CN103868639A - Pressure transmitter - Google Patents
Pressure transmitter Download PDFInfo
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- CN103868639A CN103868639A CN201210539826.6A CN201210539826A CN103868639A CN 103868639 A CN103868639 A CN 103868639A CN 201210539826 A CN201210539826 A CN 201210539826A CN 103868639 A CN103868639 A CN 103868639A
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- core body
- pressure core
- signal condition
- pressure
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Abstract
The invention discloses a pressure transmitter, belonging to a pressure detection output apparatus, and mainly aiming to simplify an assembling structure, reduce cost and raise product performance. The pressure transmitter comprises a main body with a core space with a core space and a ceramic pressure core body located in the core space of the main body. The ceramic pressure core body is positioned by a locating piece; the main body is provided with a socket; the ceramic pressure core body is in electric connection with the socket through a flexible circuit board; the back pressure surface of the ceramic pressure core body is provided with a signal conditioning chip; the peripheral circuit of the signal conditioning chip is fixed on the ceramic pressure core body and is used for a system needing pressure detection and output.
Description
Technical field
The present invention relates to a kind of pressure unit.
Background technology
Pressure unit is a kind of transmitter the most frequently used in industrial practice, and it is widely used in Automation Control System on Industry.System pressure enters in pressure chamber by pressure inlets, pressure acts directly on the front surface of ceramic pressure core body, make diaphragm that corresponding miniature deformation occur, cause 4 arm resistances on pressure unit to change, produce corresponding small electrical signals, then realized standard signal output proportional to pressure in conjunction with special ASIC signal conditioning circuit.Meeting the requirements such as transmission, processing, storage, demonstration, record and the control of information with this, is the crucial precise detection device of control system.
An existing pressure unit as shown in Figure 3, comprises main socket body 011, circuit board 012, circlip 014, insulating element 015, supportive device 016, integrated amplifier module 017, ceramic pressure core body 018, seal member 019 and main body 020; Wherein O-ring seal, ceramic pressure core body, integrated amplifier module, bracing or strutting arrangement, insulating element and circlip are fitted in main body, and be fixed in main body by circlip, main body is offered fluted inner cylinder face with inner side relative outside ceramic pressure core body.The principle of work of this pressure unit is: fluid pressure action is on ceramic pressure core body, make the pressure elements on ceramic pressure core body produce distortion, the bridge diagram being now printed on ceramic pressure core body produces corresponding electric signal, then is converted into standard output signals by integrated amplifier module.In said structure, bracing or strutting arrangement is generally metal, and in assembling process, is difficult to avoid it not and physical property occurs between main body contact.Therefore for the object that reaches electrical protection in the electrical pin of being close to bracing or strutting arrangement and integrated amplifier module, ceramic pressure core body between the two, increased insulating element, meanwhile the inwall of bracing or strutting arrangement and main body has been carried out to fluting 021.The fundamental purpose of fluting has two: the one, can increase the electrical distance between ceramic pressure core body pin and main body; The 2nd, can increase weld between integrated circuit modules and the electrical pin of ceramic pressure core body and the creepage distance between supportive device.By foregoing description, existing pressure unit, because internal part is many, causes cost higher; This face degree of flushing that insulating element contacts with ceramic pressure core body requires very high, and actual production is difficult to reach this point; The more difficult control of mounting distance between parts and parts, easily causes the deficiency of electrical protection distance.Based on what time above, in actual production, the qualification rate of product is not high, but quality guarantee maintenance cost is higher.
Summary of the invention
Problem to be solved by this invention is just to provide a kind of pressure unit, in realizing simplification assembly structure, saving cost and raising the efficiency, has improved product and has easily occurred the problem that electrical strength is bad, has improved the performance of product.
In order to achieve the above object, the present invention adopts following technical scheme: a kind of pressure unit, comprise main body with inner chamber and be located at the ceramic pressure core body in the inner chamber of main body, described ceramic pressure core body is located by keeper, described main body is provided with socket, described ceramic pressure core body is electrically connected with socket by flexible PCB, is provided with signal condition chip at the back pressure face of ceramic pressure core body, and the peripheral circuit of described signal condition chip is fixed on ceramic pressure core body.Described ceramic pressure core body is provided with Wheatstone bridge, Wheatstone bridge Main Function is the pressure signal of ceramic pressure core body generation to be changed into electric signal after the resistance compensation of Wheatstone bridge compensating basin, be delivered to signal condition chip again, and this electric signal is amplified output by signal condition chip.
