CN103846805A - Conveyer belt - Google Patents
Conveyer belt Download PDFInfo
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- CN103846805A CN103846805A CN201310503073.8A CN201310503073A CN103846805A CN 103846805 A CN103846805 A CN 103846805A CN 201310503073 A CN201310503073 A CN 201310503073A CN 103846805 A CN103846805 A CN 103846805A
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- conveyer belt
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Abstract
The invention relates to a conveyer belt for manufacturing a gettering source on the back side of a silicon wafer through dry-process sand blasting to eliminate oxidized mist on a silicon polished surface. A grid is arranged on a bearing carrier of the conveyer belt and penetrates through the bearing surface of the bearing carrier and one side opposite to the bearing surface, a dust collecting device is arranged below the conveyer belt, and the grid of the conveyer belt enables silicon carbide scattered on the conveyer belt to enter the dust collecting device. The meshed conveyer belt is adopted to convey silicon wafers; the dust collecting device below the conveyer belt can be used for collecting silicon carbide scattered at the periphery of the silicon wafer on the conveyer belt for reutilizing.
Description
Technical field
The present invention relates to IC grade silicon polished silicon wafer technical field, particularly relate to a kind of for manufacturing gettering source for silicon chip back side dry abrasive blasting to eliminate the conveyer belt of silicon polishing surface oxidation mist.
Background technology
IC grade silicon polished silicon wafer is to manufacture the core material of extensive and super large-scale integration, is mainly used in the high-tech area such as high-speed computer, Aero-Space.The microdefect " oxidation fog " of silicon single-crystal polishing plate is perplexing the quality of high reliability device silicon single-crystal polishing plate always.For a long time, people adopt several different methods to eliminate the oxidation fog on silicon polished surface.The method adopting is mainly the mode by gettering, has two kinds of intrinsic gettering and outer getterings.Intrinsic gettering is mainly to utilize the oxygen precipitation in silicon chip to produce the oxidation fog on elimination silicon polishing surface, gettering district, and because of its apparatus expensive, complex process, requires the interior oxygen precipitation profile of silicon chip even, wayward, and poor repeatability, therefore applies less at home and abroad.Outer gettering is mainly to utilize external means to form damage or stress at silicon chip back side, concrete mode has at the damage of silicon chip back side grinder belt, damage from laser or LPCVD growing polycrystalline silicon layer etc., or adopts the methods such as irradiation, heating pretreatment, the soft damage of silicon chip back side to eliminate the oxidation fog of silicon chip.
Adopting dry abrasive blasting to manufacture the oxidation fog of eliminating silicon polishing surface in gettering source to the back side of silicon chip is emergingly in recent years a kind ofly can effectively eliminate the oxidation fog on silicon polished surface, while technique advantages of simple again, invest little, workable, easy to implement outer impurity absorption method.It is to damage gettering principle according to the back of the body, at silicon chip back side dry abrasive blasting, produce lattice damage or distortion, manufacture gettering source, by control and modulation to sand size, blasting pressure, an operation pitch of fins, time course, at the uniform stacking fault density of silicon chip back side manufacture, produce 6-38 × 104/cm at silicon chip back side
2damage fault, induce heap diamicton mistake, make silicon chip there is extrinsic gettering ability.At high temperature, the impurity of silicon chip can be shifted, and transfer to the non-critical position at silicon chip the inside and the back side, in the making integrated circuit region on polished silicon wafer surface, form the clean area of the several um of thickness, thereby the high-quality that obtains nothing " oxidation fog " is silicon polished, guarantees that IC product circuit characteristic is unaffected.
Refer to shown in Fig. 1, it is the schematic diagram of the conveyer belt of prior art, the conveyer belt 1 of prior art is normally made up of fine and close nylon cloth, in the time silicon chip back side dry abrasive blasting being manufactured to gettering source with elimination silicon polishing surface oxidation mist, the diamond dust nozzle that is arranged at the conveyer belt top of transporting silicon chip can spray diamond dust to the silicon chip on conveyer belt, some diamond dust also can become scattered about on the conveyer belt of silicon chip surrounding simultaneously, and the nylon cloth conveyer belt 1 that adopts above-mentioned this densification transports silicon chip, these diamond dust that become scattered about on the conveyer belt of silicon chip surrounding are merely able to collect from conveyer belt exit.
Summary of the invention
The object of the present invention is to provide a kind of conveyer belt of new structure, technical problem to be solved makes it by adopting netted conveyer belt to transport silicon chip and configure dust collecting below conveyer belt, can collect the diamond dust that becomes scattered about silicon chip surrounding on conveyer belt at any time, recycling, is very suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of conveyer belt proposing according to the present invention, manufacture gettering source to eliminate silicon polishing surface oxidation mist for silicon chip back side dry abrasive blasting, on the bearing carrier of described conveyer belt, be provided with grid, described grid runs through the loading end of described bearing carrier and another side corresponding thereto, below described conveyer belt, be provided with dust receiving apparatus, the grid of described conveyer belt can allow to become scattered about diamond dust on described conveyer belt by entering described dust collecting.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid conveyer belt, wherein said conveyer belt is netted nylon cloth conveyer belt.
