CN103846805A - Conveyer belt - Google Patents

Conveyer belt Download PDF

Info

Publication number
CN103846805A
CN103846805A CN201310503073.8A CN201310503073A CN103846805A CN 103846805 A CN103846805 A CN 103846805A CN 201310503073 A CN201310503073 A CN 201310503073A CN 103846805 A CN103846805 A CN 103846805A
Authority
CN
China
Prior art keywords
conveyer belt
silicon
silicon chip
grid
dust collecting
Prior art date
Application number
CN201310503073.8A
Other languages
Chinese (zh)
Inventor
郭金娥
徐信富
徐力
陈兴邦
Original Assignee
洛阳市鼎晶电子材料有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 洛阳市鼎晶电子材料有限公司 filed Critical 洛阳市鼎晶电子材料有限公司
Priority to CN201310503073.8A priority Critical patent/CN103846805A/en
Publication of CN103846805A publication Critical patent/CN103846805A/en

Links

Abstract

The invention relates to a conveyer belt for manufacturing a gettering source on the back side of a silicon wafer through dry-process sand blasting to eliminate oxidized mist on a silicon polished surface. A grid is arranged on a bearing carrier of the conveyer belt and penetrates through the bearing surface of the bearing carrier and one side opposite to the bearing surface, a dust collecting device is arranged below the conveyer belt, and the grid of the conveyer belt enables silicon carbide scattered on the conveyer belt to enter the dust collecting device. The meshed conveyer belt is adopted to convey silicon wafers; the dust collecting device below the conveyer belt can be used for collecting silicon carbide scattered at the periphery of the silicon wafer on the conveyer belt for reutilizing.

Description

A kind of conveyer belt

Technical field

The present invention relates to IC grade silicon polished silicon wafer technical field, particularly relate to a kind of for manufacturing gettering source for silicon chip back side dry abrasive blasting to eliminate the conveyer belt of silicon polishing surface oxidation mist.

Background technology

IC grade silicon polished silicon wafer is to manufacture the core material of extensive and super large-scale integration, is mainly used in the high-tech area such as high-speed computer, Aero-Space.The microdefect " oxidation fog " of silicon single-crystal polishing plate is perplexing the quality of high reliability device silicon single-crystal polishing plate always.For a long time, people adopt several different methods to eliminate the oxidation fog on silicon polished surface.The method adopting is mainly the mode by gettering, has two kinds of intrinsic gettering and outer getterings.Intrinsic gettering is mainly to utilize the oxygen precipitation in silicon chip to produce the oxidation fog on elimination silicon polishing surface, gettering district, and because of its apparatus expensive, complex process, requires the interior oxygen precipitation profile of silicon chip even, wayward, and poor repeatability, therefore applies less at home and abroad.Outer gettering is mainly to utilize external means to form damage or stress at silicon chip back side, concrete mode has at the damage of silicon chip back side grinder belt, damage from laser or LPCVD growing polycrystalline silicon layer etc., or adopts the methods such as irradiation, heating pretreatment, the soft damage of silicon chip back side to eliminate the oxidation fog of silicon chip.

Adopting dry abrasive blasting to manufacture the oxidation fog of eliminating silicon polishing surface in gettering source to the back side of silicon chip is emergingly in recent years a kind ofly can effectively eliminate the oxidation fog on silicon polished surface, while technique advantages of simple again, invest little, workable, easy to implement outer impurity absorption method.It is to damage gettering principle according to the back of the body, at silicon chip back side dry abrasive blasting, produce lattice damage or distortion, manufacture gettering source, by control and modulation to sand size, blasting pressure, an operation pitch of fins, time course, at the uniform stacking fault density of silicon chip back side manufacture, produce 6-38 × 104/cm at silicon chip back side 2damage fault, induce heap diamicton mistake, make silicon chip there is extrinsic gettering ability.At high temperature, the impurity of silicon chip can be shifted, and transfer to the non-critical position at silicon chip the inside and the back side, in the making integrated circuit region on polished silicon wafer surface, form the clean area of the several um of thickness, thereby the high-quality that obtains nothing " oxidation fog " is silicon polished, guarantees that IC product circuit characteristic is unaffected.

Refer to shown in Fig. 1, it is the schematic diagram of the conveyer belt of prior art, the conveyer belt 1 of prior art is normally made up of fine and close nylon cloth, in the time silicon chip back side dry abrasive blasting being manufactured to gettering source with elimination silicon polishing surface oxidation mist, the diamond dust nozzle that is arranged at the conveyer belt top of transporting silicon chip can spray diamond dust to the silicon chip on conveyer belt, some diamond dust also can become scattered about on the conveyer belt of silicon chip surrounding simultaneously, and the nylon cloth conveyer belt 1 that adopts above-mentioned this densification transports silicon chip, these diamond dust that become scattered about on the conveyer belt of silicon chip surrounding are merely able to collect from conveyer belt exit.

Summary of the invention

The object of the present invention is to provide a kind of conveyer belt of new structure, technical problem to be solved makes it by adopting netted conveyer belt to transport silicon chip and configure dust collecting below conveyer belt, can collect the diamond dust that becomes scattered about silicon chip surrounding on conveyer belt at any time, recycling, is very suitable for practicality.

The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of conveyer belt proposing according to the present invention, manufacture gettering source to eliminate silicon polishing surface oxidation mist for silicon chip back side dry abrasive blasting, on the bearing carrier of described conveyer belt, be provided with grid, described grid runs through the loading end of described bearing carrier and another side corresponding thereto, below described conveyer belt, be provided with dust receiving apparatus, the grid of described conveyer belt can allow to become scattered about diamond dust on described conveyer belt by entering described dust collecting.

The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.

Aforesaid conveyer belt, wherein said conveyer belt is netted nylon cloth conveyer belt.

The present invention compared with prior art has obvious advantage and beneficial effect.By technique scheme, a kind of conveyer belt of the present invention at least has following advantages and beneficial effect: the present invention is by adopting netted conveyer belt to transport silicon chip and configure dust collecting below conveyer belt, can collect at any time recycling to the diamond dust that becomes scattered about silicon chip surrounding on conveyer belt.

Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of description, and for above and other object of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.

Brief description of the drawings

Fig. 1 is the schematic diagram of the conveyer belt of prior art.

Fig. 2 is the schematic diagram of conveyer belt of the present invention.

Detailed description of the invention

Technological means and effect of taking for reaching predetermined goal of the invention for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its detailed description of the invention of a kind of conveyer belt, structure, feature and effect thereof of proposing according to the present invention, be described in detail as follows.

Relevant aforementioned and other technology contents of the present invention, Characteristic can be known and present in the following detailed description coordinating with reference to graphic preferred embodiment.By the explanation of detailed description of the invention, should obtain one more deeply and concrete understanding for technological means and effect of reaching predetermined object and taking to the present invention, but appended graphic be only to provide with reference to the use of explanation, be not used for the present invention to be limited.

Referring to shown in Fig. 2, is the structural representation of the preferred embodiment of conveyer belt of the present invention.

Conveyer belt 2 of the present invention is manufactured gettering source to eliminate the transporting of silicon chip of silicon polishing surface oxidation mist for silicon chip back side dry abrasive blasting, on the bearing carrier of conveyer belt 2, be provided with grid 3, grid 3 runs through the loading end of bearing carrier and another side corresponding thereto, below conveyer belt 2, be provided with dust receiving apparatus (not shown), wherein the grid of conveyer belt 2 can allow to become scattered about diamond dust on conveyer belt 2 by entering dust collecting.Preferably, conveyer belt 2 of the present invention is netted nylon cloth conveyer belt.

Netted conveyer belt of the present invention, only can collect from conveyer belt exit the diamond dust that becomes scattered about silicon chip surrounding on conveyer belt with respect to transporting silicon chip with the conventional fine and close nylon cloth conveyer belt of prior art, can realize by the grid on conveyer belt the collection at any time of the diamond dust to becoming scattered about silicon chip surrounding on conveyer belt, recycling.

The above, it is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with preferred embodiment, but not in order to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be not depart from technical solution of the present invention content, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.

Claims (2)

1. a conveyer belt, manufacture gettering source to eliminate silicon polishing surface oxidation mist for silicon chip back side dry abrasive blasting, it is characterized in that: on the bearing carrier of described conveyer belt, be provided with grid, described grid runs through the loading end of described bearing carrier and another side corresponding thereto, below described conveyer belt, be provided with dust receiving apparatus, the grid of described conveyer belt can allow to become scattered about diamond dust on described conveyer belt by entering described dust collecting.
2. conveyer belt according to claim 1, is characterized in that wherein said conveyer belt is netted nylon cloth conveyer belt.
CN201310503073.8A 2013-10-23 2013-10-23 Conveyer belt CN103846805A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310503073.8A CN103846805A (en) 2013-10-23 2013-10-23 Conveyer belt

