CN103887207B - Prevent the rinse bath outloading mechanism of wafer overlap and go out pallet piling up method - Google Patents
Prevent the rinse bath outloading mechanism of wafer overlap and go out pallet piling up method Download PDFInfo
- Publication number
- CN103887207B CN103887207B CN201210557404.1A CN201210557404A CN103887207B CN 103887207 B CN103887207 B CN 103887207B CN 201210557404 A CN201210557404 A CN 201210557404A CN 103887207 B CN103887207 B CN 103887207B
- Authority
- CN
- China
- Prior art keywords
- wafer
- outloading mechanism
- sensing
- machine frame
- main machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention discloses a kind of rinse bath outloading mechanism preventing wafer overlapping, and this outloading mechanism comprises wafer support, is set in the casing outside this wafer support；Casing is provided with the sensing receiver and sensing transmitter being oppositely arranged, sensing receiver and sensing transmitter are arranged at the both sides of wafer support, sensing transmitter sends transducing signal to sensing receiver in real time, and sensing receiver is by transducing signal transmission extremely transmission arm control circuit；When on wafer support without wafer, sensing receiver receives transducing signal and transmits to transmission arm control circuit, transmits arm control circuit and judges not have in outloading mechanism wafer；When there being wafer on wafer support, wafer blocks the transducing signal that sensing transmitter sends to sensing receiver, and transmission arm control circuit judges to be placed with in outloading mechanism wafer.What the present invention used wafer in sensor detection outloading mechanism deposits situation, it is to avoid be stored multiple batches of wafer in outloading mechanism simultaneously, and the problem causing wafer friction and scrapping.
Description
Technical field
The present invention relates to a kind of semiconductor fabrication techniques, be specifically related to a kind of rinse bath outloading mechanism preventing wafer overlapping
And go out pallet piling up method.
Background technology
At present, the wafer cleaning groove equipment (Kaijo WET batch cassette) that Kaijo company produces is at wafer
Preparation technology flow process carries out the common equipment of wafer cleaning.This wafer cleaning groove equipment comprises the master for carrying out wafer cleaning
Mechanism (Main site), for the outloading mechanism (unload site) of wafer shipment, for wafer is passed automatically from main machine frame
Transport to the transmission arm of outloading mechanism.Main machine frame (Main site) connects the FPGA control having main machine frame (Main site)
Device processed (PLC), is controlled the running of main machine frame by this main machine frame controller (main site PLC)；Outloading mechanism (unload
Site) connection has the programmable logic controller (PLC) (PLC) of outloading mechanism (unload site), by this outloading mechanism controller
(unload site PLC) controls the running of outloading mechanism；Transmission arm has transmission arm control circuit, main machine frame control the most in succession
Device processed (main site PLC) and outloading mechanism controller (unload site PLC) send to transmission arm control circuit and refer to
Order, is controlled transmission arm by transmission arm control circuit and carries out being delivered to wafer from main machine frame the running of outloading mechanism.It lacks
Point is, in this rinse bath equipment, and the programmable logic controller (PLC) (PLC) of main machine frame (Main site) and outloading mechanism
Being not set up communication between the programmable logic controller (PLC) (PLC) of (unload site) to connect, this can cause transmitting arm by front
When the wafer of one batch is transmitted to outloading mechanism (unload site) automatically by main machine frame (Main site), rinse bath equipment
The programmable logic controller (PLC) of the outloading mechanism (unload site) of system do not receive in outloading mechanism had a collection of
The information of wafer, the system of rinse bath equipment will be considered that and not be placed with wafer in its outloading mechanism.This can cause, outloading mechanism
Programmable logic controller (PLC) may proceed to transmission arm control circuit send wafer transfer request, transmission arm will main frame
The next group wafer having in structure transmits the most automatically to outloading mechanism so that front a collection of wafer and next group wafer there occurs weight
Folded, cause wafer to be scrapped because mutually swiping.
Summary of the invention
The present invention provides a kind of rinse bath outloading mechanism preventing wafer overlap and goes out pallet piling up method, can detect shipment in real time
In mechanism, wafer deposits situation, it is to avoid because of the overlap of batch wafer before and after in outloading mechanism, and the wafer loss problem caused.
