CN103885081A - Grid mould for emission imaging device, detector and emission imaging device - Google Patents

Grid mould for emission imaging device, detector and emission imaging device Download PDF

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Publication number
CN103885081A
CN103885081A CN201410084432.5A CN201410084432A CN103885081A CN 103885081 A CN103885081 A CN 103885081A CN 201410084432 A CN201410084432 A CN 201410084432A CN 103885081 A CN103885081 A CN 103885081A
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China
Prior art keywords
grid mould
housing
grid
mould
walls
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CN201410084432.5A
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CN103885081B (en
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许剑锋
石涵
黄秋
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Sino science and Technology (Shenzhen) Co., Ltd.
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许剑锋
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Priority to CN201410084432.5A priority Critical patent/CN103885081B/en
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Priority to PCT/CN2015/073813 priority patent/WO2015135446A1/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/20Measuring radiation intensity with scintillation detectors
    • G01T1/202Measuring radiation intensity with scintillation detectors the detector being a crystal

Abstract

The invention provides a grid mould for an emission imaging device, a detector and an emission imaging device. The grid mould comprises a shell, multiple transverse walls and multiple longitudinal walls, wherein the transverse walls are located in the shell and transversely extend along the shell in parallel, the longitudinal walls are located in the shell and longitudinal extend along the shell in parallel, the transverse walls and the longitudinal walls divide a lower space in the shell into multiple grid grooves distributed in a matrix mode, and the heights of the transverse walls and the longitudinal walls are gradually reduced from the periphery of the shell to the center of the shell. The heights of the transverse walls and the longitudinal walls are precisely measured, the grid mould can accurately control projection distribution of visible photon groups generated due to high-energy photon annihilation, and accordingly the best crystal decoding effect can be achieved. The grid mould can be manufactured by assembling the transverse walls and the longitudinal walls such as sheets, precise control over surface performance, appearance and the size can be achieved, and performance of the detector is remarkably improved.

Description

For launching grid mould, detecting device and the transmitting imaging device of imaging device
Technical field
The present invention relates to launch imaging system, particularly, relate to a kind of for launch imaging device detecting device grid mould, there is the detecting device of this grid mould and there is the transmitting imaging device of this detecting device.
Background technology
The transmitting imaging device that comprises positron emission imaging device has been used to medical diagnosis.Take positron emission imaging device as example, the negatron phenomenon of effect that dies out in the positron that it utilizes positron isotope to decay to produce and human body, lead in human body and inject with the isotope-labeled compound of positron, adopt the method for complex probe, utilize detecting device to survey that the effect that dies out produces γphoton, obtains isotopic distributed intelligence in human body, rebuilds combinatorial operation by computing machine, thereby obtains the three-dimensional tomographic image that human body internal labeling compound distributes.
Transmitting imaging device generally includes support frame and is arranged on the multiple detecting devices on support frame.Take positron emission imaging device as example, detecting device mainly comprises three parts, as shown in Figure 1, i.e. and the undermost crystal matrix being formed by discrete scintillation crystal 110, glass light conducting shell 120 and photomultiplier (PMT) matrix 130.In glass light conducting shell 120, be carved with the grooving 121 of different depth, the matrix that grooving 121 is divided into the lower surface of glass light conducting shell 120, and the crystal matrix 110 of this matrix and discrete crystal composition is corresponding one by one.In grooving 121, insert reflectorized material.
The high-energy photon of 511 electron-volts (γ photon) that positron annihilation produces, a certain crystal bar inside in crystal matrix 110 reacts, and is converted into visible ray subgroup.Because five faces of scintillation crystal except end face are all covered by reflecting piece, visible ray subgroup can only be penetrated from the end face of scintillation crystal, and enters glass light guides layer 120.Visible ray subgroup from glass light conducting shell 120 out, enter PMT matrix 130.In PMT matrix 130, the size of the visible light signal that each PMT unit collects, with centroid algorithm (Anger Logic), can calculate the inner reaction occurring of which scintillation crystal of high-energy photon in crystal matrix 110.This process is called crystal decoding.
