CN104597475A - Detector and preparation method thereof and emission imaging device with the same - Google Patents
Detector and preparation method thereof and emission imaging device with the same Download PDFInfo
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- CN104597475A CN104597475A CN201510035986.0A CN201510035986A CN104597475A CN 104597475 A CN104597475 A CN 104597475A CN 201510035986 A CN201510035986 A CN 201510035986A CN 104597475 A CN104597475 A CN 104597475A
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Abstract
The invention provides a detector and a preparation method of the detector and an emission imaging device with the detector. The detector comprises a grid mold, a crystal layer and a solid photoconductive layer. The grid mold comprises multiple transverse walls, multiple longitudinal walls and a peripheral frame encircles the walls from side direction, wherein the transverse walls and the longitudinal walls are respectively arranged along the transverse direction and the longitudinal direction in an intersection mode so that multiple grid grooves which are arranged in a matrix mode are formed in the peripheral frame. The crystal layer comprises multiple scintillation crystals arranged in a matrix mode, wherein the multiple scintillation crystals and the multiple grid grooves are correspondingly fixed in the multiple grid grooves one by one, and the top surfaces of the multiple transverse walls and the multiple longitudinal walls are not lower than that of the crystal layer. The solid photoconductive layer is arranged on the top surface of the crystal layer and provided with a cutting groove, and the portions of the multiple transverse walls and the multiple longitudinal walls which are higher than the crystal layer are inserted into the cutting groove. The detector effectively controls the decoding errors of crystals and improves the resolution ratio of the image space of an emission imaging device.
Description
Technical field
The present invention relates to transmitting imaging system, particularly, relate to a kind of for detecting device launching imaging device and preparation method thereof, and relate to a kind of transmitting imaging device with this detecting device.
Background technology
Such as Positron emission tomography (Positron Emission Tomography, PET) and the transmitting imaging technique of single photon emission computed cross-sectional imaging (Single-Photon Emission Computed Tomography, SPECT) etc. be used to the fields such as medical diagnosis, pathological research, pharmaceutical research, drug development.
For Positron emission tomography, in its positron and human body of utilizing positron isotopes to decay to produce, negatron is die out the phenomenon of effect, by injecting the compound with positron isotopes mark in human body, adopt the method for complex probe, detecting device is utilized to detect the γ photon that effect produces of dieing out, obtain isotopic distributed intelligence in human body, carry out reconstruction combinatorial operation by computing machine, thus obtain the three-dimensional tomographic image of human body internal labeling compound distribution.
Launch multiple detecting devices that imaging device generally includes support frame and installs on the support frame.For Positron emission tomography equipment, detecting device mainly comprises three parts, as shown in Figure 1, i.e. and undermost crystal matrix 110, glass light conducting shell 120 and photomultiplier (PMT) matrix 130 be made up of discrete scintillation crystal.The grooving 121 of different depth is carved with, the matrix that grooving 121 is divided into the lower surface of glass light conducting shell 120 in glass light conducting shell 120, and crystal matrix 110 one_to_one corresponding of this matrix and discrete crystal composition.Reflectorized material is inserted in grooving 121.
The high-energy photon (γ photon) of 511 electron-volts that positron annihilation produces, a certain crystal bar inside in crystal matrix 110 reacts, and is converted into visible ray subgroup.Because five faces of scintillation crystal except end face are all covered by reflecting piece, visible ray subgroup can only be penetrated from the end face of scintillation crystal, and enters glass light guides layer 120.Visible ray subgroup from glass light conducting shell 120 out after, enter PMT matrix 130.By in PMT matrix 130, the size of the visible light signal that each PMT unit collects, with centroid algorithm (Anger Logic), can calculate the reaction which the scintillation crystal inside of high-energy photon in crystal matrix 110 occurs.This process is called that crystal is decoded.
In the detector design of tradition Positron emission tomography equipment, a ring of most critical is the setting of grooving 121 in glass light conducting shell 120.The method of the detecting device in existing making Positron emission tomography equipment is the grooving 121 glass light conducting shell 120 being carved into different depth.Space in the width General Requirements of grooving 121 and crystal matrix 110 between single discrete scintillation crystal is consistent.In order to improve the sensitivity of detecting device to the high-energy photon of 511 electron-volts, the smaller the better between discrete scintillation crystal.Therefore, the width of grooving is generally at 100 microns.In so narrow grooving, insert reflectorized material, technological requirement is higher.In addition, when mounted, the space in crystal matrix 110 between single scintillation crystal needs and grooving 121 close alignment in glass light conducting shell 120.