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310503073.8A CN103846805A (en) 2013-10-23 2013-10-23 Conveyer belt

Publications (1)

Publication Number Publication Date
CN103846805A true CN103846805A (en) 2014-06-11

Family

ID=50855174

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310503073.8A CN103846805A (en) 2013-10-23 2013-10-23 Conveyer belt

Country Status (1)

Country Link
CN (1) CN103846805A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105881236A (en) * 2016-05-31 2016-08-24 杭州科技职业技术学院 Rotational moving type sand blasting protecting device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08294866A (en) * 1995-04-25 1996-11-12 Aruku Seigiken:Kk Dust removing device of blasting device and blasting material spouting device
CN2915374Y (en) * 2006-05-10 2007-06-27 浙江昱辉阳光能源有限公司 Sand blasting apparatus for erasing waste silicon sheet impurity
CN201227787Y (en) * 2008-07-22 2009-04-29 东莞市吉川机械设备有限公司 Dust removing apparatus of continuous pressure turntable abrasive blaster
CN102645101A (en) * 2012-03-24 2012-08-22 无锡大塘复合材料有限公司 Sintering furnace conveyer
CN203109812U (en) * 2013-02-19 2013-08-07 廖晖 Rotating door-type burr processor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08294866A (en) * 1995-04-25 1996-11-12 Aruku Seigiken:Kk Dust removing device of blasting device and blasting material spouting device
CN2915374Y (en) * 2006-05-10 2007-06-27 浙江昱辉阳光能源有限公司 Sand blasting apparatus for erasing waste silicon sheet impurity
CN201227787Y (en) * 2008-07-22 2009-04-29 东莞市吉川机械设备有限公司 Dust removing apparatus of continuous pressure turntable abrasive blaster
CN102645101A (en) * 2012-03-24 2012-08-22 无锡大塘复合材料有限公司 Sintering furnace conveyer
CN203109812U (en) * 2013-02-19 2013-08-07 廖晖 Rotating door-type burr processor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105881236A (en) * 2016-05-31 2016-08-24 杭州科技职业技术学院 Rotational moving type sand blasting protecting device
CN105881236B (en) * 2016-05-31 2019-10-25 杭州科技职业技术学院 A kind of sandblasting protective device of moving in rotation

Similar Documents

Publication Publication Date Title
TW562878B (en) Copper-plating liquid, plating method and plating apparatus
JP4093793B2 (en) Semiconductor wafer manufacturing method and wafer
TWI278925B (en) Semiconductor device manufacturing apparatus and its manufacturing method
JP4986568B2 (en) Wafer grinding method
JP5081643B2 (en) Wafer processing method
TW525221B (en) Substrate processing method
TW393369B (en) A wafer processing machine and a processing method thereby
CN106170847B (en) The manufacturing method of semiconductor wafer
CN103213061B (en) Processing technic of sapphire substrate slice special for patterned substrate
KR101603899B1 (en) Thinned semiconductor wafer and method of thinning a semiconductor wafer
US20150259237A1 (en) Method and apparatus for processing edge of glass by using high frequency induction heater
CN100435288C (en) Process for producing silicon wafer
DE112012004211T5 (en) Double-sided polishing process
CN105034182B (en) Machining method for ultra-thin sapphire flaky bodies
CN106784161A (en) A kind of polishing lithographic method of PERC solar cells
TW200534406A (en) Fabrication method of semiconductor integrated circuit device
CN1591781A (en) Silicon wafers and method of fabricating the same
US9293318B2 (en) Semiconductor wafer manufacturing method
CN103029225B (en) Topping machanism
CN105140171A (en) Preparation method of material-on-insulator
DE102009048436B4 (en) Method for grinding a semiconductor wafer
JP2003229392A (en) Method for manufacturing silicon wafer, silicon wafer and soi wafer
TW200300963A (en) Silicon semiconductor wafer, and process for producing a multiplicity of semiconductor wafers
CN1893021A (en) Manufacturing method of semiconductor integrated circuit device
TWI612558B (en) Substrate processing apparatus and substrate processing method, and computer readable recording medium on which a substrate processing program is recorded

Legal Events

Date Code Title Description
PB01 Publication
C06 Publication
SE01 Entry into force of request for substantive examination
C10 Entry into substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140611

C02 Deemed withdrawal of patent application after publication (patent law 2001)