CN103834947A - Method for manufacturing decorative metal pattern and electronic device - Google Patents

Method for manufacturing decorative metal pattern and electronic device Download PDF

Info

Publication number
CN103834947A
CN103834947A CN201210480651.6A CN201210480651A CN103834947A CN 103834947 A CN103834947 A CN 103834947A CN 201210480651 A CN201210480651 A CN 201210480651A CN 103834947 A CN103834947 A CN 103834947A
Authority
CN
China
Prior art keywords
pattern
housing
decorative metals
etching mask
photo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201210480651.6A
Other languages
Chinese (zh)
Inventor
胡智凯
庄益诚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HTC Corp
Original Assignee
High Tech Computer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by High Tech Computer Corp filed Critical High Tech Computer Corp
Priority to CN201210480651.6A priority Critical patent/CN103834947A/en
Publication of CN103834947A publication Critical patent/CN103834947A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Telephone Set Structure (AREA)

Abstract

The invention discloses a method for manufacturing a decorative metal pattern and an electronic device. The manufacturing method comprises the following steps: providing a shell with a surface, then forming a metal layer on the surface of the shell, and then forming a first etching mask on the metal layer; conducting photoetching to remove or reduce the metal layer exposed outside the first etching mask; and finally, removing the first etching mask. Through photoetching, the decorative metal pattern is prepared on local area of the shell, so that the shell is provided with pattern with metal texture and gloss, and the antenna signal can be transmitted through the shell. The invention also provides an electronic device including the above decorative metal pattern.

Description

The manufacture method of decorative metals pattern and electronic installation
Technical field
The present invention relates to a kind of manufacture method and electronic installation of metal pattern, and particularly relate to a kind of manufacture method of decorative metals pattern and comprise the electronic installation of decorative metals pattern.
Background technology
Now, attractive in appearance in order to promote commodity, on the housing of commodity, forming pattern has been quite common a kind of mode.Conventionally can utilize on the housing of commodity, to spray ink or utilize thermal transfer printing film ink layer heat to be transferred to the modes such as the surface of shell of product and complete.Along with manufacture craft progress and aesthetic feeling promote, the texture of product appearance promotes more and more being taken seriously.
At present, showing in appearance metal-like if want at the housing of commodity, is generally directly to use metal shell or utilize plating mode to be plated on housing on metal.If but such housing is applied on mobile telephone, can limit the design of antenna.If by the material use of imitative metal spray paint, ink-jet or the mode of hot transfer printing, spray on local housing, again because the restriction of material texture, and cannot show real metalluster.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method of decorative metals pattern, can, by decorative metals pattern setting in the local surfaces of housing, show in appearance metal-like with the housing at commodity, and can avoid the position of particular element.
A further object of the present invention is to provide a kind of electronic installation, comprises above-mentioned decorative metals pattern.
For reaching above-mentioned purpose, the present invention proposes a kind of manufacture method of decorative metals pattern, comprising: a housing is provided, and its middle shell has a surface; Form a metal level in the surface of housing; Form one first etching mask to metal level; Etching part is exposed to metal level outside the first etching mask to form a decorative metals pattern; Remove the first etching mask.
In one embodiment of this invention, the step of above-mentioned formation the first etching mask comprises that formation one first photo-resist layer is to metal level; The first photo-resist layer exposes; The first photo-resist layer that development has exposed is to form the first etching mask.
In one embodiment of this invention, the step of above-mentioned formation the first etching mask also comprise arrange one first photomask be positioned at surface a first area on the first photo-resist layer on; The first photo-resist layer on exposure first area; Arrange on the first photo-resist layer of one second photomask on a second area that is positioned at surface, wherein first area is positioned at surperficial different plane from second area; And the first photo-resist layer on exposure second area.
In one embodiment of this invention, the surface of above-mentioned housing has a groove, and decorative metals pattern is positioned at groove.
In one embodiment of this invention, also comprise and form one second etching mask to decorative metals pattern; Etching part is exposed to decorative metals pattern outside the second etching mask to form; Relief pattern or an intaglio pattern are on decorative metals pattern; Remove the second etching mask.
In one embodiment of this invention, the step of above-mentioned formation the first etching mask comprises that formation one second photo-resist layer is to decorative metals pattern; The second photo-resist layer exposes; The second photo-resist layer that development has exposed is to form the second etching mask.
In one embodiment of this invention, above-mentioned is forming metal level in the surperficial step of housing, and metal level is that the mode of electroplating with wet type is formed at surface.
In one embodiment of this invention, the material of above-mentioned housing is plastic cement.
In one embodiment of this invention, the material of above-mentioned housing comprises acrylonitrile-butadiene-styrene (ABS) or polycarbonate (PC).
In one embodiment of this invention, forming metal level in the surperficial step of housing, also comprise and an active layer is first set on the surface of housing, then metal level is set on active layer.
In one embodiment of this invention, the outside surface that above-mentioned surface is housing.
In one embodiment of this invention, above-mentioned decorative metals pattern is formed at a part for the outside surface of housing, and housing has an internal surface of opposing outer face.
In one embodiment of this invention, above-mentioned outside surface is an outer convex surface, and internal surface is an inner sunken face.
In one embodiment of this invention, also comprise arrange an antenna in decorative metals pattern another surface with respect to housing, and antenna is haply corresponding to the etched part of metal level.
In one embodiment of this invention, above-mentioned metal level comprises copper, nickel, aluminium, gold and silver or palladium.
The present invention also proposes an electronic installation, comprises a housing, a decorative metals pattern and an antenna.Housing has a relative outside surface and an internal surface.Decorative metals pattern is formed at a part for the outside surface of housing.Antenna is arranged at the outside surface that corresponds on internal surface and haply housing and does not form another part of decorative pattern.
In one embodiment of this invention, above-mentioned decorative metals pattern comprises a relief pattern or an intaglio pattern.
In one embodiment of this invention, the material of above-mentioned housing comprises acrylonitrile-butadiene-styrene or polycarbonate.
In one embodiment of this invention, the material of above-mentioned decorative metals pattern comprises copper, nickel, aluminium, gold and silver or palladium.
In one embodiment of this invention, above-mentioned outside surface is an outer convex surface, and internal surface is an inner sunken face.
