CN103885293A - Photosensitive Resin Composition And Insulating Layer Prepared From The Same - Google Patents
Photosensitive Resin Composition And Insulating Layer Prepared From The Same Download PDFInfo
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- CN103885293A CN103885293A CN201310714506.4A CN201310714506A CN103885293A CN 103885293 A CN103885293 A CN 103885293A CN 201310714506 A CN201310714506 A CN 201310714506A CN 103885293 A CN103885293 A CN 103885293A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/016—Diazonium salts or compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
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- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
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Abstract
The present invention relates to a photosensitive resin composition and an insulating layer manufactured from the same, and more specifically, to a photosensitive resin composition and an insulating layer manufactured from the same, wherein the composition improves sensitivity and resolution by including a binder resin which is polymerized by including a monomer represented by chemical formula 1, facilitates processing by improving fluidity, and enables the adjustment of the slope of patterns.
Description
Technical field
The present invention relates to have excellent susceptibility and degradation capability and can control the photosensitive polymer combination of the angle of formed pattern, and the insulation course that uses it to prepare.
Background technology
For display device as thin film transistor (TFT) (TFT) liquid crystal display; inorganic protective layer has been typically used as for the protection of TFT circuit and has made the diaphragm of TFT circuit insulation as silicon nitride; but this relates to due to its high specific inductive capacity thereby is difficult to improve aperture ratio.In order to overcome the problems referred to above, there is the tendency of the increase in demand of the organic insulating film to thering is low-k.
For this type of organic insulating film as above, conventionally use by carrying out the photoresist that chemical reaction forms specific solvent is had to different deliquescent polymer compounds under light or electron beam being exposed to.In addition, the change of the retrofit of circuit pattern by polarity (' reversal of poles ') and cross-linking reaction are carried out, and it occurs by light reaction of organic insulating film.Particularly, for the material for above-mentioned organic insulating film, can utilize after exposure for solvent and change as the dissolubility of alkaline solution.
Depend on the dissolubility that sensitization part is developed, organic insulating film as above is divided into eurymeric and minus film conventionally.Eurymeric photoresist has in developer and to dissolve the process that is exposed part, and negative photoresist has the unexposed portion of dissolving and exposed portion is insoluble to the process of developer, so forms pattern.
Among these, eurymeric organic insulating film uses alkaline solution, and does not use the organic developer that is generally used for minus organic insulating film, has advantage thus aspect working environment, prevents that in theory UV exposed portion does not become swelling, thereby improves degradation capability.In addition, forming after organic film, described film can use stripper easily to remove and tool has the following advantages: when produce defective panel in process time, remove described organic film from described panel, significantly improve thus the recovery and the reusability of base material.
Specifically, form the insulation course of liquid crystal display etc. for use organic insulating film as above, above-mentioned organic insulator must not only have excellent insulativity, and has relatively low thermal expansion, so that when it is during for covering substrates, the pressure of minimizing interface.In addition, require strong physical property.
In addition, insulation course or protective seam inevitably form interface between itself and metal or silicon compound, in this case, consider the reliability of equipment, and excellent Interface Adhesion is very important factor.Make insulation course form fine pattern so that the interconnection path between circuit to be provided, if insulation course has photonasty, can save alternative photoresist is applied to described insulation course to form the common process of pattern, thereby easily form fine pattern.
Therefore; for above-mentioned eurymeric organic insulation film composition; have and offer the deep and active research of resin glue with the composition of photosensitive Photoactive compounds (PAC) to being added with, described resin glue comprises acryloyl group photoresist, novolac resin, polyimide or the siloxane etc. that represent resin glue.In addition, it has reached the commercially available acquisition of dielectric film as above recently, and this causes the stage of the issue of the various device that uses it.
One of key property that above-mentioned organic insulating film requires is susceptibility.The raising of susceptibility can be shortened the production time in the industrial manufacturing process of display device greatly.In fact,, under the present case that liquid crystal display demand is increased greatly, susceptibility is considered to one of most important characteristic of organic insulating film as above.
But, the most of susceptibility that lacks of conventional organic insulation film composition that uses acryloyl group photoresist and PAC to prepare, particularly because the dissolubility difference between UV radiant section and the non-radiative part of UV is little, degradation capability is often not enough.
For example; U.S. Patent number 4; 139,391 disclose the photoresist class organic insulation film composition that uses the multipolymer of acryl compound and acrylate compounds to prepare as polyfunctional monomer as resin glue and the selective acrylate compounds of use.But because deliquescent difference between exposed portion and non-exposed portion is large not, developability is relatively bad.In addition, described resin glue does not have residual in developing process, but is partially soluble in developer, therefore causes and is difficult to obtain the problem that is of a size of the fine pattern below 15 μ m.
Similarly, conventional organic insulating film is not enough to solve the problem about susceptibility.Although dissolubility or prolongation development time in the polymkeric substance that susceptibility can be used by increase alkaline developer in organic insulating film improve, but the method has limitation, may cause non-exposed portion to dissolve together with exposed portion, cause the residual rate of whole film to reduce.This result causes the problem that the film diffusion of large-sized monitor in base material and pattern damage.
In addition, organic insulation film composition require various characteristics for example excellent resistance to processability as thermotolerance, solvent resistance, the forged extending is burnt to the tolerance of (hot firing) etc.; The good cohesive to supporting course; The wide range of work, wherein according to its application target, pattern can form under different processing conditionss; The loss of sprawling with the development caudacoria of other high sensitive, strong perviousness or reduction and caused by developer etc.
Summary of the invention
Therefore, the object of this invention is to provide the photoresist that there is excellent susceptibility and degradation capability and can control the angle (being inclination angle) that forms pattern.
Another object of the present invention is to provide has the suitable chemical resistance and the stable on heating resin combination that need for aftertreatment.
Another object of the present invention is to provide the insulation course that uses above-mentioned photosensitive polymer combination to prepare.
To achieve these goals, the invention provides following.
(1) photosensitive polymer combination, it comprises resin glue, and described resin glue forms by comprising the monomer polymerization being represented by formula 1:
[formula 1]
(wherein R
1hydrogen atom or methyl; R
2it is the alkylidene with 1-6 carbon atom; R
3and R
4hydrogen atom or the alkyl with 1-6 carbon atom independently of one another, or can coupling and form the ring with 3-8 carbon atom; With m be the integer of 1-6).
(2), according to the composition above-mentioned (1) Suo Shu, wherein said resin glue is by further comprising by least one and polymerization in the monomer of formula 2 to 5 expressions:
[formula 2]
(wherein R is had the alkyl replacement of 1-6 carbon atom or the alkyl of the unsubstituted 1-6 of a having carbon atom; THP trtrahydropyranyl; Or there is the alkoxy of 1-6 carbon atom or there is the cycloalkyloxy replacement of 4-8 carbon atom or the alkyl of the unsubstituted 1-6 of a having carbon atom);
[formula 3]
(wherein R
1hydrogen atom or methyl, R
2the naphthenic base that there is the alkyl of 1-6 carbon atom or there is 4-8 carbon atom);
[formula 4]
(wherein R
1hydrogen atom or methyl, R
2the alkylidene with 3-8 carbon atom, R
3the naphthenic base that there is the alkyl of 1-6 carbon atom or there is 4-8 carbon atom);
[formula 5]
(wherein R
1hydrogen atom or methyl, R
2the cycloalkylidene that there is the alkylidene of 1-6 carbon atom or there is 4-8 carbon atom, R
3the naphthenic base that there is the alkyl of 1-6 carbon atom or there is 4-8 carbon atom).
(3) according to the composition above-mentioned (1) Suo Shu, wherein said resin glue forms by the monomer polymerization being represented by formula 1 that comprises 5-60mol%.
(4) according to the composition above-mentioned (1) Suo Shu, the weight-average molecular weight of wherein said resin glue is 5,000 to 30,000.
(5), according to the composition above-mentioned (1) Suo Shu, wherein with respect to the general assembly (TW) of described composition, comprise the described resin glue of 5-60wt%.
(6) according to the composition above-mentioned (1) Suo Shu, it further comprises light acid producing agent, photosensitizer and solvent.
(7), according to the composition above-mentioned (6) Suo Shu, wherein said smooth acid producing agent is at least one that select in the group of free diazo salt, phosphonium salt, sulfonium salt, salt compounded of iodine, imido sulphonic acid ester (imide sulfonate), oxime sulfonates, diazonium two sulfones, two sulfones, adjacent nitrobenzyl sulfonate esters (orth-nitrobenzylsulfonate) and triaizine compounds composition.
(8), according to the composition above-mentioned (6) Suo Shu, wherein with respect to resin glue described in 100 weight portions, comprise the described smooth acid producing agent of 0.1-20 weight portion.
(9), according to the composition above-mentioned (6) Suo Shu, wherein said photosensitizer is at least one that select in the group of free polynuclear aromatic based compound, xanthene based compound, xanthone based compound, cyanine based compound, oxonols based compound, thiazine based compound, acridine based compound, acridone based compound, anthraquinone based compound, side's acid (squaliums) based compound, compound of styryl, basicity styrene based compound (base styryls), coumarin series compounds and anthracene based compound composition.
(10), according to the composition above-mentioned (6) Suo Shu, wherein with respect to resin glue described in 100 weight portions, comprise the described photosensitizer of 0.01-60 weight portion.
(11), according to the composition above-mentioned (6) Suo Shu, wherein said solvent is at least one that select in the group of free ether, acetic acid esters, ester, ketone, acid amides and lactone composition.
(12), according to the composition above-mentioned (6) Suo Shu, wherein said solvent is methyl proxitol acetate, diglycol Methylethyl ester or their potpourri.
(13), according to the composition above-mentioned (6) Suo Shu, wherein with respect to the general assembly (TW) of described composition, comprise the described solvent of 40-90wt%.
(14), according to the composition above-mentioned (1) Suo Shu, it further comprises at least one in the group of selecting free alkali compounds, surfactant, adhesiving reinforcing agent, thermal cross-linking agent, light stabilizer, photocuring reinforcing agent, antihalation agent and defoamer composition.
(15) insulation course, it is prepared by solidifying according to the photosensitive polymer combination described in any one in above-mentioned (1) to (14).
(16) liquid crystal display, it comprises according to the insulation course above-mentioned (15) Suo Shu.
Photosensitive polymer combination of the present invention has excellent susceptibility and degradation capability and improved mobility, thereby makes easy processing, and can control the angle of formed pattern.
Photosensitive polymer combination of the present invention has excellent electrical property and good chemical resistance and thermotolerance.
Accompanying drawing explanation
From the following detailed description providing by reference to the accompanying drawings, will more clearly understand above and other objects of the present invention, feature and other advantage, wherein:
Fig. 1 shows insulation course prepared by the photosensitive polymer combination that uses in embodiment 3 photo with respect to the pattern angles of base material;
Fig. 2 shows insulation course prepared by the photosensitive polymer combination that uses in embodiment 4 photo with respect to the pattern angles of base material;
Fig. 3 shows insulation course prepared by the photosensitive polymer combination that uses in embodiment 8 photo with respect to the pattern angles of base material;
Fig. 4 shows insulation course prepared by the photosensitive polymer combination that uses in comparative example 1 photo with respect to the pattern angles of base material.
