CN103852705A - Constant temperature device - Google Patents
Constant temperature device Download PDFInfo
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- CN103852705A CN103852705A CN201310608475.4A CN201310608475A CN103852705A CN 103852705 A CN103852705 A CN 103852705A CN 201310608475 A CN201310608475 A CN 201310608475A CN 103852705 A CN103852705 A CN 103852705A
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- constant temperature
- temperature
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Abstract
The invention provides a constant temperature device. The constant temperature device, which is simple in structure, is capable of keeping and stabilizing an LED in an atmosphere of a uniform temperature during a temperature accelerated life test of the LED. The constant temperature device (100) comprises a constant temperature board (10) in which an electric heating element (11) used as a heating device is arranged; the constant temperature device also comprises a test body loading bench (20) arranged on the constant temperature board (10); the constant temperature device also comprises a flat-plate-shaped pad (30) which is configured on the constant temperature board (10), surrounds the periphery of the test body loading bench (20) and is provided with an opening part (30a); the constant temperature device further comprises a light-permeable top plate component (40) which is made of heat-resistant glass and is configured on the pad (30) when covering the test body loading bench (20) and the opening part (30a); and an air supplying fan (50) which is used as a cooling device of the constant temperature plate (10) and for performing air cooling for the constant temperature plate (10) is arranged. A heat sink (60), which is closely attached to the lower surface of the constant temperature board (10), is configured between the constant temperature board (10) and the air supplying fan (50).
Description
Technical field
The present invention relates to be used in LED(light emitting diode) the constant temperature utensil of Temperature-Accelerated Life Test.
Background technology
Although the present invention is a kind of light source take the long-life as speciality, present situation is its brightness decay lentamente along with the lengthening of the time of lighting.Therefore, as one of the evaluation method in LED life-span, the known specification that has " IES LM-80 " that " North America German Illuminating Engineeering Society " formulate.This specification has been tested the sustainment rate (luminous flux sustainment rate) of the light time of brightness to LED, according to this test findings whether steady state value with on evaluate the LED life-span.
Particularly, this is for the test body LED driving with same current value, under 3 kinds of temperature conditions of the arbitrary temp (the highest 125 ℃) determining 55 ℃, 85 ℃ and manufacturer, light continuously 6000 hours (250 day time), within every 1000 hours, measure the test method of the brightness of LED.In the situation that carrying out so test, although must will remain under steady temperature as the LED of test body the calibration cells that adopt heated air circulation type in the past for a long time more.
But, in the case of using as the LED of test body is placed in the calibration cell of heated air circulation type, owing to often making the hot blast circulating directly get on LED for holding temperature, therefore have, baneful influence is added to the possibility in test findings in calibration cell.In addition, existing heated air circulation type calibration cell is owing to having the aspect of the lack of homogeneity of Temperature Distribution in groove, so in the situation that having held multiple LED, test accuracy often reduces.
On the other hand, as the device of Temperature-Accelerated Life Test that carries out LED, in the past, although proposed the test unit of various species, as device related to the present invention, for example, there is the test unit described in patent documentation 1.
Prior art document
[patent documentation 1] TOHKEMY 2011-179937 communique
Summary of the invention
LED life test apparatus described in patent documentation 1 is due to one is disposed in HAST device and is tested by test LED, although so excellent uniformity of Temperature Distribution, but due to the hot line composition comprising in the light of the LED of continuous luminous, temperature rise in device, exceed design temperature, often test findings has been had to harmful effect.Due to high output (high brightness) of the LED as subjects, this kind of situation is just more remarkable, therefore in recent years, for the LED that has high brightness trend, carries out correct durability test and becomes difficulty.
Problem to be solved by this invention is, provide a kind of can be in the Temperature-Accelerated Life Test of LED, LED is held in the atmosphere that is stabilized in uniform temperature and also brief constant temperature utensil of structure.
Constant temperature utensil of the present invention is characterised in that, comprise: have heating arrangement and cooling device temperature-constant plate, be arranged on test body loading stage on above-mentioned temperature-constant plate and to cover the light transmission top plate member that mode was configured of above-mentioned test body loading stage, as above-mentioned heating arrangement, be provided with the heater of the above-mentioned temperature-constant plate of heating, as above-mentioned cooling device, be provided with above-mentioned temperature-constant plate is carried out to air-cooled Air Blast fan.
Herein, preferably between above-mentioned temperature-constant plate and above-mentioned Air Blast fan, arrange heat sink.
In addition, the cool-air supplier of above-mentioned Air Blast fan being supplied with to refrigerating gas also can be set.
Have again, by arranging multiple above-mentioned constant temperature utensils and the open-close type lid of upper surface that covers multiple above-mentioned constant temperature utensils being set, also can form the thermostat of Temperature-Accelerated Life Test that can the multiple LED of executed in parallel.
The effect of invention
According to the present invention, can provide a kind of can be in the Temperature-Accelerated Life Test of LED, LED is held in the atmosphere that is stabilized in uniform temperature and also brief constant temperature utensil of structure.
Accompanying drawing explanation
Fig. 1 is the part omission stereographic map illustrating as the constant temperature utensil of embodiments of the present invention.
Fig. 2 is that front elevation is omitted in the part that is shown in the constant temperature utensil of Fig. 1.
Fig. 3 is that stereographic map is omitted in the part that is shown in the constant temperature utensil of Fig. 1.
Embodiment
Below, based on accompanying drawing explanation embodiments of the present invention.As shown in FIG. 1 to 3, the constant temperature utensil 100 of present embodiment comprises: the temperature-constant plate 10 of the built-in electric heating body 11 as heating arrangement; Be arranged at the test body loading stage 20 on temperature-constant plate 10; Be disposed on temperature-constant plate 10, surround the tabular next door member 30 with peristome 30a of the surrounding of test body loading stage 20; And under the state of cover butter body loading stage 20 and peristome 30a, be disposed at the top plate member 40 of the pyroceram system of the light transmission on next door member 30.In the present embodiment, also in-built electrical heater 31 in next door member 30.Have, Fig. 1, Fig. 3 illustrate the state of having dismantled top plate member 40 again.
In addition, as the cooling device of temperature-constant plate 10, temperature-constant plate 10 is carried out air-cooled Air Blast fan 50 and is arranged at the below of temperature-constant plate 10.Between temperature-constant plate 10 and Air Blast fan 50, configure under the state of the lower surface of temperature-constant plate 10 in close attachment heat sink 60, at heat sink 60 lower face side configuration Air Blast fan 50.
And then, in the left and right side of temperature-constant plate 10, for engaging releasably loads the top plate member 40 on next door member 30, be pair of locking member 12a, the 12b of L font with shape configuration section in opposite directions.Have, although not shown, the cooling effect being risen in order to improve cooling fan 50, also can arrange the cool-air supplier of Air Blast fan 50 being supplied with to refrigerating gas again.In addition, also can in top plate member 40, air hole be set.
As shown in Figure 1, in the peripheral part of test body loading stage 20, multiple notch part 20a, 20b are set, and its signal wire (not shown) etc. that is placed in the supply lines (not shown) of the LED on test body loading stage 20 for subtend and measures near the temperature sensor of temperature LED connects up.
Have, in thermostat 100, the plan view shape of test body loading stage 20 and peristome 30a is all roughly rounded again, but owing to being not limited thereto, also can take other shape (for example, plan view shape is square, ellipse or polygon etc.).
In the situation that using thermostat 100, as shown in Figure 1, Figure 3, open top plate member 40(with reference to Fig. 2), to load as the LED of test body on test body loading stage 20 respectively, after the signal wire of supply lines and temperature sensor is connected up, sealing top plate member 40, uses locking component 12a, 12b to lock top plate member 40.,, start electric heating body 11,31 power supplies to temperature-constant plate 10 and next door member 30 thereafter.Thus, the LED on test body loading stage 20 rises to predefined temperature (for example, 55 ℃, 85 ℃ or 125 ℃), and remains on this temperature.
