CN103874338B - Preprocessing method for LED (light emitting diode) nixie tube lattice component - Google Patents
Preprocessing method for LED (light emitting diode) nixie tube lattice component Download PDFInfo
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- CN103874338B CN103874338B CN201210545686.3A CN201210545686A CN103874338B CN 103874338 B CN103874338 B CN 103874338B CN 201210545686 A CN201210545686 A CN 201210545686A CN 103874338 B CN103874338 B CN 103874338B
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- dot matrix
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- Cleaning By Liquid Or Steam (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a preprocessing method for an LED (light emitting diode) nixie tube lattice component. According to the method, before the PIN hopping and PIN pressing processing on a PCB (printed circuit board), the PCB is singly subjected to ultrasonic cleaning, and then, the PCB is subjected to the PIN hopping and PIN pressing processing for forming the dot matrix component. The method provided by the invention has the technical flow process of PCB ultrasonic cleaning, tap water flushing, pure water flushing, baking, PIN hopping, PIN pressing, oil stain removing, tap water flushing, pure water flushing and baking. The modified technical flow process is characterized in that before the PCB is subjected to the PIN hopping and PIN pressing processing, the PCB is firstly subjected to the ultrasonic cleaning, then, the PCB is subjected to the PIN hopping and PIN pressing processing for forming the dot matrix component, and a PIN needle arranged on the dot matrix component is prevented from being in contact with basic metal cleaning liquid or generating the mutual collision friction with the basic metal cleaning liquid in the ultrasonic cleaning process. Therefore a tin plating layer formed on the surface of the PIN needle is preferably protected, and the product quality and the finished product rate are improved. The problems of product PIN needle copper exposure and oxidation are effectively solved.
Description
Technical field
The present invention relates to a kind of pre-treating method of LED charactron dot matrix component, belong to LED charactron manufacture technology field.
Background technology
LED
The pre-treatment of charactron dot matrix component is a kind of character with LED chip as luminescence unit, pixel display module, there is the features such as small volume, lightweight, fast response time, be widely used in household electrical appliance, Multi-Function Display, instrument and meter, automation equipment and industrial control field.In this process of producing product, procedure for preparation is the first procedure of production line, its Main Function is the basic component that PIN needle and pcb board are grouped together into product, in order to obtain good electrical connection properties in ensuing die bond, bonding wire craft, component must be carried out with pre-treatment, the oxide on removing component pcb board metal pad and greasy dirt etc..
Existing process is：Jump PIN → pressure PIN → ultrasonic cleaning → running water flushing → pure water rinsing → baking.Existing process is first to carry out jumping PIN and pressure PIN, then it is cleaned by ultrasonic again, it is in alkalescence due to being cleaned by ultrasonic cleaner for metal used, have certain corrosiveness to the pure tin coating on PIN needle top layer, cause the non-oxidizability of PIN needle and the weldability in later stage to have a certain impact.In addition in ultrasonic cleaning tank the PIN needle between component under ultrasonic force effect, between PIN needle can random contact, mutually rub, lead to that pit in the PIN needle in partial component or tin layers are worn out, so that the coating on PIN needle surface is destroyed and expose copper substrate.Cause inefficacy ratio about 1% about, affect the raising of finished product rate.
Content of the invention
It is an object of the invention to, a kind of pre-treating method of LED charactron dot matrix component is provided.Existing technique is adjusted, to solve the problems, such as that the PIN needle on dot matrix component the tin plating destruction in top layer in processing procedure, improves finished product rate.
Technical scheme：
A kind of pre-treating method of LED charactron dot matrix component, the method is before pcb board does not carry out jumping PIN and pressure PIN process, first individually pcb board is cleaned by ultrasonic, remove the oxide of metal pad and PIN in the hole wall and greasy dirt on pcb board, then again pcb board is carried out jumping PIN and pressure PIN process constitutes dot matrix component, it is to avoid the PIN needle on dot matrix component is contacted with alkalinous metal cleaning fluid or mutual collision friction in ultrasonic cleaning process.
In preceding method, methods described is carried out by following operation：Pcb board ultrasonic cleaning → running water flushing → pure water rinsing → baking → jump PIN → pressure PIN → degreasing → running water flushing → pure water rinsing → baking.
In preceding method, described degreasing operation is with weak caustic solution, dot matrix component to be rinsed, and removes the finger oils pollution being likely to result in production process.
In preceding method, the concentration of described weak caustic solution is 1%～5%
Compared with prior art, the present invention is by existing technological process：Jump PIN → pressure PIN → ultrasonic cleaning → running water flushing → pure water rinsing → baking.It is changed to pcb board ultrasonic cleaning → running water flushing → pure water rinsing → baking → jump PIN → pressure PIN → degreasing → running water flushing → pure water rinsing → baking.Amended technological process is before pcb board does not carry out jumping PIN and pressure PIN process, first individually pcb board is cleaned by ultrasonic, then again pcb board is carried out jumping PIN and pressure PIN and process and constitute dot matrix component, it is to avoid the PIN needle on dot matrix component contact with alkalinous metal cleaning fluid or mutual collision friction in ultrasonic cleaning process.Thus protecting the tin coating on PIN needle surface well, improve product quality and yield rate.Effectively solve product PIN needle dew copper, problem of oxidation, through the application more than half a year, effect is significant.
Specific embodiment
A kind of pre-treating method of LED charactron dot matrix component, the method is before pcb board does not carry out jumping PIN and pressure PIN process, first individually pcb board is cleaned by ultrasonic, remove the oxide of metal pad and PIN in the hole wall and greasy dirt on pcb board, then again pcb board is carried out jumping PIN and pressure PIN process constitutes dot matrix component, it is to avoid the PIN needle on dot matrix component is contacted with alkalinous metal cleaning fluid or mutual collision friction in ultrasonic cleaning process.Preceding method is carried out by following operation：Pcb board ultrasonic cleaning → running water flushing → pure water rinsing → baking → jump PIN → pressure PIN → degreasing → running water flushing → pure water rinsing → baking.Aforementioned degreasing operation is with weak caustic solution, dot matrix component to be rinsed, and removes the finger oils pollution being likely to result in production process；The concentration of aforementioned weak caustic solution is 1%～5%.
Each operation in present invention process flow process is all executed by the working specification of existing operation.Being mainly characterized by of the present invention is modified to the order of each operation.Due to have modified processing flow sequence, make the PIN needle on dot matrix component without the ultrasonic cleaning of cleaner for metal, thus effectively solving product PIN needle dew copper, problem of oxidation, through the application more than half a year, effect is significant.
Claims (3)
1. a kind of pre-treating method of LED charactron dot matrix component it is characterised in that：The method is before pcb board does not carry out jumping PIN and pressure PIN process, first individually pcb board is cleaned by ultrasonic, remove the oxide of metal pad and PIN in the hole wall and greasy dirt on pcb board, then again pcb board is carried out jumping PIN and pressure PIN process constitutes dot matrix component, it is to avoid the PIN needle on dot matrix component is contacted with alkalinous metal cleaning fluid or mutual collision friction in ultrasonic cleaning process；Specifically carry out by by following operation：Pcb board ultrasonic cleaning → running water flushing → pure water rinsing → baking → jump PIN → pressure PIN → degreasing → running water flushing → pure water rinsing → baking.
2. according to claim 1 method it is characterised in that：Aforementioned degreasing operation is with weak caustic solution, dot matrix component to be rinsed, and removes the finger oils pollution being likely to result in production process.
3. according to claim 2 method it is characterised in that：The concentration of aforementioned weak caustic solution is 1%～5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210545686.3A CN103874338B (en) | 2012-12-17 | 2012-12-17 | Preprocessing method for LED (light emitting diode) nixie tube lattice component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210545686.3A CN103874338B (en) | 2012-12-17 | 2012-12-17 | Preprocessing method for LED (light emitting diode) nixie tube lattice component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103874338A CN103874338A (en) | 2014-06-18 |
| CN103874338B true CN103874338B (en) | 2017-02-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210545686.3A Active CN103874338B (en) | 2012-12-17 | 2012-12-17 | Preprocessing method for LED (light emitting diode) nixie tube lattice component |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411111A (en) * | 2014-12-17 | 2015-03-11 | 江苏稳润光电有限公司 | Packaging process for LED nixie tubes |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001170584A (en) * | 1999-12-17 | 2001-06-26 | Sharp Corp | Ultrasonic treatment apparatus |
| CN102446778A (en) * | 2010-10-08 | 2012-05-09 | 北大方正集团有限公司 | Method for improving wire bonding performance |
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2012
- 2012-12-17 CN CN201210545686.3A patent/CN103874338B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001170584A (en) * | 1999-12-17 | 2001-06-26 | Sharp Corp | Ultrasonic treatment apparatus |
| CN102446778A (en) * | 2010-10-08 | 2012-05-09 | 北大方正集团有限公司 | Method for improving wire bonding performance |
Non-Patent Citations (1)
| Title |
|---|
| LED点阵数码管作业指导书;dreamczl;《百度文库》;20100530;第1-2页 * |
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| CN103874338A (en) | 2014-06-18 |
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