Further, described signal condition chips welding is on ceramic pressure core body.
Further, the signal condition chip that described signal condition chip is wafer-level packaging.
Further, the back pressure face of described ceramic pressure core body is electrically connected district by signal condition chip soldering panel, Wheatstone bridge district, signal condition chip periphery circuit compensation district, Wheatstone bridge compensating basin and ceramic pressure core body and forms.On the back pressure face of ceramic pressure core body except signal condition chip soldering panel, all be printed with corresponding circuit, signal condition chip soldering panel is used for being welded and fixed signal condition chip, Wheatstone bridge district is used for arranging Wheatstone bridge, Wheatstone bridge compensating basin is to float in order to reduce temperature, improve the precision that Wheatstone bridge changes into pressure signal electric signal, generally integrated several little thermistors in this region.
Further, described signal condition chip soldering panel and ceramic pressure core body electrical connection district are provided with exposed solder joint, and described Wheatstone bridge district, signal condition chip periphery circuit compensation district, Wheatstone bridge compensating basin and ceramic pressure core body electrical connection district are provided with coatings floor.The solder joint in signal condition chip soldering panel is used for being welded and fixed signal condition chip, and the solder joint effect in ceramic pressure core body electrical connection district is that the stitch of drawing of ceramic pressure core body is connected with circuit board
Further, the lateral wall of described ceramic pressure core body and the laminating of the sidewall of inner chamber.Fit into and coordinate and leave gap, assembling is easy, Stability Analysis of Structures.
Further, described keeper comprises support ring and circlip, is provided with the annular groove of circlip is installed in described inner chamber, and the upper end of described support ring is against on the back pressure face that circlip upper and lower end is against ceramic pressure core body.
Further, the lateral wall of described support ring and the laminating of the sidewall of inner chamber.The sidewall of inner chamber is smooth continuously, and atresia or groove, be convenient to processing.
Further, between the front surface of described ceramic pressure core body and the bottom surface of inner chamber, be provided with seal.
Further, described seal is O-ring seal, and the bottom surface of described inner chamber is provided with the locating slot of positioning seal ring, and described O-ring seal exceeds locating slot.
Adopt after technique scheme, tool of the present invention has the following advantages: the signal condition chips welding area of wafer-level packaging is very little, on ceramic pressure core body, can obtain enough welding regions; Cancel insulating element and integrated amplifier module, reduced amount of parts, be convenient to produce and install, improve production and efficiency of assembling, improved product simultaneously and easily occurred the problem that electrical strength is bad, improved the performance of product, the cost that has reduced product, has improved profit.
Brief description of the drawings
Below in conjunction with accompanying drawing, the invention will be further described:
Fig. 1 is the structural representation of an embodiment of the present invention;
Fig. 2 is that schematic diagram is divided in the region of the back pressure face of ceramic pressure core body;
Fig. 3 is the structural representation of existing a kind of pressure unit.
Embodiment
Be illustrated in figure 1 an embodiment of the present invention, a kind of pressure unit, comprise main body with inner chamber 11 1 and be located at the ceramic pressure core body 2 in the inner chamber of main body, described ceramic pressure core body is located by keeper, described main body is provided with socket 3, described ceramic pressure core body is electrically connected with socket by flexible PCB 4, is provided with signal condition chip 5 at the back pressure face of ceramic pressure core body, and the peripheral circuit of described signal condition chip is fixed on ceramic pressure core body.Described ceramic pressure core body is provided with Wheatstone bridge, Wheatstone bridge Main Function is the pressure signal of ceramic pressure core body generation to be changed into electric signal after the resistance compensation of Wheatstone bridge compensating basin, be delivered to signal condition chip again, and this electric signal is amplified output by signal condition chip.The peripheral circuit of signal condition chip generally comprises the components and parts such as electric capacity.Described signal condition chips welding is on ceramic pressure core body.As preferably, described signal condition chip is that wafer-level packaging is the signal condition chip of WLP encapsulation.The lateral wall of described ceramic pressure core body and the laminating of the sidewall of inner chamber, laminating matches and leaves gap.Described keeper comprises support ring 6 and circlip 7, is provided with the annular groove 12 of circlip is installed in described inner chamber, and the upper end of described support ring is against on the back pressure face that circlip upper and lower end is against ceramic pressure core body.The lateral wall of described support ring and the laminating of the sidewall of inner chamber.Between the front surface of described ceramic pressure core body and the bottom surface of inner chamber, be provided with seal.Described seal is O-ring seal 8, and the bottom surface of described inner chamber is provided with the locating slot 13 of positioning seal ring, and described O-ring seal exceeds locating slot.
