CN117740234A - Pressure port module for pressure sensor - Google Patents
Pressure port module for pressure sensor Download PDFInfo
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- CN117740234A CN117740234A CN202410125956.8A CN202410125956A CN117740234A CN 117740234 A CN117740234 A CN 117740234A CN 202410125956 A CN202410125956 A CN 202410125956A CN 117740234 A CN117740234 A CN 117740234A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 9
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
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- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The invention relates to the technical field of pressure sensors, in particular to a pressure port module for a pressure sensor, which comprises a conditioning signal circuit board, a lead circuit board and a high-pressure connector with a pressure channel, wherein the two ends of the high-pressure connector are respectively provided with a connecting seat and a supporting boss, the supporting boss comprises an annular supporting seat boss and a strain gauge fixing table, the strain gauge fixing table comprises a positive strain area and a negative strain area, and the connecting seat is provided with a pressure port; at least 2 strain gauges are arranged on the strain gauge fixing table; the annular supporting seat boss is sleeved with a lead plate supporting seat, and the lead plate supporting seat is provided with a lead circuit board; the upper surface of the lead circuit board is provided with a conductive slot; the lower electric connection part is electrically connected with the conductive socket component through the vertical plug-in connection of the conditioning signal circuit board and the conductive slot. The pressure port module is simple in structure, convenient to assemble or disassemble, and capable of enabling the internal layout of the sensor to be simpler and effectively improving the assembly efficiency of the sensor.
Description
Technical Field
The invention relates to the technical field of pressure sensors, in particular to a pressure port module for a pressure sensor.
Background
The brake pressure sensor is applied to an ESC system (automobile electronic stability control system) and is mainly arranged on a hydraulic control module to monitor the pressure of brake fluid. The traditional pressure sensor all involves a plurality of circuit boards with functional modules, and is used as the most core with a conditioning signal circuit board and a lead circuit board, wherein the lead circuit board is mainly used for transmitting bridge resistance differential signals generated by a strain gauge (instrument) to the conditioning signal circuit board; the conditioning signal circuit board is mainly used for realizing the collection, processing and external output of pressure signals.
The pressure port of the sensor is mainly used for receiving the pressure of the medium and collecting and processing the pressure information of the pressure of the medium so as to obtain real-time pressure data of the medium, and the pressure port of the sensor mainly comprises a high-pressure connector with a pressure channel, a strain gauge, a lead circuit board and a lower electric connection part of a signal conditioning circuit. How to layout and electrically connect these components to each other in a narrow space is always a pain point of the industry.
The traditional electric connection mode between the main boards is that special slots are respectively arranged on the inner wall of the sensor shell for the insertion of the conditioning signal circuit board and the lead circuit board, and the conditioning signal circuit board and the lead circuit board are mutually parallel after being installed. This form is not only cumbersome to assemble, but also can cause space confusion in the sensor housing, not only being detrimental to the electrical connection of the wiring between the two, but also being detrimental to heat dissipation, assembly, and later disassembly and maintenance.
The two ends of a plurality of cables are welded with the conditioning signal circuit board and the lead circuit board respectively, so that the mode is not only manually dependent and low in yield, but also causes space confusion in the sensor shell, is not beneficial to heat dissipation, assembly and later disassembly and maintenance, and greatly influences the assembly efficiency of the pressure sensor.
In addition, for the layout of the strain gage, the strain gage is usually arranged on the diaphragm in a head-to-tail manner to form a long strip shape, and the strain gage occupies a lot of installation space due to the structure, so that the sensor is not beneficial to miniaturization, and the cost is high due to the fact that the area requirement on the diaphragm is large. On the other hand, in the traditional sensor, the pressure channel and the diaphragm are separated, and after assembly, the pressure medium is easy to leak because of gaps, so that the acquired medium pressure value is inaccurate.
Therefore, a technology is urgently needed to solve the above technical problems.
Disclosure of Invention
The invention aims to overcome the problems in the prior art, and provides a pressure port module for a pressure sensor, which is used for solving the problems that the assembly is troublesome, the internal wiring is disordered and the connection is inconvenient in the prior art because parallel slots are formed on the inner wall of a sensor shell for inserting a conditioning signal circuit board and a lead circuit board; and a plurality of strain gages are arranged on the diaphragm in the prior art in the head and tail mode to form a strip shape, the occupied space of the existing diaphragm area is large, miniaturization and high cost are not facilitated, and the diaphragm and the pressure channel are assembled in a separated mode, so that pressure leakage is easy to occur, and the technical problem that the acquired pressure value is inaccurate is caused.