On the other hand, by lighting continuously of LED, once become and will exceed design temperature near test body loading stage 20 and LED, Air Blast fan 50 automatically starts, and heat sink 60 air-supplies start, and by the heat radiation from heat sink 60, temperature-constant plate 10 obtains cooling.In addition, once drop to design temperature near test body loading stage 20 and LED, Air Blast fan 50 automatically stops.Like this, due to according near temperature test body loading stage 20 and LED, Air Blast fan 50 automatically opens and closes, so can prevent from testing the overheated of body loading stage 20 and LED or excessively cold, can maintain high temperature accuracy.In addition, as the Air Blast fan 50 of the cooling device of temperature-constant plate 10, because of feed flow path and discharge opeing path etc. without for supplying with liquid coolant, so structure is also brief.
Like this, in constant temperature utensil 100, test body loading stage 20 and LED are separated to come with atmospheric zone by next door member 30 and top plate member 40, and, because temperature-constant plate 10 and the next door member 30 with heating function are heated to set point of temperature continuously, so the LED being placed on test body loading stage 20 can be held in to the atmosphere that is stabilized in uniform temperature.Thereby, can with high-accuracy high-efficiency rate carry out the Temperature-Accelerated Life Test of LED.Have again, if offer air hole (not shown) to keep aeration in top plate member 40, preventing that aspect LED overheated be effective.
Have again, although not shown, if arrange in length and breadth multiple constant temperature utensils 100, and the open-close type lid etc. of the upper surface that covers multiple constant temperature utensils 100 is set, also can form the thermostat of Temperature-Accelerated Life Test that can the multiple LED of executed in parallel.
Having, is utensils that an example of the present invention is shown based on the illustrated constant temperature utensil 100 of Fig. 1～Fig. 3 again, and constant temperature utensil of the present invention is not limited to above-mentioned constant temperature utensil 100.
Utilizability in industry
Constant temperature utensil of the present invention can extensively be utilized in the field such as electronics and motor industry or mechanical industry of the Temperature-Accelerated Life Test that carries out various LED.
Description of reference numerals
10 temperature-constant plates
11,31 electric heating bodies
12a, 12b locking component
20 test body loading stages
20a, 20b notch part
30 next door members
30a peristome
40 top plate member
50 Air Blast fans
60 is heat sink
Claims (3)
1. a constant temperature utensil,
Comprise: have heating arrangement and cooling device temperature-constant plate, be arranged on test body loading stage on above-mentioned temperature-constant plate and to cover the light transmission top plate member that mode was configured of above-mentioned test body loading stage, as above-mentioned heating arrangement, be provided with the heater of the above-mentioned temperature-constant plate of heating, as above-mentioned cooling device, be provided with above-mentioned temperature-constant plate is carried out to air-cooled Air Blast fan.
2. constant temperature utensil as claimed in claim 1,
Between above-mentioned temperature-constant plate and above-mentioned Air Blast fan, dispose heat sink.
3. constant temperature utensil as claimed in claim 1 or 2,
Be provided with the cool-air supplier of above-mentioned Air Blast fan being supplied with to refrigerating gas.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012265398A JP5805615B2 (en) | 2012-12-04 | 2012-12-04 | Constant temperature apparatus |
| JP2012-265398 | 2012-12-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103852705A true CN103852705A (en) | 2014-06-11 |
| CN103852705B CN103852705B (en) | 2018-02-13 |
Family
ID=50860599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310608475.4A Expired - Fee Related CN103852705B (en) | 2012-12-04 | 2013-11-26 | Constant temperature utensil |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5805615B2 (en) |
