CN104597475B - Detector and preparation method thereof and the transmitting imaging device with the detector - Google Patents
Detector and preparation method thereof and the transmitting imaging device with the detector Download PDFInfo
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- CN104597475B CN104597475B CN201510035986.0A CN201510035986A CN104597475B CN 104597475 B CN104597475 B CN 104597475B CN 201510035986 A CN201510035986 A CN 201510035986A CN 104597475 B CN104597475 B CN 104597475B
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Abstract
The present invention provides a kind of detector and preparation method thereof and the transmitting imaging device with the detector.The detector includes：Grid mould, including multiple transverse walls and multiple longitudinal walls and from their peripheral frame of flanked, transverse wall and longitudinal wall respectively in transverse direction with longitudinal direction arranged crosswise, to be formed in peripheral frame with multiple grid grooves of matrix arrangement；Crystal layer, including the multiple scintillation crystals arranged in a matrix fashion, multiple scintillation crystals are separately fixed in multiple grid grooves correspondingly with multiple grid grooves, and multiple transverse walls and the top surface of multiple longitudinal walls are not less than the top surface of crystal layer；Solid light guide layer, it is arranged on the top surface of crystal layer and is provided with grooving, in the partial insertion grooving higher than crystal layer of multiple transverse walls and multiple longitudinal walls.Crystal solution code error is efficiently controlled, improves the image spatial resolution of transmitting imaging device.
Description
Technical field
The present invention relates to transmitting imaging system, in particular it relates to a kind of detector and its system for being used to launch imaging device
Make method, and further relate to a kind of transmitting imaging device with the detector.
Background technology
Such as Positron emission tomography (Positron Emission Tomography, PET) and single photon emission calculate
The transmitting imaging technique of machine cross-sectional imaging (Single-Photon Emission Computed Tomography, SPECT) etc.
Have been used for the fields such as medical diagnosis, pathological research, pharmaceutical research, drug development.
By taking Positron emission tomography as an example, it utilizes negative electricity in positron isotopes the decay positive electron and human body that produce
The phenomenon of the sub effect that dies out, by carrying the compound of positron isotopes mark to people's internal injection, using compound spy
The method of survey, γ photons caused by effect of dieing out are detected using detector, the distributed intelligence of isotope into the human body are obtained, by counting
Calculation machine carries out reconstruction combinatorial operation, so as to obtain the three-dimensional tomographic image of human body internal labeling compound distribution.
Transmitting imaging device generally includes the multiple detectors of support frame and installation on the support frame.Sent out with positive electron
Penetrate exemplified by imaging device, detector mainly includes three parts, is made up of as shown in figure 1, i.e. undermost discrete scintillation crystal
Crystal matrix 110, glass light conducting shell 120 and photomultiplier (PMT) matrix 130.Different depth is carved with glass light conducting shell 120
Grooving 121, the matrix that grooving 121 is divided into the lower surface of glass light conducting shell 120, and the matrix and discrete crystal composition
Crystal matrix 110 corresponds.Reflectorized material is inserted in grooving 121.
511 electron-volts of high-energy photon (γ photons), a certain crystalline substance in crystal matrix 110 caused by positron annihilation
Reacted inside body bar, be converted into visible ray subgroup.Because five faces of the scintillation crystal in addition to top surface are all covered by reflecting piece,
Visible ray subgroup can only be projected from the top surface of scintillation crystal, and enter glass light guides layer 120.Visible ray subgroup is from glass light conducting shell
After 120 come out, into PMT matrixes 130.By in PMT matrixes 130, the size for the visible light signal that each PMT units collect,
With centroid algorithm (Anger Logic), high-energy photon can be calculated inside which of crystal matrix 110 scintillation crystal
The reaction of generation.This process is referred to as crystal decoding.
In the detector design of traditional Positron emission tomography equipment, a ring of most critical is cut in glass light conducting shell 120
The setting of groove 121.The existing method for making the detector in Positron emission tomography equipment is that glass light conducting shell 120 is carved into
The grooving 121 of different depth.In the width of grooving 121 typically requirement and crystal matrix 110 between single discrete scintillation crystal
Space it is consistent.In order to improve sensitivity of the detector to 511 electron-volts of high-energy photon, got between discrete scintillation crystal
It is small better.Therefore, the width of grooving is typically in 100 microns.Reflectorized material is inserted in so narrow grooving, technique will
Ask higher.In addition, when mounted, in the space needs and glass light conducting shell 120 in crystal matrix 110 between single scintillation crystal
The close alignment of grooving 121.
In view of above-mentioned factor, the difficulty of processing of detector is very big, and precision is difficult control.Processing and assembly precision are not
Foot, it will usually cause significantly increasing for crystal solution code error, have a strong impact on the image quality of system.Therefore, processed to make up
With the deficiency of assembly precision, it is common practice to use the crystal (such as the length of side on cross section is in more than 4mm) of large-size.