The present invention compared with prior art has obvious advantage and beneficial effect.By technique scheme, a kind of conveyer belt of the present invention at least has following advantages and beneficial effect: the present invention is by adopting netted conveyer belt to transport silicon chip and configure dust collecting below conveyer belt, can collect at any time recycling to the diamond dust that becomes scattered about silicon chip surrounding on conveyer belt.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of description, and for above and other object of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.
Brief description of the drawings
Fig. 1 is the schematic diagram of the conveyer belt of prior art.
Fig. 2 is the schematic diagram of conveyer belt of the present invention.
Detailed description of the invention
Technological means and effect of taking for reaching predetermined goal of the invention for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its detailed description of the invention of a kind of conveyer belt, structure, feature and effect thereof of proposing according to the present invention, be described in detail as follows.
Relevant aforementioned and other technology contents of the present invention, Characteristic can be known and present in the following detailed description coordinating with reference to graphic preferred embodiment.By the explanation of detailed description of the invention, should obtain one more deeply and concrete understanding for technological means and effect of reaching predetermined object and taking to the present invention, but appended graphic be only to provide with reference to the use of explanation, be not used for the present invention to be limited.
Referring to shown in Fig. 2, is the structural representation of the preferred embodiment of conveyer belt of the present invention.
Conveyer belt 2 of the present invention is manufactured gettering source to eliminate the transporting of silicon chip of silicon polishing surface oxidation mist for silicon chip back side dry abrasive blasting, on the bearing carrier of conveyer belt 2, be provided with grid 3, grid 3 runs through the loading end of bearing carrier and another side corresponding thereto, below conveyer belt 2, be provided with dust receiving apparatus (not shown), wherein the grid of conveyer belt 2 can allow to become scattered about diamond dust on conveyer belt 2 by entering dust collecting.Preferably, conveyer belt 2 of the present invention is netted nylon cloth conveyer belt.
Netted conveyer belt of the present invention, only can collect from conveyer belt exit the diamond dust that becomes scattered about silicon chip surrounding on conveyer belt with respect to transporting silicon chip with the conventional fine and close nylon cloth conveyer belt of prior art, can realize by the grid on conveyer belt the collection at any time of the diamond dust to becoming scattered about silicon chip surrounding on conveyer belt, recycling.
The above, it is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with preferred embodiment, but not in order to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be not depart from technical solution of the present invention content, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (2)
1. a conveyer belt, manufacture gettering source to eliminate silicon polishing surface oxidation mist for silicon chip back side dry abrasive blasting, it is characterized in that: on the bearing carrier of described conveyer belt, be provided with grid, described grid runs through the loading end of described bearing carrier and another side corresponding thereto, below described conveyer belt, be provided with dust receiving apparatus, the grid of described conveyer belt can allow to become scattered about diamond dust on described conveyer belt by entering described dust collecting.
2. conveyer belt according to claim 1, is characterized in that wherein said conveyer belt is netted nylon cloth conveyer belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310503073.8A CN103846805A (en) | 2013-10-23 | 2013-10-23 | Conveyer belt |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310503073.8A CN103846805A (en) | 2013-10-23 | 2013-10-23 | Conveyer belt |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103846805A true CN103846805A (en) | 2014-06-11 |
Family
ID=50855174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310503073.8A Pending CN103846805A (en) | 2013-10-23 | 2013-10-23 | Conveyer belt |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103846805A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105881236A (en) * | 2016-05-31 | 2016-08-24 | 杭州科技职业技术学院 | Rotational moving type sand blasting protecting device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08294866A (en) * | 1995-04-25 | 1996-11-12 | Mitsugi Kai | Dust removing device of blasting device and blasting material spouting device |
| CN2915374Y (en) * | 2006-05-10 | 2007-06-27 | 浙江昱辉阳光能源有限公司 | Sand blasting apparatus for erasing waste silicon sheet impurity |
| CN201227787Y (en) * | 2008-07-22 | 2009-04-29 | 东莞市吉川机械设备有限公司 | Dust removing apparatus of continuous pressure turntable abrasive blaster |
| CN102645101A (en) * | 2012-03-24 | 2012-08-22 | 无锡大塘复合材料有限公司 | Sintering furnace conveyer |
| CN203109812U (en) * | 2013-02-19 | 2013-08-07 | 廖晖 | Rotating door-type burr processor |
-
2013
- 2013-10-23 CN CN201310503073.8A patent/CN103846805A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08294866A (en) * | 1995-04-25 | 1996-11-12 | Mitsugi Kai | Dust removing device of blasting device and blasting material spouting device |
| CN2915374Y (en) * | 2006-05-10 | 2007-06-27 | 浙江昱辉阳光能源有限公司 | Sand blasting apparatus for erasing waste silicon sheet impurity |
| CN201227787Y (en) * | 2008-07-22 | 2009-04-29 | 东莞市吉川机械设备有限公司 | Dust removing apparatus of continuous pressure turntable abrasive blaster |
| CN102645101A (en) * | 2012-03-24 | 2012-08-22 | 无锡大塘复合材料有限公司 | Sintering furnace conveyer |
| CN203109812U (en) * | 2013-02-19 | 2013-08-07 | 廖晖 | Rotating door-type burr processor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105881236A (en) * | 2016-05-31 | 2016-08-24 | 杭州科技职业技术学院 | Rotational moving type sand blasting protecting device |
| CN105881236B (en) * | 2016-05-31 | 2019-10-25 | 杭州科技职业技术学院 | A kind of sandblasting protective device of moving in rotation |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140611 |