For achieving the above object, the present invention provides a kind of rinse bath outloading mechanism preventing wafer overlapping, this outloading mechanism
Comprising wafer support, be set in the casing outside this wafer support, this outloading mechanism communication link is connected to outloading mechanism controller；
Being characterized in, above-mentioned casing is provided with the sensing receiver being oppositely arranged and sensing transmitter, and this sensing connects
Receipts device and sensing transmitter are respectively arranged at the both sides of wafer support, and sensing transmitter sends sensing letter to sensing receiver in real time
Number, sensing receiver is by main machine frame controller the most external for transducing signal transmission；
When not placing wafer on wafer support, sensing receiver receives transducing signal and by the transmission of this transducing signal to main
Mechanics controller, main machine frame controller judges not have in outloading mechanism wafer；
When being placed with wafer on wafer support, wafer i.e. blocks the sensing letter that sensing transmitter sends to sensing receiver
Number, main machine frame controller does not receives this transducing signal and judges to be placed with in outloading mechanism wafer.
During between above-mentioned sensing receiver and sensing transmitter, the transmission path of transducing signal passes above-mentioned outloading mechanism
Place the position of wafer.
Above-mentioned casing is made up of structural framing and the plate face that is fixed on structural framing.
Above-mentioned sensing receiver and sensing transmitter are all fixed on the structural framing of described casing.
The end face of above-mentioned wafer support is set to recessed circular arc, the shape of this wafer support end face and crystal round fringes
Shape is suitable.
A kind of be applicable to above-mentioned prevent the overlapping rinse bath outloading mechanism of wafer go out pallet piling up method, be characterized in, the party
Method comprises the steps of
Step 1, sensing transmitter launch transducing signal to sensing receiver in real time, and transducing signal is transmitted by sensing receiver
To main machine frame controller；
Step 2, outloading mechanism controller send wafer to transmission arm control circuit and transmit request signal；
Step 3, main machine frame controller judge whether sensing receiver receives the transducing signal that sensing transmitter sends, if
It is that then main machine frame controller judges not have in outloading mechanism wafer, and jumps to step 4；If it is not, then main machine frame controller judges
Outloading mechanism is placed with wafer, and jumps to step 5；
Step 4, main machine frame controller transmission outloading mechanism there is no the signal of wafer to transmission arm control circuit, transmission
The wafer of arm control circuit response outloading mechanism controller transmits request signal, controls transmission arm by the wafer in main machine frame
Shipment, to outloading mechanism, jumps to step 1；
Step 5, main machine frame controller transmission outloading mechanism has the signal of wafer to transmission arm control circuit, transmit hands
Arm control circuit is not responding to the wafer of outloading mechanism controller and transmits request signal, and alerts, and jumps to step 1.
The present invention prevents the rinse bath outloading mechanism of wafer overlap and goes out wafer cleaning groove in pallet piling up method and prior art
The outloading mechanism of equipment is compared, and has an advantage in that, the present invention installs sensor to monitor outloading mechanism in real time in outloading mechanism
In whether be placed with wafer.Between outloading mechanism controller with main machine frame controller, unrealized communication is connected, and causes shipment
In the case of mechanics controller cannot learn in outloading mechanism the information having wafer, shipment can be detected in real time by sensor
Whether being placed with wafer in mechanism, if being placed with wafer in outloading mechanism, main machine frame controller i.e. can stop transmission arm to control
The wafer of Circuit responce outloading mechanism controller transmits request and alerts, it is to avoid be stored in outloading mechanism simultaneously
Multiple batches of wafer, and cause wafer friction and the problem scrapped.
Accompanying drawing explanation
Fig. 1 is the structural representation that the present invention prevents the rinse bath outloading mechanism of wafer overlap；
Fig. 2 is the flow chart going out pallet piling up method that the present invention prevents the rinse bath outloading mechanism of wafer overlap.
Detailed description of the invention
Below in conjunction with width figure, further illustrate the specific embodiment of the present invention.