Consider above-mentioned factor, the difficulty of processing of detecting device is very large, and precision is difficult to control.The deficiency of processing and assembly precision, usually can cause enlarging markedly of crystal decode error, have a strong impact on the image quality of system.Therefore, in order to make up the deficiency of processing and assembly precision, common way is the crystal (length of side on such as xsect is at more than 4mm) using large-size.And the image spatial resolution of Positron emission tomography system, depend on the size of crystal to a great extent.The size of crystal is less, and the image spatial resolution of Positron emission tomography system is higher.
Therefore, be necessary that proposition is a kind of for detecting device launching imaging device and preparation method thereof and the transmitting imaging device with this detecting device, to solve problems of the prior art.
Summary of the invention
According to an aspect of the present invention, provide a kind of detecting device for launching imaging device, described detecting device comprises:
Grid mould, described grid mould comprises peripheral frame, multiple transverse wall and multiple longitudinal wall, described peripheral frame is from transverse wall multiple described in flanked and described multiple longitudinal wall, described multiple transverse wall and described multiple longitudinal wall difference transversely direction and longitudinal direction arranged crosswise, to form the multiple grid groove arranged in a matrix fashion in described peripheral frame, the side of described multiple transverse wall and described multiple longitudinal wall and the medial surface of described peripheral frame are all coated with reflection layer;
Crystal layer, described crystal layer comprises the multiple scintillation crystals arranged in a matrix fashion, described multiple scintillation crystal and described multiple grid groove are separately fixed in described multiple grid groove correspondingly, and the end face of described multiple transverse wall and described multiple longitudinal wall is not less than the end face of described crystal layer;
Solid light guide layer, described solid light guide layer is arranged on the end face of described crystal layer, and being provided with grooving in described solid light guide layer, the body fit higher than described crystal layer of described grooving and described multiple transverse wall and described multiple longitudinal wall, to make in grooving described in described partial insertion.
Preferably, described grooving has along the direction at the outer thoughtful center from described solid light guide layer the height reduced gradually.
Preferably, described multiple transverse wall is formed by multiple transverse slice respectively, and described multiple longitudinal wall is formed by multiple longitudinal thin slice respectively, wherein said multiple transverse slice and described multiple longitudinal thin slice are respectively arranged with the slot that can make their mutual grafting, and described multiple transverse slice and described multiple longitudinal thin slice are in described slot place plug arranged crosswise.
Preferably, the thickness of described peripheral frame is greater than the thickness of described multiple transverse wall and described multiple longitudinal wall.
Preferably, described peripheral frame also surrounds described solid light guide layer from side direction, and described peripheral frame extends beyond the end face of described solid light guide layer in the height direction, the part exceeding described solid light guide layer of described peripheral frame is for fixing the photosensor layer of described detecting device.
Preferably, the bottom surface of described crystal layer flushes with the bottom surface of described grid mould.
Preferably, the bottom surface of described crystal layer and described grid mould is coated with bottom, and the surface coverage towards described crystal layer of described bottom has reflection layer.
Preferably, described detecting device also comprises the photosensor layer on the end face being arranged on described solid light guide layer, and described photosensor layer comprises multiple optical sensor.
According to an aspect of the present invention, also provide a kind of and launch imaging device, described transmitting imaging device comprises any one detecting device as above.
According to an aspect of the present invention, also provide a kind of method for making of any one detecting device as above, described method comprises:
Described multiple scintillation crystal and described multiple grid groove are inserted in described multiple grid groove correspondingly respectively, so that described multiple scintillation crystal is fixed to described grid mould;
Injection optics glue in the described grooving of described solid light guide layer; And
By described multiple transverse wall and described multiple longitudinal wall higher than described crystal layer partial insertion described in solid light guide layer described grooving in.
According to an aspect of the present invention, also provide a kind of method for making of any one detecting device as above, described method comprises:
Injection optics glue in the described grooving of described solid light guide layer;
Described multiple transverse wall and described multiple longitudinal wall are inserted in described grooving respectively, and described peripheral frame are fixed on the periphery of described multiple transverse wall and described multiple longitudinal wall, to form described multiple grid groove; And
Described multiple scintillation crystal and described multiple grid groove are inserted in described multiple grid groove correspondingly respectively, so that described multiple scintillation crystal is fixed to described grid mould.
According to an aspect of the present invention, also provide a kind of method for making of any one detecting device as above, described method comprises:
Crystal block and solid light guide block are provided;
Described crystal block is fixed to described solid light guide block;
From the side of described crystal block, the described crystal block be fixed together and described solid light guide block are cut, to make described crystal block form the multiple scintillation crystals arranged in a matrix fashion, and in described solid light guide block, form described grooving to form described solid light guide layer;
Described multiple transverse wall and multiple longitudinal wall are inserted between described multiple scintillation crystal, and enter into described grooving; And
Described peripheral frame is fixed on the periphery of described multiple transverse wall and described multiple longitudinal wall.
Preferably, described method also comprise photosensor layer is fixed on described solid light guide layer end face on, wherein said photosensor layer comprises multiple optical sensor; And/or bottom being covered on the bottom surface of described crystal layer and described grid mould, the surface coverage towards described crystal layer of wherein said bottom has reflection layer.
As can be seen here, detecting device provided by the invention utilizes grid mould to connect crystal layer and solid light guide layer, and the gap between grooving with scintillation crystal can be made corresponding well; By forming reflection layer in the side of transverse wall and longitudinal wall and being inserted in grooving and can filling light reflecting material like a cork in the grooving of less width; Further, by controlling the thickness of transverse wall and longitudinal wall and forming thinner reflection layer on its lateral surface grooving can be made to have less width.Based on above-mentioned factor, the scintillation crystal that size is less can also be used, therefore can improve the image spatial resolution launching imaging device, effectively control crystal decode error, to reduce the impact produced the image quality of launching imaging device.
In summary of the invention, introduce the concept of a series of reduced form, this will further describe in embodiment part.Content part of the present invention does not also mean that the key feature and essential features that will attempt to limit technical scheme required for protection, does not more mean that the protection domain attempting to determine technical scheme required for protection.
Below in conjunction with accompanying drawing, describe advantages and features of the invention in detail.
Accompanying drawing explanation
Following accompanying drawing of the present invention in this as a part of the present invention for understanding the present invention.Shown in the drawings of embodiments of the present invention and description thereof, be used for explaining principle of the present invention.In the accompanying drawings,
Fig. 1 is the schematic diagram of the existing detecting device for Positron emission tomography equipment;
Fig. 2 A-2B is cut-open view according to the detecting device of an invention embodiment and vertical view;
Fig. 3 A is the front view of the grid mould according to an invention embodiment;
Fig. 3 B is the cut-open view according to the transversely cutting of the grid mould of an invention embodiment;
Fig. 3 C is the cut-open view of the grid mould longitudinally cutting according to an invention embodiment;
Fig. 4 A-4D is the schematic diagram of the grid mould according to an invention embodiment making;
Fig. 5 is the process flow diagram of the detecting device according to an invention preferred embodiment making;
Fig. 6 is the process flow diagram of the detecting device according to an invention preferred embodiment making; And
Fig. 7 is the process flow diagram of the detecting device according to an invention preferred embodiment making.
Embodiment
In the following description, a large amount of concrete details is given to provide more thorough understanding of the invention.But, it will be apparent to one skilled in the art that the present invention can be implemented without the need to these details one or more.In other example, in order to avoid obscuring with the present invention, technical characteristics more well known in the art are not described.
In order to thoroughly understand the present invention, by following description, detailed structure is proposed.Obviously, embodiments of the invention are not limited to the specific details that those skilled in the art has the knack of.Preferred embodiment of the present invention is described in detail as follows, but except these are described in detail, the present invention can also have other embodiments.
The invention provides a kind of detecting device for launching imaging device.As seen in figs. 2a-2b, this detecting device 200 comprises grid mould 210, crystal layer 220 and solid light guide layer 230.From the disposing way shown in Fig. 2 A, crystal layer 220 is positioned at the below of solid light guide layer 230.Grid mould 210 is connected respectively to crystal layer 220 and solid light guide layer 230.Respectively they will be described in detail below.
Fig. 3 A-3C shows the grid mould according to one embodiment of the present invention.As shown in figs. 3 a-3 c, this grid mould 210 comprises multiple transverse wall 211 and multiple longitudinal wall 212.Multiple transverse wall 211 extends along horizontal direction in parallel to each other.Multiple longitudinal wall 212 extends in parallel to each other in a longitudinal direction.This grid mould 210 also comprises peripheral frame 214.Peripheral frame 214 is from the multiple transverse wall of flanked 211 and multiple longitudinal wall 212.Multiple transverse wall 211 and multiple longitudinal wall 212 arranged crosswise mutually, defines the multiple grid groove 213 arranged in a matrix fashion in peripheral frame 214.This grid groove 213 is mainly used in fixed crystal layer 220.The side of multiple transverse wall 211 and multiple longitudinal wall 212 is all coated with reflection layer (not illustrating in the drawings).This reflection layer can spray, plated film (such as spraying or silver-plated film) or sticking reflecting material (such as ESR reflecting piece) are formed.The thickness of ESR (Enhanced Specular Reflector) reflecting piece can be made into 40 microns, such as 38 microns, to reduce the width of grooving in solid light guide layer 230.As high-efficient reflecting mirror, the reflectivity of ESR in whole visible spectrum all more than 98%, higher than the reflector plate of current other kinds.ESR itself is made up of macromolecule membrane layer, is the reflector plate material of environmental protection more.The medial surface of peripheral frame 214 is also coated with reflection layer.This reflection layer also can adopt spraying, plated film (such as spraying or silver-plated film) or sticking reflecting material (such as ESR reflecting piece) to be formed.In addition, TEFLON (Teflon) adhesive tape from E.I.Du Pont Company can also be adhered to form reflection layer on the medial surface of peripheral frame 214.
Return see Fig. 2 A-2B, crystal layer 220 comprises the multiple scintillation crystals 221 arranged in a matrix fashion.Multiple scintillation crystal 221 is separately fixed in multiple grid groove 213 correspondingly with multiple grid groove 213 (Fig. 3 A).The end face of multiple transverse wall 211 and multiple longitudinal wall 212 is not less than the end face of crystal layer 220, and namely multiple transverse wall 211 and multiple longitudinal wall 212 stretch out the end face of crystal layer 220 or flush with the end face of crystal layer 220.In the preferred embodiment shown in Fig. 2 A-2B, be positioned at middle transverse wall 211 and longitudinal wall 212 and crystal layer 220 contour.From centre to the periphery, transverse wall 211 and longitudinal wall 212 has the height increased gradually, especially see shown in Fig. 3 B-3C.As hereinafter described, the upper part of this transverse wall 211 and longitudinal wall 212 will be mainly used in being inserted in the grooving of solid light guide layer 230.Wall (comprising peripheral transverse wall 211 and longitudinal wall 212) the closer to periphery has higher height, mainly for making to avoid the decoded positions of the scintillation crystal at edge to mix.The height of each wall needs to be determined by repetition test usually.
Scintillation crystal 221 can be the one in active thallium sodium iodide crystal, bismuth-germanium-oxide crystal, lutecium silicate crystal, silicic acid lutetium-yttrium crystal.In a preferred embodiment, scintillation crystal 221 can be inserted into respectively in grid groove 213 that transverse wall 211 and longitudinal wall 212 be separated out, as seen in figs. 2a-2b.The size of grid groove 213 can equal or be slightly less than the size of scintillation crystal 221.During installation, first grid mould 210 can be heated to a little the size of size slightly larger than scintillation crystal 221 of grid groove 213, then by among the grid groove 213 of scintillation crystal 221 interpenetration network mould 210 one by one.Stop heating, scintillation crystal 221 can be fixed after grid mould 210 cooling meat.
Preferably, the bottom surface of crystal layer 220 flushes with the bottom surface of grid mould 210.Like this, the side of scintillation crystal 221 can surround by transverse wall 211 and longitudinal wall 212 completely, to wrap each scintillation crystal 221 with reflection layer in side direction.In addition, only enter into solid light guide layer 230 from the injection of the end face of scintillation crystal 210 to limit visible ray subgroup, preferably, the bottom surface of crystal layer 220 and grid mould 210 is coated with bottom 240.The surface coverage towards crystal layer 220 of bottom 204 has reflection layer.This reflection layer can adopt and be formed about one or more in the technique described by the reflection layer on the medial surface of peripheral frame 214 above.
Solid light guide layer 230 is arranged on the end face of crystal layer 210.Solid light guide layer 230 can be made up of the material of such as quartz or plexiglas.Preferably, on the wavelength that the visible ray subgroup that produces when γ photon is had an effect with scintillation crystal of solid light guide layer 230 is corresponding, (wavelength of photon group that such as, LYSO crystal produces is 420nm) light decay is lower.Preferably, solid light guide layer 230 has higher refractive index (such as about 1.5), when scintillation crystal (refractive index is higher, and the refractive index of LYSO crystal is 1.8) enters solid light guide layer, the energy loss caused such as, is totally reflected to reduce photon group.Grooving 231 is provided with in solid light guide layer 230.The body fit higher than crystal layer 220 of grooving 231 and multiple transverse wall 211 and multiple longitudinal wall 212, to make in this partial insertion grooving 231.Preferably, grooving 231 has along the direction at the outer thoughtful center from solid light guide layer 230 height reduced gradually, as mentioned above, mainly for making to avoid the decoded positions of the scintillation crystal at edge to mix.
The effect of fixing scintillation crystal 213 can be played in the bottom of grid mould 210, can also utilize the reflection layer be previously formed on sidewall in side direction, wrap up each scintillation crystal 213 simultaneously.And the upper part higher than crystal layer 220 of transverse wall 211 and longitudinal wall 212 can directly be inserted in the grooving 231 of solid light guide layer 230, so also in each grooving 231, define reflection layer.The reflection layer be contained in grooving 231 is mainly used to guide the distribution of visible ray subgroup in photosensor layer 250, to reach best crystal decoding effect.
As can be seen here, detecting device provided by the invention utilizes grid mould 210 to connect crystal layer 220 and solid light guide layer 230, and the gap between grooving 231 with scintillation crystal 221 can be made corresponding well; By forming reflection layer in the side of transverse wall 211 and longitudinal wall 212 and being inserted in grooving and can filling light reflecting material like a cork in the grooving of less width; Further, by controlling the thickness of transverse wall 211 and longitudinal wall 212 and forming thinner reflection layer on its lateral surface grooving can be made to have less width.Based on above-mentioned factor, the scintillation crystal that size is less can also be used, therefore can improve the image spatial resolution launching imaging device, effectively control crystal decode error, to reduce the impact produced the image quality of launching imaging device.
In addition, detecting device 200 provided by the invention also comprises the photosensor layer 250 on the end face being arranged on solid light guide layer 230.Photosensor layer 250 comprises multiple optical sensor 251.Four optical sensors 251 are comprised for photosensor layer 250 in figure.Exemplarily, optical sensor 251 can be photomultiplier (PMT).Photosensor layer 250 can adopt that existed in prior art or that future may occur any structure, will not describe in further detail herein to it.
In a preferred embodiment, as seen in figs. 2a-2b, peripheral frame 214 not only surrounds transverse wall and longitudinal wall, and it also surrounds solid light guide layer 230 from side direction, therefore, it is possible to fixing and protection solid light guide layer 230.Further, utilize the reflection layer on the madial wall of peripheral frame 214 to surround solid light guide layer 230, also save the step of surrounding light reflecting material in the periphery of solid light guide layer 230.Further, peripheral frame 214 extends beyond the end face of solid light guide layer 230 in the height direction.The part exceeding solid light guide layer 230 of peripheral frame 214 is for the photosensor layer 250 of fixed detector 200.Such as, photosensor layer 250 directly can be held in the top of peripheral frame 214.Utilize peripheral frame 214 to connect crystal layer 220, solid light guide layer 230 and photosensor layer 250 can make the structure of detecting device 200 compacter, reduce production cost greatly can simplify manufacture craft.
Preferably, the thickness of peripheral frame 214 is greater than the thickness of multiple transverse wall 211 and multiple longitudinal wall 212.Be appreciated that the notch width in the thickness of transverse wall 211 and longitudinal wall 212 and solid light guide layer 230 has direct relation, therefore thinlyyer to a certain extent unreasonablely think.And peripheral frame 214 mainly plays the effect connecting and support, therefore its thickness can be bigger, and such as its thickness can be 1-5mm.
Transverse wall 211 and longitudinal wall 212 can be formed by any-mode, and transverse wall 211 and longitudinal wall 212 can be single or multiple lift structures.Each transverse wall 211 and each longitudinal wall 212 can be spliced to form by multiple discrete sheet, and like this, multiple are interconnected to be separated to form multiple grid groove.Certainly, each transverse wall 211 and each longitudinal wall 212 also can be the component of full wafer.With reference to Fig. 4 A-4D, provide a kind of mode adopting full wafer structure manufacture transverse wall 211 and longitudinal wall 212.
As shown in figs. 4 a-4b, first provide thin slice 211 ', this thin slice 211 ' can be super thin metal sheet, ultra-thin PVC sheet etc., can be generally 50-120 micron.Then, slot 215a is set at the correct position place of the such as bottom of thin slice 211 ', to form transverse wall 211.Similarly, each longitudinal wall also can for the longitudinal thin slice adopting said method to make, and difference is that the slot 215b (see Fig. 4 C) on longitudinal wall 212 is oppositely arranged with slot 215a, such as, be arranged on the top of longitudinal wall 212.Exemplarily, the various known technologies comprising 3D printing technique can also be adopted to carry out the transverse wall 211 shown in construction drawing 4B and there is longitudinal wall 212 (see Fig. 4 C) of similar structures.
As shown in Figure 4 C, slot 215a and 215b on transverse wall 211 and longitudinal wall 212 can make transverse wall 211 and longitudinal wall 212 grafting mutually, and multiple like this transverse wall 211 and multiple longitudinal wall 212 are respectively in corresponding slot place grafting.Then, as shown in Figure 4 D, the multiple transverse walls 211 after grafting and multiple longitudinal wall 212 are fixed in peripheral frame 214, to form grid groove.
It should be noted that, transverse wall 211 illustrated in Fig. 4 A-4D and longitudinal wall 212, only for illustration of the principle of the preferred embodiment, are not intended to the quantity of transverse wall 211 and longitudinal wall 212 to be limited to illustrated embodiment herein.In fact, the transverse wall 211 be finally plugged in together and longitudinal wall 212 correspond to the grooving in existing glass light conducting shell, the grid groove be separated to form can respectively with scintillation crystal one_to_one corresponding, namely length and the width of grid groove are respectively corresponding with the length of scintillation crystal and width (size of such as grid groove is equal or be slightly less than the size of scintillation crystal), therefore, transverse wall 211 and longitudinal wall 212 quantity will according to reality should be used for determine.In addition, might not carrying out continuously with reference to the number of assembling steps described by Fig. 4 A-4D, when making detecting device, between these steps, the step relevant with the miscellaneous part assembling detecting device may be inserted.Hereinafter the method for multiple making detecting device provided by the invention will be described in conjunction with multiple embodiment.
Further, the present invention also provides a kind of and launches imaging device, and this transmitting imaging device comprises any one detecting device as above.
According to an aspect of the present invention, a kind of method making any one detecting device as above is provided.The method comprises the following steps, with reference to Fig. 5:
First, perform step 501, multiple scintillation crystal and multiple grid groove are inserted in multiple grid groove, correspondingly respectively so that multiple scintillation crystal is fixed to grid mould.Exemplarily, grid mould can be adopt the embodiment introduced with reference to Fig. 4 A-4D to make.Certainly, NM but obvious other modes within the scope of the present invention can also be adopted herein to make.Scintillation crystal can adopt optical glue to be fixed in grid groove.Scintillation crystal also can method be fixed in grid groove as mentioned above, size by grid groove makes match with the size of scintillation crystal or be slightly less than the size of scintillation crystal, then make the size expansion of grid groove to inserting scintillation crystal by heating, finally cooling makes grid groove contraction fix scintillation crystal.
Then, step 502 is performed, injection optics glue in the grooving of solid light guide layer.Grooving in solid light guide layer can be adopt existing any one method that is known or that may occur future to be formed.Preferably, the width design of grooving must slightly larger than the thickness of transverse wall and longitudinal wall.Preferably, the depth design of grooving must slightly larger than the height exceeding the part of the end face of crystal layer of transverse wall and longitudinal wall.These balance of grooving are for holding the optical glue after solidifying.
Then, perform step 503, by the grooving of the partial insertion solid light guide layer higher than crystal layer of multiple transverse wall and multiple longitudinal wall.Compress the bubble got rid of wherein, wait for that the glue solidifies.
In addition, above-mentioned method for making also comprises step 504, such as, photosensor layer be fixed on the end face of solid light guide layer by optical glue.Preferably, this step can perform afterwards at the part insertion grooving of transverse wall and longitudinal wall.Certainly, this step also can on end face solid light guide layer being fixed to crystal layer before carry out.Further, this method for making also comprises and such as covers on the bottom surface of crystal layer and grid mould by optical glue by bottom, and wherein the surface coverage towards crystal layer of bottom has reflection layer.
According to another aspect of the present invention, a kind of method making any one detecting device as above is also provided.The method comprises the following steps, with reference to Fig. 6:
First, step 601 is performed, injection optics glue in the grooving of solid light guide layer.
Then, perform step 602, multiple transverse wall and multiple longitudinal wall are inserted in grooving respectively, and peripheral frame are fixed on the periphery of multiple transverse wall and multiple longitudinal wall.The part exposing grooving of multiple transverse wall and multiple longitudinal wall with peripheral frame together form multiple grid groove.
Then, perform step 603, multiple scintillation crystal and multiple grid groove are inserted in multiple grid groove, correspondingly respectively so that multiple scintillation crystal is fixed to grid mould.Scintillation crystal can adopt any one mode as above to be fixed in grid groove.
In addition, above-mentioned method for making also comprises step 604, such as, photosensor layer be fixed on the end face of solid light guide layer by optical glue.Preferably, this step can be fixed to performing afterwards in grid groove at scintillation crystal.Certainly, this step also can be carried out before being fixed in grid groove by scintillation crystal.Further, this method for making also comprises and such as covers on the bottom surface of crystal layer and grid mould by optical glue by bottom, and wherein the surface coverage towards crystal layer of bottom has reflection layer.
According to a further aspect of the invention, a kind of method making any one detecting device as above is also provided.The method comprises the following steps, with reference to Fig. 7:
First, perform step 701, crystal block and solid light guide block are provided.Crystal block and solid light guide block are used for forming crystal layer and solid light guide layer through the cutting of subsequent step, therefore the size of crystal block and solid light guide block preferably with match for the formation of the crystal layer of a detecting device and the size of solid light guide layer.
Then, perform step 702, crystal block is fixed to solid light guide block.Exemplarily, crystal block can adopt optical glue to be fixed on fixed light guide block.
Then, perform step 703, from the side of crystal block, the crystal block be fixed together and solid light guide block are cut, to make crystal block form the multiple scintillation crystals arranged in a matrix fashion, and in solid light guide block, form grooving to form solid light guide layer.The degree of depth being appreciated that the cutting groove formed in crystal block and solid light guide block is preferably slightly larger than the height of transverse wall and longitudinal wall.Preferably, the width of cutting groove is slightly larger than the thickness of transverse wall and longitudinal wall.These balance of cutting groove may be used for holding the optical glue after solidifying.Certainly, when not using optical glue, the thickness of the width of cutting groove and the degree of depth and transverse wall and longitudinal wall and highly suitable.
Then, perform step 704, multiple transverse wall and multiple longitudinal wall are inserted between multiple scintillation crystal, and enter into grooving.Before transverse wall and longitudinal wall are inserted in cutting groove, can in cutting groove injection optics glue.Certainly, also can not use optical glue, only rely on the cooperation in size to fix transverse wall and longitudinal wall.
Then, perform step 705, peripheral frame is fixed on the periphery of multiple transverse wall and multiple longitudinal wall.
In addition, above-mentioned method for making also comprises step 706, such as, photosensor layer be fixed on the end face of solid light guide layer by optical glue.In addition, also before sliced crystal block and solid light guide block, photosensor layer can be fixed on the face relative with crystal block of fixed light guide block.Even can with regard to first fixed light sensor layer before crystal block is fixed to fixed light guide block.Further, this method for making also comprises and such as covers on the bottom surface of crystal layer and grid mould by optical glue by bottom, and wherein the surface coverage towards crystal layer of bottom has reflection layer.
The present invention is illustrated by above-described embodiment, but should be understood that, above-described embodiment just for the object of illustrating and illustrate, and is not intended to the present invention to be limited in described scope of embodiments.In addition it will be appreciated by persons skilled in the art that the present invention is not limited to above-described embodiment, more kinds of variants and modifications can also be made according to instruction of the present invention, within these variants and modifications all drop on the present invention's scope required for protection.Protection scope of the present invention defined by the appended claims and equivalent scope thereof.