In the detector design of tradition positron emission imaging device, a ring of most critical is the degree of depth setting of grooving 121 in glass light conducting shell 120.Irrational grooving 121 degree of depth settings, can cause larger even mistake of crystal solution code error.Otherwise reasonably grooving 121 degree of depth settings, can greatly reduce crystal solution code error.Therefore the processing of detecting device is even more important.But the detecting device in traditional positron emission imaging device need to be carved into glass light conducting shell 120 grooving 121 of different depth.Space in the width General Requirements of grooving 121 and crystal matrix 110 between single discrete scintillation crystal is consistent.On the other hand, in order to improve the sensitivity of detecting device to the high-energy photon of 511 electron-volts, the smaller the better between discrete scintillation crystal.Therefore, the width of grooving is generally 100 microns of left and right.In so narrow grooving, insert reflectorized material, technological requirement is higher.And for the degree of depth of grooving 121, as previously mentioned, in order to obtain best crystal decoding effect, grooving 121 degree of depth being provided with to certain accuracy requirement (for example 200 microns of precision), traditional cutting technique is more difficult reaches this requirement.
Therefore, be necessary to propose a kind of for launch imaging device detecting device grid mould, there is the detecting device of this grid mould and there is the transmitting imaging device of this detecting device, to solve problems of the prior art.
Summary of the invention
According to an aspect of the present invention, provide a kind of for launching the grid mould of detecting device of imaging device, comprising: housing; Multiple transverse walls, it is positioned at described housing and in parallel to each other along the horizontal expansion of described housing; And multiple longitudinal walls, it is positioned at described housing and extending longitudinally along described housing in parallel to each other, wherein said multiple transverse wall and described multiple longitudinal wall are separated into the lower space in described housing multiple grid grooves of arranging with matrix-style, and described multiple transverse wall and described multiple longitudinal wall have the height reducing gradually along the center of thoughtful described housing from described housing.
Preferably, described multiple transverse wall is formed by multiple transverse slice respectively, and described multiple longitudinal wall is formed by multiple longitudinal thin slices respectively, on wherein said multiple transverse slice and described multiple longitudinal thin slice, be respectively arranged with the grooving that can make them mutually peg graft, described multiple transverse slice and described multiple longitudinal thin slice peg graft to form described multiple grid groove at described grooving place.
Preferably, the surface towards described enclosure interior of the diapire of described housing and sidewall and the side of described multiple transverse walls and described multiple longitudinal walls are provided with reflection layer.
Preferably, the top of the housing of described grid mould is open, and is provided with connecting portion at described top place, and described connecting portion is for being connected with the photosensor layer of described detecting device.
Preferably, the described housing of described grid mould seals, and the roof of described housing is made up of the transparent material of optical photon.
Preferably, the space-filling in described housing has photoconduction liquid.
Preferably, on the described housing of described grid mould, be provided with device for casting and/or the exhaust apparatus on the sidewall that is arranged on described housing.
Preferably, described grid mould also comprises exhaust apparatus, and described exhaust apparatus comprises the guide plate of one or more umbrellas, is formed with vent port at the top center place of each described guide plate.
According to another aspect of the present invention, also provide a kind of for launching the detecting device of imaging device, described detecting device comprises: crystal layer, and described crystal layer comprises multiple scintillation crystals of arranging with matrix-style; Any grid mould as above, described crystal layer is connected to the bottom of described grid mould, and described multiple scintillation crystal is corresponding one by one with described multiple grid grooves of described grid mould respectively, in described grid mould, is filled with photoconduction liquid; And photosensor layer, described photosensor layer is connected to the top of described grid mould, and described photosensor layer comprises multiple optical sensors.
Preferably, described multiple scintillation crystals are inserted in respectively in described multiple grid groove, and the height of described multiple transverse wall and described multiple longitudinal walls is not less than the height of described scintillation crystal.
Preferably, the bottom surface of described multiple scintillation crystals and side are connected to described grid mould by reflectorized material.
Preferably, described crystal layer is connected to the bottom surface of described grid mould in the outside of described grid mould.
Preferably, described grid mould also comprises exhaust apparatus, and described exhaust apparatus comprises the guide plate of one or more umbrellas, is formed with vent port at the top center place of each described guide plate, in the gap of described guide plate between described multiple optical sensors.