As shown in Figure 2, the back pressure face of described ceramic pressure core body is electrically connected district 25 by signal condition chip soldering panel 21, Wheatstone bridge district 22, signal condition chip periphery circuit compensation district 23, Wheatstone bridge compensating basin 24 and ceramic pressure core body and forms.Described signal condition chip soldering panel and ceramic pressure core body electrical connection district are provided with exposed solder joint, and described Wheatstone bridge district, signal condition chip periphery circuit compensation district, Wheatstone bridge compensating basin and ceramic pressure core body electrical connection district are provided with coatings floor.On the back pressure face of ceramic pressure core body, except signal condition chip soldering panel and ceramic pressure core body electrical connection district, be all printed with corresponding circuit, so relative set coatings layer.Signal condition chip soldering panel is used for being welded and fixed signal condition chip, Wheatstone bridge district is used for arranging Wheatstone bridge, Wheatstone bridge compensating basin is to float in order to reduce temperature, improve the precision that Wheatstone bridge changes into pressure signal electric signal, generally integrated several little thermistors in this region.
In above-described embodiment, adopt flexible PCB, be convenient to distortion and install; The sidewall of inner chamber is smooth continuous anchor ring, atresia or groove, and cancelled insulating element and integrated amplifier module, and structure becomes simple, and processing request reduces.The present invention has adopted the peripheral circuit of signal condition chip to be integrated on ceramic pressure core body, and signal condition chips welding is on ceramic pressure core body, realize the integrated of ceramic pressure core body (sensor) and signal conditioning circuit (special ASCI circuit), realize pressure unit to integrated, the development trend of low energy consumption.Make Product Assembly become simpler, improved production efficiency, ensured properties of product; Reduce scrappage and rework rate, reduced production cost; Improve the reliability of product connection etc.On the basis that simultaneously can improve in the performance that ensures product, the size of dwindling each parts, for example, the height of main body reduces, and the height of support ring reduces etc.
Claims (10)
1. a pressure unit, comprise the ceramic pressure core body (2) in the inner chamber of being with the main body (1) of inner chamber (11) and being located at main body, described ceramic pressure core body is located by keeper, described main body is provided with socket (3), described ceramic pressure core body is electrically connected with socket by flexible PCB (4), it is characterized in that: be provided with signal condition chip (5) at the back pressure face of ceramic pressure core body, the peripheral circuit of described signal condition chip is fixed on ceramic pressure core body.
2. a kind of pressure unit according to claim 1, is characterized in that: described signal condition chips welding is on ceramic pressure core body.
3. a kind of pressure unit according to claim 1 and 2, is characterized in that: the signal condition chip that described signal condition chip is wafer-level packaging.
4. a kind of pressure unit according to claim 1 and 2, is characterized in that: the back pressure face of described ceramic pressure core body is made up of signal condition chip soldering panel (21), Wheatstone bridge district (22), signal condition chip periphery circuit compensation district (23), Wheatstone bridge compensating basin (24) and ceramic pressure core body electrical connection district (25).
5. a kind of pressure unit according to claim 4, it is characterized in that: described signal condition chip soldering panel and ceramic pressure core body electrical connection district are provided with exposed solder joint, described Wheatstone bridge district, signal condition chip periphery circuit compensation district, Wheatstone bridge compensating basin and ceramic pressure core body electrical connection district are provided with coatings floor.
6. a kind of pressure unit according to claim 4, is characterized in that: the lateral wall of described ceramic pressure core body and the laminating of the sidewall of inner chamber.
7. a kind of pressure unit according to claim 1, it is characterized in that: described keeper comprises support ring (6) and circlip (7), in described inner chamber, be provided with the annular groove (12) of circlip is installed, the upper end of described support ring is against on the back pressure face that circlip upper and lower end is against ceramic pressure core body.
8. a kind of pressure unit according to claim 7, is characterized in that: the lateral wall of described support ring and the laminating of the sidewall of inner chamber.
9. according to a kind of pressure unit described in claim 1 or 2 or 7 or 8, it is characterized in that: between the front surface of described ceramic pressure core body and the bottom surface of inner chamber, be provided with seal.