The above purpose is realized by the following technical scheme:
the pressure port module for the pressure sensor comprises a conditioning signal circuit board, a lead circuit board and a high-pressure connector with a pressure channel, wherein a connecting seat and a supporting boss are respectively arranged at two ends of the high-pressure connector, the supporting boss comprises an annular supporting seat boss for sleeving a lead plate supporting seat and a strain gauge fixing table for mounting a strain gauge, the strain gauge fixing table comprises a positive strain area and a negative strain area, and the connecting seat is provided with a pressure port; one end of the pressure channel is communicated with the pressure port and used for inputting external medium pressure, and the other end of the pressure channel is connected with the bottom surface of the positive strain area and used for acting the input medium pressure on the bottom surface of the positive strain area to cause the deformation of the positive strain area; at least 2 strain gages are arranged on the strain gage fixing table;
the lead plate supporting seat is sleeved on the boss of the annular supporting seat, and the lead circuit board is arranged on the lead plate supporting seat; the upper surface of the lead circuit board is provided with a plurality of conductive reeds, and each conductive reed forms a conductive socket assembly with a conductive slot; correspondingly, the conditioning signal circuit board comprises a lower electric connection part arranged at the lower part, and the lower electric connection part is electrically connected with the conductive socket assembly through the vertical plug-in connection of the conditioning signal circuit board and the conductive slot;
and the lead wire circuit board is also provided with a lead wire through groove, and the lead wires on the strain gauge are welded with the surface of the lead wire circuit board through the lead wire through groove.
Further, the conductive slots are in a shape of a line, and pin through slots which are symmetrical to each other are formed on the lead circuit board corresponding to the conductive slots;
correspondingly, a pair of pins which are symmetrical to each other are arranged on the bottom surface of the conditioning signal circuit board, and lead plate clamping grooves are formed between 2 pins and the bottom side of the conditioning signal circuit board; the 2 pins can respectively penetrate through the 2 pin through grooves, so that the pin through grooves are clamped by the lead plate clamping grooves.
Further, the lower electrical connection portion includes a plurality of conditioning signal pads disposed on both sides of the conditioning signal circuit board.
Further, the conductive reed includes:
the reed plug-in part is used for being plugged into a lead board slot formed in the lead circuit board below, and the lead circuit board is horizontally arranged below the conductive reed;
a reed-below electrical connection portion for contacting a lead pad on a surface of the lead circuit board;
an electrical connection part above the reed, which is used for being in pressure connection with the conditioning signal pad;
the reed plug-in part is vertically connected with the reed lower electric connecting part, and the reed lower electric connecting part is connected with the reed upper electric connecting part by an included angle.
Further, the spring plate upper electric connection part comprises a spring plate supporting part and a spring plate bending part which are connected in an angle, and an included angle between the spring plate supporting part and the spring plate bending part is used as a spring plate crimping part.
Further, the lead plate supporting seat is cylindrical, and a pair of slots matched with the pins are formed along the top of the lead plate supporting seat; the pins penetrate through the pin through grooves and then are inserted into the slots to form lead plate installation spaces which take the tops of the lead plate supporting seats as supporting surfaces and the lead plate clamping grooves as limiting clamping.
Further, the pin is provided with a pin limiting groove, and the pin limiting groove extends to the bottom end of the pin; the pin limiting groove is used for limiting the plug-in connection with the slot;
the pin limiting grooves divide the pins into pin inserting parts and pin extending parts, after the pins are inserted into the slots, the pin inserting parts can be limited and clamped by the slots, and the pin extending parts extend into the cavity of the lead plate supporting seat.
Further, the pin inserting portion is inserted into the slot portion.
Further, a pair of lead plate baffles facing inwards are arranged at the upper port of the lead plate supporting seat, and the tops of the 2 lead plate baffles form a lead circuit board supporting surface for supporting the bottom surface of the lead circuit board.
Further, the conductive reed is metallic copper.