Preferably, the described gap between described multiple optical sensor is provided with lock gas chamber.
According to a further aspect of the invention, also provide a kind of transmitting imaging device, described transmitting imaging device comprises any detecting device as above.
, can control exactly high-energy photon and bury in oblivion the projective distribution that produces visible ray subgroup, and then can reach best crystal decoding effect by transverse wall and the longitudinally height of wall exactly according to grid mould of the present invention.And this grid mould can for example,, by transverse wall and longitudinally wall (thin slice) assembling making, can accurately be controlled its surface property and appearance and size realization, significantly improves detector performance.For example, as required can also be easily at housing and the transverse wall of grid mould with longitudinally lay reflection layer on wall.
In summary of the invention, introduced the concept of a series of reduced forms, this will further describe in embodiment part.Content part of the present invention does not also mean that key feature and the essential features that will attempt to limit technical scheme required for protection, does not more mean that the protection domain of attempting to determine technical scheme required for protection.
Below in conjunction with accompanying drawing, describe advantages and features of the invention in detail.
Accompanying drawing explanation
Following accompanying drawing of the present invention is used for understanding the present invention in this as a part of the present invention.Shown in the drawings of embodiments of the present invention and description thereof, be used for explaining principle of the present invention.In the accompanying drawings,
Fig. 1 is the schematic diagram of the existing detecting device for positron emission imaging device;
Fig. 2 A is according to the front view of the grid mould of an embodiment of invention;
Fig. 2 B is the cut-open view along transverse cross sectional according to the grid mould of an embodiment of invention;
Fig. 2 C is the cut-open view longitudinally dissecing according to the grid mould of an embodiment of invention;
Fig. 3 A-3E is according to the schematic diagram of the grid mould of an embodiment making of invention;
Fig. 4 A-4B is according to cut-open view and the vertical view of the detecting device of an embodiment of invention;
Fig. 5 is according to the cut-open view of the detecting device of another embodiment of invention;
Fig. 6 is according to the cut-open view of the detecting device of another embodiment of invention;
Fig. 7 A-7B is according to vertical view and the cut-open view of the detecting device of another embodiment of invention.
Embodiment
In the following description, a large amount of concrete details have been provided to more thorough understanding of the invention is provided.But, it will be apparent to one skilled in the art that the present invention can be implemented without one or more these details.In other example, for fear of obscuring with the present invention, be not described for technical characterictics more well known in the art.
In order thoroughly to understand the present invention, will detailed structure be proposed in following description.Obviously, embodiments of the invention are not limited to the specific details that those skilled in the art has the knack of.Preferred embodiment of the present invention is described in detail as follows, but except these are described in detail, the present invention can also have other embodiments.
The invention provides a kind ofly for launching the grid mould of detecting device of imaging device, this grid mould is mainly used in substituting glass light conducting shell of the prior art, the especially grooving in instead of glass photoconductive layer.As shown in Fig. 2 A-2C, this grid mould comprises housing 210, multiple transverse wall 220 and multiple longitudinal wall 230.Transverse wall 220 is positioned at housing 210, and in parallel to each other along the horizontal expansion of housing 210.Longitudinally wall 230 is positioned at housing 210, and extending longitudinally along housing 210 in parallel to each other.As shown in Fig. 2 B-2C, the lower space in housing 210 is separated into multiple grid grooves by multiple transverse walls 220 and multiple longitudinal wall 230, and the plurality of grid groove is arranged with matrix-style.In short transverse, multiple transverse walls 220 and multiple longitudinal wall 230 can start upwards to extend from the bottom surface of housing 210, also can upwards extend with spaced apart certain distance ground, bottom surface.Under these two kinds of modes, the crystal layer of the detecting device of transmitting imaging device can have different structures, hereinafter in connection with the structure of crystal layer, it is described respectively.In addition, multiple transverse walls 220 and multiple longitudinal wall 230 have along thoughtful housing 210 center from housing 210 height reducing gradually.As hereinafter described, this transverse wall 220 and the longitudinally main grooving replacing in glass light conducting shell of the prior art of wall 230, there is higher height the closer to peripheral wall (comprising peripheral transverse wall 220 and longitudinal wall 230), mainly for the decoded positions that makes the scintillation crystal of avoiding edge mixes.The height of each wall need to be determined by repetition test conventionally.
