CN103855069A - Adsorption device - Google Patents
Adsorption device Download PDFInfo
- Publication number
- CN103855069A CN103855069A CN201410038443.XA CN201410038443A CN103855069A CN 103855069 A CN103855069 A CN 103855069A CN 201410038443 A CN201410038443 A CN 201410038443A CN 103855069 A CN103855069 A CN 103855069A
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- China
- Prior art keywords
- platform
- fluorescent glue
- led
- cavity
- led chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0025—Processes relating to coatings
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to the technical field of LED packaging, and provides an adsorption device. The adsorption device locates LED chips when fluorescent glue is coated. The adsorption device is provided with a plurality of micro holes, a cavity and a valve, wherein the cavity is communicated with the micro holes, the valve is used for sealing the cavity, and after the LED chips cover openings of all the micro holes, the cavity is vacuumized, so that the LED chips are located on the same platform. When the fluorescent glue is coated, the adsorption device with the multiple micro holes locates the LED chips. Particularly, after the LED chips cover the openings of all the micro holes, the cavity of the adsorption device is vacuumized, the LED chips can be located on the same platform and then are coated with the fluorescent glue on the platform, the LED chips are surrounded by and wrapped with the fluorescent glue with the same concentration and thickness, and therefore the consistency of the color zone of light emitted by a manufactured LED wafer is good.
Description
Technical field
The invention belongs to LED encapsulation technology field, relate in particular to a kind of adsorbent equipment.
Background technology
The packaged type of white light LEDs product is that the mode of LED wafer is bonding by crystal-bonding adhesive or eutectic welding is fixed on support, adopt gold thread the positive pole of wafer to be connected in to the positive pole of support, the negative pole of wafer is connected in the negative pole of support, then fills the fluorescent glue (mixture of fluorescent material and packaging plastic) that meets aim colour district in support bowl cup.The scheme of filling fluorescent glue need be for the operation of single bowl cup, inefficiency; Need a large amount of spot gluing equipments to drop into, and material waste is serious, fluorescent material and packaging plastic water use efficiency are low; Simultaneously because the bowl cup degree of depth is darker, cause photon more serious in problems such as the scattering absorptions of phosphor powder layer, affect the light extraction efficiency of LED packaging.In addition, because fluorescent material can precipitate in the fluorescent glue of its mixing, fluorescent material amount in a certain amount of fluorescent glue of pointing out before and after causing is inconsistent and cause white light LED part look district consistency poor, and then causes the yield of encapsulation to be difficult to control.
Summary of the invention
The object of the embodiment of the present invention is to provide a kind of adsorbent equipment, and the photochromic district consistency of sending through the made LED wafer of this device is good.
The embodiment of the present invention is achieved in that a kind of adsorbent equipment, in the time applying fluorescent glue, LED chip is positioned; The cavity that it has multiple micropores, be connected with each micropore and in order to seal the valve of described cavity; After the opening of all micropores being covered with described LED chip, described cavity is vacuumized, thereby each LED chip is positioned to identical platform.
The embodiment of the present invention, in the time applying fluorescent glue, is positioned LED chip by the adsorbent equipment with multiple micropores.Particularly, after the opening of all micropores being covered with LED chip, cavity to described adsorbent equipment vacuumizes, thereby each LED chip is positioned to identical platform, then on this platform, multiple LED chips are applied to fluorescent glue simultaneously, make each LED chip be enclosed and cover by concentration, fluorescent glue that thickness is identical, thereby the photochromic district consistency that made LED wafer sends is good.
Accompanying drawing explanation
Fig. 1 is the LED wafer preparation method's that provides of the embodiment of the present invention realization flow figure;
Fig. 2 is the structural representation after the horizontal structure chips welding gold goal that provides of the embodiment of the present invention;
Fig. 3 is the structural representation after the thin-film LED welding gold ball that provides of the embodiment of the present invention;
The horizontal structure chip that is welded with gold goal is placed in the state diagram after adsorbent equipment by Fig. 4;
Fig. 5 is the state diagram that applies fluorescent glue in platform shown in Fig. 4;
Fig. 6 is the state diagram that removes the fluorescent glue that is positioned at gold goal upper surface;
Fig. 7 is Fig. 6 partial enlarged drawing;
Fig. 8 is the state diagram after the film of fluorescence shown in Fig. 6 is cut apart;
Fig. 9 is the structural representation of LED;
Crystal covered chip is placed in the state diagram after platform by Figure 10;
Figure 11 is the state diagram that applies fluorescent glue in platform shown in Figure 10;
Figure 12 is the state diagram after the film of fluorescence shown in Figure 11 is cut apart.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
The embodiment of the present invention, in the time applying fluorescent glue, is positioned LED chip by the adsorbent equipment with multiple micropores.Particularly, after the opening of all micropores being covered with LED chip, cavity to described adsorbent equipment vacuumizes, thereby each LED chip is positioned to identical platform, then on this platform, multiple LED chips are applied to fluorescent glue simultaneously, make each LED chip be enclosed and cover by concentration, fluorescent glue that thickness is identical, thereby the photochromic district consistency that made LED wafer sends is good.