As it is shown in figure 1, the present invention discloses the embodiment of a kind of rinse bath outloading mechanism preventing wafer overlap.This article delivery machine
Structure is at the shipment of wafer cleaning groove equipment.Wafer cleaning groove equipment includes main machine frame (main site) and article delivery machine
Structure (unload site).Main machine frame, for wafer is carried out operation, is i.e. incited somebody to action by outloading mechanism when wafer completes cleaning
Wafer sends out rinse bath equipment.Main machine frame connects has main machine frame controller (main site PLC), by main machine frame controller control
The work of main machine frame processed and its with rinse bath in the communication of miscellaneous part.Outloading mechanism connects outloading mechanism controller
(unload site PLC), is controlled the work of outloading mechanism and itself and miscellaneous part in rinse bath by outloading mechanism controller
Communication.Without communication between main machine frame controller (main site PLC) and outloading mechanism controller (unload site PLC)
Connect.
Wafer cleaning groove equipment is additionally provided with transmission arm, and this transmission arm connects transmission arm control circuit, main machine frame
Controller (main site PLC) is sent out to this transmission arm control circuit with outloading mechanism controller (unload site PLC)
Go out instruction, transmission arm control circuit control transmission arm and carry out the behaviour of the wafer transfer in main machine frame to outloading mechanism
Make.
Outloading mechanism comprises wafer support 2 and the casing 1 being set in outside this wafer support 2.
Wafer support 2 is for depositing the wafer 5 of shipment, and the end face of this wafer support 2 is set to recessed circular arc, this wafer
The shape of support 2 end face is suitable with the shape at wafer 5 edge, it is achieved wafer 5 can vertically be placed on the top of wafer support 2.
The wafer 5 of one batch can exist on the wafer support 2 of outloading mechanism in vertical placement, and each wafer 5 phase in a batch
Setting arranged in parallel between Hu.
Casing 1 is made up of the structural framing of rectangle and the plate face that is fixed on this structural framing.In the present embodiment, casing
The plate face of 1 uses transparent material to make, and makes whole casing 1 be set to transparent.Side at casing 1 is provided with opening, for from casing 1
Wafer 5 is taken out on interior wafer support 2.
The rinse bath outloading mechanism preventing wafer overlapping disclosed by the invention also includes sensing receiver 3 and sensing is launched
Device 4, this sensing receiver 3 and sensing transmitter 4 be separately mounted on the structural framing of casing 1, this sensing receiver 3 He simultaneously
Sensing transmitter 4 is respectively arranged at the both sides of wafer support 2, transducing signal between this sensing receiver 3 and sensing transmitter 4
Transmission path through and the top of slightly above wafer support 2, when wafer support 2 is placed with wafer, i.e. can stop that sensing connects
Receive the transmission of transducing signal between device 3 and sensing transmitter 4.
Sensing receiver 3 and sensing transmitter 4 are respectively with external main machine frame controller (main site PLC) circuit even
Connecing, sensing transmitter 4 sends transducing signal to sensing receiver 3 in real time, and transducing signal is transmitted to main machine frame by sensing receiver 3
Controller, main machine frame controller real-time reception also judges whether sensing receiver 3 receives the sensing letter that sensing transmitter 4 sends
Number.In the priority transmitting the control signal that arm control circuit sends is arranged, this sensing receiver 3 and sensing transmitter
4 priority levels of transducing signals sent to transmission arm control circuit higher than main machine frame controller (main site PLC) with
The instruction that outloading mechanism controller (unload site PLC) sends to this transmission arm control circuit.
When not placing wafer 5 on wafer support 2, sensing receiver 3 receives transducing signal that sensing transmitter 4 sends also
Transmitting this transducing signal to main machine frame controller, main machine frame controller i.e. judges not have in outloading mechanism wafer 5.
When being placed with wafer 5 on wafer support 2, wafer 5 i.e. can block and pass between sensing transmitter 4 and sensing receiver 3
The transmission channel of sense signal.Wafer 5 i.e. blocks the transducing signal that sensing transmitter 4 sends to sensing receiver 3, and main machine frame controls
Device does not receives this transducing signal, and can judge to be placed with in outloading mechanism wafer 5.
A kind of it is applicable to the above-mentioned wafer overlapping rinse bath outloading mechanism of preventing as in figure 2 it is shown, the invention discloses
Going out pallet piling up method, the method includes the steps of:
Step 1, sensing transmitter 4 launch transducing signal to sensing receiver 3 in real time.When sensing receiver 3 receives biography
Sense signal, will transmit to main machine frame controller by transducing signal.When sensing receiver 3 does not receives transducing signal, the most not to master
Mechanics controller sends transducing signal.
Step 2, rinse bath equipment work in, outloading mechanism controller to transmission arm control circuit send from main machine frame
The request signal of transmission wafer 5 to outloading mechanism.
Step 3, main machine frame controller judge whether sensing receiver 3 receives the transducing signal that sensing transmitter 4 sends,
If so, i.e. sensing receiver 3 transmission sensing signal is to main machine frame controller, then main machine frame controller judges the wafer of outloading mechanism
Support 2 does not has wafer 5, and jumps to step 4.If it is not, i.e. sensing receiver 3 non-transmission sensing signal is to main machine frame control
Device, then main machine frame controller is placed with wafer 5 in judging the wafer support 2 of outloading mechanism, and jumps to step 5.
Step 4, main machine frame controller transmission outloading mechanism there is no the signal of wafer 5 to transmission arm control circuit, pass
The wafer 5 that defeated arm control circuit response outloading mechanism controller sends transmits request signal, controls transmission arm by main machine frame
In wafer 5 shipment to outloading mechanism, jump to step 1 after completing, circulation carries out above-mentioned shipment flow process.
Step 5, main machine frame controller transmission outloading mechanism has the signal of wafer to transmission arm control circuit, transmit hands
Arm control circuit is not responding to the wafer of outloading mechanism controller and transmits request signal, and alerts, and jumps to step after completing
1, circulation carries out above-mentioned shipment flow process.
Although present disclosure has been made to be discussed in detail by above preferred embodiment, but it should be appreciated that above-mentioned
Description is not considered as limitation of the present invention.After those skilled in the art have read foregoing, for the present invention's
Multiple amendment and replacement all will be apparent from.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (5)
1. preventing the rinse bath outloading mechanism that wafer is overlapping, this outloading mechanism comprises wafer support (2), is set in this wafer
Support (2) casing (1) outward, this outloading mechanism communication link is connected to outloading mechanism controller；
It is characterized in that, described casing (1) is provided with the sensing receiver (3) being oppositely arranged and sensing transmitter (4), should
Sensing receiver (3) and sensing transmitter (4) are respectively arranged at the both sides of wafer support (2), and sensing transmitter (4) is in real time to biography
Sense receptor (3) sends transducing signal, and sensing receiver (3) is by main machine frame controller the most external for transducing signal transmission；
When not placing wafer (5) on wafer support (2), sensing receiver (3) receives transducing signal and is passed by this transducing signal
Transporting to main machine frame controller, main machine frame controller judges do not have wafer (5) in outloading mechanism；
When being placed with wafer (5) on wafer support (2), wafer (5) i.e. blocks sensing transmitter (4) and sends out to sensing receiver (3)
The transducing signal sent, main machine frame controller does not receives this transducing signal and judges to be placed with wafer (5) in outloading mechanism；
The end face of described wafer support (2) is set to recessed circular arc, the shape of this wafer support (2) end face and wafer (5)
The shape at edge is suitable.
Prevent the rinse bath outloading mechanism that wafer is overlapping the most as claimed in claim 1, it is characterised in that described sensing receives
Between device (3) and sensing transmitter (4), the transmission path of transducing signal passes the position placing wafer in described outloading mechanism.
Prevent the rinse bath outloading mechanism that wafer is overlapping the most as claimed in claim 1 or 2, it is characterised in that described casing
(1) it is made up of structural framing and the plate face that is fixed on structural framing.
Prevent the rinse bath outloading mechanism that wafer is overlapping, described sensing receiver (3) and sensing the most as claimed in claim 3
Emitter (4) is all fixed on the structural framing of described casing (1).