Transverse wall 220 and longitudinally wall 230 can form by any-mode, and transverse wall 220 can be single or multiple lift structure with longitudinal wall 230.Each transverse wall 220 and each longitudinal wall 230 can be spliced to form by multiple discrete sheets, and like this, multiple interconnect to be separated to form multiple grid grooves.Certainly, each transverse wall 220 and each longitudinal wall 230 can be also the member of full wafer.With reference to Fig. 3 A-3E, provide a kind of mode that adopts full wafer structure manufacture transverse wall 220 and longitudinal wall 230.
As shown in Fig. 3 A-3B, thin slice 220 ' is first provided, this thin slice 220 ' can be super thin metal sheet, ultra-thin PVC sheet etc., can be generally 50-120 micron.Then, at the correct position place of the bottom of for example thin slice 220 ', grooving 221 is set, to form transverse slice.Each transverse wall 220 can be the transverse slice that adopts the method to make.Similarly, each longitudinal wall also can be for adopting longitudinal thin slice of making of said method, and difference is that grooving 231(on longitudinal thin slice is referring to Fig. 3 C) portion disposed thereon.As example, can also adopt longitudinal wall 230(that the various known technologies including 3D printing technique carry out the transverse wall 220 shown in construction drawing 3B and have similar structures referring to Fig. 3 C).
As shown in Figure 3 C, on transverse slice and longitudinally thin slice, grooving can make transverse slice and longitudinal thin slice mutually peg graft, and multiple like this transverse slice and multiple longitudinal thin slice are pegged graft at grooving place, can form multiple grid grooves, as shown in Figure 3 D.Then this grid groove is fixed in housing 210, for the inner structure of housing 310 can be shown, in Fig. 3 E, only shows a part for housing.
It should be noted that, in Fig. 3 A-3E, illustrated transverse wall 220 and longitudinal wall 230, only for the principle of the preferred embodiment is described, are not intended to the quantity of transverse wall 220 and longitudinal wall 230 to be limited to illustrated embodiment herein.In fact, the transverse wall 220 being finally plugged in together and longitudinally wall 230 are corresponding to the grooving in existing glass light conducting shell, the grid groove being separated to form can be corresponding one by one with scintillation crystal respectively, be grid groove length and width respectively with length and the width corresponding (for example the size of grid groove equates or be slightly less than the size of scintillation crystal) of scintillation crystal, therefore, transverse wall 220 and longitudinally wall 230 quantity will according to reality should be used for determine.
As shown in Fig. 3 E, the diapire of housing 210 and sidewall on the surface of housing 210 inside and the side of multiple transverse wall and multiple longitudinal walls, can be provided with reflection layer.This reflection layer can be that spraying, plated film (for example spraying or silver-plated film) or sticking reflecting material (for example ESR reflecting piece) form.ESR(Enhanced Specular Reflector) thickness of reflecting piece is 40 microns of left and right, and for example 38 microns.As high-efficient reflecting mirror, the reflectivity of ESR in whole visible spectrum is all more than 98%, higher than the reflector plate of current other kinds.ESR itself is made up of macromolecule membrane layer, is the reflector plate material of environmental protection more.Certainly, the present invention does not get rid of the embodiment that housing 210 and transverse wall 220 and longitudinal wall 230 are made by reflectorized material.
Preferably, the top of housing 210 is provided with connecting portion, and this connecting portion is for being connected with the photosensor layer 420 of detecting device, as shown in Fig. 4 A-4B.In figure, comprise that take photosensor layer 420 four optical sensors are as example.As example, optical sensor can be photomultiplier (PMT).Photosensor layer 420 is connected to after the housing 210 of grid mould, the interior formation seal cavity of housing 210.Sealing space is used for filling photoconduction liquid 430.Photoconduction liquid 430 can be to be filled in housing 210 before photosensor layer 420 connects, and also can after photosensor layer 420 is connected to housing 210, fill by the device for casting (referring to the fill openings shown in Fig. 5 and connector 500) being additionally arranged on housing.