Advantageous effects
According to the pressure port module for the pressure sensor, the conditioning signal circuit board is vertically connected with the lead board supporting seat so as to form the lead board installation space capable of supporting the bottom surface of the lead board and limiting the side edges and the top, so that the lead board is convenient to stably place, the lower side of the conditioning signal circuit board is ensured, the conditioning signal circuit board can be better electrically connected with the strain gauge positioned at the pressure port of the sensor and the conditioning signal circuit board in the inner cavity of the sensor, and the circuit path of internal electrical connection is shorter. The conducting socket assembly with the conducting slot is arranged on the lead circuit board, and the conditioning signal circuit board with the electric connection part at the lower part is vertically spliced with the conducting socket assembly, so that the purpose of quick electric connection is realized. The strain gauges are arranged on the strain gauge fixing table in the wide direction, so that the collection of pressure data is not influenced while the strain area is occupied to be smaller; through the integrated into one piece processing with high-pressure joint, connecting seat and foil gage fixed station, ensured the seal of pressure channel for the pressure of pressure medium can be accepted completely to the strain area, and then the accuracy of pressure value collection has been ensured. The pressure port module for the pressure sensor is simple in structure, convenient to assemble or disassemble, capable of enabling the internal layout of the sensor to be simpler, compact in each functional part, short in electric connection path of the port, accurate in collected signals and capable of effectively improving the assembly efficiency of the sensor.
Drawings
FIG. 1 is a schematic diagram of a pressure port module for a pressure sensor according to the present invention;
FIG. 2 is a schematic diagram of a connection structure between a high-pressure connector and a strain gauge in a pressure port module for a pressure sensor according to the present invention;
FIG. 3 is a cross-sectional view of a high pressure port module for a pressure sensor in accordance with the present invention in connection with a strain gage;
FIG. 4 is a top view of a high pressure interface with strain gauge connection in a pressure port module for a pressure sensor according to the present invention;
FIG. 5 is a schematic diagram of a structure of a conditioning signal circuit board and a lead circuit board in a pressure port module for a pressure sensor according to the present invention after the conditioning signal circuit board and the lead circuit board are connected by a conductive reed;
FIG. 6 is a schematic diagram showing a structure of a conditioning signal circuit board and a lead circuit board before connection via a conductive reed in a pressure port module for a pressure sensor according to the present invention;
FIG. 7 is a top view of a lead circuit board with conductive reed in a pressure port module for a pressure sensor according to the present invention;
FIG. 8 is a side view of a lead circuit board with a conductive reed in a pressure port module for a pressure sensor according to the present invention;
fig. 9 is a schematic view of a first perspective view of a conductive reed in a pressure port module for a pressure sensor according to the present invention;
fig. 10 is a schematic view of a second perspective of a conductive reed in a pressure port module for a pressure sensor according to the present invention;
FIG. 11 is a schematic view of a first view of a conditioning signal circuit board, a lead circuit board, and a lead plate support base of a pressure port module for a pressure sensor according to the present invention after being connected to each other;
FIG. 12 is a schematic diagram of a second view of the pressure port module for a pressure sensor of the present invention after the conditioning signal circuit board, the lead circuit board and the lead plate support are connected to each other;
FIG. 13 is a schematic view of a third view of the pressure port module for a pressure sensor of the present invention after the conditioning signal circuit board, the lead circuit board and the lead plate support are connected to each other;
fig. 14 is a schematic diagram of the conditioning signal circuit board, the lead circuit board and the lead plate support base of the pressure port module for a pressure sensor according to the present invention before being connected to each other.