10. a kind of pressure unit according to claim 9, is characterized in that: described seal is O-ring seal (8), and the bottom surface of described inner chamber is provided with the locating slot of positioning seal ring (13), and described O-ring seal exceeds locating slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210539826.6A CN103868639A (en) | 2012-12-12 | 2012-12-12 | Pressure transmitter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210539826.6A CN103868639A (en) | 2012-12-12 | 2012-12-12 | Pressure transmitter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103868639A true CN103868639A (en) | 2014-06-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210539826.6A Pending CN103868639A (en) | 2012-12-12 | 2012-12-12 | Pressure transmitter |
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| CN (1) | CN103868639A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105823708A (en) * | 2015-01-08 | 2016-08-03 | 上海朝辉压力仪器有限公司 | Density transducer |
| CN106546376A (en) * | 2015-09-18 | 2017-03-29 | Smc株式会社 | Pressure sensor |
| CN107219027A (en) * | 2017-07-17 | 2017-09-29 | 合肥皖科智能技术有限公司 | A kind of encapsulating structure of ceramic capacitive pressure sensors |
| CN109596260A (en) * | 2019-01-03 | 2019-04-09 | 西安中星测控有限公司 | A kind of pressure transmitter |
| CN109932109A (en) * | 2019-03-07 | 2019-06-25 | 胡波 | Microminiature quick response absolute pressure transducer |
| CN112414615A (en) * | 2020-11-10 | 2021-02-26 | 宁波中车时代传感技术有限公司 | Ultrahigh voltage sputtering resistant film pressure transmitter and manufacturing method thereof |
| CN114646420A (en) * | 2022-05-19 | 2022-06-21 | 成都倍芯传感技术有限公司 | Pressure transmitter with high reliability |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2864896B2 (en) * | 1992-10-01 | 1999-03-08 | 日産自動車株式会社 | Control unit for diesel engine |
| CN1749719A (en) * | 2004-09-16 | 2006-03-22 | 株式会社电装 | Pressure sensor |
| CN201859034U (en) * | 2010-11-24 | 2011-06-08 | 李炳蔚 | Mounting structure of pressure transmitter |
| CN102435380A (en) * | 2011-10-28 | 2012-05-02 | 芜湖通和汽车管路系统有限公司 | High-range hydraulic sensor and manufacturing method thereof |
| CN202547855U (en) * | 2012-04-10 | 2012-11-21 | 武汉神动汽车电子电器有限公司 | Ceramic thick film resistor oil pressure sensor based on novel connection |
-
2012
- 2012-12-12 CN CN201210539826.6A patent/CN103868639A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2864896B2 (en) * | 1992-10-01 | 1999-03-08 | 日産自動車株式会社 | Control unit for diesel engine |
| CN1749719A (en) * | 2004-09-16 | 2006-03-22 | 株式会社电装 | Pressure sensor |
| CN201859034U (en) * | 2010-11-24 | 2011-06-08 | 李炳蔚 | Mounting structure of pressure transmitter |
| CN102435380A (en) * | 2011-10-28 | 2012-05-02 | 芜湖通和汽车管路系统有限公司 | High-range hydraulic sensor and manufacturing method thereof |
| CN202547855U (en) * | 2012-04-10 | 2012-11-21 | 武汉神动汽车电子电器有限公司 | Ceramic thick film resistor oil pressure sensor based on novel connection |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105823708A (en) * | 2015-01-08 | 2016-08-03 | 上海朝辉压力仪器有限公司 | Density transducer |
| CN106546376A (en) * | 2015-09-18 | 2017-03-29 | Smc株式会社 | Pressure sensor |
| CN106546376B (en) * | 2015-09-18 | 2020-08-21 | Smc株式会社 | Pressure sensor |
| CN107219027A (en) * | 2017-07-17 | 2017-09-29 | 合肥皖科智能技术有限公司 | A kind of encapsulating structure of ceramic capacitive pressure sensors |
| CN107219027B (en) * | 2017-07-17 | 2024-06-11 | 合肥皖科智能技术有限公司 | Encapsulation structure of ceramic capacitor pressure sensor |
| CN109596260A (en) * | 2019-01-03 | 2019-04-09 | 西安中星测控有限公司 | A kind of pressure transmitter |
| CN109932109A (en) * | 2019-03-07 | 2019-06-25 | 胡波 | Microminiature quick response absolute pressure transducer |
| CN112414615A (en) * | 2020-11-10 | 2021-02-26 | 宁波中车时代传感技术有限公司 | Ultrahigh voltage sputtering resistant film pressure transmitter and manufacturing method thereof |
| CN114646420A (en) * | 2022-05-19 | 2022-06-21 | 成都倍芯传感技术有限公司 | Pressure transmitter with high reliability |
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Application publication date: 20140618 |