And the image spatial resolution of Positron emission tomography system, it is heavily dependent on the size of crystal.The size of crystal is got over
Small, the image spatial resolution of Positron emission tomography system is higher.
Therefore, it is necessary to propose a kind of for launching detector of imaging device and preparation method thereof and there is the inspection
The transmitting imaging device of device is surveyed, to solve problems of the prior art.
The content of the invention
According to an aspect of the present invention, there is provided a kind of detector for being used to launch imaging device, the detector include：
Grid mould, the grid mould include peripheral frame, multiple transverse walls and multiple longitudinal walls, the peripheral frame
From the multiple transverse wall of flanked and the multiple longitudinal wall, the multiple transverse wall and the multiple longitudinal wall edge respectively
Horizontal direction and longitudinal direction arranged crosswise, to form the multiple grid grooves arranged in a matrix fashion in the peripheral frame,
Light reflection is all covered with the medial surface of the side and the peripheral frame of the multiple transverse wall and the multiple longitudinal wall
Layer；
Crystal layer, the crystal layer include multiple scintillation crystals for arranging in a matrix fashion, the multiple scintillation crystal with
The multiple grid groove is separately fixed in the multiple grid groove correspondingly, and the multiple transverse wall and the multiple
The top surface of longitudinal wall is not less than the top surface of the crystal layer；
Solid light guide layer, the solid light guide layer are arranged on the top surface of the crystal layer, and in the solid light guide layer
Grooving is provided with, the grooving and the part higher than the crystal layer of the multiple transverse wall and the multiple longitudinal wall are mutually fitted
Match somebody with somebody, so that in grooving described in the partial insertion.
Preferably, the height that the grooving is gradually reduced along having from the direction at the outer thoughtful center of the solid light guide layer
Degree.
Preferably, the multiple transverse wall is formed by multiple transverse slices respectively, and the multiple longitudinal wall is respectively by more
Individual longitudinal thin slice is formed, wherein their phases can be made by being respectively arranged with the multiple transverse slice and the multiple longitudinal thin slice
The slot of mutual grafting, the multiple transverse slice and the multiple longitudinal thin slice the plug arranged crosswise at the slot.
Preferably, the thickness of the peripheral frame is more than the multiple transverse wall and the thickness of the multiple longitudinal wall.
Preferably, the peripheral frame also from surrounding the solid light guide layer on the side, and the peripheral frame is in height
Side extends upwardly beyond the top surface of the solid light guide layer, and the part more than the solid light guide layer of the peripheral frame is used for
The photosensor layer of the fixed detector.
Preferably, the bottom surface of the crystal layer flushes with the bottom surface of the grid mould.
Preferably, the bottom surface of the crystal layer and the grid mould is covered with bottom, the bottom towards the crystalline substance
The surface of body layer is covered with reflection layer.
Preferably, the detector also includes the photosensor layer being arranged on the top surface of the solid light guide layer, described
Photosensor layer includes multiple optical sensors.
According to an aspect of the present invention, a kind of transmitting imaging device is also provided, the transmitting imaging device is included as above
Described any detector.
According to an aspect of the present invention, a kind of preparation method of any detector as described above is also provided, it is described
Method includes：
The multiple scintillation crystal and the multiple grid groove are respectively inserted into the multiple grid groove correspondingly
In, the multiple scintillation crystal is fixed to the grid mould；
The injection optics glue in the grooving of the solid light guide layer；And
By solid light described in the multiple transverse wall and the partial insertion higher than the crystal layer of the multiple longitudinal wall
In the grooving of conducting shell.
According to an aspect of the present invention, a kind of preparation method of any detector as described above is also provided, it is described
Method includes：
The injection optics glue in the grooving of the solid light guide layer；
The multiple transverse wall and the multiple longitudinal wall are respectively inserted into the grooving, and by the peripheral frame
The periphery of the multiple transverse wall and the multiple longitudinal wall is fixed on, to form the multiple grid groove；And
The multiple scintillation crystal and the multiple grid groove are respectively inserted into the multiple grid groove correspondingly
In, the multiple scintillation crystal is fixed to the grid mould.
According to an aspect of the present invention, a kind of preparation method of any detector as described above is also provided, it is described
Method includes：
Crystal block and solid light guide block are provided；
The crystal block is fixed to the solid light guide block；
The crystal block being fixed together and the solid light guide block are cut from the side of the crystal block, with
The crystal block is formed the multiple scintillation crystals arranged in a matrix fashion, and the grooving is formed in the solid light guide block
To form the solid light guide layer；
Between the multiple transverse wall and multiple longitudinal walls are inserted into the multiple scintillation crystal, and enter described cut
In groove；And
The peripheral frame is fixed on to the periphery of the multiple transverse wall and the multiple longitudinal wall.
Preferably, methods described also includes being fixed on photosensor layer on the top surface of the solid light guide layer, wherein institute
Stating photosensor layer includes multiple optical sensors；And/or bottom is covered in the bottom surface of the crystal layer and the grid mould
On, wherein the surface towards the crystal layer of the bottom is covered with reflection layer.
As can be seen here, detector provided by the invention connects crystal layer and solid light guide layer using grid mould, can
Make the gap between grooving and scintillation crystal corresponding well；By forming reflection layer simultaneously in the side of transverse wall and longitudinal wall
Be inserted into grooving easily can fill light reflecting material in the grooving of smaller width；Also, by control transverse wall and
The thickness of longitudinal wall and forming relatively thin reflection layer on its lateral surface can make grooving have lesser width.Based on above-mentioned
Factor, the less scintillation crystal of size can also be used, therefore the image spatial resolution of transmitting imaging device can be improved, had
Effect ground control crystal solution code error, to reduce on influence caused by the image quality for launching imaging device.
A series of concept of reduced forms is introduced in the content of the invention, this will be in specific embodiment part further
Describe in detail.Present invention part be not meant to attempt the key feature for limiting technical scheme claimed and
Essential features, the protection domain for attempting to determine technical scheme claimed is not meant that more.
Below in conjunction with accompanying drawing, advantages and features of the invention are described in detail.
Brief description of the drawings
The drawings below of the present invention is used to understand the present invention in this as the part of the present invention.Shown in the drawings of this hair
Bright embodiment and its description, for explaining the principle of the present invention.In the accompanying drawings,
Fig. 1 is the schematic diagram of the existing detector for Positron emission tomography equipment；
Fig. 2A -2B are the sectional view and top view according to the detector of invention one embodiment；
Fig. 3 A are the front view according to the grid mould of invention one embodiment；
Fig. 3 B are the sectional view according to the transversely cutting of the grid mould of invention one embodiment；
Fig. 3 C are according to sectional view of the grid mould of invention one embodiment along longitudinally cutting；
Fig. 4 A-4D are the schematic diagram of the grid mould made according to invention one embodiment；
Fig. 5 is the flow chart of the detector made according to one preferred embodiment of invention；
Fig. 6 is the flow chart of the detector made according to one preferred embodiment of invention；And
Fig. 7 is the flow chart of the detector made according to one preferred embodiment of invention.
Embodiment
In the following description, a large amount of concrete details are given to provide more thorough understanding of the invention.So
And it will be apparent to one skilled in the art that the present invention can be able to without one or more of these details
Implement.In other examples, in order to avoid obscuring with the present invention, do not enter for some technical characteristics well known in the art
Row description.
In order to thoroughly understand the present invention, detailed structure will be proposed in following description.Obviously, embodiments of the invention
It is not limited to the specific details that those skilled in the art is familiar with.Presently preferred embodiments of the present invention is described in detail as follows, so
And in addition to these detailed descriptions, the present invention can also have other embodiment.
The present invention provides a kind of detector for being used to launch imaging device.As seen in figs. 2a-2b, the detector 200 includes
Grid mould 210, crystal layer 220 and solid light guide layer 230.From the point of view of the disposing way shown in Fig. 2A, crystal layer 220 is positioned at solid
The lower section of body photoconductive layer 230.Grid mould 210 is connected respectively to crystal layer 220 and solid light guide layer 230.Below will be right respectively
They are described in detail.
Fig. 3 A-3C show the grid mould according to one embodiment of the present invention.As shown in figs. 3 a-3 c, the grid mould
Tool 210 includes multiple transverse walls 211 and multiple longitudinal walls 212.Multiple transverse walls 211 prolong along horizontal direction in parallel to each other
Stretch.Multiple longitudinal walls 212 extend in a longitudinal direction in parallel to each other.The grid mould 210 also includes peripheral frame 214.Outside
Peripheral frame frame 214 is from the multiple transverse walls 211 of flanked and multiple longitudinal walls 212.Multiple transverse walls 211 and multiple longitudinal walls 212
Intersected arrangement, and the multiple grid grooves 213 arranged in a matrix fashion are formd in peripheral frame 214.The grid groove 213 is led
It is used to fix crystal layer 220.The side of multiple transverse walls 211 and multiple longitudinal walls 212 is all covered with reflection layer and (not schemed
In show).The reflection layer can be spraying, plated film (such as spraying or plating silverskin) or paste reflectorized material (such as ESR be reflective
Piece) formed.The thickness of ESR (Enhanced Specular Reflector) reflecting piece can be fabricated to 40 microns, example
Such as 38 microns, to reduce the width of grooving in solid light guide layer 230.As high-efficient reflecting mirror, ESR is in whole visible light
In the range of reflectivity all more than 98%, higher than current other kinds of reflector plate.ESR is in itself by macromolecule membrane layer group
Into being more green reflector plate material.Reflection layer is again covered with the medial surface of peripheral frame 214.The light reflects
Layer can also be formed using spraying, plated film (such as spraying or plating silverskin) or stickup reflectorized material (such as ESR reflecting pieces).This
Outside, TEFLON (Teflon) adhesive tapes from E.I.Du Pont Company can also be adhered on the medial surface of peripheral frame 214 to form light
Reflecting layer.
Referring back to Fig. 2A -2B, crystal layer 220 includes the multiple scintillation crystals 221 arranged in a matrix fashion.Multiple flickers
Crystal 221 is separately fixed in multiple grid grooves 213 correspondingly with multiple grid grooves 213 (Fig. 3 A).Multiple transverse walls 211
It is not less than the top surface of crystal layer 220 with the top surface of multiple longitudinal walls 212, i.e., multiple transverse walls 211 and multiple longitudinal walls 212 are stretched out
The top surface of crystal layer 220 flushes with the top surface of crystal layer 220.In the preferred embodiment shown in Fig. 2A -2B, positioned at centre
Transverse wall 211 and longitudinal wall 212 and crystal layer 220 are contour.From it is middle to the periphery, transverse wall 211 and longitudinal wall 212 have by
Cumulative big height, referring particularly to shown in Fig. 3 B-3C.As hereinafter will described in, the transverse wall 211 and longitudinal wall 212 it is upper
Portion part is mainly used in being inserted into the grooving of solid light guide layer 230.Wall closer to periphery (includes the transverse wall 211 of periphery
With longitudinal wall 212) there is higher height, mainly for the decoded positions for the scintillation crystal for making to avoid edge mix.Respectively
The height of individual wall usually requires to determine by repetition test.
Scintillation crystal 221 can be active thallium sodium iodide crystal, bismuth-germanium-oxide crystal, lutecium silicate crystal, silicic acid lutetium-yttrium crystal
In one kind.In a preferred embodiment, scintillation crystal 221 can be inserted into transverse wall 211 respectively and longitudinal wall 212 is separated out
Grid groove 213 in, as seen in figs. 2a-2b.The size of grid groove 213 can be equal to or slightly less than the chi of scintillation crystal 221
It is very little.During installation, grid mould 210 can be first slightly moderately heated to chi of the size slightly larger than scintillation crystal 221 of grid groove 213
It is very little, then by among the scintillation crystal 221 one by one grid groove 213 of interpenetration network mould 210.Stop heating, treat grid mould
Scintillation crystal 221 can be fixed after 210 cooling meats.
Preferably, the bottom surface of crystal layer 220 flushes with the bottom surface of grid mould 210.So, transverse wall 211 and longitudinal wall
212 can surround the side of scintillation crystal 221 completely, to wrap each scintillation crystal 221 with reflection layer on the side.
In addition, only entered to limit visible ray subgroup from the top surface injection of scintillation crystal 210 in solid light guide layer 230, it is preferable that
The bottom surface of crystal layer 220 and grid mould 210 is covered with bottom 240.The surface towards crystal layer 220 of bottom 204 covered with
Reflection layer.The reflection layer can use the work described by above for the reflection layer on the medial surface of peripheral frame 214
One or more formation in skill.
Solid light guide layer 230 is arranged on the top surface of crystal layer 210.Solid light guide layer 230 can be by such as quartz or tree
The material of fat glass is made.Preferably, solid light guide layer 230 is had an effect caused visible ray in γ photons and scintillation crystal
(for example, the wavelength of photon group caused by LYSO crystal is 420nm) light decay is relatively low on wavelength corresponding to subgroup.Preferably, solid
Photoconductive layer 230 has higher refractive index (such as 1.5 or so), with reduce photon group from scintillation crystal (refractive index is higher, such as
Energy loss caused by total reflection when the refractive index of LYSO crystal is enters solid light guide layer 1.8).Set in solid light guide layer 230
It is equipped with grooving 231.Grooving 231 and multiple transverse walls 211 and the body fit higher than crystal layer 220 of multiple longitudinal walls 212,
So that in the partial insertion grooving 231.Preferably, direction of the grooving 231 along the outer thoughtful center from solid light guide layer 230 has
There is the height being gradually reduced, as mentioned above, mainly for the decoded positions for the scintillation crystal for making to avoid edge are mixed in one
Rise.
The bottom of grid mould 210 can play a part of fixed scintillation crystal 213, while can also utilize and be previously formed in
Reflection layer in side wall wraps up each scintillation crystal 213 on the side.And transverse wall 211 and longitudinal wall 212 are higher than crystal
The upper part of layer 220 is directly inserted into the grooving 231 of solid light guide layer 230, so the also shape in each grooving 231
Into reflection layer.The reflection layer being contained in grooving 231 is mainly used to guide visible ray subgroup in photosensor layer 250
Distribution, to reach optimal crystal decoding effect.
As can be seen here, detector provided by the invention connects crystal layer 220 and solid light guide layer using grid mould 210
230, the gap between grooving 231 and scintillation crystal 221 can be made corresponding well；By in transverse wall 211 and longitudinal wall 212
Side formed and reflection layer and be inserted into grooving and easily can fill light reflecting material in the grooving of smaller width；And
And it can make to cut by controlling the thickness of transverse wall 211 and longitudinal wall 212 and forming relatively thin reflection layer on its lateral surface
Groove has lesser width.Based on above-mentioned factor, the less scintillation crystal of size can also be used, thus can improve transmitting into
As the image spatial resolution of equipment, crystal solution code error is efficiently controlled, to reduce the image quality to launching imaging device
Caused influence.
In addition, detector 200 provided by the invention also includes the optical sensor being arranged on the top surface of solid light guide layer 230
Layer 250.Photosensor layer 250 includes multiple optical sensors 251.Four optical sensors 251 are included with photosensor layer 250 in figure
Exemplified by.As an example, optical sensor 251 can be photomultiplier (PMT).Photosensor layer 250 can use prior art
In the existing or following any construction being likely to occur, it will not be described in further detail herein.
In a preferred embodiment, as seen in figs. 2a-2b, peripheral frame 214 not only surrounds transverse wall and longitudinal wall, it
Also from encirclement solid light guide layer 230, therefore can fix and protect solid light guide layer 230 on the side.Also, utilize peripheral frame
Reflection layer on 214 madial wall surrounds solid light guide layer 230, also saves in the encirclement of the periphery of solid light guide layer 230
The step of light reflecting material.Further, peripheral frame 214 extends beyond the top surface of solid light guide layer 230 in the height direction.Outside
The part more than solid light guide layer 230 of peripheral frame frame 214 is used for the photosensor layer 250 of fixed detector 200.For example, can be with
Photosensor layer 250 is directly held in the top of peripheral frame 214.Connect crystal layer 220 using peripheral frame 214, consolidate
Body photoconductive layer 230 and photosensor layer 250 can make that the structure of detector 200 is compacter, reduces production cost and being capable of pole
The earth simplifies manufacture craft.
Preferably, the thickness of peripheral frame 214 is more than multiple transverse walls 211 and the thickness of multiple longitudinal walls 212.It can manage
The thickness of solution, transverse wall 211 and longitudinal wall 212 has direct relation with the notch width in solid light guide layer 230, therefore certain
It is more thin more preferable in degree.And peripheral frame 214 primarily serves the effect of connection and support, therefore its thickness can be with bigger, example
If its thickness can be 1-5mm.
Transverse wall 211 and longitudinal wall 212 can be formed by any-mode, and transverse wall 211 and longitudinal wall 212 can
To be single or multiple lift structure.Each transverse wall 211 and longitudinally in each wall 212 can splice shape by multiple discrete pieces
Into so, multiple are connected with each other to be separated to form multiple grid grooves.Certainly, each transverse wall 211 and longitudinally in each wall
212 can also be the component of full wafer.Reference picture 4A-4D, there is provided one kind uses full wafer structure manufacture transverse wall 211 and longitudinal wall
212 mode.
As shown in figs. 4 a-4b, thin slice 211 ' is provided first, and the thin slice 211 ' can be super thin metal piece, ultra-thin PVC pieces etc.
Deng typically being 50-120 microns.Then, slot 215a is set at the correct position of such as bottom of thin slice 211 ', with
Form transverse wall 211.Similarly, wall also can be using longitudinal thin slice, difference made of the above method longitudinally in each
It is that the slot 215b (referring to Fig. 4 C) in longitudinal wall 212 is oppositely arranged with slot 215a, such as is arranged on the upper of longitudinal wall 212
Portion.As an example, the transverse direction shown in Fig. 4 B can also be made using the various known technologies including 3D printing technique
Wall 211 and the longitudinal wall 212 with similar structures (referring to Fig. 4 C).
As shown in Figure 4 C, the slot 215a and 215b on transverse wall 211 and longitudinal wall 212 can make transverse wall 211 and indulge
It is mutually inserted to wall 212, so multiple transverse walls 211 and the grafting at corresponding slot respectively of multiple longitudinal walls 212.So
Afterwards, as shown in Figure 4 D, multiple transverse walls 211 after grafting and multiple longitudinal walls 212 are fixed in peripheral frame 214, with shape
Into grid groove.
It should be noted that transverse wall 211 and longitudinal wall 212 illustrated in Fig. 4 A-4D is merely to illustrate the preferred reality
The principle of example is applied, is not intended to the quantity of transverse wall 211 and longitudinal wall 212 being limited to diagram embodiment herein.It is in fact, last
The grooving that the transverse wall 211 and longitudinal wall 212 being plugged in together correspond in existing glass light conducting shell, the grid being separated to form
Groove can correspond with scintillation crystal respectively, i.e. the length and width of the grid groove length and width phase with scintillation crystal respectively
Corresponding (such as size that is equal sized or being slightly less than scintillation crystal of grid groove), therefore, transverse wall 211 and longitudinal wall 212
Quantity will determine according to the application of reality.In addition, the number of assembling steps described by reference picture 4A-4D is not necessarily carried out continuously
, when making detector, the step relevant with the miscellaneous part for assembling detector may be inserted between these steps.Hereinafter
Multiple embodiments will be combined to describe a variety of methods for making detector provided by the invention.
Further, the present invention also provides a kind of transmitting imaging device, and the transmitting imaging device includes as described above appoint
A kind of detector.
According to an aspect of the present invention, there is provided a kind of method for making any detector as described above.This method
Comprise the following steps, reference picture 5：
First, step 501 is performed, multiple scintillation crystals and multiple grid grooves are respectively inserted into multiple nets correspondingly
In cell, multiple scintillation crystals are fixed to grid mould.As an example, grid mould can use reference picture 4A-4D
The embodiment of introduction makes.It is, of course, also possible to using NM herein but obvious its other party within the scope of the present invention
Formula makes.Scintillation crystal can be fixed in grid groove using optical glue.Scintillation crystal can also be as mentioned above
Method is fixed in grid groove, i.e., is sized so as to the size of scintillation crystal match or be slightly less than flicker crystalline substance by grid groove
The size of body, the size expansion of grid groove is then made to scintillation crystal is inserted into by heating, finally cooling receives grid groove
Contract to fix scintillation crystal.
Then, step 502, the injection optics glue in the grooving of solid light guide layer are performed.Grooving in solid light guide layer
Can be formed using the existing known or following any method being likely to occur.Preferably, the width design of grooving obtains
Slightly larger than transverse wall and the thickness of longitudinal wall.Preferably, the depth design of grooving must be slightly larger than exceeding for transverse wall and longitudinal wall
The height of the part of the top surface of crystal layer.These balances of grooving are used to accommodate the optical glue after solidification.
Then, step 503 is performed, by multiple transverse walls and the partial insertion solid light higher than crystal layer of multiple longitudinal walls
In the grooving of conducting shell.Compress and exclude bubble therein, the glue solidifies for wait.
In addition, above-mentioned preparation method also includes step 504, such as photosensor layer is fixed on solid light with optical glue
On the top surface of conducting shell.Preferably, the step can perform later in the part insertion grooving of transverse wall and longitudinal wall.Certainly,
The step can also be carried out before solid light guide layer is fixed on the top surface of crystal layer.Further, the preparation method is also wrapped
Include and for example bottom is covered on the bottom surface of crystal layer and grid mould with optical glue, wherein the table towards crystal layer of bottom
Face is covered with reflection layer.
According to another aspect of the present invention, a kind of method for making any detector as described above is also provided.Should
Method comprises the following steps, reference picture 6：
First, step 601, the injection optics glue in the grooving of solid light guide layer are performed.
Then, step 602 is performed, multiple transverse walls and multiple longitudinal walls are respectively inserted into grooving, and by external surrounding frame
Frame is fixed on the periphery of multiple transverse walls and multiple longitudinal walls.The part for exposing grooving of multiple transverse walls and multiple longitudinal walls with
Peripheral frame is to together form multiple grid grooves.
Then, step 603 is performed, multiple scintillation crystals and multiple grid grooves are respectively inserted into multiple nets correspondingly
In cell, multiple scintillation crystals are fixed to grid mould.Scintillation crystal can use any mode as described above to consolidate
It is scheduled in grid groove.
In addition, above-mentioned preparation method also includes step 604, such as photosensor layer is fixed on solid light with optical glue
On the top surface of conducting shell.Preferably, the step can be fixed to the later execution in grid groove in scintillation crystal.Certainly, the step
It can also be carried out before scintillation crystal is fixed in grid groove.Further, the preparation method also includes for example using optical cement
Bottom is covered on the bottom surface of crystal layer and grid mould by water, and wherein the surface towards crystal layer of bottom is reflected covered with light
Layer.
According to a further aspect of the invention, a kind of method for making any detector as described above is also provided.Should
Method comprises the following steps, reference picture 7：
First, step 701 is performed, there is provided crystal block and solid light guide block.Crystal block and solid light guide block are used for after passing through
The cutting of continuous step forms crystal layer and solid light guide layer, thus crystal block and the size of solid light guide block preferably with for shape
The size of crystal layer and solid light guide layer into detector matches.
Then, step 702 is performed, crystal block is fixed to solid light guide block.As an example, crystal block can use optics
Glue is fixed on fixed light guide block.
Then, step 703 is performed, the crystal block and solid light guide block that are fixed together are cut from the side of crystal block
Cut, so that crystal block forms the multiple scintillation crystals arranged in a matrix fashion, and grooving is formed to be formed in solid light guide block
Solid light guide layer.It is appreciated that the depth of the cutting groove formed in crystal block and solid light guide block is preferably more than transverse wall
With the height of longitudinal wall.Preferably, the width of cutting groove is slightly larger than transverse wall and the thickness of longitudinal wall.These surpluses of cutting groove
Part can be used for accommodating the optical glue after solidification.Certainly, in the case of without using optical glue, the width of cutting groove and
Depth is adapted with the thickness and height of transverse wall and longitudinal wall.
Then, step 704 is performed, between multiple transverse walls and multiple longitudinal walls are inserted into multiple scintillation crystals, is gone forward side by side
Enter into grooving.By transverse wall and longitudinal wall insertion cutting groove in before, can in cutting groove injection optics glue.When
So, it can also only rely on the cooperation in size without using optical glue and come fixed lateral wall and longitudinal wall.
Then, step 705 is performed, peripheral frame is fixed on to the periphery of multiple transverse walls and multiple longitudinal walls.
In addition, above-mentioned preparation method also includes step 706, such as photosensor layer is fixed on solid light with optical glue
On the top surface of conducting shell.In addition it is also possible to before sliced crystal block and solid light guide block, photosensor layer is fixed to fixed light
On the face relative with crystal block of guide block.Even it just can first fix light sensing before crystal block is fixed into fixed light guide block
Device layer.Further, the preparation method also includes the bottom surface that bottom is for example covered in crystal layer and grid mould with optical glue
On, wherein the surface towards crystal layer of bottom is covered with reflection layer.
The present invention is illustrated by above-described embodiment, but it is to be understood that, above-described embodiment is only intended to
Citing and the purpose of explanation, and be not intended to limit the invention in described scope of embodiments.In addition people in the art
Member can also make more kinds of it is understood that the invention is not limited in above-described embodiment according to the teachings of the present invention
Variants and modifications, these variants and modifications are all fallen within scope of the present invention.Protection scope of the present invention by
The appended claims and its equivalent scope are defined.
Claims (11)
1. a kind of preparation method for being used to launch the detector of imaging device, the detector include：
Grid mould, the grid mould include peripheral frame, multiple transverse walls and multiple longitudinal walls, and the peripheral frame is from side
To the multiple transverse wall and the multiple longitudinal wall is surrounded, the multiple transverse wall and the multiple longitudinal wall difference are transversely
Direction and longitudinal direction arranged crosswise, it is described to form the multiple grid grooves arranged in a matrix fashion in the peripheral frame
Reflection layer is all covered with the medial surface of the side and the peripheral frame of multiple transverse walls and the multiple longitudinal wall；
Crystal layer, the crystal layer include multiple scintillation crystals for arranging in a matrix fashion, the multiple scintillation crystal with it is described
Multiple grid grooves are separately fixed in the multiple grid groove correspondingly, and the multiple transverse wall and the multiple longitudinal direction
The top surface of wall is not less than the top surface of the crystal layer；
Solid light guide layer, the solid light guide layer are arranged on the top surface of the crystal layer, and are set in the solid light guide layer
There are grooving, the grooving and the multiple transverse wall and the body fit higher than the crystal layer of the multiple longitudinal wall,
So that in grooving described in the partial insertion,
Methods described includes：
The multiple scintillation crystal and the multiple grid groove are respectively inserted into the multiple grid groove correspondingly, with
The multiple scintillation crystal is fixed to the grid mould；
The injection optics glue in the grooving of the solid light guide layer；And
By solid light guide layer described in the multiple transverse wall and the partial insertion higher than the crystal layer of the multiple longitudinal wall
The grooving in, connect the crystal layer and the solid light guide layer will pass through the grid mould.
2. a kind of preparation method for being used to launch the detector of imaging device, the detector include：
Grid mould, the grid mould include peripheral frame, multiple transverse walls and multiple longitudinal walls, and the peripheral frame is from side
To the multiple transverse wall and the multiple longitudinal wall is surrounded, the multiple transverse wall and the multiple longitudinal wall difference are transversely
Direction and longitudinal direction arranged crosswise, it is described to form the multiple grid grooves arranged in a matrix fashion in the peripheral frame
Reflection layer is all covered with the medial surface of the side and the peripheral frame of multiple transverse walls and the multiple longitudinal wall；
Crystal layer, the crystal layer include multiple scintillation crystals for arranging in a matrix fashion, the multiple scintillation crystal with it is described
Multiple grid grooves are separately fixed in the multiple grid groove correspondingly, and the multiple transverse wall and the multiple longitudinal direction
The top surface of wall is not less than the top surface of the crystal layer；
Solid light guide layer, the solid light guide layer are arranged on the top surface of the crystal layer, and are set in the solid light guide layer
There are grooving, the grooving and the multiple transverse wall and the body fit higher than the crystal layer of the multiple longitudinal wall,
So that in grooving described in the partial insertion,
Methods described includes：
The injection optics glue in the grooving of the solid light guide layer；
The multiple transverse wall and the multiple longitudinal wall are respectively inserted into the grooving, and the peripheral frame is fixed
In the multiple transverse wall and the periphery of the multiple longitudinal wall, to form the multiple grid groove；And
The multiple scintillation crystal and the multiple grid groove are respectively inserted into the multiple grid groove correspondingly, with
The multiple scintillation crystal is fixed to the grid mould, the crystal layer and described is connected will pass through the grid mould
Solid light guide layer.
3. a kind of preparation method for being used to launch the detector of imaging device, the detector include：
Grid mould, the grid mould include peripheral frame, multiple transverse walls and multiple longitudinal walls, and the peripheral frame is from side
To the multiple transverse wall and the multiple longitudinal wall is surrounded, the multiple transverse wall and the multiple longitudinal wall difference are transversely
Direction and longitudinal direction arranged crosswise, it is described to form the multiple grid grooves arranged in a matrix fashion in the peripheral frame
Reflection layer is all covered with the medial surface of the side and the peripheral frame of multiple transverse walls and the multiple longitudinal wall；
Crystal layer, the crystal layer include multiple scintillation crystals for arranging in a matrix fashion, the multiple scintillation crystal with it is described
Multiple grid grooves are separately fixed in the multiple grid groove correspondingly, and the multiple transverse wall and the multiple longitudinal direction
The top surface of wall is not less than the top surface of the crystal layer；
Solid light guide layer, the solid light guide layer are arranged on the top surface of the crystal layer, and are set in the solid light guide layer
There are grooving, the grooving and the multiple transverse wall and the body fit higher than the crystal layer of the multiple longitudinal wall,
So that in grooving described in the partial insertion,
Methods described includes：
Crystal block and solid light guide block are provided；
The crystal block is fixed to the solid light guide block；
The crystal block being fixed together and the solid light guide block are cut from the side of the crystal block, so that institute
State crystal block and form the multiple scintillation crystals arranged in a matrix fashion, and the grooving is formed with shape in the solid light guide block
Into the solid light guide layer；
Between the multiple transverse wall and multiple longitudinal walls are inserted into the multiple scintillation crystal, and enter the grooving
In；And
The peripheral frame is fixed on to the periphery of the multiple transverse wall and the multiple longitudinal wall, will pass through the grid
Mould connects the crystal layer and the solid light guide layer.
4. such as the method any one of claim 1-3, it is characterised in that methods described also includes consolidating photosensor layer
It is scheduled on the top surface of the solid light guide layer, wherein the photosensor layer includes multiple optical sensors；And/or bottom is covered
On the bottom surface of the crystal layer and the grid mould, wherein the surface towards the crystal layer of the bottom is covered with light
Reflecting layer.
5. such as the method any one of claim 1-3, it is characterised in that the grooving is along from the solid light guide layer
The direction at outer thoughtful center there is the height being gradually reduced.
6. such as the method any one of claim 1-3, it is characterised in that the multiple transverse wall is respectively by multiple transverse directions
Thin slice is formed, and the multiple longitudinal wall is formed by multiple longitudinal thin slices respectively,
Be respectively arranged with wherein the multiple transverse slice and the multiple longitudinal thin slice can be mutually inserted them insert
Groove, the multiple transverse slice and the multiple longitudinal thin slice the plug arranged crosswise at the slot.
7. such as the method any one of claim 1-3, it is characterised in that the thickness of the peripheral frame is more than described more
The thickness of individual transverse wall and the multiple longitudinal wall.
8. such as the method any one of claim 1-3, it is characterised in that the peripheral frame also from surrounding institute on the side
Solid light guide layer is stated, and the peripheral frame extends beyond the top surface of the solid light guide layer, the periphery in the height direction
The part more than the solid light guide layer of framework is used for the photosensor layer for fixing the detector.
9. such as the method any one of claim 1-3, it is characterised in that the bottom surface of the crystal layer and the grid mould
The bottom surface of tool flushes.
10. such as the method any one of claim 1-3, it is characterised in that the crystal layer and the grid mould
Bottom surface is covered with bottom, and the surface towards the crystal layer of the bottom is covered with reflection layer.
11. such as the method any one of claim 1-3, it is characterised in that the detector is also described including being arranged on
Photosensor layer on the top surface of solid light guide layer, the photosensor layer include multiple optical sensors.
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| CN105277965B (en) * | 2015-09-30 | 2017-12-12 | 华中科技大学 | A kind of detector for being used to launch imaging device |
| CN105372693B (en) * | 2015-11-26 | 2019-07-16 | 东软医疗系统股份有限公司 | A kind of synthetic method and mold of crystal and light guide |
| CN105403907B (en) * | 2015-12-02 | 2018-02-27 | 沈阳东软医疗系统有限公司 | A kind of scintillation crystal block and preparation method thereof, scintillation crystal detectors |
| CN107415069B (en) * | 2017-09-14 | 2019-04-12 | 中国电子科技集团公司第二十六研究所 | A kind of fixture of batch machining scintillator crystal bar end face |
| CN107443597B (en) * | 2017-09-14 | 2019-04-12 | 中国电子科技集团公司第二十六研究所 | Adjustable product clamping mount structure |
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