Embodiment
The insulation course that the invention discloses a kind of photosensitive polymer combination and made by it, described photosensitive polymer combination comprises the resin glue forming by comprising the monomer polymerization that represented by formula 1, thereby there is excellent susceptibility and degradation capability, improved mobility, itself so can easily process and can control the angle that forms pattern.
Hereinafter, the present invention will be described in more detail.
Photosensitive polymer combination of the present invention can comprise the resin glue forming by comprising the monomer polymerization that represented by formula 1.
Described resin glue can form by comprising the monomer polymerization being represented by following formula 1.
[formula 1]
(wherein R
1hydrogen atom or methyl; R
2it is the alkylidene with 1-6 carbon atom; R
3and R
4be hydrogen atom or the alkyl with 1-6 carbon atom independently of one another, or can coupling form the ring with 3-8 carbon atom; With m be the integer of 1-6).
The monomer being represented by formula 1 has and R
2the oxygen atom of adjacency, if contain oxygen atom in chain, the turning radius of singly-bound becomes large, thereby reduces glass transition temperature and improve mobility, thereby can easily process.
In formula 1, the length of monomer can be controlled by adjusting ' m ', thereby controls the angle of the pattern that forms.In this case, the angle that reduces formed pattern can prevent in transparency electrode deposition process that cured film departs from or crackle occurs.
For resin glue according to the present invention, owing to depending on concrete monomer type, the monomer being represented by formula 1 can make us desirably mixing with other monomer and copolymerization, so its content and mixing ratio are not particularly limited.But, consider the improvement transparency and easy processability and control pattern angles so that prevent from occurring in cured film the maximum effect of crackle in transparency electrode deposition process, preferably include the also monomer being represented by formula 1 of polymerization 5-60 % by mole.
Can be by the monomer that makes to be represented by formula 1 and known in the art and prepare for any other monomer copolymerization of resin glue according to resin glue of the present invention.For example, described copolymerization can be undertaken by further comprising by least one in the monomer of following formula 2 to 5 expressions.The compound being represented by formula 2 can play the effect that improves hardness, and can improve perviousness by the compound of formula 3 to 5 expressions.
[formula 2]
(wherein R is had the alkyl replacement of 1-6 carbon atom or the alkyl of the unsubstituted 1-6 of a having carbon atom; THP trtrahydropyranyl; Or there is the alkoxy of 1-6 carbon atom or there is the cycloalkyloxy replacement of 4-8 carbon atom or the alkyl of the unsubstituted 1-6 of a having carbon atom).
[formula 3]
(wherein R
1hydrogen atom or methyl, R
2the naphthenic base that there is the alkyl of 1-6 carbon atom or there is 4-8 carbon atom).
[formula 4]
(wherein R
1hydrogen atom or methyl, R
2the alkylidene with 3-8 carbon atom, R
3the naphthenic base that there is the alkyl of 1-6 carbon atom or there is 4-8 carbon atom).
[formula 5]
(wherein R
1hydrogen atom or methyl, R
2the cycloalkylidene that there is the alkylidene of 1-6 carbon atom or there is 4-8 carbon atom, R
3the naphthenic base that there is the alkyl of 1-6 carbon atom or there is 4-8 carbon atom).
Optionally, resin glue of the present invention can carry out copolymerization by further comprising the normally used acrylate monomer in this area.
The kind of described acrylate monomer is not particularly limited, as long as they are known and normally used in this area, but, can comprise, for example, two (methyl) acrylic acid glycol ester, two (methyl) acrylic acid 1,6-hexanediol ester, two (methyl) acrylic acid polypropylene glycol ester, two (methyl) acrylic acid tetraethylene glycol ester, trimethylolpropane tris (methyl) acrylate, three (methyl) acrylic acid pentaerythritol ester, four (methyl) acrylic acid pentaerythritol ester, five (methyl) acrylic acid dipentaerythritol ester, six (methyl) acrylic acid dipentaerythritol ester, (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) acrylic acid n-propyl, (methyl) isopropyl acrylate, (methyl) n-butyl acrylate, (methyl) isobutyl acrylate, (methyl) tert-butyl acrylate, the just own ester of (methyl) acrylic acid, (methyl) acrylic acid cyclohexyl ester, (methyl) acrylic acid tert-butylcyclohexyl ester, (methyl) 2-ethylhexyl acrylate, the tertiary octyl group ester of (methyl) acrylic acid, (methyl) dodecylacrylate, (methyl) acrylic acid stearyl, (methyl) acrylic acid acetoxy ethyl ester, (methyl) phenyl acrylate, (methyl) HEA, (methyl) acrylic acid 2-methoxy ethyl ester, (methyl) acrylic acid 2-ethoxyethyl group ester, (methyl) acrylic acid 2-(2-methoxy ethoxy) ethyl ester, (methyl) acrylic acid 3-phenoxy group-2-hydroxypropyl ester, (methyl) benzyl acrylate ester, diglycol monotertiary methyl ether (methyl) acrylate, carbiphene (methyl) acrylate, diglycol monotertiary phenyl ether (methyl) acrylate, triethylene glycol monomethyl ether (methyl) acrylate, triethylene glycol list ethylether (methyl) acrylate, beta-phenoxy ethoxyethyl group acrylate, Nonylphenoxy polyglycol (methyl) acrylate, (methyl) acrylic acid cyclopentane base ester, (methyl) acrylic acid dicyclopentenyl ester, (methyl) acrylic acid dicyclopentenyl oxygen base ethyl ester, (methyl) acrylic acid trifluoroethyl ester, (methyl) acrylic acid octafluoro amyl group ester, (methyl) acrylic acid perfluoro capryl ethyl ester, (methyl) acrylic acid tribromo phenylester, (methyl) acrylic acid tribromo phenyl oxygen ethyl esters etc., these can be used alone or with its two or more being used in combination.