The graphic indicia:
1-conditioning signal circuit board, 2-strain gauge, 3-pressure channel, 4-connection mount, 5-strain gauge mounting pad, 6-first resistance unit, 7-second resistance unit, 8-first resistance unit row, 9-second resistance unit row, 10-pressure port, 11-positive strain zone, 12-negative strain zone, 13-first pressure channel, 14-second pressure channel, 15-annular pilot edge, 16-high voltage connector, 17-support boss, 18-annular mount boss, 19-lead circuit board, 20-lead plate mount, 21-pin, 22-lead plate clamping slot, 23-lead plate mounting space, 24-lead plate baffle, 25-pin through slot, 26-slot, 27-pin plug, 28-pin extension, 29-cambered chamfer, 30-limit slot, 31-lead circuit board support face, 32-slot plane, 33-conductive plug, 34-conductive slot, 35-conductive socket assembly, 36-lower electrical connection, 37-conditioning signal pad, 38-39-lower electrical plug, 40-lead pad, 45-lower electrical plug, 43-lead pad, 40-lead pad, 43-45-lower electrical plug, and 43-lead pad, and 43-socket.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. The described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1 to 4, the present solution provides a pressure port module for a pressure sensor, which comprises a conditioning signal circuit board 1, a lead circuit board 19 and a high-voltage connector 16 with a pressure channel 3, wherein two ends of the high-voltage connector 16 are respectively provided with a connecting seat 4 and a supporting boss 17, the supporting boss 17 comprises an annular supporting seat boss 18 for sleeving a lead plate supporting seat 20, and a strain gauge fixing table 5 for installing a strain gauge 2, the strain gauge fixing table 5 comprises a positive strain area 11 and a negative strain area 12, and the connecting seat 4 is provided with a pressure port 10; one end of the pressure channel 3 is communicated with the pressure port 10 and is used for inputting external medium pressure, and the other end of the pressure channel is connected with the bottom surface of the positive strain area 11 and is used for applying the input medium pressure to the bottom surface of the positive strain area 11 to cause deformation of the positive strain area 11; at least 2 strain gauges 2 are arranged on the strain gauge fixing table 5;
the annular supporting seat boss 18 is sleeved with the lead plate supporting seat 20, and the lead circuit board 19 is arranged on the lead plate supporting seat 20; the upper surface of the lead circuit board 19 is provided with a plurality of conductive reeds 33, and each conductive reed 33 forms a conductive socket assembly 35 with a conductive slot 34; correspondingly, the conditioning signal circuit board 1 includes a lower electrical connection portion 36 disposed at a lower portion, and the conditioning signal circuit board 1 and the conductive socket 34 are vertically inserted to electrically connect the lower electrical connection portion 36 with the conductive socket assembly 35;
the lead wire circuit board 19 is also provided with a lead wire through groove 45, and the lead wire on the strain gauge 2 is welded with the surface of the lead wire circuit board 19 through the lead wire through groove 45.
As shown in fig. 2 to 4, the strain gauge 2 and the connection method with the strain gauge fixing base 5 in the present embodiment are optimized as follows:
each strain gauge 2 comprises a first resistive element 6 located in the positive strain region 11 and a second resistive element 7 located in the negative strain region 12;
the first resistor unit 6 of each strain gauge 2 forms a first resistor unit column 8, the second resistor unit 7 of each strain gauge 2 forms a second resistor unit column 9, and the first resistor unit column 8 and the second resistor unit column 9 are parallel to each other.
Specifically, the surface of the strain gauge fixing table 5 in this embodiment is provided with at least 2 strain gauges 2, each strain gauge 2 is arranged in a wide direction, and the first resistor unit 6 on each strain gauge 2 is ensured to be located in the positive strain area 11, and the second resistor unit 7 is ensured to be located in the negative strain area 12.
Working principle:
the medium pressure enters the pressure channel 3 along the pressure port 10 and directly acts on the bottom surface of the positive strain area, the positive strain area 11 is slightly deformed under the action of the medium pressure, so that each resistance unit on each strain gauge 2 is changed, and when voltage is supplied to each resistance unit, voltage output proportional to the pressure is generated, so that the collection of the medium pressure is realized.
It should be noted that, since the sensing of the strain gauge 2 to the pressure of the medium and the conversion of the pressure value into the pressure value are common knowledge in the art, the specific method for implementing the strain gauge is not described in detail in this embodiment, and only the innovation in the structural layout is protected.
Furthermore, the outer wall of the connection socket 4 is provided with threads for screwing with the pressure medium device in this embodiment.
Wherein, the connecting seat 4 and the strain gauge fixing table 5 are coaxial with the high-pressure joint 16, and the pressure channel 3 is positioned on the axis.
The positive strain region 11 in this embodiment is a strain gage having a very thin thickness.
Specifically, the thickness of the positive strain region 11 is smaller than the thickness of the negative strain region 12, and the shape of the positive strain region 11 corresponds to the shape of the output end of the pressure channel 3.
In this embodiment, the pressure channel 3 is cylindrical, and correspondingly, the shape of the positive strain area 11 is circular.
In this embodiment, the high-pressure connector 16, the connection base 4 and the strain gauge fixing base 5 are all made of stainless steel, and are integrally formed.
As shown in fig. 3, the pressure channel 3 includes a first pressure channel 13 having one end communicating with the pressure port 10, and a second pressure channel 14 having one end sealed by the positive strain region 11, the first pressure channel 13 and the second pressure channel 14 communicating with each other;
the inner diameter of the first pressure channel 13 is larger than the inner diameter of the second pressure channel 14; this configuration ensures that the medium pressure entering the second pressure channel 14 has the highest accuracy and can be accurately acquired by the strain gauge 2 after acting on the positive strain region 11.
In addition, an annular guiding edge 15 inclined towards the second pressure channel 14 is arranged at the connection part of the first pressure channel 13 and the second pressure channel 14, so that the medium pressure entering the first pressure channel 13 can be timely guided to the second pressure channel 14, and the inclination of the annular guiding edge 15 is 30-60 degrees in the embodiment.
As a further optimization of the strain gauge 2 in this embodiment, specifically:
the strain gauge 2 is sintered on the surface of the strain gauge fixing table 5 at a high temperature.
The thickness of the strain gauge 2 is 10 um-13 um.
In this embodiment, the strain gauge 2 may be a silicon piezoresistor strain gauge, and the gauge of the strain gauge 2 is 1.56mm×0.96mm.
As shown in fig. 5 to 8, in this embodiment, the conductive slots 34 are in a line shape, and symmetrical pin through slots 25 are formed along the lead circuit board 19 corresponding to the conductive slots 34;
correspondingly, a pair of pins 21 which are symmetrical to each other are arranged on the bottom surface of the conditioning signal circuit board 1, and lead plate clamping grooves 22 are formed between 2 pins 21 and the bottom side of the conditioning signal circuit board 1; the 2 pins 21 can respectively penetrate through the 2 pin through grooves 25, so that the pin through grooves 25 are clamped by the lead plate clamping grooves 22. During installation, the lead circuit board 19 is connected with the lead board support base 20, and then the 2 pins 21 on the conditioning signal circuit board 1 are vertically inserted into the 2 slots 26, so that the purpose of rapid assembly can be achieved.
Under the action of the lead plate holder 20 and the conditioning signal circuit board 1 with the pins 21, the bottom, side and top of the lead circuit board 19 are confined in the lead plate mounting space 23.
As shown in fig. 5 and 6, the lower electrical connection portion 36 in this embodiment includes a plurality of conditioning signal pads 37 disposed on both sides of the conditioning signal circuit board 1. In order to facilitate the accurate crimping of each conditioning signal pad 37 to the plurality of conductive reeds 33 plugged onto the upper surface of the lead circuit board 19, each conditioning signal pad 37 is located at the same level in this embodiment.
In this embodiment, the 2 pins in the conditioning signal circuit board 1 perform the function of guiding the conditioning signal circuit board 1 to be quickly and vertically connected with the lead circuit board 19, and simultaneously, the lower electrical connection portion 36 can be accurately guided into the conductive slot 34, so as to achieve the crimping with each conductive reed 33 in the conductive socket assembly 35, thereby achieving the purpose of electrically connecting the 2 circuit boards.
Compared with the traditional mode of adopting cable spot welding, the structure adopts the plug-and-play conductive electric connection mode, is more efficient and quick, and can effectively improve the assembly efficiency between the lead circuit board 19 and the conditioning signal circuit board 1.
In addition, in this embodiment, the interaction between the pins 21 and the pin through grooves 25 can guide the conditioning signal circuit board 1 to be quickly and vertically connected with the lead circuit board 19, and simultaneously can also clamp and limit two sides of the lead circuit board 19, so that the 2 connected pins can be effectively prevented from being shifted by external shock, and further stable electrical connection is ensured.
As shown in fig. 7 and 8, as a specific embodiment of the present solution, the conductive spring pieces 33 in the conductive socket assembly 35 have 6, 2, and 4 sides, which are first sides of the conductive socket 34 and second sides of the conductive socket 34, and the conductive socket 34 is formed between the first sides and the second sides; the 2 conductive reeds 33 on the first side correspond to the outside of the second side, respectively.
As shown in fig. 5 and 6, the lower electrical connection portion 36 in this embodiment includes a plurality of conditioning signal pads 37 disposed on both sides of the conditioning signal circuit board 1. In order to facilitate the accurate crimping of the conditioning signal pads 37 to the plurality of conductive reeds 33 plugged on the upper surface of the lead circuit board 19, the conditioning signal pads 37 are located on the same horizontal plane in this embodiment.
