CN103848564A - Substrate transfer apparatus - Google Patents
Substrate transfer apparatus Download PDFInfo
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- CN103848564A CN103848564A CN201310632472.4A CN201310632472A CN103848564A CN 103848564 A CN103848564 A CN 103848564A CN 201310632472 A CN201310632472 A CN 201310632472A CN 103848564 A CN103848564 A CN 103848564A
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- plate transfer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
The invention relates to a substrate transfer apparatus capable of correcting a loading position without floating a brittle material substrate. Additionally, the position of the brittle material substrate is corrected when the brittle material substrate is transferred, thereby easily adjusting the position and structure. The substrate transfer apparatus comprises substrate position-detecting cameras used for shooting the portion where the brittle material substrate is arranged of a substrate loading table and producing image data, a substrate position correcting value calculating portion used for receiving the image data produced by the substrate position-detecting cameras to calculate substrate position correcting value of the brittle material substrate through the image data, a substrate transferring method for transferring the brittle material substrate along a substrate transferring path reflecting the substrate position correcting value. More specifically, the substrate position correcting value calculating portion receives the substrate position correcting value to calculate the substrate transferring path reflecting the substrate position correcting value.
Description
Technical field
The present invention relates to a kind of base plate transfer device that brittle substrate, such as glass substrate etc. are transferred, particularly relate to a kind of base plate transfer device that uses image processing to transfer brittle substrate.
Background technology
Existing known in, first, brittle substrate is loaded to (loading) in the base plate transfer device that comprises baseplate carrier, transfer in abutting connection with the substrate breaking apparatus arranging with base plate transfer device past the brittle substrate having loaded, then, in substrate breaking apparatus, by delineating line formation step and substrate-cutting step, brittle substrate is divided and is broken into multiple less substrates.But there is the situation of skew during in the mounting position of brittle substrate, base plate transfer device, after utilization is arranged at its inner position and adjusts means the mounting position of brittle substrate is revised, is transferred brittle substrate.
Below, referring to Fig. 8 (a) to Fig. 8 (d), is in existing known base plate transfer device, describes by a succession of process of the mounting position of position correction means correction brittle substrate.Fig. 8 (a) diagrammatically represents brittle substrate to load in the stereographic map of the state of the baseplate carrier of existing known base plate transfer device; Fig. 8 (b) diagrammatically represents that existing known base plate transfer device becomes the stereographic map of (floating ON) state of unlatching that floats; Fig. 8 (c) diagrammatically represents that existing known base plate transfer device, during floating and opening, adjusts the stereographic map of state of the position of brittle substrate by position adjustment means; Fig. 8 (d) be diagrammatically represent by existing known be arranged at base plate transfer means in base plate transfer device by brittle substrate the stereographic map toward the process of transferring in substrate breaking apparatus.
First,, in Fig. 8 (a), disclose and have the baseplate carrier 200 being arranged in base plate transfer device.As shown in Figure 8 a, brittle substrate 100 is loaded to baseplate carrier 200 tops in base plate transfer device toward the illustrated direction of arrow.On baseplate carrier 200, be formed with the multiple air ejiction openings 210 from its inner ejection air with certain pressure.
Then, refer to shown in Fig. 8 (b), be formed at the multiple air ejiction openings 210 on baseplate carrier 200, respectively be formed at air in baseplate carrier 200 ejection path 225 and be communicated with, and all those air ejection path 225 and be arranged at baseplate carrier 200 below the air Injection mouth 220 of central part be communicated with.In addition, air ejection path 225 is also formed as being interconnected each other.In addition, multiple air ejiction openings 210, have identical diameter in the mode of utilizing identical pressure ejection air.Therefore, once with certain pressure by air Injection air Injection mouth 220, from multiple air ejiction openings 210 irrelevant positions with uniform pressure ejection air.After brittle substrate 100 is loaded on baseplate carrier 200, once spray air from multiple air ejiction openings 210 with uniform pressure, brittle substrate 100 floats (floating) in the mode that is separated with set interval with baseplate carrier 200, becomes without friction and the state that can move in directions X and/or Y-direction through unsteady brittle substrate 100.So, by the pressure with certain by air Injection air Injection mouth 220 and make the unsteady state of brittle substrate 100 be called " float ON " state, the state that stops air Injection being called to " OFF floats " state, and air is toward the injection of air Injection mouth 220, is to be undertaken by air injection device (graphic omission).