Based on above-mentioned, the present invention produces decorative metals pattern by etched mode at the regional area of housing, so that housing has the pattern modelling of metal-like and gloss.And for being applied in the housing of mobile telephone, the manufacture method of decorative metals pattern of the present invention can be avoided the antenna in housing, to avoid affecting antenna performance.In addition, the present invention also produces relief pattern or intaglio pattern on decorative metals pattern by etched mode, to increase the rich of metal pattern.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended graphic being described in detail below.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the manufacture method of a kind of decorative metals pattern of one embodiment of the invention;
Fig. 2 A to Fig. 2 F is the schematic diagram of the manufacture method of the decorative metals pattern of Fig. 1;
Fig. 3 A to Fig. 3 F is the partial cutaway schematic of Fig. 2 A to Fig. 2 F;
Fig. 4 A to Fig. 4 F is the diagrammatic cross-section of the manufacturing processed of the decorative metals pattern of Fig. 1;
Fig. 5 is the schematic flow sheet of a kind of relief pattern of one embodiment of the invention or the manufacture method of intaglio pattern;
Fig. 6 A to Fig. 6 I is the schematic diagram of the manufacture method of the intaglio pattern of Fig. 5;
Fig. 7 A to Fig. 7 C is the part schematic diagram of the manufacture method of the relief pattern of Fig. 5.
Main element nomenclature
S110-S150: step
10: antenna
110,210,310: housing
112,212,312: surface
116: active layer
119,219,319: metal level
120,220,320: the first photo-resist layers
130,230,330: the first photomasks
150,250,350: decorative metals pattern
212a: groove
240: the first etching masks
360: the second photo-resist layers
370,470: the second photomasks
380,480: the second etching masks
390: intaglio pattern
490: relief pattern
Embodiment
Fig. 1 is the schematic flow sheet according to the manufacture method of a kind of decorative metals pattern of one embodiment of the invention.Fig. 2 A to Fig. 2 F is the schematic diagram of the manufacture method of the decorative metals pattern of Fig. 1.Fig. 3 A to Fig. 3 F is the partial cutaway schematic of Fig. 2 A to Fig. 2 F.
The manufacture method S100 of the decorative metals pattern of the present embodiment, comprises the following steps.Please refer to Fig. 1, Fig. 2 A and Fig. 3 A, first, provide a housing 110, its middle shell 110 has a surperficial 112(step S110).In the present embodiment, the housing that housing 110 is electronic installation, electronic installation can be mobile telephone, and in other embodiments, electronic installation also can be notebook computer or panel computer, and the kind of electronic installation is not with the above-mentioned system that is limited.As shown in Figure 2 A, the surface 112 of housing 110 is an outside surface, and in the present embodiment, outside surface is an outer convex surface, but outside surface is not as restriction.In addition, the material of housing 110 is plastic cement, for example, be acrylonitrile-butadiene-styrene (ABS) or polycarbonate (PC), but the material of housing 110 is not as restriction.
Then, please refer to Fig. 2 B and Fig. 3 B, form a metal level 119 in the surperficial 112(step S120 of housing 110).In the present embodiment, the material of metal level 119 comprises copper, nickel, aluminium, gold and silver or palladium, and metal level 119 is that the mode of electroplating with wet type is formed at surface 112.The mode that the metal level 119 of the present embodiment is electroplated by wet type, can make metal level 119 be securely fixed on surface 112.Certainly the mode that, the material of metal level 119 and metal level 119 are formed at surface 112 is not as restriction.
For example, when the material (polycarbonate) of housing 110 and metal level 119 direct engages effect when poor, for promoting the surface 112 of housing 110 and the connecting state of metal level 119, can between the surface of housing 110 112 and metal level 119, spread and be coated with an active layer 116, be formed uniformly the surface 112 at housing 110 with assistant metal layer 119.In the present embodiment, the material of active layer 116 can be metal or resin, and metal and resin can adopt respectively the mode of sputter and water plating to be formed at surface 112, but the material kind of active layer 119 and generation type can be as restrictions.
Come again, form one first etching mask (step S130) to metal level 119.In the present embodiment, the step that forms the first etching mask is as follows: the first, please refer to Fig. 2 C and Fig. 3 C, and form one first photo-resist layer 120 (step S132) to metal level 119.The second, please refer to Fig. 2 D and Fig. 3 D, one first photomask 130 is set on the first photo-resist layer 120.The 3rd, please refer to Fig. 2 E and Fig. 3 E, exposure the first photo-resist layer 120(step S134).In the present embodiment, use the technology of three-dimensional exposure, with to covering surperficial 112(outside surface) and metal level 119 on the first photo-resist layer 120 carry out exposure program.Finally, the first photo-resist layer 120 that development has exposed is to form the first etching mask (step S136).In other embodiments, the surface 112 of housing 110 can comprise the first area and the second area that are positioned at Different Plane, by arranging on the first photo-resist layer 120 of the first photomask on the first area that is positioned at surface 112, after the first photo-resist layer 120 on exposure first area.Arrange again on the first photo-resist layer 120 of the second photomask on a second area that is positioned at surface 112, the first photo-resist layer 120 on exposure second area, after different photomask multiple-exposures is passed through from second area in the first area of Different Plane, the first photo-resist layer 120 that development has exposed is to form the first etching mask, but the mode that forms the first etching mask is not as restriction.
