface, the first surface The surface of the base is electrically connected to, and the MEMS microphone chip is provided with by the second surface towards the first surface direction One deep hole；

One control chip, the control chip have a first surface and a second surface, and the first surface of the wherein control chip is consolidated Due to the second surface of the MEMS microphone chip, and the second surface of the control chip is electrically connected by plural wires It is connected to the base；And

One encapsulating material, it covers the base, the MEMS microphone chip, the control chip and wire；In the control core The first surface of piece is inwardly formed with a groove, and the groove and the deep hole of the MEMS microphone chip form a back of the body chamber；It is micro- The side wall of electromechanical microphone chip and control chip is in trim state.

2. micro-electro-mechanical microphone packaging structure as claimed in claim 1, it is characterized in that：Also include a metal cover, be incorporated into The base, and encapsulate the encapsulating material, wire, the control chip and the MEMS microphone chip.

3. micro-electro-mechanical microphone packaging structure as claimed in claim 2, it is characterized in that：Described metal cover is by metal material It is made or is made by by conductive layer coated on plastic material.

4. micro-electro-mechanical microphone packaging structure as claimed in claim 2, it is characterized in that：Removed between the metal cover and the base Space outside the wire, control chip and MEMS microphone chip, is all filled up by the encapsulating material.

5. micro-electro-mechanical microphone packaging structure as claimed in claim 1, it is characterized in that：The encapsulating material is with plastic shaping skill Art is made.

6. micro-electro-mechanical microphone packaging structure as claimed in claim 2, it is characterized in that：The encapsulating material coats skill by chip Art is made, or is made by integrated circuit plastic encapsulation process.

7. micro-electro-mechanical microphone packaging structure as claimed in claim 1, it is characterized in that：Also include one and stick brilliant adhesion layer, if It is placed between the control chip and the MEMS microphone chip, to fix the control chip and the MEMS microphone chip.

8. micro-electro-mechanical microphone packaging structure as claimed in claim 1, it is characterized in that：A plurality of welderings are provided with the base Pad for being electrically connected with the MEMS microphone chip and the wire.

9. micro-electro-mechanical microphone packaging structure as claimed in claim 8, it is characterized in that：Also include a plurality of metal couplings to set Put between the MEMS microphone chip and the base, and the MEMS microphone chip is through those metal couplings and the bottom These weld pads are electrically connected with corresponding on seat.