Photoconduction liquid 430 is the fluent material under normal temperature.Stroll liquid and preferably there is following performance requirement: stable chemical nature is nontoxic; 420nm light decay lowers; Optical conductivity higher (1.5 left and right); The coefficient of viscosity low (low viscosity, preventing from bubbling produces).As example, photoconduction liquid 430 can be for the mineral oil, Silica(that meet above condition are as the Viscasil series of General Corporation) etc.
In other embodiments, the housing 210 of grid mould also can seal, i.e. 210 members as sealing of housing.In order to make photon can enter photosensor layer 420, the roof of housing 210 is made up of the transparent material of optical photon.Further, the space in housing 210 can be filled with photoconduction liquid 430.This means and can before the housing 210 that forms sealing, fill photoconduction liquid 430.Can certainly be not in advance at the interior filling photoconduction of housing 210 liquid, but on the housing 210 of sealing, the device for casting 500 shown in Fig. 5 is set.According to using needs, can fill at any time, supplement or change photoconduction liquid like this.
In the situation that housing 210 itself is containment member, photosensor layer 420 can adhere to or the mode of other any appropriate is fixed to the upper surface of housing 210 by jointing material.But, it should be noted that, visible ray subgroup arrives before photosensor layer 420 from photoconductive layer, jointing material that need to be through photoconductive layer and photosensor layer 420.Therefore, jointing material choose with processing technology very large to the performance impact of detecting device.On the one hand, the bad jointing material of light transmission not only affects crystal decoding, and the energy resolution on detecting device and temporal resolution also have larger impact.On the other hand, jointing material is generally the liquid with certain coefficient of viscosity.In the time of bonding each parts, in jointing material, probably produce bubble, to crystal decoding, the energy resolution of detection head and temporal resolution produce destructive influences.Even if do not produce bubble in adhesion process, part jointing material is subject to the impact of the factors such as temperature, also may produce crack or bubble in long-term use procedure, affects the use of detecting device.Therefore, while consideration from above aspect, the top that preferably adopts housing 210 is open, and this top place is provided with connecting portion, and this connecting portion is for being connected with photosensor layer 420, as shown in Figure 4 A.In the preferred embodiment, photoconduction liquid 430 directly contacts with photosensor layer 420, and visible ray subgroup can directly enter photosensor layer 420 from photoconduction liquid 430 out like this, and then avoids the adverse effect of bonding agent.But while consideration from other side, for example, from technique and cost aspect, housing 210 itself is that the embodiment of containment member also has advantage, and therefore, the present invention does not get rid of this embodiment.
For crystal layer, it comprises multiple scintillation crystals of arranging with matrix-style.Scintillation crystal can be the one in active thallium sodium iodide crystal, bismuth-germanium-oxide crystal, lutecium silicate crystal, silicic acid lutetium-yttrium crystal.In a preferred embodiment, scintillation crystal can be inserted into respectively in the grid groove of transverse wall and longitudinally wall formation, as shown in Fig. 4 A-4B.In the case, transverse wall 210 and longitudinally 220 height that are highly not less than scintillation crystal 410 of wall.As above, the size of grid groove can equal or be slightly less than the size of scintillation crystal.When installation, when the size that can first grid mould be heated to a little to grid mould is slightly larger than the size of scintillation crystal, by scintillation crystal one by one among the grid groove of interpenetration network mould.Then stop heating, after grid mold cools down is shunk, scintillation crystal is fixed.Scintillation crystal is inserted into grid groove and can makes directly to enter photoconduction liquid level from scintillation crystal visible ray subgroup out, avoid middle layer (comprising the medium such as bonding agent and/or the gas) impact that decoding produces on crystal getting involved.
As described in Fig. 4 A-4B, on the side of the diapire of housing 210 and the surface towards housing 210 inside of sidewall and multiple transverse wall 220 and multiple longitudinal walls 230, can be provided with in the embodiment of reflection layer, scintillation crystal can directly be inserted in grid groove.Do not have in the embodiment of reflection layer at grid mould, can after other face except top surface of scintillation crystal wraps up reflectorized material respectively, be inserted in grid groove.In addition, can also pass through the sticking reflectorized material of tool, make the bottom surface of multiple scintillation crystals and side be connected to grid mould by reflectorized material.