Consider to form in pattern process to keep excellent resolution and/or pattern flow characteristics, resin glue of the present invention can have 5,000 to 30,000 weight-average molecular weight.
The content of described resin glue is not particularly limited, as long as in its scope that can make us desirably working in described resin glue, but can be 5-60wt%, and preferably 10-40wt%, with respect to the general assembly (TW) of described composition.When the general assembly (TW) with respect to described composition, while comprising the described resin glue of 5wt% to 60wt%, can make to improve the maximum effect of susceptibility and degradation capability, there is suitable viscosity simultaneously.
Except above-mentioned resin glue, photosensitive polymer combination of the present invention can further comprise the light acid producing agent that conventionally uses in the application of chemically-amplified resist resin combination (' PAG'), photosensitizer and solvent.
Described PAG sends the light of activation or radiation with acidic compound.
The kind of described PAG is not particularly limited, but can comprise, for example, diazo salt, phosphonium salt, sulfonium salt, salt compounded of iodine, imido sulphonic acid ester, oxime sulfonates, diazonium two sulfones, two sulfones, adjacent nitrobenzyl sulfonate esters or triaizine compounds etc., it can be used alone or with its two or more being used in combination.
The content of described PAG is not particularly limited, as long as in its scope that can make us desirably working in described PAG, but can be 0.1-20 weight portion, and preferably 0.5-10 weight portion, with respect to resin glue described in 100 weight portions.
When with respect to resin glue described in 100 weight portions, while comprising described in 0.1 weight portion to 20 weight portion PAG, because the chemical modification that sour catalytic reaction causes can be carried out completely, and in the time applying described composition, described composition can be sprawled equably.
Described photosensitizer can absorb the light of activation or radiation with in the state being excited in electronics, and contacts with PAG, causes that energy and electronics shift or heat generation etc., accelerates thus the degraded of PAG, thereby improves susceptibility.
The kind of described photosensitizer is not particularly limited, as long as it can accelerate the degraded of PAG, but can comprise, for example, select free polynuclear aromatic based compound, xanthene based compound, xanthone based compound, cyanine based compound, oxonols based compound, thiazine based compound, acridine based compound, acridone based compound, anthraquinone based compound, the sour based compound in side, compound of styryl, basicity styrene based compound, coumarin series compounds, at least one in the group of anthracene based compound composition, it uses separately or uses with its two or more array mode.
Among above-claimed cpd, described photosensitizer can be the compound of absorbing wavelength in 350-450nm bandwidth range.
The kind of described polynuclear aromatic based compound is not particularly limited, but can comprise, for example, and Bi, perylene, benzophenanthrene or anthracene etc.
The kind of described xanthene based compound is not particularly limited, but can comprise, fluorescein, eosin, erythrosine, rhodamine B or rose-red etc.
The kind of described xanthone based compound is not particularly limited, but can comprise, xanthone, thioxanthones, dimethyl thioxanthones or diethyl thioxanthone etc.
The kind of described cyanine based compound compound is not particularly limited, but can comprise, thia-carbonyl cyanine (thiacarbocyanine), oxa-carbocyanine (oxacarbocyanine), merocyanine, carbonyl merocyanine (carbomerocyanine) are if or red cyanine (rhodacyanine) etc.
The kind of described thiazine based compound compound is not particularly limited, but can comprise, for example, and thionine, methylene blue or toluidine blue etc.
The kind of described acridine based compound is not particularly limited, but can comprise, for example, and acridine orange, chloroflavin (chloroflavine) or acridine yellow etc.
The kind of described acridone based compound is not particularly limited, but can comprise, for example, and acridone or 10-butyl-2-chloro-acridine ketone etc.
The kind of described coumarin series compounds is not particularly limited, but can comprise, for example, and 7-diethylamino-4-methylcoumarin.
The content of described photosensitizer is not particularly limited, as long as described photosensitizer can make us desirably working, but can be 0.01-60 weight portion, and preferably 0.02-40 weight portion, with respect to resin glue described in 100 weight portions.When with respect to resin glue described in 100 weight portions, while comprising the described photosensitizer of 0.01-60 weight portion, described resin glue can have suitable susceptibility simultaneously and have the transparency.
The kind of solvent is not particularly limited as used herein, as long as it can dissolve said components, but can use any solvent that has suitable rate of drying and form even and smooth coated film after described solvent evaporation.
The instantiation of described solvent can comprise ether, acetic acid esters, ester, ketone, acid imide and lactone, and it is used alone or in combination use of two or more.
The instantiation of described ether can comprise: ethylene glycol monoalkyl ether is as ethylene glycol monomethyl ether, ethylene glycol monomethyl ether, ethylene glycol list propyl ether, ethylene glycol monobutyl ether etc.; Glycol dialkyl ether is as ethylene glycol dimethyl ether, ethylene glycol bisthioglycolate ethylether, ethylene glycol bisthioglycolate propyl ether etc.; Propylene-glycol monoalky lether is as propylene glycol monomethyl ether, propylene glycol list ethylether, propylene glycol list propyl ether, propylene glycol single-butyl ether etc.; Propylene glycol dialkyl ether is as propylene glycol dimethyl ether, propylene glycol Anaesthetie Ether etc.; Monoalkyl ethers of diethylene glycol is as diglycol monotertiary methyl ether, carbiphene etc.; Diglycol dialkyl ether is as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diglycol ethyl-methyl ether etc.; Dipropylene glycol monoalky lether is as DPGME, dihydroxypropane single-ethyl ether, dipropylene glycol list propyl ether, dipropylene glycol single-butyl ether etc.; With dipropylene glycol dialkyl ether as dipropylene glycol dimethyl ether, dipropylene glycol Anaesthetie Ether, dipropylene glycol ethyl-methyl ether etc.