Then, refer to shown in Fig. 8 (c), in unsteady ON state brittle substrate 100 being floated on baseplate carrier 200, in base plate transfer device, on the side face of baseplate carrier 200, by the directions X position adjusting mechanism 240 and the Y-direction position adjusting mechanism 230 that are arranged at directions X and Y-direction, brittle substrate 100 can be moved toward directions X and Y-direction.Directions X position adjusting mechanism 240 and Y-direction position adjusting mechanism 230, drive in the mode of advancing and retreat in directions X and Y-direction respectively in the XY plane parallel with respect to baseplate carrier 200.Brittle substrate 100 is loaded when the baseplate carrier 200, produce the situation of position skew originally departing from mounting position, the correction position mechanically by making directions X position adjusting mechanism 240 and Y-direction position adjusting mechanism 230 advance and retreat under unsteady ON state, once be set as afterwards the OFF state that floats, the adjusted position of brittle substrate 100 is to mounting position originally.Now, float ON and OFF state, with not damaged brittle substrate 100, not the mode of change of location gradual carry out.
Then, refer to shown in Fig. 8 (d), through adjusting the brittle substrate 100 of position to the mounting position of the script on baseplate carrier 200, move and prop up the Working position 250 on the substrate support platform 201 that is held in base plate processing device (graphic omission) with the order that rises, transfers and decline by base plate transfer means 300.In this situation, base plate transfer means 300, mechanically transfer along predetermined handover path on space repeatedly to brittle substrate 100.In addition, base plate transfer means 300 can make brittle substrate 100 reverse up and down and transfer in transferring on the way.
Summary of the invention
But, along with the slimming of brittle substrate 100 and the progress that maximizes, in existing known base plate transfer device, be difficult to make brittle substrate 100 to float, in addition, to unsteady brittle substrate 100, by directions X position adjusting mechanism 240 and Y-direction position adjusting mechanism 230, in the time applying the situation of impact of physical property, probably have the situation that makes brittle substrate 100 breakages.In addition have with becoming more complicated tendency so that the brittle substrate 100 of slimming and maximization floats, adjusts the mechanism of position.
Therefore, the object of the present invention is to provide a kind of base plate transfer device of novel texture, technical problem to be solved is that the impact that can make the physical property that puts on brittle substrate minimizes, can revise loading position not making brittle substrate float lower, in addition, can in the way that brittle substrate is transferred, revise the position to brittle substrate, and position adjustment structure is become simple, be very suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of base plate transfer device proposing according to the present invention, includes: baseplate carrier, mounting brittle substrate; Substrate position detects Kamera, and image data is taken and generated to the part loading on this brittle substrate of this baseplate carrier; Substrate position modified value calculating section, receives by this substrate position and detects the image data that Kamera generates, and calculates the substrate position modified value of this brittle substrate from this image data; And base plate transfer means, along reflecting the base plate transfer path of this substrate position modified value, this brittle substrate is transferred; These base plate transfer means, receive this substrate position modified value from this substrate position modified value calculating section, calculate the base plate transfer path of reflecting this substrate position modified value.
The object of the invention to solve the technical problems also realizes by the following technical solutions.A kind of base plate transfer device proposing according to the present invention, includes: baseplate carrier, mounting brittle substrate; Substrate position detects Kamera, and image data is taken and generated to the part loading on this brittle substrate of this baseplate carrier; Substrate position modified value calculating section, receives by this substrate position and detects the image data that Kamera generates, and calculates the substrate position modified value of this brittle substrate from this image data; Base plate transfer starting point modified value calculating section, from this substrate position modified value, calculates the base plate transfer starting point modified value of the substrate position modified value that is transformed into the anywhere on this brittle substrate that becomes the handover of these base plate transfer means starting point; And base plate transfer means, along reflecting the base plate transfer path of this base plate transfer starting point modified value, this brittle substrate is transferred; These base plate transfer means, receive this base plate transfer starting point modified value from this base plate transfer starting point modified value calculating section, calculate the base plate transfer path of reflecting this base plate transfer starting point modified value.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid base plate transfer device, the part on this brittle substrate of wherein being taken by this substrate position detection Kamera, is the alignment mark of holding or be formed at the corner of this brittle substrate week in the corner of this brittle substrate.
Aforesaid base plate transfer device, wherein in the situation that is calculated this substrate position modified value by this substrate position modified value calculating section, uses two these above substrate positions to detect Kamera.
Aforesaid base plate transfer device, wherein this brittle substrate reverses it up and down in the way of transferring.
Aforesaid base plate transfer device, wherein this substrate position detects Kamera, to size that should brittle substrate and shift position.
Aforesaid base plate transfer device, wherein this substrate position detects the position of the shooting centre mark of Kamera, with the week end or be formed at the mode correction position of the position consistency of the alignment mark in the corner of this brittle substrate in the corner of this brittle substrate.
The present invention compared with prior art has obvious advantage and beneficial effect.By technique scheme, base plate transfer device of the present invention at least has following advantages and beneficial effect: base plate transfer device of the present invention can make the impact of the physical property that puts on brittle substrate minimize while make brittle substrate from the baseplate carrier precision of base plate transfer device good support the set position platform to transfer toward the substrate of base plate processing device, and can make position adjustment structure become simple.
In sum, the invention relates to a kind of base plate transfer device, its can do not make brittle substrate float under to mounting position revise, in addition, can in the way that brittle substrate is transferred, revise the position to brittle substrate, and position adjustment structure is become simple.Base plate transfer device of the present invention, comprises: substrate position detects Kamera, and image data is taken and generated to the part loading on the brittle substrate of baseplate carrier; Substrate position modified value calculating section, receives by substrate position and detects the image data that Kamera generates, and calculates the substrate position modified value of brittle substrate from image data; And base plate transfer means, along reflecting the base plate transfer path of substrate position modified value, brittle substrate is transferred; Base plate transfer means, receive substrate position modified value from substrate position modified value calculating section, calculate the base plate transfer path of reflecting substrate position modified value.The present invention has significant progress technically, and has obvious positively effect, is really a new and innovative, progressive, practical new design.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technique means of the present invention, and can be implemented according to the content of specification sheets, and for above and other object of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Fig. 1 diagrammatically represents brittle substrate being loaded in the stereographic map of the state of the baseplate carrier of base plate transfer device of preferred embodiment of the present invention.
Fig. 2 is the stereographic map that diagrammatically represents the annexation between substrate position modified value calculating section in base plate transfer device and the peripheral device thereof of preferred embodiment of the present invention.
Fig. 3 (a) is that summary illustrates the schematic diagram that calculates the example of modified value from the captured image of position detection Kamera by Fig. 2 to Fig. 3 (c).
Fig. 4 is the schematic diagram that represents the substrate position modified value calculating by Fig. 3 (a) to the mode shown in Fig. 3 (c) to be sent to by base plate transfer starting point modified value calculating section from substrate position modified value calculating section the process of base plate transfer means.
Fig. 5 diagrammatically illustrates that in Fig. 4 base plate transfer means modified value calculating section calculates the schematic diagram of an example of base plate transfer modified value.
Fig. 6 represents to load brittle substrate in baseplate carrier by base plate transfer means and the substrate that is held in base plate processing device is supported the schematic diagram of the process of the Working position on platform.
Fig. 7 is the schema according to the process of step order presentation graphs 1 to Fig. 6.
Fig. 8 (a) diagrammatically represents brittle substrate to load in the stereographic map of the state of the baseplate carrier of existing known base plate transfer device.
Fig. 8 (b) is the stereographic map that diagrammatically represents the unsteady state of opening of existing known base plate transfer device.
Fig. 8 (c) diagrammatically represents that existing known base plate transfer device, during floating and opening, adjusts the stereographic map of state of the position of brittle substrate by position adjustment means.
Fig. 8 (d) be diagrammatically represent by existing known be arranged at base plate transfer means in base plate transfer device by brittle substrate the stereographic map toward the process of transferring in substrate breaking apparatus.
[main element nomenclature]
100: brittle substrate
200: baseplate carrier
201: substrate is supported platform
250: Working position
300,700: base plate transfer means
400,410,420,430: position detection Kamera
500: substrate position modified value calculating section
600: base plate transfer starting point modified value calculating section
Embodiment
Technique means and effect of taking for reaching predetermined goal of the invention for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of base plate transfer device, structure, feature and effect thereof of proposing according to the present invention, be described in detail as follows.
Below, refer to shown in Fig. 1 to Fig. 7, describe for preferred embodiment of the present invention.Fig. 1 diagrammatically represents brittle substrate 100 being loaded in the stereographic map of the state of the baseplate carrier 200 of base plate transfer device of preferred embodiment of the present invention.Refer to shown in Fig. 1, brittle substrate 100, loads the baseplate carrier 200 in base plate transfer device toward the direction of arrow.At baseplate carrier 200, be not formed with multiple air ejiction openings, air ejection path and air Injection mouth with certain pressure ejection air.Therefore, the baseplate carrier 200 of preferred embodiment of the present invention, compared with the existing known baseplate carrier 200 shown in Fig. 8 a, has the effect that forms simply and can save manufacturing expense.
Then, Fig. 2 is the stereographic map that diagrammatically represents the annexation between substrate position modified value calculating section in base plate transfer device and the peripheral device thereof of preferred embodiment of the present invention.Refer to shown in Fig. 2, take respectively by position detection Kamera 410,420,430,400 4 corners that loaded in the brittle substrate 100 of baseplate carrier 200, and form image data.Position detection Kamera 410,420,430,400, is mounted to movably, and decides its position according to the size of brittle substrate 100.For example, maybe can make the size 2200 × 2500mm of the brittle substrate of 8 46 o'clock LCD panels once the size 1870 × 2200mm that determines the brittle substrate that can make 8 40 LCD panels, position detection Kamera 410,420,430,400 moves toward each corner of this hard brittle material, fixed position.That is once determine the size of brittle substrate, the position of position detection Kamera 410,420,430,400 is also fixed.Position detection Kamera 410,420,430,400, utilizes the alignment mark in corner or the Zhou Duan in corner that are formed at brittle substrate 100 is taken and can generate image data.The image data generating transmits toward substrate position modified value calculating section 500 from position detection Kamera 410,420,430,400.Substrate position modified value calculating section 500, calculates substrate position modified value the image data being received is carried out to digitized video processing (DSP:digital signal processing).Calculating of substrate position modified value is not limited to DSP, can be done to accept or reject by the those skilled in the art in this field and select.Substrate position modified value, is that the mounting position that represents brittle substrate 100 is offset how many degree from desirable mounting position toward directions X and Y-direction, in this external XY plane, rotates how many degree (θ).
In the present embodiment, there are 4 position detection Kameras though use, are not limited to this and can use 2 above position detection Kameras.In addition, substrate position modified value calculating section 500 can calculate substrate position modified value by more than 2 image data in 4 image datas that generated by 4 position detection Kameras being carried out to digitized video processing etc.
Then, refer to Fig. 3 (a) to shown in Fig. 3 (c), describe for the example that calculates substrate position modified value.Fig. 3 (a) is that summary illustrates the schematic diagram that calculates the example of modified value from the captured image of position detection Kamera by Fig. 2 to Fig. 3 (c).
In Fig. 3 (a), the captured image data of position detection Kamera 400 of presentation graphs 2.Herein, it is the size of determining brittle substrate, and position detection Kamera 400 moves and the state of fixed position toward each corner of brittle substrate, in addition, the shooting centre mark (central point of crosswise mark) 440 of position detection Kamera 400 is mounting positions of the script of brittle substrate 100.That is, must load brittle substrate 100 with the consistent mode of holding in week in the corner of brittle substrate 100 with the shooting centre mark of position detection Kamera 400 (central point of crosswise mark) 440.As shown at Fig. 3 (a), it is the image data of the situation of the upper left quarter of the shooting centre mark 440 of the located position detection Kamera 400 in a certain corner of supposition brittle substrate 100.In this situation, substrate position modified value calculating section 500, calculates position correction value according to the image data of accepting from position detection Kamera 400.Calculating of modified value, be can by image data is carried out DSP or this field selection that those skilled in the art accept or reject method and carry out.In Fig. 3 (a), the position correction value that substrate position modified value calculating section 500 calculates,-x (the shooting centre mark 440 of position detection Kamera 400 and the directions X range difference of the Zhou Duan in the corner of brittle substrate 100) ,-y (the shooting centre mark 440 of position detection Kamera 400 and the Y-direction range difference of the Zhou Duan in the corner of brittle substrate 100) and angle of rotation (θ=0, the shooting centre mark 440 of position detection Kamera 400 and the windup-degree of the Zhou Duan in the corner of brittle substrate 100).In this situation,-x ,-y and θ, because the various parameters that have because of as the magnification ratio of position detection Kamera 400 etc. cause the distance situation different from actual distance on image data, therefore also there is the situation of considering this aspect and calculate again position correction value.
In addition, Fig. 3 (b), represents as the image data of another captured example of the position detection Kamera 400 of Fig. 2, compared with Fig. 3 (a), only brittle substrate 100 in XY plane angle of rotation θ aspect different.In Fig. 3 (b), substrate position modified value calculating section 500, first calculates the angle of rotation θ among position correction value according to the image data receiving from position detection Kamera 400.Modified value to angle of rotation θ calculates, be can by image data is carried out DSP or this field selection that those skilled in the art accept or reject method and carry out.Then, substrate position modified value calculating section 500, only revises with angle of rotation θ image data.To the subsequent disposal of the image data of only revising with angle of rotation θ, carry out in the mode identical with Fig. 3 (a).Its result is, in Fig. 3 (b), the position correction value that substrate position modified value calculating section 500 calculates is-x (the shooting centre mark 440 of position detection Kamera 400 and the directions X range difference of the Zhou Duan in the corner of brittle substrate 100) ,-y (the shooting centre mark 440 of position detection Kamera 400 and the Y-direction range difference of the Zhou Duan in the corner of brittle substrate 100) and angle of rotation (θ; The shooting centre mark 440 of position detection Kamera 400 and the windup-degree of the Zhou Duan in the corner of brittle substrate 100).In this situation,-x ,-y and θ, because the various parameters that have because of as the magnification ratio of position detection Kamera 400 etc. cause the distance situation different from actual distance on image data, therefore also there is the situation of considering this aspect and calculate again position correction value.
On the other hand, Fig. 3 (c), represent the image data as captured another example again of the position detection Kamera 400 of Fig. 2, compared with Fig. 3 (a), only substrate position modified value calculating section 500 utilization be formed at brittle substrate 100 corner alignment mark and to calculate the aspect of modified value different.Herein, the shooting centre mark of position detection Kamera 400 (central point of crosswise mark) 440, becomes the central point of the script of the alignment mark of brittle substrate 100.That is, must load brittle substrate 100 in the shooting centre mark of position detection Kamera 400 (central point of crosswise mark) 440 mode consistent with the central point of the alignment mark in the corner of brittle substrate 100.In this situation, substrate position modified value calculating section 500, calculates position correction value according to the image data receiving from position detection Kamera 400.Calculating of modified value, be can by image data is carried out DSP or this field selection that those skilled in the art accept or reject method and carry out.In Fig. 3 (c), the position correction value that substrate position modified value calculating section 500 calculates is-x (the directions X range difference of the central point of the alignment mark in the shooting centre mark of position detection Kamera 400 and the corner of brittle substrate 100) ,-y (the shooting centre mark 440 of position detection Kamera 400 and the Y-direction range difference of the central point of the alignment mark in the corner of brittle substrate 100) and angle of rotation (θ=0; The shooting centre mark 440 of position detection Kamera 400 and the windup-degree of the alignment mark in the corner of brittle substrate 100).In this situation,-x ,-y and θ, because the various parameters that have because of as the magnification ratio of position detection Kamera 400 etc. cause the distance situation different from actual distance on image data, therefore also there is the situation of considering this aspect and calculate again position correction value.
In the present embodiment, though from the image data being generated by position detection Kamera 400, by the week end or calculate the substrate position modified value of brittle substrate 100 with the distance of alignment mark and windup-degree in the shooting centre mark 440 of position detection Kamera 400 and the corner of brittle substrate 100, but be not limited to this, and also can, by the those skilled in the art in this field, calculate the substrate position modified value of brittle substrate 100 in various modes from the image data of position detection Kamera 400.
Then, refer to shown in Fig. 4, describe for the process that the substrate position modified value calculating by substrate position modified value calculating section 500 is conveyed to base plate transfer means 700.Fig. 4 is the schematic diagram that represents the substrate position modified value calculating by Fig. 3 (a) to the method shown in Fig. 3 (c) to be conveyed to by base plate transfer starting point modified value calculating section 600 from substrate position modified value calculating section 500 process of base plate transfer means 700.
As shown in Figure 4, by the substrate position modified value calculating from substrate position modified value calculating section 500 (for example, at Fig. 3 (a) to Fig. 3 (c) ,-x ,-y, θ) transmit toward base plate transfer starting point modified value calculating section 600.This substrate position modified value, is the modified value in 4 corners of brittle substrate 100, and those substrate position modified value is with regard to every nook and cranny and different.Therefore, substrate position modified value can not be used under remaining stationary to base plate transfer means 700, and can be the position correction value that changes wherein the essence of base plate transfer means 700 according to transferring starting point.For example, if Fig. 3 (a) is to as Fig. 3 (c), if the handover starting point that a corner of the brittle substrate 100 that position detection Kamera 400 is taken is base plate transfer means 700, as as shown in Fig. 3 (a),-x value ,-y value and θ value (θ=0), modified value is transferred in the position that becomes base plate transfer means 700.But, as shown in Fig. 5 described as follows, become the situation of the handover starting point of base plate transfer means 700 at the focus point of brittle substrate 100, can not be in the modified value of lower use Fig. 3 (a) of remaining stationary, that is-x value ,-y value and θ value (θ=0), and must be transformed into again the value of the focus point of corresponding brittle substrate 100.In addition, base plate transfer means 700, though also there is promising multiple situation, also must be transformed in this case and become the handover modified value in place of handover starting point of each base plate transfer means 700.
Therefore, base plate transfer starting point modified value calculating section 600, is connected with substrate position modified value calculating section 500, receives substrate position modified value, according to received substrate position modified value, calculate the base plate transfer starting point modified value that counterpart substrate is transferred the number of means 700 or transferred starting point.Calculated base plate transfer starting point modified value is transmitted toward base plate transfer means 700.On the other hand, if Fig. 3 (a) is to as Fig. 3 (c), 1 corner of the brittle substrate 100 of taking at position detection Kamera 400 becomes the situation of the handover starting point of base plate transfer means 700, due to without calculating base plate transfer starting point modified value, therefore also have: the substrate position modified value of substrate position modified value calculating section 500 directly transmits toward base plate transfer means 700 without base plate transfer starting point modified value calculating section 600.Base plate transfer means 700 are revised the handover path of brittle substrate by base plate transfer starting point modified value while are transferred brittle substrate 100.To this, in following Fig. 6, will further at length describe.
Then, refer to shown in Fig. 5, focus points of brittle substrate 100 in the handover starting point of base plate transfer means 700, and the brittle substrate 100 loading is only with the situation of angle of rotation θ skew, and the method that calculates base plate transfer modified value for base plate transfer means modified value calculating section 600 describes.Fig. 5 diagrammatically illustrates that in Fig. 4 base plate transfer means modified value calculating section 600 calculates the schematic diagram of an example of base plate transfer modified value.
As shown in Figure 5, position detection Kamera 410,420,430,400 is taken from 4 corners of the brittle substrate 100 of desirable mounting position skew, and generates each image data.As shown in Figure 5, the image data being generated by position detection Kamera 410,420,430,400 is completely different, and the θ value of the image data especially being generated by position detection Kamera 410 is 0.Therefore, below, the process that calculates base plate transfer modified value according to the image data being generated by position detection Kamera 410 for base plate transfer means modified value calculating section 600 describes.
As shown in Figure 5, the central point of the shot mark of position detection Kamera 410,420,430,400 is respectively an a, some b, some d, some c, and is the mounting position of the script of the summit in 4 corners of brittle substrate 100 central point of the alignment mark in 4 corners (or be formed at).Though this, some b, some d, some c change position according to the size of brittle substrate 100, once determine the size of brittle substrate 100, the position of point are fixed.In addition, the position of some a, some b, some d, some c can be by position detection Kamera 410,420,430,400 papers from Fig. 5 are changed toward moving up and down.
First, position detection Kamera 410,420,430,400, takes and generates image data to 4 corners of the brittle substrate 100 having loaded respectively.Generated image data is transmitted toward substrate position modified value calculating section 500.Substrate position modified value calculating section 500, calculates each substrate position modified value from the image data having sent.Substrate position modified value calculating section 500, judge as shown in Figure 5 from substrate position modified value as, some a consistent with the central point of the shot mark of position detection Kamera 410 (windup-degree of x=0, y=0, θ=brittle substrate), other put with the central point of the shot mark of corresponding position detection Kamera inconsistent.Then, substrate position modified value calculating section 500, the windup-degree that calculates brittle substrate 100 from the image data being generated by position detection Kamera 410 is θ.Pre-determine the length L of the long side direction of brittle substrate 100.Then, once the captured image data of the position detection Kamera 410 by Fig. 5 is revised to θ value as Fig. 3 (b),, because x value is that x=0, y value are y=o, therefore result is, substrate position modified value only exists θ.Therefore, base plate transfer starting point modified value calculating section 600, can be L from the length of the long side direction of brittle substrate 100, and utilize following equation to calculate:
X ' value (x '=(L/2) (cos θ-1))
Y ' value (y '=(L/2) sin θ)
Above, though the image data having been generated by position detection Kamera 410 for base plate transfer starting point modified value calculating section 600 bases, calculate in the base plate transfer starting point modified value of the situation that the focus point of brittle substrate 100 is made as to base plate transfer starting point and be illustrated, but be not limited thereto.For example, also can, according to the image data being generated by 2 above different position detection Kameras, calculate the base plate transfer starting point modified value of 1 above base plate transfer starting point with respect to other.In addition, the modified value calculation method of base plate transfer starting point modified value calculating section 600 is also not limited to above-mentioned, and can utilize various methods to carry out by the those skilled in the art in this field.
Then, refer to shown in Fig. 6, the process of transferring brittle substrate 100 for base plate transfer means 700 describes.Fig. 6 represents to load brittle substrate 100 in baseplate carrier 200 by base plate transfer means 700 and the substrate that is held in base plate processing device is supported the schematic diagram of the process of the Working position 250 on platform 201.
As shown in Figure 6, base plate transfer means 700, generally speaking, to transfer loading to wait and lift and start by absorption in the brittle substrate 100 of the baseplate carrier 200 of base plate transfer device, transfer brittle substrate 100 along set handover path, then support platform 201 that brittle substrate 100 is declined and load in substrate to support the Working position 250 on platform 201 from the substrate of base plate processing device.In the situation that brittle substrate 100 is transferred along set handover path, also have brittle substrate 100 top and bottom reversions.In addition, as shown in Figure 4, in base plate transfer means 700 when base plate transfer starting point modified value calculating section 600 has received base plate transfer starting point modified value or received the situation of substrate position modified value from substrate position modified value calculating section 500, base plate transfer means 700, above-mentioned set handover path is calculated to reflect base plate transfer starting point modified value or substrate position modified value and handover path through revising, transfer brittle substrate 100 along this handover path through revising.That is, base plate transfer means 700, transfer brittle substrate 100 while (for example revise base plate transfer starting point modified value, in Fig. 5, x ' value, y ' value and θ value), load and make it to be held in the Working position 250 of the brittle substrate 100 of substrate support platform 201 brittle substrate 100.Whereby, through the brittle substrate 100 of correction position, can correctly load and prop up the Working position 250 that is held in substrate support platform 201.According to this formation, can make the impact of the physical property that puts on brittle substrate minimize, can not load brittle substrate and revise mounting position, in addition, can in the way that brittle substrate is transferred, revise the position to brittle substrate, and the base plate transfer device that position adjustment structure is become simple is provided.
Then, refer to shown in Fig. 7, describe for the process of Fig. 1 to Fig. 6 according to step order.First, brittle substrate 100 is loaded on baseplate carrier 200 (S100).Then, take 4 corners of brittle substrate 100 and generate image data by position detection Kamera 410,420,430,400, substrate position modified value calculating section 500 calculates the position correction value (S200) of brittle substrate according to image data.Then, calculate base plate transfer starting point modified value (S300) according to the substrate position modified value having calculated by base plate transfer starting point modified value calculating section 600.Then, base plate transfer means 700, transfer brittle substrate 100 along the base plate transfer path that is modified to base plate transfer starting point modified value, and load and prop up on the substrate support platform 201 that is held in base plate processing device (S400).Then, brittle substrate 100 is carried out to following process (for example, delineation line forms step, brisement step etc.) (S500).Certainly, S300 also can omit according to the position of the handover starting point of base plate transfer means 700, in this situation, in S400, base plate transfer means 700 are transferred brittle substrate 100 along the base plate transfer path of the position correction value that is modified to brittle substrate 100.
As illustrated above, according to the base plate transfer means 700 of preferred embodiment of the present invention, without the unsteady equipment that brittle substrate 100 is floated or as other the formation as directions X and Y-direction position adjusting mechanism etc., can save manufacturing cost, and also can reduce in the time that brittle substrate 100 is transferred, in order to adjust position to brittle substrate 100 apply the power of physical property step, prevent the breakage of brittle substrate 100, therefore there is the effect that can make productivity improve.
The above, it is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with preferred embodiment, but not in order to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be not depart from technical solution of the present invention content, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (7)
1. a base plate transfer device, is characterized in that it comprises:
Baseplate carrier (200), mounting brittle substrate (100);
Substrate position detects Kamera (400,410,420,430), and image data is taken, generated to the part loading on this brittle substrate (100) of this baseplate carrier (200);
Substrate position modified value calculating section (500), receive by this substrate position and detect the image data that Kamera (400,410,420,430) generates, calculate the substrate position modified value of this brittle substrate (100) from this image data; And
Base plate transfer means (700), transfer this brittle substrate (100) along reflecting the base plate transfer path of this substrate position modified value;
These base plate transfer means (700), receive this substrate position modified value from this substrate position modified value calculating section (500), calculate the base plate transfer path of reflecting this substrate position modified value.
2. a base plate transfer device, is characterized in that it comprises:
Baseplate carrier (200), mounting brittle substrate (100);
Substrate position detects Kamera (400,410,420,430), and image data is taken, generated to the part loading on this brittle substrate (100) of this baseplate carrier (200);
Substrate position modified value calculating section (500), receive by this substrate position and detect the image data that Kamera (400,410,420,430) generates, calculate the substrate position modified value of this brittle substrate (100) from this image data;
Base plate transfer starting point modified value calculating section (600), from this substrate position modified value, calculate the base plate transfer starting point modified value of the substrate position modified value that is transformed into the anywhere on this brittle substrate (100) that becomes the handover starting point of these base plate transfer means (700); And
Base plate transfer means (700), transfer this brittle substrate (100) along reflecting the base plate transfer path of this base plate transfer starting point modified value;
These base plate transfer means (700), receive this base plate transfer starting point modified value from this base plate transfer starting point modified value calculating section (600), calculate the base plate transfer path of reflecting this base plate transfer starting point modified value.
3. base plate transfer device according to claim 1 and 2, is characterized in that, wherein,
Part on this brittle substrate (100) of being taken by this substrate position detection Kamera (400,410,420,430) is the alignment mark of holding or be formed at the corner of this brittle substrate (100) week in the corner of this brittle substrate (100).
4. base plate transfer device according to claim 1 and 2, is characterized in that, wherein,
In the situation that is calculated this substrate position modified value by this substrate position modified value calculating section (500), use two these above substrate positions to detect Kamera (400,410,420,430).
5. base plate transfer device according to claim 1 and 2, is characterized in that, wherein,
This brittle substrate (100) reverses it up and down in the way of transferring.
6. base plate transfer device according to claim 1 and 2, is characterized in that, wherein,
This substrate position detects Kamera (400,410,420,430), to size that should brittle substrate (100) and shift position.
7. base plate transfer device according to claim 1 and 2, is characterized in that, wherein,
This substrate position detects the position of the shooting centre mark of Kamera (400,410,420,430), with the week end or be formed at the mode correction position of the position consistency of the alignment mark in the corner of this brittle substrate (100) in the corner of this brittle substrate (100).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20120140293A KR101481992B1 (en) | 2012-12-05 | 2012-12-05 | Substrate transfer apparatus |
| KR10-2012-0140293 | 2012-12-05 |
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| CN103848564A true CN103848564A (en) | 2014-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310632472.4A Pending CN103848564A (en) | 2012-12-05 | 2013-11-28 | Substrate transfer apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2014114161A (en) |
| KR (1) | KR101481992B1 (en) |
| CN (1) | CN103848564A (en) |
| TW (1) | TW201423892A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105996601A (en) * | 2016-06-24 | 2016-10-12 | 芜湖莫森泰克汽车科技股份有限公司 | Showing stand for panoramic sunroof of automobile |
| CN108521778A (en) * | 2017-05-17 | 2018-09-11 | 深圳市柔宇科技有限公司 | The judgment method of substrate force-bearing situation and transportation system |
| CN110416140A (en) * | 2018-04-26 | 2019-11-05 | 佳能特机株式会社 | The manufacturing method of substrate transfer system, the manufacturing device of electronic equipment and electronic equipment |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102355418B1 (en) * | 2018-04-26 | 2022-01-24 | 캐논 톡키 가부시키가이샤 | Substrate conveying system, method and apparatus for manufacturing electronic devices |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0620920A (en) * | 1992-07-01 | 1994-01-28 | Nikon Corp | Substrate-position compensator |
| JP2000071190A (en) * | 1998-08-27 | 2000-03-07 | Komatsu Ltd | Workpiece carrying system |
| JP4665468B2 (en) * | 2004-09-15 | 2011-04-06 | 凸版印刷株式会社 | Photomask and photomask blank placement direction changing device |
| JP4827573B2 (en) | 2006-03-29 | 2011-11-30 | 東レ株式会社 | A substrate positioning method, a substrate positioning device, and a plasma display back plate manufacturing apparatus. |
| KR101060653B1 (en) * | 2008-11-27 | 2011-08-31 | 엘아이지에이디피 주식회사 | Substrate transfer device, substrate transfer method and substrate bonding apparatus using same |
| JP5512349B2 (en) * | 2010-03-30 | 2014-06-04 | 株式会社日立製作所 | Substrate inversion apparatus and substrate inversion method |
-
2012
- 2012-12-05 KR KR20120140293A patent/KR101481992B1/en active IP Right Grant
-
2013
- 2013-09-23 TW TW102134062A patent/TW201423892A/en unknown
- 2013-10-01 JP JP2013206051A patent/JP2014114161A/en active Pending
- 2013-11-28 CN CN201310632472.4A patent/CN103848564A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105996601A (en) * | 2016-06-24 | 2016-10-12 | 芜湖莫森泰克汽车科技股份有限公司 | Showing stand for panoramic sunroof of automobile |
| CN108521778A (en) * | 2017-05-17 | 2018-09-11 | 深圳市柔宇科技有限公司 | The judgment method of substrate force-bearing situation and transportation system |
| CN110416140A (en) * | 2018-04-26 | 2019-11-05 | 佳能特机株式会社 | The manufacturing method of substrate transfer system, the manufacturing device of electronic equipment and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101481992B1 (en) | 2015-01-14 |
| TW201423892A (en) | 2014-06-16 |
| JP2014114161A (en) | 2014-06-26 |
| KR20140072600A (en) | 2014-06-13 |
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Application publication date: 20140611 |