Realization of the present invention is described as example to prepare white light LEDs wafer below.Wherein, Fig. 1 shows the LED wafer preparation method's that the embodiment of the present invention provides realization flow, and details are as follows.
In step S101, obtain multiple LED chips, be located thereon surperficial electrode welding electric conductor at each LED chip respectively.
The embodiment of the present invention is first obtained multiple LED chips 1, is then located thereon surperficial electrode welding electric conductor at each LED chip 1 respectively.Wherein, described LED chip can be horizontal structure chip, can be also thin-film LED, can also be overlay crystal chip.Particularly, the upper surface of described horizontal structure chip is established two electrodes, and one of them is positive electrode, and another is negative electrode, in these two electrode places welding gold ball 3 respectively, as shown in Figure 2.The upper surface of described thin-film LED is only established an electrode, in this electrode place welding gold ball 3, as shown in Figure 3.Described crystal covered chip upper surface does not have electrode, thereby without welding gold ball.
In step S102, each LED chip is positioned to identical platform, and lays the fluorescent glue that covers each LED chip on this platform.
The LED chip 1 that is welded with gold goal is positioned identical platform 4 by the embodiment of the present invention, and lay the fluorescent glue 5 that covers each LED chip 1 and gold goal 3 thereof on this platform 4, as shown in Figure 4,5.When described LED chip 1 is crystal covered chip, its electrode contacts with 4, platform, as shown in figure 10.At this, multiple LED chips in identical platform 4 are carried out to fluorescent glue coating, efficiency is high, and fluorescent glue coating equipment drops into little, and fluorescent material utilance is high.Because fluorescent glue is applied to the flat coating of same time, do not exist because fluorescent material precipitation causes the poor problem of Se district consistency, light (as white light) the look district consistency that made LED wafer sends is good, and after LED wafer is made, spectrophotometric test can be carried out equally, control can be further segmented to product colour.
In the time applying fluorescent glue 5, by the adsorbent equipment with multiple micropores 40, LED chip 1 is positioned, as shown in Fig. 4,5,10,11.Particularly, after the opening of all micropores 40 being covered with LED chip 1, cavity 41 to described adsorbent equipment vacuumizes, thereby each LED chip 1 is positioned to identical platform 4, then on this platform 4, multiple LED chips 1 are applied to fluorescent glue 5 simultaneously, make each LED chip 1 be enclosed and cover by concentration, fluorescent glue 5 that thickness is identical, thereby the photochromic district consistency that made LED wafer sends is good.
Wherein, described adsorbent equipment there are multiple micropores 40, the cavity 41 that is connected with each micropore 40 and in order to seal the valve 42 of described cavity 41; After the opening of all micropores 40 being covered with described LED chip 1, described cavity 41 is vacuumized, thereby each LED chip 1 is positioned to identical platform 4.Particularly, support described platform 4 by base 10, described cavity 41 is surrounded by platform 4 and base 10, and described valve 42 is located between base 10 and platform 4, and described micropore 40 is located at platform 4, and such adsorbent equipment is simple in structure, and cost is relatively cheap.As preferably, the diameter of described micropore is 30～50 μ m, to promote the absorption affinity to LED chip., make the lower surface of each LED chip 1 be close to the upper surface of described platform when the location.Micropore 40 on described platform vacuumizes operation by vacuum extractor to described cavity 41 after all being covered by LED chip 1, thereby makes each LED chip 1 be adsorbed on described platform.Then, on this platform, lay the fluorescent glue 5 that covers each LED chip 1.Carry out fluorescent glue coating at the platform having by vacuum suction fixed wafer function, process is simple, is easy to realize.
In step S103, make described fluorescent glue smooth, solidify after, remove the fluorescent glue that is positioned at each electric conductor upper surface and make it to expose, then cut out each LED wafer.
The embodiment of the present invention first makes the upper surface of described fluorescent glue 5 smooth by natural levelling, centrifugal rotation or formed in mould mode.After described fluorescent glue 5 solidifies, remove the fluorescent glue that is positioned at each gold goal 3 upper surfaces and make it to expose, then cut out each LED wafer 6, as shown in Fig. 6,7,8,12.Method (as etching) at this by physics or chemistry removes the fluorescent glue that is positioned at each gold goal 3 upper surfaces, so that wire 8 connects the electrode on described gold goal 3 and LED support 9, as shown in Figure 9.
Particularly, first fluorescence film 7(is contained to LED chip 1) shift out from platform, adopt the mode of physical break to cut apart fluorescence film, the fluorescent glue that makes single LEDs wafer all have same thickness encloses and covers, photochromic consistency.Meanwhile, electrode is drawn fluorescent adhesive layer 5 via gold goal 3, can carry out normal bonding wire (as gold thread) operation, and (as white light) horizontal structure wafer or vertical stratification wafer that can bonding wire complete.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (3)
1. an adsorbent equipment, is characterized in that, described adsorbent equipment, in the time applying fluorescent glue, positions LED chip; The cavity that it has multiple micropores, be connected with each micropore and in order to seal the valve of described cavity; After the opening of all micropores being covered with described LED chip, described cavity is vacuumized, thereby each LED chip is positioned to identical platform.
2. adsorbent equipment as claimed in claim 1, is characterized in that, supports described platform by base, and described cavity is surrounded by platform and base, and described valve is located between base and platform, and described micropore is located at platform.
3. adsorbent equipment as claimed in claim 1, is characterized in that, the diameter of described micropore is 30～100 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410038443.XA CN103855069A (en) | 2014-01-26 | 2014-01-26 | Adsorption device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410038443.XA CN103855069A (en) | 2014-01-26 | 2014-01-26 | Adsorption device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103855069A true CN103855069A (en) | 2014-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410038443.XA Pending CN103855069A (en) | 2014-01-26 | 2014-01-26 | Adsorption device |
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| Country | Link |
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| CN (1) | CN103855069A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108645352A (en) * | 2018-06-29 | 2018-10-12 | 苏州富强科技有限公司 | A kind of support smelting tool |
| CN109148309A (en) * | 2018-09-03 | 2019-01-04 | 苏州通富超威半导体有限公司 | Encapsulating structure and forming method thereof |
| CN111977586A (en) * | 2020-08-25 | 2020-11-24 | 王合林 | Cap screwing mechanism for full-automatic cap screwing machine |
Citations (7)
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|---|---|---|---|---|
| US5618759A (en) * | 1995-05-31 | 1997-04-08 | Texas Instruments Incorporated | Methods of and apparatus for immobilizing semiconductor wafers during sawing thereof |
| CN101996959A (en) * | 2009-08-17 | 2011-03-30 | 宏齐科技股份有限公司 | Chip encapsulation structure capable of realizing electrical connection without routing and manufacture method thereof |
| CN102637623A (en) * | 2012-04-18 | 2012-08-15 | 吴晓 | LED (light-emitting diode) chip carrier positioning and absorbing device |
| CN202549910U (en) * | 2012-04-18 | 2012-11-21 | 吴晓 | Absorbing device for locating LED chip carrier |
| US20120309119A1 (en) * | 2011-05-30 | 2012-12-06 | Samsung Electronics Co., Ltd. | Vacuum tray and method of manufacturing light emitting device using the same |
| CN103311381A (en) * | 2012-03-13 | 2013-09-18 | 展晶科技(深圳)有限公司 | Production method for packaging structures of light-emitting diode |
| CN203746811U (en) * | 2014-01-26 | 2014-07-30 | 上海瑞丰光电子有限公司 | Adsorption device |
-
2014
- 2014-01-26 CN CN201410038443.XA patent/CN103855069A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5618759A (en) * | 1995-05-31 | 1997-04-08 | Texas Instruments Incorporated | Methods of and apparatus for immobilizing semiconductor wafers during sawing thereof |
| CN101996959A (en) * | 2009-08-17 | 2011-03-30 | 宏齐科技股份有限公司 | Chip encapsulation structure capable of realizing electrical connection without routing and manufacture method thereof |
| US20120309119A1 (en) * | 2011-05-30 | 2012-12-06 | Samsung Electronics Co., Ltd. | Vacuum tray and method of manufacturing light emitting device using the same |
| CN103311381A (en) * | 2012-03-13 | 2013-09-18 | 展晶科技(深圳)有限公司 | Production method for packaging structures of light-emitting diode |
| CN102637623A (en) * | 2012-04-18 | 2012-08-15 | 吴晓 | LED (light-emitting diode) chip carrier positioning and absorbing device |
| CN202549910U (en) * | 2012-04-18 | 2012-11-21 | 吴晓 | Absorbing device for locating LED chip carrier |
| CN203746811U (en) * | 2014-01-26 | 2014-07-30 | 上海瑞丰光电子有限公司 | Adsorption device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108645352A (en) * | 2018-06-29 | 2018-10-12 | 苏州富强科技有限公司 | A kind of support smelting tool |
| CN109148309A (en) * | 2018-09-03 | 2019-01-04 | 苏州通富超威半导体有限公司 | Encapsulating structure and forming method thereof |
| CN111977586A (en) * | 2020-08-25 | 2020-11-24 | 王合林 | Cap screwing mechanism for full-automatic cap screwing machine |
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Application publication date: 20140611 |
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| RJ01 | Rejection of invention patent application after publication |