The instantiation of described acetic acid esters can comprise: ethylene glycol monoalkyl ether acetate is as ethylene glycol monomethyl ether acetate, ethylene glycol monomethyl ether acetate, ethylene glycol list propyl ether acetic acid esters, ethylene glycol monobutyl ether acetic acid esters etc.; Propylene-glycol monoalky lether acetic acid esters is as propylene glycol monomethyl ether, propylene glycol list ethylether acetic acid esters, propylene glycol list propyl ether acetic acid esters, propylene glycol single-butyl ether acetic acid esters etc.; Monoalkyl ethers of diethylene glycol acetic acid esters is as diglycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diglycol monotertiary propyl ether acetic acid esters, diglycol monotertiary butyl ether acetic acid esters etc.; With dipropylene glycol monoalky lether acetic acid esters as DPGME acetic acid esters, dihydroxypropane single-ethyl ether acetic acid esters, dipropylene glycol list propyl ether acetic acid esters, dipropylene glycol single-butyl ether acetic acid esters etc.
The instantiation of described ester can comprise: lactate is as methyl lactate, ethyl lactate, lactic acid n-propyl ester, isopropyl lactate, n-butyl lactate, isobutyl lactate, lactic acid n-pentyl ester, isoamyl lactate etc., alphatic carboxylic acid ester is as n-butyl acetate, isobutyl acetate, n-amyl acetate, isoamyl acetate, n-hexyl acetate, acetic acid 2-ethylhexyl, ethyl propionate, n propyl propionate, isopropyl propionate, n-butyl propionate, isobutyl propionate, methyl butyrate, ethyl butyrate, propyl butyrate, isopropyl isobutyrate, the positive butyl ester of butyric acid, isobutyl isobutyrate (IBIB) etc., other ester is as hydroxyl ethyl acetate, 2-hydroxy-2-methyl ethyl propionate, 2-hydroxy-3-methyl ethyl butyrate, methoxyacetic acid ethyl ester, ethoxy ethyl acetate, 3-methoxy methyl propionate, 3-methoxy propyl acetoacetic ester, 3-ethoxy-propionic acid methyl esters, 3-ethoxyl ethyl propionate, 3-methoxyl butylacetic acid ester, 3-methyl-3-methoxyl butylacetic acid ester, 3-methyl-3-methoxyl butyl propionic ester, 3-methyl-3-methoxyl butyl butyric ester, methyl acetoacetate, ethyl acetoacetate, methyl pyruvate, ethyl pyruvate, diglycol Methylethyl ester etc.
The instantiation of described ketone can comprise MEK, methyl propyl ketone, methyl n-butyl ketone, methyl isobutyl ketone, 2-HEPTANONE, 3-heptanone, 4-heptanone, cyclohexanone etc.
The instantiation of described acid amides can comprise N-METHYLFORMAMIDE, DMF, N-methylacetamide, DMA, 1-METHYLPYRROLIDONE etc.
The instantiation of described lactone can comprise gamma-butyrolacton etc.
Applying property and the film thickness homogeneity of considering insulation coated film, described solvent can be methyl proxitol acetate, diglycol Methylethyl ester or their potpourri.
The content of described solvent is not particularly limited, as long as in its scope that can make us desirably working in described solvent, but can be 40-90wt%, and preferably 50-80wt%, with respect to the general assembly (TW) of described composition.When the general assembly (TW) with respect to described composition, while comprising the described solvent of 40wt% to 90wt%, solid content and viscosity can remain on desired level, thereby improve Painting effect.
Photosensitive polymer combination of the present invention can further comprise that with appropriate amount adjuvant is as alkali compounds, surfactant, adhesiving reinforcing agent, thermal cross-linking agent, light stabilizer, photocuring reinforcing agent, antihalation agent (levelling agent) or defoamer etc. in the situation that not deviating from object of the present invention.
The kind of described alkali compounds is not particularly limited, but can comprise and being selected from as any of the compound of chemically-amplified resist.The instantiation of described alkali compounds can comprise the quaternary ammonium salt of aliphatic amine, aromatic amine, heterocyclic amine, quaternary ammonium hydroxide, carboxylic acid etc., and it uses separately or with its two or more being used in combination.
The instantiation of described aliphatic amine can comprise trimethylamine, diethylamine, triethylamine, di-n-propylamine, Tri-n-Propylamine, two n-amylamines, tri-n-amyl amine, diethanolamine, triethanolamine, dicyclohexyl amine, dicyclohexyl methylamine etc.
The instantiation of described aromatic amine can comprise aniline, benzylamine, N, N-dimethylaniline, diphenylamine etc.
The instantiation of described heterocyclic amine can comprise pyridine, 2-picoline, 4-picoline, 2-ethylpyridine, 4-ethylpyridine, 2-phenylpyridine, 4-phenylpyridine, N-methyl 4-phenyl pyridine, 4-dimethylaminopyridine, imidazoles, benzimidazole, 4-methylimidazole, 2-Phenylbenzimidazole, 2, 4, 5-triphenyl imidazoles, nicotine, nicotinic acid, niacinamide, quinoline, oxine, pyrazine, pyrazoles, pyridazine, purine, pyrrolidine, piperidines, piperazine, morpholine, 4-methyl morpholine, 1, 5-diazabicyclo [4.3.0]-5-nonene, 1, 8-diazabicyclo [5.3.0]-7-undecylene etc.
The instantiation of quaternary ammonium hydroxide can comprise just own ammonium etc. of tetramethylammonium hydroxide, tetraethylammonium hydroxide, the positive fourth ammonium of hydroxide four, hydroxide four.