Claims (13)
1., for launching a detecting device for imaging device, described detecting device comprises:
Grid mould, described grid mould comprises peripheral frame, multiple transverse wall and multiple longitudinal wall, described peripheral frame is from transverse wall multiple described in flanked and described multiple longitudinal wall, described multiple transverse wall and described multiple longitudinal wall difference transversely direction and longitudinal direction arranged crosswise, to form the multiple grid groove arranged in a matrix fashion in described peripheral frame, the side of described multiple transverse wall and described multiple longitudinal wall and the medial surface of described peripheral frame are all coated with reflection layer;
Crystal layer, described crystal layer comprises the multiple scintillation crystals arranged in a matrix fashion, described multiple scintillation crystal and described multiple grid groove are separately fixed in described multiple grid groove correspondingly, and the end face of described multiple transverse wall and described multiple longitudinal wall is not less than the end face of described crystal layer;
Solid light guide layer, described solid light guide layer is arranged on the end face of described crystal layer, and being provided with grooving in described solid light guide layer, the body fit higher than described crystal layer of described grooving and described multiple transverse wall and described multiple longitudinal wall, to make in grooving described in described partial insertion.
2. detecting device as claimed in claim 1, it is characterized in that, described grooving has along the direction at the outer thoughtful center from described solid light guide layer the height reduced gradually.
3. detecting device as claimed in claim 1, it is characterized in that, described multiple transverse wall is formed by multiple transverse slice respectively, and described multiple longitudinal wall is formed by multiple longitudinal thin slice respectively,
Wherein said multiple transverse slice and described multiple longitudinal thin slice are respectively arranged with the slot that can make their mutual grafting, and described multiple transverse slice and described multiple longitudinal thin slice are in described slot place plug arranged crosswise.
4. detecting device as claimed in claim 1, it is characterized in that, the thickness of described peripheral frame is greater than the thickness of described multiple transverse wall and described multiple longitudinal wall.
5. detecting device as claimed in claim 1, it is characterized in that, described peripheral frame also surrounds described solid light guide layer from side direction, and described peripheral frame extends beyond the end face of described solid light guide layer in the height direction, the part exceeding described solid light guide layer of described peripheral frame is for fixing the photosensor layer of described detecting device.
6. detecting device as claimed in claim 1, it is characterized in that, the bottom surface of described crystal layer flushes with the bottom surface of described grid mould.
7. detecting device as claimed in claim 1, it is characterized in that, the bottom surface of described crystal layer and described grid mould is coated with bottom, and the surface coverage towards described crystal layer of described bottom has reflection layer.
8. detecting device as claimed in claim 1, it is characterized in that, described detecting device also comprises the photosensor layer on the end face being arranged on described solid light guide layer, and described photosensor layer comprises multiple optical sensor.
9. a transmitting imaging device, is characterized in that, described transmitting imaging device comprises as the detecting device in claim 1-8 as described in any one.
10., as a method for making for the detecting device in claim 1-6 as described in any one, described method comprises:
Described multiple scintillation crystal and described multiple grid groove are inserted in described multiple grid groove correspondingly respectively, so that described multiple scintillation crystal is fixed to described grid mould;
Injection optics glue in the described grooving of described solid light guide layer; And
By described multiple transverse wall and described multiple longitudinal wall higher than described crystal layer partial insertion described in solid light guide layer described grooving in.
11. 1 kinds of method for makings as the detecting device in claim 1-6 as described in any one, described method comprises:
Injection optics glue in the described grooving of described solid light guide layer;
Described multiple transverse wall and described multiple longitudinal wall are inserted in described grooving respectively, and described peripheral frame are fixed on the periphery of described multiple transverse wall and described multiple longitudinal wall, to form described multiple grid groove; And
Described multiple scintillation crystal and described multiple grid groove are inserted in described multiple grid groove correspondingly respectively, so that described multiple scintillation crystal is fixed to described grid mould.
12. 1 kinds of method for makings as the detecting device in claim 1-6 as described in any one, described method comprises:
Crystal block and solid light guide block are provided;
Described crystal block is fixed to described solid light guide block;
From the side of described crystal block, the described crystal block be fixed together and described solid light guide block are cut, to make described crystal block form the multiple scintillation crystals arranged in a matrix fashion, and in described solid light guide block, form described grooving to form described solid light guide layer;
Described multiple transverse wall and multiple longitudinal wall are inserted between described multiple scintillation crystal, and enter into described grooving; And
Described peripheral frame is fixed on the periphery of described multiple transverse wall and described multiple longitudinal wall.
13. methods according to any one of claim 10-12, is characterized in that, described method also comprise photosensor layer is fixed on described solid light guide layer end face on, wherein said photosensor layer comprises multiple optical sensor; And/or bottom being covered on the bottom surface of described crystal layer and described grid mould, the surface coverage towards described crystal layer of wherein said bottom has reflection layer.
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