Then, etching part is exposed to metal level 119 outside the first etching mask to form a decorative metals pattern 150(step S140).Finally, remove the first etching mask (step S150), please refer to Fig. 2 F and Fig. 3 F, decorative metals pattern 150 is formed at a part for the outside surface of housing 110.Adopt in the present embodiment positive photo-resist, but in other embodiments, also can adopt negative photoresist, it can obtain the pattern contrary with Fig. 3 F.
In the present embodiment, housing 110 has an internal surface of opposing outer face, and an antenna 10 in decorative metals pattern 150 another surface with respect to housing 110, and antenna 10 is haply corresponding to the etched part of metal level 119.That is to say, antenna 10 is arranged at the another part that corresponds to outside surface on internal surface.In the present embodiment, internal surface is an inner sunken face, but internal surface is not as restriction.The manufacture method 200 of the decorative metals pattern of the present embodiment can form decorative metals pattern 150 at the regional area of the outside surface of housing 110, to provide housing 110 to have the moulding of metal-like and gloss.In addition, because decorative metals pattern 150 is only distributed in outside surface partly, therefore, if the housing that housing 110 is mobile telephone, decorative metals pattern 150 can be avoided antenna 10 positions of housing 110 inside in the position of outside surface, to avoid affecting antenna 10 usefulness.
Fig. 4 A to Fig. 4 F is the diagrammatic cross-section of the manufacturing processed of the decorative metals pattern of Fig. 1.The Main Differences of Fig. 4 A to Fig. 4 F and Fig. 3 A to Fig. 3 F is, the surface 212 of the housing 210 of Fig. 4 A is for having the outside surface 214 of groove 212a, and decorative metals pattern 250 is formed in groove 212a, and the surface 112 of the housing 110 of Fig. 3 A is level and smooth outside surface 114.Details are as follows for the manufacturing processed of the decorative metals pattern 250 of the present embodiment.
First, please refer to Fig. 4 A, housing 210 is provided, the surface 212 of its middle shell 210 is the outside surfaces with groove 212a, and the outside surface of the present embodiment is an outer convex surface, but outside surface is not as restriction.Then, please refer to Fig. 4 B, form a metal level 219 in the surface 212 of housing 210.In the present embodiment, metal level 219 comprises copper, nickel, aluminium, gold and silver or palladium, and metal level 219 is that the mode of electroplating with wet type is formed at surface, but the material of metal level 219 with form the mode of metal level 219 not as restriction.
Come again, form one first etching mask 240 to metal level 219.In the present embodiment, form the first etching mask 240 step Ru Xia ﹕ the first, please refer to Fig. 4 C, form one first photo-resist layer 220 to metal level 219.The second, please refer to Fig. 4 D, the first photomask 230 is set on the first photo-resist layer 220 and exposure the first photo-resist layer 220.In the present embodiment, use the technology of three-dimensional exposure, with to covering surperficial 212(outside surface) and metal level 219 on the first photo-resist layer 220 carry out exposure program.Finally, please refer to Fig. 4 E, the first photo-resist layer 220 that development has exposed is to form the first etching mask 240.
Finally, etching part is exposed to metal level 219 outside the first etching mask 240 to form a decorative metals pattern 250, and removes the first etching mask 240.Please refer to Fig. 4 F, decorative metals pattern 250 is formed in the groove 212a on surface 212 of housing 210, to provide the regional area of housing 210 to have the moulding of metal-like and gloss.
Except can producing on the outer surface decorative metals pattern 150,250, also can on decorative metals pattern, produce by identical mode relief pattern or intaglio pattern, to provide on the outside surface that abundanter and polynary metal pattern is formed on housing.Fig. 5 is the schematic flow sheet according to a kind of relief pattern of one embodiment of the invention or the manufacture method of intaglio pattern.Fig. 6 A to Fig. 6 I is the schematic diagram of the manufacture method of the intaglio pattern of Fig. 5.Details are as follows for the manufacture method S300 of the intaglio pattern of the present embodiment.
First, please refer to Fig. 5 and Fig. 6 A, a housing 310 is provided, its middle shell 310 has a surperficial 312(step S310).In the present embodiment, surface 312 is an outside surface of housing 310, and the outside surface of the present embodiment is an outer convex surface, but outside surface is not as restriction.Housing 310 can be the housing of mobile telephone, but the kind of housing 310 is not as restriction.In addition, the material of housing 310 can be plastic cement, for example, be acrylonitrile-butadiene-styrene (ABS) or polycarbonate (PC), but not as limit.
Then, please refer to Fig. 6 A and 6B, form a metal level 319 in the surperficial 312(step S320 of housing 310).In the present embodiment, metal level 319 comprises copper, nickel, aluminium, gold and silver or palladium, and metal level 319 is that the mode of electroplating with wet type is formed at surface 312.In addition, the thickness of the metal level 319 of the present embodiment can be greater than the thickness of the metal level 119 in Fig. 2 G, produces intaglio pattern 390 so that follow-up on decorative metals pattern 350.
Come again, form one first etching mask (step S330) to metal level 319.In the present embodiment, form the first etching mask process Ru Xia ﹕ the first, please refer to Fig. 6 C, form one first photo-resist layer 320 to metal level 319 (step S332).The second, please refer to Fig. 6 D, one first photomask 330 is set on the first photo-resist layer 320 and exposure the first photo-resist layer 320(step S334).In the present embodiment, use the technology of three-dimensional exposure, with to covering surperficial 312(outside surface) and metal level 319 on the first photo-resist layer 320 carry out exposure program.Finally, the first photo-resist layer 320 that development has exposed is to form the first etching mask (step S336).The pattern of the first etching mask is corresponding to the pattern of the first photomask 330.
Then, etching part is exposed to metal level 319 outside the first etching mask to form a decorative metals pattern 350(step S340).Come again, remove the first etching mask (step S350).Please refer to Fig. 6 E, decorative metals pattern 350 is formed at a part for the outside surface of housing 310.
Come again, form one second etching mask 380 (step S360) to decorative metals pattern 350.The process that forms the first etching mask 380 Ru Xia ﹕ the first, please refer to Fig. 6 F, form one second photo-resist layer 360 (step S362) to decorative metals pattern 350.The second, please refer to Fig. 6 G, one second photomask 370 is set on the second photo-resist layer 360 and exposure the second photo-resist layer 360(step S364).Finally, please refer to Fig. 6 H, the second photo-resist layer 360 that development has exposed is to form the second etching mask 380(step S366), wherein the pattern of the second etching mask 380 is corresponding to the pattern of the second photomask 370.
Then, etching part is exposed to decorative metals pattern 350 outside the second etching mask 380 to form an intaglio pattern 390 (step S370) on decorative metals pattern 350.Finally, remove the second etching mask 380(step S380).Please refer to Fig. 6 I, intaglio pattern 390 is formed on the decorative metals pattern 350 of outside surface of housing 310.In the present embodiment, the second etching mask 380 of part is distributed in the periphery of decorative metals pattern 350, through after etching program, the part being removed compared to the inside of decorative metals pattern 350, the periphery of decorative metals pattern 350 can't be removed, therefore, intaglio pattern 390 is just formed on decorative metals pattern 350.
In addition, in the present embodiment, housing 310 has an internal surface of opposing outer face, and an antenna 10 in decorative metals pattern 350 another surface with respect to housing 310, and antenna 10 is haply corresponding to the etched part of metal level 319.That is to say, antenna 10 is arranged at the another part that corresponds to outside surface on internal surface.The internal surface of the present embodiment is an inner sunken face, but internal surface is not as restriction.The manufacture method of the intaglio pattern 390 of the present embodiment can form after decorative metals pattern 350 at the regional area of the outside surface of housing 310, then on decorative metals pattern 350, forms intaglio pattern 390.The shadow difference that intaglio pattern 390 can produce by depth difference, provides housing 310 abundanter metal pattern moulding.In addition,, because intaglio pattern 390 is only distributed in outside surface partly, therefore, if the housing that housing 310 is mobile telephone, intaglio pattern 390 can be avoided antenna 10 positions of housing 310 inside in the position of outside surface, to avoid affecting antenna 10 usefulness.
Fig. 7 A to Fig. 7 C is the part schematic diagram of the manufacture method of the relief pattern of Fig. 5.The Main Differences of Fig. 7 A to Fig. 7 C and Fig. 6 G to Fig. 6 I is, Fig. 7 A to Fig. 7 C is for producing relief pattern 490, and Fig. 6 G to Fig. 6 I is for producing intaglio pattern 390.In the present embodiment, first as shown in Fig. 6 A to Fig. 6 F, first, form a decorative metals pattern 350 after a part for the outside surface of housing 310, form one second photo-resist layer 360 to decorative metals pattern 350, step describes in detail in Fig. 6 A to Fig. 6 F, does not add to repeat at this.
Then, please refer to Fig. 7 A, one second photomask 470 is set on the second photo-resist layer 360 and exposure the second photo-resist layer 360.Use the technology of three-dimensional exposure herein, so that the second photo-resist layer 360 is carried out to exposure program.Come again, please refer to Fig. 7 B, develop the second photo-resist layer 360 of having exposed with on decorative metals pattern 350 to form the second etching mask 480, wherein the pattern of the second etching mask 480 is corresponding to the pattern of the second photomask 470.Finally, etching part is exposed to decorative metals pattern 350 outside the second etching mask 480 to form a relief pattern 490 on decorative metals pattern 350, and removes the second etching mask 480.Please refer to Fig. 7 C, relief pattern 490 can be formed on the decorative metals pattern 350 of outside surface of housing 310.
In the present embodiment, the second etching mask 480 is distributed in the inside of decorative metals pattern 350, through after etching program, and the part being removed compared to the periphery of decorative metals pattern 350, the decorative metals pattern 350 of partial interior can't be removed, and has just formed relief pattern 490.
That is to say, the distribution situation by the second etching mask on decorative metals pattern, producer can decide in its sole discretion and will form intaglio pattern or relief pattern at decorative metals pattern, to increase the diversity of the metal pattern on the outside surface that is formed at housing.Certainly, in other embodiments, also can pass through repeatedly above-mentioned steps, there is to produce the metal pattern that more shadows change.
In sum, the present invention produces decorative metals pattern by the etched mode of photoetching at the regional area of housing, so that housing has the pattern modelling of metal-like and gloss.And for being applied in the housing of mobile telephone, the manufacture method of decorative metals pattern of the present invention can be avoided the antenna in housing, to avoid affecting antenna performance.In addition, the present invention, also by form the second etching mask on decorative metals pattern, to produce relief pattern or intaglio pattern on decorative metals pattern, increases the rich of metal pattern.
Although disclose the present invention in conjunction with above embodiment; but it is not in order to limit the present invention; under any, in technical field, be familiar with this operator; without departing from the spirit and scope of the present invention; can do a little change and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.

Claims (12)

1. a manufacture method for decorative metals pattern, comprising:
One housing is provided, and wherein this housing has a surface;
Form a metal level in this surface of this housing;
Form one first etching mask to this metal level;
Etching part is exposed to this metal level outside this first etching mask to form a decorative metals pattern; And
Remove this first etching mask.
2. the manufacture method of decorative metals pattern as claimed in claim 1, the step that wherein forms this first etching mask comprises:
Form one first photo-resist layer to this metal level;
This first photo-resist layer exposes; And
This first photo-resist layer that development has exposed is to form this first etching mask.
3. the manufacture method of decorative metals pattern as claimed in claim 2, the step that wherein forms this first etching mask also comprises:
Arrange on one first photomask this first photo-resist layer on a first area that is positioned at this surface;
This first photo-resist layer exposing on this first area;
Arrange on one second photomask this first photo-resist layer on a second area that is positioned at this surface, wherein this first area and this second area are positioned at the different plane on this surface; And
This first photo-resist layer exposing on this second area.
4. the manufacture method of decorative metals pattern as claimed in claim 1, wherein this surface of this housing has a groove, and this decorative metals pattern is positioned at this groove.
5. the manufacture method of decorative metals pattern as claimed in claim 1, also comprises:
Form one second etching mask to this decorative metals pattern;
Etching part is exposed to this decorative metals pattern outside this second etching mask to form a relief pattern or an intaglio pattern on this decorative metals pattern; And
Remove this second etching mask.
6. the manufacture method of decorative metals pattern as claimed in claim 5, the step that wherein forms this first etching mask comprises:
Form one second photo-resist layer to this decorative metals pattern;
This second photo-resist layer exposes; And
This second photo-resist layer that development has exposed is to form this second etching mask.
7. the manufacture method of decorative metals pattern as claimed in claim 1, is wherein forming this metal level in this surperficial step of this housing, and this metal level is that the mode of electroplating with wet type is formed at this surface.
8. the manufacture method of decorative metals pattern as claimed in claim 1, wherein, forming this metal level in this surperficial step of this housing, also comprises and an active layer is first set on this surface of this housing, then this metal level is set on this active layer.
9. the manufacture method of decorative metals pattern as claimed in claim 1, also comprises:
Arrange an antenna in this decorative metals pattern another surface with respect to this housing, and this antenna is haply corresponding to the etched part of this metal level.
10. an electronic installation, comprising:
Housing, has a relative outside surface and an internal surface;
Decorative metals pattern, is formed at the part of this outside surface of this housing; And
Antenna, is arranged on this internal surface and this outside surface of corresponding to haply this housing does not form another part of this decorative pattern.
11. electronic installations as claimed in claim 10, wherein this decorative metals pattern comprises a relief pattern or an intaglio pattern.
12. electronic installations as claimed in claim 10, wherein this outside surface is an outer convex surface, and this internal surface is an inner sunken face.
CN201210480651.6A 2012-11-23 2012-11-23 Method for manufacturing decorative metal pattern and electronic device Pending CN103834947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210480651.6A CN103834947A (en) 2012-11-23 2012-11-23 Method for manufacturing decorative metal pattern and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210480651.6A CN103834947A (en) 2012-11-23 2012-11-23 Method for manufacturing decorative metal pattern and electronic device

Publications (1)

Publication Number Publication Date
CN103834947A true CN103834947A (en) 2014-06-04

Family

ID=50798829

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210480651.6A Pending CN103834947A (en) 2012-11-23 2012-11-23 Method for manufacturing decorative metal pattern and electronic device

Country Status (1)

Country Link
CN (1) CN103834947A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106576434A (en) * 2014-08-21 2017-04-19 索尼公司 Chassis component, electronic device, and chassis component manufacturing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW589509B (en) * 2003-10-24 2004-06-01 Giga Byte Tech Co Ltd Production method of forming multi-layered pattern on aluminum composite plate
CN101227022A (en) * 2007-01-19 2008-07-23 富准精密工业(深圳)有限公司 Antenna device of expendability electronic product and manufacturing method thereof
CN101352947A (en) * 2007-07-23 2009-01-28 比亚迪股份有限公司 Outer casing of electronic product and preparation method thereof
TW201018349A (en) * 2008-10-24 2010-05-01 Fih Hong Kong Ltd Housing and method of making the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW589509B (en) * 2003-10-24 2004-06-01 Giga Byte Tech Co Ltd Production method of forming multi-layered pattern on aluminum composite plate
CN101227022A (en) * 2007-01-19 2008-07-23 富准精密工业(深圳)有限公司 Antenna device of expendability electronic product and manufacturing method thereof
CN101352947A (en) * 2007-07-23 2009-01-28 比亚迪股份有限公司 Outer casing of electronic product and preparation method thereof
TW201018349A (en) * 2008-10-24 2010-05-01 Fih Hong Kong Ltd Housing and method of making the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106576434A (en) * 2014-08-21 2017-04-19 索尼公司 Chassis component, electronic device, and chassis component manufacturing method
CN106576434B (en) * 2014-08-21 2020-05-15 索尼公司 Housing assembly, electronic device and housing assembly manufacturing method

Similar Documents

Publication Publication Date Title
CN111016415B (en) Texture transfer master mold, plate and preparation method thereof, texture transfer sub mold, shell and electronic equipment
CN103619125B (en) A kind of PCB electro-plating method for improving electroplating evenness
CN101616549B (en) Method for manufacturing single-side thick copper stepped plate by electroplating addition method
CN101873775A (en) Shell having knitted patterns and manufacturing method thereof
CN102958282A (en) Circuit manufacturing method utilizing wet films and dry films for circuit boards
CN101365300A (en) Manufacturing method of circuit board conductive wire
CN106455345A (en) Method of machining burr-free hole of PCB copper-based core board
CN110248470A (en) A kind of production method of the unmanned electromechanical source printed circuit board of civilian high-speed transfer
CN102843447A (en) Mobile phone and manufacturing method of surface decorative layer of appearance piece thereof
CN102141728A (en) Method for forming three-dimensional pattern
CN103260361B (en) A kind of HDI outer-layer circuit negative film processing method
CN107459266B (en) Cover plate glass and manufacturing method thereof
CN103313520A (en) Curved-surface metal graphic manufacturing method and curved-surface metal graphic substrate
JP2008168611A (en) Plastic member with three-dimensional pattern and visual effect and its manufacturing method
CN103834947A (en) Method for manufacturing decorative metal pattern and electronic device
CN101752643A (en) Three-dimensional photoetching method for antenna manufacture
CN101351083B (en) Line board and technique
CN109496080B (en) Circuit board electroplating process method
TWI546205B (en) Manufacturing method of decorative metal pattern and electronic device
CN102480844B (en) Process for manufacturing diffusion coating prevention PCB (printed circuit board) gold-plated board
US20070128412A1 (en) Structure of an electromagnetic shield layer for a plasma display panel and method for manufacturing the same
CN108372746B (en) 3D glass plate with texture patterns, manufacturing method thereof and mobile terminal
US20130044041A1 (en) Portable electronic device, antenna structure, and antenna producing process thereof
CN202524691U (en) Metal sheet structure with surface effect
CN104953262A (en) LDS (laser direct structuring) film antenna and manufacturing method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20140604