The instantiation of the quaternary ammonium salt of carboxylic acid can comprise acetic acid tetramethyl-ammonium, benzoic acid tetramethyl-ammonium, acetic acid tetra-n-butyl ammonium, benzoic acid tetra-n-butyl ammonium etc.
The content of described alkali compounds is not particularly limited, as long as in its scope that can make us desirably working in described alkali compounds, but can be 0.0001-1 weight portion, preferably 0.004-0.5 weight portion, with respect to resin glue described in 100 weight portions.
When with respect to resin glue described in 100 weight portions, while comprising the described alkali compounds of 0.0001 weight portion to 1 weight portion, can form the middle layer insulation course with good susceptibility and storage stability.
Described surfactant is the fusible composition improving between base material and photosensitive polymer combination.
The type of described surfactant is not particularly limited, but can comprise that various surfactants are as fluorochemical surfactant, non-ionic surfactant, cationic surfactant, anionic surfactant or silicon surface active agent etc., it uses separately or with its two or more being used in combination.
The instantiation of described fluorochemical surfactant can comprise MAGAFAC F171, F172, F173, F176, F177, F141, F142, F143, F144, R30, F437, F475, F479, F482, F554, F780 and F781 (trade name, manufactured by DIC company), FLUORAD FC430, FC431 and FC171 (trade name, manufactured by Sumitomo3M Limited), SURFLON S-382, SC-101, SC-103, SC-104, SC-105, SC1068, SC-381, SC-383, S393 and KH-40 (trade name, by Asahi Glass Co., Ltd. manufacture), SOLSPERSE20000 (trade name, manufactured by Lubrizol Japan Limited) etc.
The instantiation of described non-ionic surfactant can comprise: glycerine, trimethylolpropane and trimethylolethane, with and ethoxylate or propoxylate (for example, glycerine propoxylate or glycerol ethoxylate); Polyoxyethylene lauryl ether, polyoxyethylene stearyl base ether, polyoxyethylene oleyl ether, NONIN HS 240, polyoxyethylene nonylplenyl ether, polyethylene glycol dilaurate, polyglycol distearate, sorbitan fatty acid esters are as PLURONIC L10, L31, L61, L62,10R5,17R2 and 25R2, and TETRONIC304,701,704901,904 and 150R1 (trade name, manufactured by BASF), etc.
The instantiation of described cationic surfactant can comprise that the compound of phthalocyanine modification is as EFKA-745 (trade name, by Morishita & Co., Ltd. manufacture), organic siloxane polymer is as KP341 (trade name, by Shin-Etsu Chemical Co., Ltd. manufacture), (methyl) acrylic acid (being total to) polymkeric substance is as POLYFLOW No.75, No.90, No.95 (trade name, by Kyoeisha Chemical Co., Ltd. manufacture), W001 (trade name, by Yusho Co., Ltd. manufactures) etc.
The instantiation of described anionic surfactant can comprise W004, W005, W017 (trade name, by Yusho Co., Ltd. manufactures) etc.
The instantiation of described silicon surface active agent can comprise TORAY SILICONE DC3PA, SH7PA, DC11PA, SH21PA, SH28PA, SH29PA, SH30PA and SH8400 (trade name, by Dow Corning Toray Co., Ltd. manufacture), TSF-4440, 4300, 4445, 4460 and 4452 (trade names, manufactured by Momentive Performance Materials Inc.), KP341, KF6001 and KF6002 (trade name, by Shin-Etsu Chemical Co., Ltd. manufacture), BYK307, 323 and 330 (trade names, manufactured by BYK Chemie) etc.
The content of described surfactant is not particularly limited, as long as in its scope that can make us desirably working in described surfactant, but can be 0.001-3 weight portion, and preferably 0.001-2 weight portion, with respect to resin glue described in 100 weight portions.When with respect to resin glue described in 100 weight portions, while comprising described in 0.001 weight portion to 3 weight portion surfactant, can make cohesive between base material and resin combination improve effect and/or Painting effect maximizes.
Described adhesiving reinforcing agent can improve the cohesive between described insulation course and the inorganic material of base material, it is for example that silicon compound is as silicon, monox, silicon nitride etc., or metals like gold, copper, aluminium etc., and can be used for adjusting and the cone angle (taper angle) of described base material.
The kind of described adhesiving reinforcing agent is not particularly limited, and its instantiation can comprise silane coupling agent or mercaptan compound, preferred silane coupling agent.
The kind of described silane coupling agent is not particularly limited, but can comprise, for example, gamma-amino propyl trimethoxy silicane, γ aminopropyltriethoxy silane, γ-glycidoxy propyl trialkoxy silane, γ-glycidoxy propyl group alkyl-dialkoxysilanes, γ-methacryloxypropyl trialkoxy silane, γ-methacryloxypropyl alkyl-dialkoxysilanes, γ-chloropropyl trialkoxy silane, γ-mercapto propyl trialkoxy silane, β-(3, 4-epoxy radicals cyclohexyl) ethyl trialkoxy silane, vinyl trialkyl oxysilane etc., preferably γ-glycidoxy propyl trialkoxy silane or γ-methacryloxypropyl trialkoxy silane, more preferably γ-glycidoxy propyl trialkoxy silane.These can be used alone or with its two or more being used in combination.
The content of described adhesiving reinforcing agent is not particularly limited, as long as in its scope that can make us desirably working in described adhesiving reinforcing agent, but can be 0.1-20 weight portion, and preferably 0.5-10 weight portion, with respect to resin glue described in 100 weight portions.When with respect to resin glue described in 100 weight portions, while comprising the adhesiving reinforcing agent of 0.1 weight portion to 20 weight portion, can make the cohesive of insulation course maximize.