5. be applicable to prevent as claimed in claim 1 the overlapping rinse bath outloading mechanism of wafer goes out a pallet piling up method, and it is special
Levying and be, the method includes the steps of:
Step 1, sensing transmitter (4) launch transducing signal to sensing receiver (3) in real time, and sensing is believed by sensing receiver (3)
Number transmission to main machine frame controller；
Step 2, outloading mechanism controller send wafer (5) to transmission arm control circuit and transmit request signal；
Step 3, main machine frame controller judge whether sensing receiver (3) receives the transducing signal that sensing transmitter (4) sends,
The most then main machine frame controller judges do not have wafer (5) in outloading mechanism, and jumps to step 4；If it is not, then main machine frame controls
Device judges to be placed with wafer (5) in outloading mechanism, and jumps to step 5；
Step 4, main machine frame controller transmission outloading mechanism there is no the signal of wafer to transmission arm control circuit, transmit arm
The wafer of control circuit response outloading mechanism controller transmits request signal, controls transmission arm by the wafer (5) in main machine frame
Shipment, to outloading mechanism, jumps to step 1；
Step 5, main machine frame controller transmission outloading mechanism has the signal of wafer to transmission arm control circuit, transmit arm control
Circuit processed is not responding to the wafer of outloading mechanism controller and transmits request signal, and alerts, and jumps to step 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210557404.1A CN103887207B (en) | 2012-12-20 | 2012-12-20 | Prevent the rinse bath outloading mechanism of wafer overlap and go out pallet piling up method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210557404.1A CN103887207B (en) | 2012-12-20 | 2012-12-20 | Prevent the rinse bath outloading mechanism of wafer overlap and go out pallet piling up method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103887207A CN103887207A (en) | 2014-06-25 |
| CN103887207B true CN103887207B (en) | 2016-12-07 |
Family
ID=50956042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210557404.1A Active CN103887207B (en) | 2012-12-20 | 2012-12-20 | Prevent the rinse bath outloading mechanism of wafer overlap and go out pallet piling up method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103887207B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1335700A (en) * | 2000-07-26 | 2002-02-13 | 三星电子株式会社 | Automatic guiding transporting apparatus system and its controlling method |
| CN101640166A (en) * | 2008-08-01 | 2010-02-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate transmission device and control system and control method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6901971B2 (en) * | 2001-01-10 | 2005-06-07 | Entegris, Inc. | Transportable container including an internal environment monitor |
-
2012
- 2012-12-20 CN CN201210557404.1A patent/CN103887207B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1335700A (en) * | 2000-07-26 | 2002-02-13 | 三星电子株式会社 | Automatic guiding transporting apparatus system and its controlling method |
| CN101640166A (en) * | 2008-08-01 | 2010-02-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate transmission device and control system and control method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103887207A (en) | 2014-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010140484A5 (en) | ||
| KR100272252B1 (en) | Method for carrying wafer cassette | |
| CN110808873B (en) | Method and device for detecting link failure | |
| CN110510405A (en) | A kind of material transferring method, transmitting device, Transmission system and readable storage medium storing program for executing | |
| CN103887207B (en) | Prevent the rinse bath outloading mechanism of wafer overlap and go out pallet piling up method | |
| CN102554924A (en) | Manipulator locating device and conveying system | |
| CN106200570B (en) | Article handling apparatus | |
| CN106698911A (en) | Substrate blend-cutting system and shunting method | |
| CN105000230A (en) | Weighing inkjet printer and weighing and inkjet printing method thereof | |
| CN106249725B (en) | Product distributing system and its control method | |
| JP5024422B2 (en) | Transport system | |
| CN108147056A (en) | A kind of panel blocked-material detecting device and with its panel transport device | |
| CN210364671U (en) | Ampoule box holds in palm and weighs to reject and add a return mechanism | |
| CN107649403A (en) | Article detection apparatus | |
| CN113363184A (en) | Semiconductor processing machine, semiconductor processing system and wafer conveying method | |
| KR102311738B1 (en) | Communication systems and methods of communication | |
| CN110015270B (en) | Charging abnormity processing system and method, battery replacement station and energy storage station | |
| KR101411879B1 (en) | System for Monitoring Conveyer Equipment Using wireless communication | |
| CN108789405A (en) | A kind of automatic test path planing method and its system based on six shaft mechanical arms | |
| CN103241522A (en) | Loading-unloading flow control method and system | |
| JP2005524155A (en) | Access management method and apparatus, and mobility management method | |
| CN104257500A (en) | Automatic fault alarm system of CIT capsule production line | |
| CN106406260B (en) | A kind of transfer control method, device and Transmission system for production line | |
| JP4427739B2 (en) | Automatic warehouse equipment | |
| KR101622854B1 (en) | Detecting Metal System for Parallel Type Trasferring Apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |