CN103874338A - Preprocessing method for LED (light emitting diode) nixie tube lattice component - Google Patents
Preprocessing method for LED (light emitting diode) nixie tube lattice component Download PDFInfo
- Publication number
- CN103874338A CN103874338A CN201210545686.3A CN201210545686A CN103874338A CN 103874338 A CN103874338 A CN 103874338A CN 201210545686 A CN201210545686 A CN 201210545686A CN 103874338 A CN103874338 A CN 103874338A
- Authority
- CN
- China
- Prior art keywords
- pin
- dot matrix
- pcb
- ultrasonic cleaning
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a preprocessing method for an LED (light emitting diode) nixie tube lattice component. According to the method, before the PIN hopping and PIN pressing processing on a PCB (printed circuit board), the PCB is singly subjected to ultrasonic cleaning, and then, the PCB is subjected to the PIN hopping and PIN pressing processing for forming the dot matrix component. The method provided by the invention has the technical flow process of PCB ultrasonic cleaning, tap water flushing, pure water flushing, baking, PIN hopping, PIN pressing, oil stain removing, tap water flushing, pure water flushing and baking. The modified technical flow process is characterized in that before the PCB is subjected to the PIN hopping and PIN pressing processing, the PCB is firstly subjected to the ultrasonic cleaning, then, the PCB is subjected to the PIN hopping and PIN pressing processing for forming the dot matrix component, and a PIN needle arranged on the dot matrix component is prevented from being in contact with basic metal cleaning liquid or generating the mutual collision friction with the basic metal cleaning liquid in the ultrasonic cleaning process. Therefore a tin plating layer formed on the surface of the PIN needle is preferably protected, and the product quality and the finished product rate are improved. The problems of product PIN needle copper exposure and oxidation are effectively solved.
Description
Technical field
the pre-treating method that the present invention relates to a kind of LED charactron dot matrix member, belongs to LED charactron manufacture technology field.
Background technology
the pre-treatment of LED charactron dot matrix member is a kind of character, pixel display module take LED chip as luminescence unit, there is the features such as volume is little, lightweight, fast response time, be widely used in household electrical appliance, Multi-Function Display, instrument and meter, automation equipment and industrial control field.In this process of producing product, procedure for preparation is the first operation of production line, its Main Function is that PIN pin and pcb board are combined to the basic component that forms product, in order to obtain good electrical connection properties in ensuing die bond, bonding wire craft, must carry out pre-treatment to member, remove oxide and greasy dirt etc. on member pcb board metal pad.
existing process is: jump the flushing → pure water rinsing → baking of PIN → pressure PIN → ultrasonic cleaning → running water.Existing technique is first to jump PIN and press PIN, and then carry out ultrasonic cleaning, because ultrasonic cleaning cleaner for metal used is alkalescence, the pure tin coating on PIN pin top layer is had to certain corrosiveness, cause the non-oxidizability of PIN pin and the weldability in later stage to have a certain impact.In ultrasonic cleaning tank, the PIN pin between member, can random contact between PIN pin under ultrasonic force effect in addition, friction mutually, cause PIN pin in partial component occur pit or tin layer worn out, the coating of PIN wire surface is destroyed and exposes copper substrate.Cause inefficacy ratio approximately in 1% left and right, affect the raising of finished product rate.
Summary of the invention
the object of the invention is to, a kind of pre-treating method of LED charactron dot matrix member is provided.Existing technique is adjusted, in processing procedure, occurred the problem of the zinc-plated destruction in top layer to solve PIN pin on dot matrix member, improve finished product rate.
technical scheme of the present invention:
a kind of pre-treating method of LED charactron dot matrix member, the method is before pcb board is jumped PIN and pressed PIN processing, first separately pcb board is carried out to ultrasonic cleaning, oxide and the greasy dirt of metal pad and PIN hole inwall on removing pcb board, and then pcb board is jumped PIN and pressed PIN to process formation dot matrix member, avoid the PIN pin on dot matrix member in ultrasonic cleaning process, to contact with alkalinous metal cleaning fluid or mutual collision friction.
in preceding method, described method is undertaken by following operation: the flushing → pure water rinsing → baking of pcb board ultrasonic cleaning → running water flushing → pure water rinsing → baking → jumping PIN → pressure PIN → degreasing → running water.
in preceding method, described degreasing operation is, with weak caustic solution, dot matrix member is carried out to rinsing, removes the finger grease contamination that may cause in production process.
in preceding method, the concentration of described weak caustic solution is 1%～5%
compared with prior art, the present invention is by existing technological process: jump the flushing → pure water rinsing → baking of PIN → pressure PIN → ultrasonic cleaning → running water.Change the flushing → pure water rinsing → baking of pcb board ultrasonic cleaning → running water flushing → pure water rinsing → baking → jumping PIN → pressure PIN → degreasing → running water into.Amended technological process is before pcb board is jumped PIN and pressed PIN processing, first separately pcb board is carried out to ultrasonic cleaning, and then pcb board is jumped PIN and pressed PIN to process formation dot matrix member, avoid the PIN pin on dot matrix member in ultrasonic cleaning process, to contact with alkalinous metal cleaning fluid or mutual collision friction.Thereby the tin coating of well having protected PIN wire surface, has improved product quality and rate of finished products.Effectively solved product P IN pin and revealed copper, problem of oxidation, through many application half a year, effect is remarkable.
Embodiment
a kind of pre-treating method of LED charactron dot matrix member, the method is before pcb board is jumped PIN and pressed PIN processing, first separately pcb board is carried out to ultrasonic cleaning, oxide and the greasy dirt of metal pad and PIN hole inwall on removing pcb board, and then pcb board is jumped PIN and pressed PIN to process formation dot matrix member, avoid the PIN pin on dot matrix member in ultrasonic cleaning process, to contact with alkalinous metal cleaning fluid or mutual collision friction.Preceding method is undertaken by following operation: the flushing → pure water rinsing → baking of pcb board ultrasonic cleaning → running water flushing → pure water rinsing → baking → jumping PIN → pressure PIN → degreasing → running water.Aforementioned degreasing operation is, with weak caustic solution, dot matrix member is carried out to rinsing, removes the finger grease contamination that may cause in production process; The concentration of aforementioned weak caustic solution is 1%～5%.
each operation in technological process of the present invention is all carried out by the working specification of existing operation.Main feature of the present invention is that the order of each operation is revised.Owing to having revised technological process order, make the ultrasonic cleaning without cleaner for metal of PIN pin on dot matrix member, reveal copper, problem of oxidation thereby effectively solved product P IN pin, through many application half a year, effect is remarkable.
Claims (4)
1. the pre-treating method of a LED charactron dot matrix member, it is characterized in that: the method is before pcb board is jumped PIN and pressed PIN processing, first separately pcb board is carried out to ultrasonic cleaning, oxide and the greasy dirt of metal pad and PIN hole inwall on removing pcb board, and then pcb board is jumped PIN and pressed PIN to process formation dot matrix member, avoid the PIN pin on dot matrix member in ultrasonic cleaning process, to contact with alkalinous metal cleaning fluid or mutual collision friction.
2. method according to claim 1, is characterized in that: preceding method is undertaken by following operation: the flushing → pure water rinsing → baking of pcb board ultrasonic cleaning → running water flushing → pure water rinsing → baking → jumping PIN → pressure PIN → degreasing → running water.
3. method according to claim 2, is characterized in that: aforementioned degreasing operation is, with weak caustic solution, dot matrix member is carried out to rinsing, removes the finger grease contamination that may cause in production process.
4. method according to claim 3, is characterized in that: the concentration of aforementioned weak caustic solution is 1%～5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210545686.3A CN103874338B (en) | 2012-12-17 | 2012-12-17 | Preprocessing method for LED (light emitting diode) nixie tube lattice component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210545686.3A CN103874338B (en) | 2012-12-17 | 2012-12-17 | Preprocessing method for LED (light emitting diode) nixie tube lattice component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103874338A true CN103874338A (en) | 2014-06-18 |
| CN103874338B CN103874338B (en) | 2017-02-08 |
Family
ID=50912353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210545686.3A Active CN103874338B (en) | 2012-12-17 | 2012-12-17 | Preprocessing method for LED (light emitting diode) nixie tube lattice component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103874338B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411111A (en) * | 2014-12-17 | 2015-03-11 | 江苏稳润光电有限公司 | Packaging process for LED nixie tubes |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001170584A (en) * | 1999-12-17 | 2001-06-26 | Sharp Corp | Ultrasonic treatment apparatus |
| CN102446778A (en) * | 2010-10-08 | 2012-05-09 | 北大方正集团有限公司 | Method for improving wire bonding performance |
-
2012
- 2012-12-17 CN CN201210545686.3A patent/CN103874338B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001170584A (en) * | 1999-12-17 | 2001-06-26 | Sharp Corp | Ultrasonic treatment apparatus |
| CN102446778A (en) * | 2010-10-08 | 2012-05-09 | 北大方正集团有限公司 | Method for improving wire bonding performance |
Non-Patent Citations (1)
| Title |
|---|
| DREAMCZL: "LED点阵数码管作业指导书", 《百度文库》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411111A (en) * | 2014-12-17 | 2015-03-11 | 江苏稳润光电有限公司 | Packaging process for LED nixie tubes |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103874338B (en) | 2017-02-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104419916A (en) | Manufacturing method of chemical nickel palladium gold plating plated with thick palladium | |
| MY165726A (en) | Cleaning liquid composition for electronic device | |
| CN104561943B (en) | Chemical nickel-palladium alloy plating process for circuit boards | |
| CN102548066A (en) | PCB (Printed Circuit Board) surface treatment technology | |
| CN105025662A (en) | Preparing technology of circuit board nickel and gold deposition | |
| CN105112892A (en) | Chemical nickel, palladium and gold plating technique for printed circuit board | |
| CN105744753A (en) | Method for forming oxidation-resistant protecting membrane on surfaces of copper and copper alloy on printed circuit board | |
| CN102912329A (en) | Chemical nickel and palladium plating process used for circuit boards | |
| CN107022762B (en) | The application of three amido fortified phenols or three amido substituted benzene thiophenols and tiny-etching treatment fluid | |
| TW200701845A (en) | Method of manufacturing wiring board | |
| CN102098880A (en) | Surface processing method of PCB (printed circuit board) | |
| CN107995802A (en) | A kind of preparation method of the immersion Ni/Au of printed circuit board (PCB) | |
| CN103874338B (en) | Preprocessing method for LED (light emitting diode) nixie tube lattice component | |
| TW200709388A (en) | Method and apparatus for forming a noble metal layer, notably on inlaid metal features | |
| CN104241025B (en) | A kind of multiple layer nickel plating method of relay1 case | |
| CN110158066B (en) | Environment-friendly solution capable of inhibiting tetravalent tin generation rate | |
| CN104651811A (en) | Catalyst solution for electroless plating | |
| CN102994994A (en) | Lead-free electroless tin plating solution | |
| CN203653724U (en) | High speed electroplating line equipment for IC pins | |
| CN104388960B (en) | The special degreaser of non-conduction Kong Shangjin prevented by PCB chemical nickel and gold plate | |
| CN202475956U (en) | Novel steel plate | |
| CN103849861A (en) | Method for cyanide-free replacement of plated silver on surface of copper-based body | |
| CN107683025A (en) | A kind of manufacture method of the non-homogeneous copper thickness pcb board of same aspect | |
| CN103898488A (en) | Nickel-plating method of nickel-plated copper strip | |
| CN105316735A (en) | Environment-friendly silver-plated contact of fuse |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |