CN103846814A - Mobile spray nozzle - Google Patents
Mobile spray nozzle Download PDFInfo
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- CN103846814A CN103846814A CN201310502818.9A CN201310502818A CN103846814A CN 103846814 A CN103846814 A CN 103846814A CN 201310502818 A CN201310502818 A CN 201310502818A CN 103846814 A CN103846814 A CN 103846814A
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Abstract
The invention relates to a mobile spray nozzle for manufacturing a gettering source on the rear surface of a silicon wafer by dry method sand spraying so as to eliminate oxidized fog on a polished surface of silicon. The mobile spray nozzle comprises a tubular spray nozzle and a spray nozzle mobile device, wherein the tubular spray nozzle is arranged on the spray nozzle mobile device, and can move left and right under the effect of the spray nozzle moving device. According to the invention, the spray nozzle is tubular, and the spray nozzle mobile device is arranged to enable the spray nozzle to move left and right, so that the damage formed by sand spraying on the rear surface of the silicon wafer is uniformly controllable.
Description
Technical field
The present invention relates to IC grade silicon polished silicon wafer technical field, particularly relate to and a kind ofly manufacture gettering source to eliminate the portable nozzle of silicon polishing surface oxidation mist for silicon chip back side dry abrasive blasting.
Background technology
IC grade silicon polished silicon wafer is to manufacture the core material of extensive and super large-scale integration, is mainly used in the high-tech area such as high-speed computer, Aero-Space.The microdefect " oxidation fog " of silicon single-crystal polishing plate is perplexing the quality of high reliability device silicon single-crystal polishing plate always.For a long time, people adopt several different methods to eliminate the oxidation fog on silicon polished surface.The method adopting is mainly the mode by gettering, has two kinds of intrinsic gettering and outer getterings.Intrinsic gettering is mainly to utilize the oxygen precipitation in silicon chip to produce the oxidation fog on elimination silicon polishing surface, gettering district, and because of its apparatus expensive, complex process, requires the interior oxygen precipitation profile of silicon chip even, wayward, and poor repeatability, therefore applies less at home and abroad.Outer gettering is mainly to utilize external means to form damage or stress at silicon chip back side, concrete mode has at the damage of silicon chip back side grinder belt, damage from laser or LPCVD growing polycrystalline silicon layer etc., or adopts the methods such as irradiation, heat pre-treatment, the soft damage of silicon chip back side to eliminate the oxidation fog of silicon chip.
Adopting dry abrasive blasting to manufacture the oxidation fog of eliminating silicon polishing surface in gettering source to the back side of silicon chip is emergingly in recent years a kind ofly can effectively eliminate the oxidation fog on silicon polished surface, while technique advantages of simple again, invest little, workable, easy to implement outer impurity absorption method.It is to damage gettering principle according to the back of the body, at silicon chip back side dry abrasive blasting, produce lattice damage or distortion, manufacture gettering source, by control and modulation to sand size, blasting pressure, an operation pitch of fins, time course, at the uniform stacking fault density of silicon chip back side manufacture, produce 6-38 × 104/cm at silicon chip back side
2damage fault, induce heap diamicton mistake, make silicon chip there is extrinsic gettering ability.At high temperature, the impurity of silicon chip can be shifted, and transfer to the non-critical position at silicon chip the inside and the back side, in the making integrated circuit region on polished silicon wafer surface, form the clean area of the several um of thickness, thereby the high-quality that obtains nothing " oxidation fog " is silicon polished, guarantees that IC product circuit characteristic is unaffected.
Conventional in the prior art silicon chip back side dry abrasive blasting is manufactured to gettering source take the nozzle of eliminating silicon polishing surface oxidation mist as fixed bell-shaped nozzle 1, as shown in Figure 1, Fig. 1 is the schematic diagram of the bell-shaped nozzle of prior art.Adopt this fixed bell-shaped nozzle to spray diamond dust to silicon chip back side, conventionally cannot make diamond dust be uniformly dispersed, can cause silicon chip back side damage layer inhomogeneous, this manufactures gettering source for silicon chip back side dry abrasive blasting and does not wish to eliminate silicon polishing surface oxidation mist the result obtaining.
Summary of the invention
The object of the invention is to, overcome the defect of the nozzle existence of prior art, and provide a kind of portable nozzle of new structure, technical problem to be solved is that to make it be tubulose by making nozzle, and nozzle mobile device is set moves left and right nozzle, the damage that can make silicon chip back side sandblast form is evenly controlled, is very suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions.The portable nozzle of one proposing according to the present invention, manufactures gettering source to eliminate silicon polishing surface oxidation mist for silicon chip back side dry abrasive blasting, and it comprises: tubular nozzle and nozzle mobile device; Described tubular nozzle is arranged on described nozzle mobile device, can under the effect of described nozzle mobile device, move left and right.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid portable nozzle, wherein said nozzle mobile device is cylinder, described tubular nozzle is arranged on the piston of described cylinder.
Aforesaid portable nozzle, the distance that wherein said tubular nozzle moves left and right under the effect of described nozzle mobile device is 0-200mm.
The present invention compared with prior art has obvious advantage and beneficial effect.By technique scheme, a kind of portable nozzle of the present invention at least has following advantages and beneficial effect: the present invention is tubulose by making nozzle, and nozzle mobile device is set nozzle is moved left and right, the damage that can make silicon chip back side sandblast form is evenly controlled.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of description, and for above and other object of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the bell-shaped nozzle of prior art.
Fig. 2 is the schematic diagram of portable nozzle of the present invention.
The specific embodiment
Technological means and effect of taking for reaching predetermined goal of the invention for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to portable its specific embodiment of nozzle of the one proposing according to the present invention, structure, feature and effect thereof, be described in detail as follows.
Relevant aforementioned and other technology contents of the present invention, Characteristic can be known and present in the following detailed description coordinating with reference to graphic preferred embodiment.By the explanation of the specific embodiment, should obtain one more deeply and concrete understanding for technological means and effect of reaching predetermined object and taking to the present invention, but appended graphic be only to provide with reference to the use of explanation, be not used for the present invention to be limited.
Referring to shown in Fig. 2, is the schematic diagram of portable nozzle of the present invention.Portable nozzle of the present invention is manufactured gettering source to eliminate silicon polishing surface oxidation mist for silicon chip back side dry abrasive blasting, it is mainly made up of tubular nozzle 2 and nozzle mobile device 3, wherein tubular nozzle 2 is arranged on nozzle mobile device 3, can under the effect of nozzle mobile device 3, move left and right.
Nozzle mobile device 3 of the present invention can be cylinder, and now tubular nozzle 2 is arranged on the piston of cylinder.The distance that tubular nozzle 2 moves left and right under the effect of nozzle mobile device 3 can be 0-200mm.
The present invention is by adopting tubular nozzle 2 and nozzle mobile device 3 can make tubular nozzle 2 move left and right under the effect of nozzle mobile device 3, disperse to spray diamond dust with respect to the fixed bell-shaped nozzle that prior art is conventional, the silicon chip back side damage layer that can avoid adopting bell-shaped nozzle sandblast to cause is inhomogeneous, make the damage of silicon chip back side evenly controlled, the damage layer consistent in density of the center and peripheral of silicon chip back side.
The above, it is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with preferred embodiment, but not in order to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be not depart from technical solution of the present invention content, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (3)
1. a portable nozzle, manufactures gettering source to eliminate silicon polishing surface oxidation mist for silicon chip back side dry abrasive blasting, it is characterized in that it comprises: tubular nozzle and nozzle mobile device; Described tubular nozzle is arranged on described nozzle mobile device, can under the effect of described nozzle mobile device, move left and right.
2. portable nozzle according to claim 1, is characterized in that wherein said nozzle mobile device is cylinder, and described tubular nozzle is arranged on the piston of described cylinder.
3. portable nozzle according to claim 2, is characterized in that the distance that wherein said tubular nozzle moves left and right under the effect of described nozzle mobile device is 0-200mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310502818.9A CN103846814A (en) | 2013-10-23 | 2013-10-23 | Mobile spray nozzle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310502818.9A CN103846814A (en) | 2013-10-23 | 2013-10-23 | Mobile spray nozzle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103846814A true CN103846814A (en) | 2014-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310502818.9A Pending CN103846814A (en) | 2013-10-23 | 2013-10-23 | Mobile spray nozzle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103846814A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU1824296C (en) * | 1990-01-15 | 1993-06-30 | Симферопольское Научно-Производственное Объединение Механизации И Автоматизации Погрузочно-Разгрузочных И Складских Работ | Jet apparatus for hydroabrasive machining outer cylindrical surfaces |
| JP2000254864A (en) * | 1999-03-10 | 2000-09-19 | Sintokogio Ltd | Support device for air blast nozzle |
| CN101935038A (en) * | 2010-08-13 | 2011-01-05 | 镇江环太硅科技有限公司 | Silicon ingot cutting waste material recovery method and silicon ingot treatment device |
| CN201872089U (en) * | 2010-07-06 | 2011-06-22 | 重庆迈崴机器有限公司 | Automatic sand blasting machine for inner hole |
| CN102862224A (en) * | 2012-09-30 | 2013-01-09 | 东北石油大学 | Integral manufacturing device for rough surfaces of multi-phase casings |
| CN103029043A (en) * | 2011-10-09 | 2013-04-10 | 彭武良 | Accurate shot blasting equipment |
| CN203738610U (en) * | 2013-10-23 | 2014-07-30 | 洛阳市鼎晶电子材料有限公司 | Movable nozzle |
-
2013
- 2013-10-23 CN CN201310502818.9A patent/CN103846814A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU1824296C (en) * | 1990-01-15 | 1993-06-30 | Симферопольское Научно-Производственное Объединение Механизации И Автоматизации Погрузочно-Разгрузочных И Складских Работ | Jet apparatus for hydroabrasive machining outer cylindrical surfaces |
| JP2000254864A (en) * | 1999-03-10 | 2000-09-19 | Sintokogio Ltd | Support device for air blast nozzle |
| CN201872089U (en) * | 2010-07-06 | 2011-06-22 | 重庆迈崴机器有限公司 | Automatic sand blasting machine for inner hole |
| CN101935038A (en) * | 2010-08-13 | 2011-01-05 | 镇江环太硅科技有限公司 | Silicon ingot cutting waste material recovery method and silicon ingot treatment device |
| CN103029043A (en) * | 2011-10-09 | 2013-04-10 | 彭武良 | Accurate shot blasting equipment |
| CN102862224A (en) * | 2012-09-30 | 2013-01-09 | 东北石油大学 | Integral manufacturing device for rough surfaces of multi-phase casings |
| CN203738610U (en) * | 2013-10-23 | 2014-07-30 | 洛阳市鼎晶电子材料有限公司 | Movable nozzle |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140611 |