| CN (1) | CN103852705B (en) |
| TW (1) | TWI603101B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105425173A (en) * | 2015-12-25 | 2016-03-23 | 中国电子科技集团公司第十三研究所 | High-temperature-box-used LED device burn-in device meeting LM80 requirements |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1175088A (en) * | 1996-08-27 | 1998-03-04 | 株式会社爱德万测试 | Constant temperature chamber of handler for use with semiconductor device testing apparatus |
| JP2985883B1 (en) * | 1998-08-28 | 1999-12-06 | 日本電気株式会社 | Simple constant temperature and humidity room |
| JP2002267714A (en) * | 2001-03-08 | 2002-09-18 | Furukawa Electric Co Ltd:The | Holder for aging test of semiconductor device |
| US20030113106A1 (en) * | 2001-12-17 | 2003-06-19 | Mirae Corporation | Apparatus for heating and cooling semiconductor device in handler for testing semiconductor device |
| JP2003337156A (en) * | 2002-05-20 | 2003-11-28 | Nec Tokin Corp | Temperature testing device |
| US20080053123A1 (en) * | 2003-11-14 | 2008-03-06 | Hamilton Harold E | Cooling air flow control valve for burn-in system |
| JP3151612U (en) * | 2009-03-18 | 2009-07-02 | 理想計測株式会社 | Electronic equipment testing equipment |
| CN201611377U (en) * | 2009-09-27 | 2010-10-20 | 宜准科技股份有限公司 | Service life test device of high-brightness light-emitting diode |
| CN201772946U (en) * | 2010-05-20 | 2011-03-23 | 江西省通用半导体照明检测有限公司 | High-power silicon substrate LED junction temperature detection device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1114697A (en) * | 1997-06-23 | 1999-01-22 | Crest:Kk | Temperature controlled type product inspecting apparatus |
| JP2005069938A (en) * | 2003-08-26 | 2005-03-17 | Risou Keisoku Kk | Testing arrangement of electronic component |
| TWM251940U (en) * | 2004-02-27 | 2004-12-01 | Tangteck Equipment Inc | Blowing apparatus used in high-temperature environment |
| JP4475206B2 (en) * | 2005-09-02 | 2010-06-09 | パナソニック株式会社 | Electronic component testing equipment |
| CN101559391B (en) * | 2009-05-26 | 2011-04-06 | 北京新雷能科技股份有限公司 | Temperature control heating and cooling device |
-
2012
- 2012-12-04 JP JP2012265398A patent/JP5805615B2/en active Active
-
2013
- 2013-11-26 CN CN201310608475.4A patent/CN103852705B/en not_active Expired - Fee Related
- 2013-11-29 TW TW102143646A patent/TWI603101B/en not_active IP Right Cessation
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1175088A (en) * | 1996-08-27 | 1998-03-04 | 株式会社爱德万测试 | Constant temperature chamber of handler for use with semiconductor device testing apparatus |
| JP2985883B1 (en) * | 1998-08-28 | 1999-12-06 | 日本電気株式会社 | Simple constant temperature and humidity room |
| JP2002267714A (en) * | 2001-03-08 | 2002-09-18 | Furukawa Electric Co Ltd:The | Holder for aging test of semiconductor device |
| US20030113106A1 (en) * | 2001-12-17 | 2003-06-19 | Mirae Corporation | Apparatus for heating and cooling semiconductor device in handler for testing semiconductor device |
| JP2003337156A (en) * | 2002-05-20 | 2003-11-28 | Nec Tokin Corp | Temperature testing device |
| US20080053123A1 (en) * | 2003-11-14 | 2008-03-06 | Hamilton Harold E | Cooling air flow control valve for burn-in system |
| JP3151612U (en) * | 2009-03-18 | 2009-07-02 | 理想計測株式会社 | Electronic equipment testing equipment |
| CN201611377U (en) * | 2009-09-27 | 2010-10-20 | 宜准科技股份有限公司 | Service life test device of high-brightness light-emitting diode |
| CN201772946U (en) * | 2010-05-20 | 2011-03-23 | 江西省通用半导体照明检测有限公司 | High-power silicon substrate LED junction temperature detection device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105425173A (en) * | 2015-12-25 | 2016-03-23 | 中国电子科技集团公司第十三研究所 | High-temperature-box-used LED device burn-in device meeting LM80 requirements |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103852705B (en) | 2018-02-13 |
| JP2014109544A (en) | 2014-06-12 |
| TW201428313A (en) | 2014-07-16 |
| TWI603101B (en) | 2017-10-21 |
| JP5805615B2 (en) | 2015-11-04 |
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Granted publication date: 20180213 Termination date: 20211126 |