In the time using above-mentioned composition to form described insulation course, described thermal cross-linking agent makes initiatively to carry out cross-linking reaction by UV radiation and thermal treatment, and it is to improve stable on heating component.
The kind of described thermal cross-linking agent is not particularly limited, but can comprise, for example, polyacrylate resin, epoxy resin, phenolics, melamine resin, organic acid, amines, anhydrous compound etc., it uses separately or with its two or more being used in combination.
The content of described thermal cross-linking agent is not particularly limited, as long as in its scope that can make us desirably working in described thermal cross-linking agent, but can be 0.01-5 weight portion, and more preferably 0.1-3 weight portion, with respect to resin glue described in 100 weight portions.When with respect to resin glue described in 100 weight portions, while comprising the thermal cross-linking agent of 0.01 weight portion to 5 weight portion, can make to improve thermotolerance and maximize.
Described light stabilizer is the sunproof component that improves described photosensitive polymer combination.
The kind of described light stabilizer is not particularly limited, but can comprise, for example, benzotriazole, triazine, benzophenone, be obstructed amino ethers or hindered amine compound etc., it uses separately or with its two or more being used in combination.
The content of described light stabilizer is not particularly limited, as long as in its scope that can make us desirably working in described light stabilizer, but can be 0.01-5 weight portion, and preferably 0.1-3 weight portion, with respect to resin glue described in 100 weight portions.When with respect to resin glue described in 100 weight portions, while comprising described in 0.01 weight portion to 5 weight portion light stabilizer, can make to improve photostability and maximize.
Photosensitive polymer combination formed according to the present invention as above has excellent susceptibility and degradation capability, and can control the angle of formed pattern.
The present invention can further provide the insulation course that uses above-mentioned composition to prepare.
The method of preparing insulation course according to the present invention can comprise: photosensitive polymer combination of the present invention is applied to the top of display device base material or is arranged on source/drain on described base material or the top of silicon nitride layer; Photosensitive polymer combination described in preroast; Make selectively described photosensitive polymer combination exposure and develop, to form pattern; Expose completely and heat, or only heating described photosensitive polymer combination.
Can use glass or clear plastic resin to prepare described base material as main material, it is generally used for manufacturing liquid crystal display or display of organic electroluminescence etc.But this type of material is not particularly limited, but can be depending on the characteristic of the display device that will use.For example, metal film can be set to form gate electrode at insulating substrate on as glass plate, and described metal film can form its top layer.
The method that described photosensitive polymer combination is applied to the top of described base material etc. is not particularly limited, but can comprise, for example, spraying, print roll coating, gap nozzle coating as nozzle type apply, rotate to apply and be coated with etc. as central dispense spin coating, extrusion coated, rod.In addition the capable of being combined and two or more above-mentioned coating process of use.
The film thickness applying is according to solid content, the viscosity etc. of method of application, described composition and different, but, conventionally can apply to reach film thickness after 0.5-100 μ m dry.
As ensuing operation, described preroast is to make solvent evaporates to obtain the operation that there is no the coated film of mobility after coated film forming by applying vacuum, infrared ray or heating.The kind that depends on each component or their combination, heating condition is different, for example, heating plate can be heated 5-500 second at 60-130 ℃, and oven heat can be heated at 60-140 ℃ to 20-1,000 second.
Then, can, in the case of irradiating excimer laser, far ultraviolet, ultraviolet ray, luminous ray, electron beam, X ray or g-ray (wavelength is 436nm), i-ray (wavelength is 365nm), h-ray (wavelength is 405nm) or their combination, implement optionally exposure.Described exposure can be implemented by contact, proximity or projection type exposure method etc.
According to the present invention, after alkaline development, described photosensitive polymer combination can carry out overall exposing and heating (hot temperature calcining) or only heating (hot temperature calcining).In the situation that hot temperature is calcined, described photosensitive polymer combination can have the composition configuration that comprises thermal cross-linking agent etc.Can use firing equipment at 150-350 ℃, to heat 10 minutes to 3 hours as heating plate or baking oven.After described heating, can be cross-linked completely and curing pattern.
Hereinafter, in order more specifically to understand the present invention, will describe preferred embodiment.But, to be it is evident that to those skilled in the art, this type of embodiment providing is for illustration purpose rather than the special restriction to appended claims, in the situation that not deviating from scope and spirit of the present invention, various modifications and change are fine, and limit as appended claims, the present invention suitably comprises such modification and change.
embodiment
Embodiment 1-8 and comparative example
Rotary coating composition uses component listed in table 1 with its corresponding content (wt%) preparation.
[table 1]
Experimental example
For the resin combination of preparing according to embodiment and comparative example, carry out following evaluation experimental, its result is presented in following table 2.
(1) susceptibility
Be 0.7mm (Corning1737 by being applied to thickness according to every kind of photosensitive polymer combination of embodiment 1-8 and comparative example, manufactured by Corning co.) glass baseplate on, then on the heating plate of 100 ℃, heat its 125 seconds so that described solvent evaporates, so forming thickness is the photosensitive polymer combination layer of 4.0 μ m.
Then,, in order to obtain the contact hole pattern that diameter is 10 μ m, use and there is the mask of the square pattern opening that is of a size of 10 μ m and implement exposure by means of i-X-ray lithography X machine (NSR-205i11D is manufactured by Nikon.Co.).
After exposure, use 2.38% tetramethyl-ammonium hydroxide solution as developer, at 23 ℃, make described base material carry out puddle formula development (puddle development) 40 seconds, then in the baking oven of 230 ℃, heat its 30 minutes, so obtain cured film.
The contact hole pattern that perpendicular cuts obtains, the exposure value (EV) during by acquisition 10 μ m contact hole is defined as the susceptibility of every kind of composition composition.
(2) pattern angles
After the pattern obtaining in perpendicular cuts, calculate the angle of described pattern with respect to described base material according to corresponding optical photograph.
(3) transmittance
Use spectrophotometer, be determined at the transmittance under 400nm.
[table 2]
| ? | Susceptibility (mJ/cm 2) | Pattern angles (°) | Transmittance (%) |
| |
15 | 58 | 95 |
| Embodiment 2 | 14 | 52 | 96 |
| Embodiment 3 | 10 | 45 | 93 |
| Embodiment 4 | 14 | 42 | 93 |
| Embodiment 5 | 12 | 48 | 97 |
| Embodiment 6 | 11 | 52 | 96 |
| Embodiment 7 | 16 | 43 | 92 |
| Embodiment 8 | 10 | 24 | 94 |
| Comparative example | 20 | 72 | 81 |
Ginseng sees the above table 2, has confirmed to use the insulation course of preparing according to every kind of photosensitive polymer combination of embodiment 1-8 to have excellent susceptibility and high transmission rate.In addition,, due to low pattern angles (, the low inclination angle of pattern), can in the transparency electrode deposition process as operation subsequently, prevent that described cured film from departing from or crackle occurs.
On the other hand, find to use the insulation course of preparing according to composition described in comparative example to there is bad susceptibility, low-transmittance and large pattern angles, therefore can in transparency electrode deposition process, produce defect.
Claims (16)
1. a photosensitive polymer combination, it comprises resin glue, and described resin glue forms by comprising the monomer polymerization being represented by formula 1:
[formula 1]
(wherein R
1hydrogen atom or methyl; R
2it is the alkylidene with 1-6 carbon atom; R
3and R
4be hydrogen atom or the alkyl with 1-6 carbon atom independently of one another, or can coupling form the ring with 3-8 carbon atom; With m be the integer of 1-6).
2. composition according to claim 1, wherein said resin glue is polymerized by further comprising by least one in the monomer of formula 2 to 5 expressions:
[formula 2]
(wherein R is had the alkyl replacement of 1-6 carbon atom or the alkyl of the unsubstituted 1-6 of a having carbon atom; THP trtrahydropyranyl; Or there is the alkoxy of 1-6 carbon atom or there is the cycloalkyloxy replacement of 4-8 carbon atom or the alkyl of the unsubstituted 1-6 of a having carbon atom);
[formula 3]
(wherein R
1hydrogen atom or methyl, R
2the naphthenic base that there is the alkyl of 1-6 carbon atom or there is 4-8 carbon atom);
[formula 4]
(wherein R
1hydrogen atom or methyl, R
2the alkylidene with 3-8 carbon atom, R
3the naphthenic base that there is the alkyl of 1-6 carbon atom or there is 4-8 carbon atom);
[formula 5]
(wherein R
1hydrogen atom or methyl, R
2the cycloalkylidene that there is the alkylidene of 1-6 carbon atom or there is 4-8 carbon atom, R
3the naphthenic base that there is the alkyl of 1-6 carbon atom or there is 4-8 carbon atom).
3. composition according to claim 1, wherein said resin glue forms by the monomer polymerization being represented by formula 1 that comprises 5-60mol%.
4. composition according to claim 1, the weight-average molecular weight of wherein said resin glue is 5,000 to 30,000.
5. composition according to claim 1, wherein with respect to the general assembly (TW) of described composition, comprises the described resin glue of 5-60wt%.
6. composition according to claim 1, it further comprises light acid producing agent, photosensitizer and solvent.
7. composition according to claim 6, wherein said smooth acid producing agent is at least one that select in the group of free diazo salt, phosphonium salt, sulfonium salt, salt compounded of iodine, imido sulphonic acid ester, oxime sulfonates, diazonium two sulfones, two sulfones, adjacent nitrobenzyl sulfonate esters and triaizine compounds composition.
8. composition according to claim 6, wherein with respect to resin glue described in 100 weight portions, comprises the described smooth acid producing agent of 0.1-20 weight portion.
9. composition according to claim 6, wherein said photosensitizer is at least one that select in the group of free polynuclear aromatic based compound, xanthene based compound, xanthone based compound, cyanine based compound, oxonols based compound, thiazine based compound, acridine based compound, acridone based compound, anthraquinone based compound, the sour based compound in side, compound of styryl, basicity styrene based compound, coumarin series compounds and anthracene based compound composition.
10. composition according to claim 6, wherein with respect to resin glue described in 100 weight portions, comprises the described photosensitizer of 0.01-60 weight portion.
11. compositions according to claim 6, wherein said solvent is at least one that select in the group of free ether, acetic acid esters, ester, ketone, acid amides and lactone composition.
12. compositions according to claim 6, wherein said solvent is methyl proxitol acetate, diglycol Methylethyl ester or their potpourri.
13. compositions according to claim 6, wherein with respect to the general assembly (TW) of described composition, comprise the described solvent of 40-90wt%.
14. compositions according to claim 1, it further comprises at least one in the group of selecting free alkali compounds, surfactant, adhesiving reinforcing agent, thermal cross-linking agent, light stabilizer, photocuring reinforcing agent, antihalation agent and defoamer composition.
15. 1 kinds of insulation courses, it is prepared according to the photosensitive polymer combination described in any one in claim 1 to 14 by solidifying.
16. 1 kinds of liquid crystal displays, it comprises insulation course according to claim 15.
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| CN105938299A (en) * | 2015-03-06 | 2016-09-14 | 东友精细化工有限公司 | Chemically amplified photosensitive resin composition and insulation layer prepared from the same |
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| TW201426184A (en) | 2014-07-01 |
| TWI617887B (en) | 2018-03-11 |
| KR101364229B1 (en) | 2014-02-17 |
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