In embodiment in scintillation crystal is directly inserted into grid groove, the effect of fixing scintillation crystal is played in transverse wall 220 and the longitudinally bottom of wall 230, and the effect of the grooving in existing glass light conducting shell is played on transverse wall 220 and the longitudinally top of wall 230.Therefore, preferably, at the transverse wall 220 of corresponding slot portion with longitudinally on the side of wall 230 and the medial surface of housing, reflection layer can be set.The reflection layer of this part is mainly used to guide the distribution of visible ray subgroup in photosensor layer, to reach best crystal decoding effect.
In another embodiment, as shown in Figure 6, adopt crystal matrix 600(in traditional detector module to be similar to the crystal matrix 110 shown in Fig. 1).Particularly, between scintillation crystal, be bonded together with reflectorized material (as ESR reflecting piece), and five faces except bottom surface all use reflectorized material (as TEFLON adhesive tape) to be bundled together by the scintillation crystal after bonding, to form crystal matrix 600.Then by crystal matrix 600, by bonding agent, bonding or other any suitable mode is fixed to the lower surface of grid mould.In a preferred embodiment, the slot of fixed crystal matrix 600 can be provided in the lower end of housing 210, bonding agent can be avoided using like this.This setup has the following advantages: the technique that (a) can utilize the bonding formation crystal matrix of ripe scintillation crystal; (b) lower to forming the thickness requirement of thin slice of grid mould, because sheet thickness can not affect the filling rate of crystal in this embodiment.But, than by the embodiment of scintillation crystal interpenetration network groove, grid mould and crystal matrix for light splitting are strictly being alignd, and the aspect that do not interspace, may acquire a certain degree of difficulty.
In use, in photoconduction liquid, may produce bubble, this bubble may cause their refraction in the transmitting procedure of visible ray subgroup, and then affects crystal decoding.Therefore, in a preferred embodiment of the invention, this grid mould also comprises exhaust apparatus.
In the embodiment shown in fig. 5, exhaust apparatus 500 can be arranged on the sidewall of housing 210.This exhaust apparatus 500 also can be used as the device for casting of photoconduction liquid.This device for casting and/or exhaust apparatus 500 can comprise the opening on the sidewall that is arranged on housing 210 and fill in the connector that can seal this opening in opening.It should be noted that, the quantity of device for casting and/or exhaust apparatus 500 and position are not subject to the restriction of illustrated embodiment, and the structure of device for casting and/or exhaust apparatus 500 also can be different from illustrated embodiment, as long as can realize above-mentioned functions.
In a preferred embodiment, as shown in Fig. 7 A-7B, exhaust apparatus is umbrella, and this exhaust apparatus comprises the guide plate 700 of umbrella, and the top center place of guide plate 700 has vent port 710.In the time that grid mould is mounted to photosensor layer 421, exhaust apparatus can be arranged on the gap location between optical sensor.As example, guide plate 700 can be connected at this gap location the sidewall of optical sensor, or is connected to the sidewall on the top of housing 210 by the connecting elements of for example linking arm.Although only the center clearance place at optical sensor is provided with this exhaust apparatus in Fig. 7 A-7B, the present invention is not intended to be defined in this embodiment.But as required, exhaust apparatus can be arranged on the gap location between any adjacent optical sensor.In unshowned other embodiment, this grid mould can comprise multiple exhaust apparatus, and multiple exhaust apparatus are separately positioned on the multiple gap locations between optical sensor.Exhaust apparatus is arranged on to the gap location between optical sensor, can avoids guide plate 700 to exert an influence to the transmission of visible ray subgroup.Preferably, the gap location between optical sensor can also arrange lock gas chamber, to avoid bubble easily in back light drain body.As example, Gai Suo gas chamber can be the hollow chamber of the relative closure that formed by the sidewall of guide plate, optical sensor and/or other necessary member.For example, lock gas chamber can be arranged on the top of the guide plate 700 shown in Fig. 7 B.Lock gas chamber is communicated with vent port 710.In the time that needs carry out the processing of exhaust bubble to photoconduction liquid, detecting device uprightly can be placed as shown in Fig. 7 and 6, because bubble is lighter, bubble can and move along guide plate 700 to floating, and enters lock gas chamber from vent port 10.Process in order to accelerate exhaust bubble, detecting device can be placed on centrifugal device, so that bubble is discharged from the vent port 710 of exhaust apparatus.
In the time that sensor layer 420 is connected to grid mould by the connecting portion of housing 210 tops, exhaust apparatus can be aimed at the gap between multiple optical sensors 421, as shown in Figure 7 A.Lock gas chamber can be arranged in this gap, and then bubble can be locked in Gai Suo gas chamber.Because photon collection is not carried out in the gap between this optical sensor 421, therefore the bubble of this exhaust apparatus and discharge can not exert an influence to crystal decoding.
, can control exactly high-energy photon and bury in oblivion the projective distribution that produces visible ray subgroup, and then can reach best crystal decoding effect by transverse wall and the longitudinally height of wall exactly according to grid mould of the present invention.This grid mould can for example,, by transverse wall and longitudinally wall (thin slice) assembling making, can accurately be controlled its surface property and appearance and size realization, significantly improves detector performance.For example, as required can also be easily at housing and the transverse wall of grid mould with longitudinally lay reflection layer on wall.
In addition, it is a kind of for launching the detecting device of imaging device, foregoing that the present invention also provides, and this detecting device comprises crystal layer, foregoing any grid mould and photosensor layer.Can, with reference to corresponding description above, for simplicity, no longer describe in detail herein for crystal layer, grid mould and photosensor layer.
Further, the present invention also provides a kind of transmitting imaging device, and this transmitting imaging device comprises any detecting device as above.
The present invention is illustrated by above-described embodiment, but should be understood that, above-described embodiment is the object for giving an example and illustrating just, but not is intended to the present invention to be limited in described scope of embodiments.In addition it will be appreciated by persons skilled in the art that the present invention is not limited to above-described embodiment, can also make more kinds of variants and modifications according to instruction of the present invention, these variants and modifications all drop in the present invention's scope required for protection.Protection scope of the present invention is defined by the appended claims and equivalent scope thereof.

Claims (15)

1. for launching the grid mould of detecting device for imaging device, it is characterized in that, comprising:
Housing;
Multiple transverse walls, it is positioned at described housing and in parallel to each other along the horizontal expansion of described housing; And
Multiple longitudinal walls, it is positioned at described housing and extending longitudinally along described housing in parallel to each other,
Wherein said multiple transverse wall and described multiple longitudinal wall are separated into the lower space in described housing multiple grid grooves of arranging with matrix-style, and described multiple transverse wall and described multiple longitudinal wall have the height reducing gradually along the center of thoughtful described housing from described housing.
2. grid mould as claimed in claim 1, is characterized in that, described multiple transverse walls are formed by multiple transverse slice respectively, and described multiple longitudinal wall forms by multiple longitudinal thin slices respectively,
On wherein said multiple transverse slice and described multiple longitudinal thin slice, be respectively arranged with the grooving that can make them mutually peg graft, described multiple transverse slice and described multiple longitudinal thin slice peg graft to form described multiple grid groove at described grooving place.
3. grid mould as claimed in claim 1, is characterized in that, the surface towards described enclosure interior of the diapire of described housing and sidewall and the side of described multiple transverse walls and described multiple longitudinal walls are provided with reflection layer.
4. grid mould as claimed in claim 1, is characterized in that, the top of the housing of described grid mould is open, and is provided with connecting portion at described top place, and described connecting portion is for being connected with the photosensor layer of described detecting device.
5. grid mould as claimed in claim 1, is characterized in that, the described housing of described grid mould seals, and the roof of described housing is made up of the transparent material of optical photon.
6. grid mould as claimed in claim 5, is characterized in that, the space-filling in described housing has photoconduction liquid.
7. grid mould as claimed in claim 1, is characterized in that, is provided with device for casting and/or the exhaust apparatus on the sidewall that is arranged on described housing on the described housing of described grid mould.