As shown in fig. 9 and 10, the conductive reed 33 in this embodiment includes:
a reed inserting part 38, wherein the reed inserting part 38 is used for inserting with a lead board slot 43 arranged on the lead circuit board 19 below, and the lead circuit board 19 is horizontally arranged below the conductive reed 33;
a reed-under electrical connection 39, the reed-under electrical connection 39 for making contact with a lead pad 44 on the surface of the lead circuit board 19;
a reed-up electrical connection 40, the reed-up electrical connection 40 for crimping with the conditioning signal pad 37;
the reed plug part 38 is vertically connected with the reed lower electric connection part 39, and the reed lower electric connection part 39 and the reed upper electric connection part 40 are connected at an included angle.
Further, the above-reed electrical connection portion 40 includes a reed supporting portion 41 and a reed bending portion 42 connected at an angle, and an included angle of the reed supporting portion 41 and the reed bending portion 42 serves as a reed crimping portion 46.
Specifically, the included angle between the spring supporting portion 41 and the spring bending portion 42 is an arc angle, and the corresponding spring crimping portion 46 is an arc surface.
In this embodiment, the angle between the spring supporting portion 41 and the spring bending portion 42 is 90 ° to 160 °.
Specifically, with this structure, the smaller the degree of the angle between the reed holding portion 41 and the reed bending portion 42, the smaller the crimping area of the reed crimping portion 46; the greater the degree of the angle between the reed holding portion 41 and the reed bending portion 42, the greater the crimping area of the reed crimping portion 46, and the greater the contact surface with the conditioning signal pad 37, the more stable the electrical connection.
It should be noted that, in this embodiment, the reed inserting portion 38, the reed lower electrical connecting portion 39, and the reed upper electrical connecting portion 40 are integrally formed, and are made of conductive metal, such as copper metal.
As shown in fig. 11 to 14, the lead plate supporting base 20 has a cylindrical shape, and a pair of slots 26 matching with the pins 21 are formed along the top thereof; the pins 21 penetrate through the pin through grooves 25 and then are inserted into the slots 26, so as to form a lead board installation space 23 which takes the top of the lead board supporting seat 20 as a supporting surface and the lead board clamping grooves 22 as limiting clamping.
As an optimization of the lead circuit board 19 in this embodiment, the lead circuit board 19 is circular and corresponds to the top of the lead board support base 20; and the outer diameter of the lead circuit board 19 is not smaller than the outer diameter of the lead board supporting seat 20, so that the top of the lead board supporting seat 20 can act on the bottom surface of the lead circuit board 19 to realize stable support.
As shown in fig. 13, in order to better support the bottom surface of the lead circuit board 19, in the present embodiment, a pair of lead plate baffles 24,2 facing inward are provided at the upper port of the lead plate support base 20, and the top portions of the lead plate baffles 24 form a lead circuit board support surface 31 for supporting the bottom surface of the lead circuit board 19.
It should be noted that, in this embodiment, the height of the supporting surface 31 of the lead circuit board is higher than the slot plane 32 where the top slots of the 2 slots 26 are located; the structure enables an air-permeable space to be formed between the bottom surface of the lead circuit board 19 and the slot notch plane 32, and is also beneficial to disassembly and maintenance between subsequent components.
As an optimization of the structure, the connection part of the lead plate baffle 24 and the upper port of the lead plate supporting seat 20 forms a cambered chamfer 29, which can prevent the lead circuit board 19 from being damaged in the process of assembling with the lead plate supporting seat 20.
As shown in fig. 14, as an optimization of the pin 21 in this embodiment, a pin limiting groove 30 is formed on the pin 21, and the pin limiting groove 30 extends to the bottom end of the pin 21; the pin limiting groove 30 is used for limiting the insertion of the slot 26.
Specifically, the pin limiting groove 30 divides the pin 21 into a pin inserting portion 27 and a pin extending portion 28, after the pin 21 is inserted into the slot 26, the pin inserting portion 27 can be limited and clamped by the slot 26, and the pin extending portion 28 extends into the cavity of the lead board supporting seat 20.
The pin insertion portion 27 is partially inserted into the slot 26.
Specifically, in this embodiment, only the outer portion of the bottom end of the pin inserting portion 27 is inserted into the slot 26, and the top of the pin inserting portion 27 is higher than the lead board supporting seat 20, so that the upper portion of the lead board clamping groove 22 is located above the lead board supporting seat 20, and further, the two sides of the lead circuit board 19 mounted on the top of the lead board supporting seat 20 are clamped in a limited manner.
Whereas the top of the lead plate holding groove 22 in this embodiment is not in contact with the lead circuit board 19.
Specifically, 2 the pin 21 with the base angle of conditioning signal circuit board 1 becomes the radian angle to be connected, and the setting of 2 radian angles makes lead plate clamping groove 22 upper portion's interval is less than 2 the interval between pin logical groove 25, this structure can effectively prevent lead plate 19 with lead plate clamping groove 22's top contact, and then form the space that has certain clearance between 2, this space both is favorable to follow-up conditioning signal circuit board 1 with electric connection operation between the lead plate 19 also can act as the heat dissipation ventilation passageway.
The above description is for the purpose of illustrating the embodiments of the present invention and is not to be construed as limiting the invention, but is intended to cover all modifications, equivalents, improvements and alternatives falling within the spirit and principle of the invention.
Claims (10)
1. The pressure port module for the pressure sensor comprises a conditioning signal circuit board (1), a lead circuit board (19) and a high-pressure connector (16) with a pressure channel (3), and is characterized in that a connecting seat (4) and a supporting boss (17) are respectively arranged at two ends of the high-pressure connector (16), the supporting boss (17) comprises an annular supporting seat boss (18) for sleeving a lead plate supporting seat (20) and a strain gauge fixing table (5) for mounting a strain gauge (2), the strain gauge fixing table (5) comprises a positive strain area (11) and a negative strain area (12), and a pressure port (10) is arranged on the connecting seat (4); one end of the pressure channel (3) is communicated with the pressure port (10) and is used for inputting external medium pressure, and the other end of the pressure channel is connected with the bottom surface of the positive strain area (11) and is used for applying the input medium pressure to the bottom surface of the positive strain area (11) to cause deformation of the positive strain area (11); at least 2 strain gauges (2) are arranged on the strain gauge fixing table (5);
the annular supporting seat boss (18) is sleeved with the lead plate supporting seat (20), and the lead circuit board (19) is arranged on the lead plate supporting seat (20); the upper surface of the lead circuit board (19) is provided with a plurality of conductive reeds (33), and each conductive reed (33) forms a conductive socket assembly (35) with a conductive slot (34); correspondingly, the conditioning signal circuit board (1) comprises a lower electric connection part (36) arranged at the lower part, and the lower electric connection part (36) is electrically connected with the conductive socket assembly (35) through the vertical plug-in connection of the conditioning signal circuit board (1) and the conductive slot (34);
and a lead through groove (45) is further formed in the lead circuit board (19), and leads on the strain gauge (2) are welded with the surface of the lead circuit board (19) through the lead through groove (45).
2. The pressure port module for a pressure sensor according to claim 1, wherein the conductive slots (34) are in a line shape, and pin through slots (25) which are symmetrical to each other are formed along the lead circuit board (19) corresponding to the conductive slots (34);
correspondingly, a pair of pins (21) which are symmetrical to each other are arranged on the bottom surface of the conditioning signal circuit board (1), and lead plate clamping grooves (22) are formed between 2 pins (21) and the bottom side of the conditioning signal circuit board (1); the 2 pins (21) can respectively penetrate through the 2 pin through grooves (25), so that the pin through grooves (25) are clamped by the lead plate clamping grooves (22).
3. Pressure port module for a pressure sensor according to claim 1 or 2, characterized in that the lower electrical connection (36) comprises several conditioning signal pads (37) arranged on both sides of the conditioning signal circuit board (1).
4. A pressure port module for a pressure sensor according to claim 3, characterized in that the conductive reed (33) comprises:
the reed plug-in part (38), the reed plug-in part (38) is used for being plugged into a lead board slot (43) formed in the lower lead circuit board (19), and the lead circuit board (19) is horizontally arranged below the conductive reed (33);
a reed-under electrical connection (39), the reed-under electrical connection (39) being for contact with a lead pad (44) on a surface of the lead circuit board (19);
a reed-up electrical connection (40), the reed-up electrical connection (40) for crimping with the conditioning signal pad (37);
the reed plug-in part (38) is vertically connected with the reed lower electric connection part (39), and the reed lower electric connection part (39) is connected with the reed upper electric connection part (40) at an included angle.
5. The pressure port module for a pressure sensor of claim 4, wherein the above-reed electrical connection (40) comprises an angularly connected reed support (41) and a reed bending portion (42), the included angle of the reed support (41) and the reed bending portion (42) being a reed crimp (46).
6. The pressure port module for a pressure sensor according to claim 2, characterized in that said lead plate support (20) is cylindrical, along the top of which a pair of slots (26) matching said pins (21) are open; the pins (21) penetrate through the pin through grooves (25) and then are inserted into the slots (26) to form lead plate installation spaces (23) which take the tops of the lead plate supporting seats (20) as supporting surfaces and the lead plate clamping grooves (22) as limiting clamps.
7. The pressure port module for a pressure sensor according to claim 6, wherein the pin (21) is provided with a pin limiting groove (30), and the pin limiting groove (30) extends to the bottom end of the pin (21); the pin limiting groove (30) is used for limiting the plug-in connection with the slot (26);
the pin limiting grooves (30) divide the pins (21) into pin inserting portions (27) and pin extending portions (28), after the pins (21) are inserted into the slots (26), the pin inserting portions (27) can be limited and clamped by the slots (26), and the pin extending portions (28) extend into the cavity of the lead plate supporting seat (20).
8. Pressure port module for a pressure sensor according to claim 7, characterized in that the pin-plug part (27) is partially plugged into the socket (26).
9. The pressure port module for a pressure sensor according to claim 6, wherein a pair of lead plate baffles (24) facing inward are provided at an upper port of the lead plate support base (20), and tops of 2 of the lead plate baffles (24) constitute a lead circuit board support surface (31) for supporting a bottom surface of the lead circuit board (19).
10. Pressure port module for a pressure sensor according to claim 1, characterized in that the conductive reed (33) is metallic copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410125956.8A CN117740234B (en) | 2024-01-30 | 2024-01-30 | Pressure port module for pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410125956.8A CN117740234B (en) | 2024-01-30 | 2024-01-30 | Pressure port module for pressure sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117740234A true CN117740234A (en) | 2024-03-22 |
| CN117740234B CN117740234B (en) | 2024-09-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410125956.8A Active CN117740234B (en) | 2024-01-30 | 2024-01-30 | Pressure port module for pressure sensor |
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| Country | Link |
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| CN (1) | CN117740234B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6672170B1 (en) * | 2002-07-10 | 2004-01-06 | Texas Instruments Incorporated | Hermetic pressure transducer |
| CN102023066A (en) * | 2010-05-31 | 2011-04-20 | 昆山双桥传感器测控技术有限公司 | Universal pressure sensor of automobile |
| CN103868639A (en) * | 2012-12-12 | 2014-06-18 | 浙江盾安人工环境股份有限公司 | Pressure transmitter |
| CN112924079A (en) * | 2021-04-09 | 2021-06-08 | 无锡华阳科技有限公司 | Strain gauge type pressure sensor |
| CN214309247U (en) * | 2021-04-09 | 2021-09-28 | 无锡华阳科技有限公司 | Strain gauge type pressure sensor |
| CN115979497A (en) * | 2023-01-30 | 2023-04-18 | 深圳安培龙科技股份有限公司 | Small-diameter high-pressure sensor, manufacturing method thereof and sensor diameter reduction method |
-
2024
- 2024-01-30 CN CN202410125956.8A patent/CN117740234B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6672170B1 (en) * | 2002-07-10 | 2004-01-06 | Texas Instruments Incorporated | Hermetic pressure transducer |
| CN102023066A (en) * | 2010-05-31 | 2011-04-20 | 昆山双桥传感器测控技术有限公司 | Universal pressure sensor of automobile |
| CN103868639A (en) * | 2012-12-12 | 2014-06-18 | 浙江盾安人工环境股份有限公司 | Pressure transmitter |
| CN112924079A (en) * | 2021-04-09 | 2021-06-08 | 无锡华阳科技有限公司 | Strain gauge type pressure sensor |
| CN214309247U (en) * | 2021-04-09 | 2021-09-28 | 无锡华阳科技有限公司 | Strain gauge type pressure sensor |
| CN115979497A (en) * | 2023-01-30 | 2023-04-18 | 深圳安培龙科技股份有限公司 | Small-diameter high-pressure sensor, manufacturing method thereof and sensor diameter reduction method |
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| Publication number | Publication date |
|---|---|
| CN117740234B (en) | 2024-09-17 |
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