8. grid mould as claimed in claim 1, is characterized in that, described grid mould also comprises exhaust apparatus, and described exhaust apparatus comprises the guide plate of one or more umbrellas, is formed with vent port at the top center place of each described guide plate.
9. for launching a detecting device for imaging device, it is characterized in that, described detecting device comprises:
Crystal layer, described crystal layer comprises multiple scintillation crystals of arranging with matrix-style;
Grid mould as described in any one in claim 1-7, described crystal layer is connected to the bottom of described grid mould, and described multiple scintillation crystal is corresponding one by one with described multiple grid grooves of described grid mould respectively, in described grid mould, is filled with photoconduction liquid; And
Photosensor layer, described photosensor layer is connected to the top of described grid mould, and described photosensor layer comprises multiple optical sensors.
10. detecting device as claimed in claim 9, is characterized in that, described multiple scintillation crystals are inserted in respectively in described multiple grid groove, and the height of described multiple transverse wall and described multiple longitudinal walls is not less than the height of described scintillation crystal.
11. detecting devices as claimed in claim 10, is characterized in that, the bottom surface of described multiple scintillation crystals and side are connected to described grid mould by reflectorized material.
12. detecting devices as claimed in claim 9, is characterized in that, described crystal layer is connected to the bottom surface of described grid mould in the outside of described grid mould.
13. detecting devices as claimed in claim 9, it is characterized in that, described grid mould also comprises exhaust apparatus, described exhaust apparatus comprises the guide plate of one or more umbrellas, top center place at each described guide plate is formed with vent port, in the gap of described guide plate between described multiple optical sensors.
14. detecting devices as claimed in claim 13, is characterized in that, the described gap between described multiple optical sensors is provided with the lock gas chamber being communicated with described vent port.
15. 1 kinds of transmitting imaging devices, is characterized in that, described transmitting imaging device comprises as the detecting device as described in any one in claim 9-14.
CN201410084432.5A 2014-03-10 2014-03-10 For launching the grid mould of imaging device, detector and transmitting imaging device Active CN103885081B (en)

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Application Number Priority Date Filing Date Title
CN201410084432.5A CN103885081B (en) 2014-03-10 2014-03-10 For launching the grid mould of imaging device, detector and transmitting imaging device
PCT/CN2015/073813 WO2015135446A1 (en) 2014-03-10 2015-03-06 Grid mold for emission imaging device, detector and emission imaging device

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Application Number Priority Date Filing Date Title
CN201410084432.5A CN103885081B (en) 2014-03-10 2014-03-10 For launching the grid mould of imaging device, detector and transmitting imaging device

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CN104237924A (en) * 2014-08-20 2014-12-24 许剑锋 Grid mould, detector including same and emission imaging equipment
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CN104199079A (en) * 2014-07-17 2014-12-10 许剑锋 Fixing device, detection device and detection method for scintillation crystals of emission imaging equipment
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CN104237924A (en) * 2014-08-20 2014-12-24 许剑锋 Grid mould, detector including same and emission imaging equipment
CN104597475A (en) * 2015-01-24 2015-05-06 东莞南方医大松山湖科技园有限公司 Detector and preparation method thereof and emission imaging device with the same
CN104597475B (en) * 2015-01-24 2017-11-14 东莞南方医大松山湖科技园有限公司 Detector and preparation method thereof and the transmitting imaging device with the detector
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CN105403907A (en) * 2015-12-02 2016-03-16 沈阳东软医疗系统有限公司 Scintillation crystal block and preparation method thereof, and scintillation crystal detector
CN108107463A (en) * 2017-12-12 2018-06-01 宁波虔东科浩光电科技有限公司 A kind of scintillating ceramic array and preparation method thereof
CN112782746A (en) * 2021-02-22 2021-05-11 中国电子科技集团公司第二十六研究所 Method for manufacturing vacuum centrifugal scintillation crystal array
CN112782746B (en) * 2021-02-22 2022-09-20 中国电子科技集团公司第二十六研究所 Method for manufacturing vacuum centrifugal scintillation crystal array

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